Nova Measuring Instruments Ltd. is a leading innovator and key provider of metrology solutions for advanced process control used in semiconductor manufacturing. Nova delivers continuous innovation by providing state-of-the-art high- performance metrology solutions for effective process control throughout the semiconductor fabrication lifecycle. Nova's product portfolio, which combines high- precision hardware and cutting-edge software, provides its customers with deep insight into the development and production of the most advanced semiconductor devices. Nova's unique capability to deliver innovative X-ray and Optical solutions enable its customers to improve performance, enhance product yields and accelerate time to market. Nova acts as a partner to semiconductor manufacturers from its offices around the world.

Company profile

Eitan Oppenhaim
Fiscal year end
Former names

NVMI stock data



1 Mar 21
2 Dec 21
31 Dec 21
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Financial data from Nova earnings reports.

Data for the last complete 13F reporting period. To see the most recent changes to ownership, click the ownership history button above.

62.7% owned by funds/institutions
13F holders
Current Prev Q Change
Total holders 134 134
Opened positions 17 26 -34.6%
Closed positions 17 7 +142.9%
Increased positions 57 46 +23.9%
Reduced positions 38 42 -9.5%
13F shares
Current Prev Q Change
Total value 1.83B 1.95B -6.2%
Total shares 17.87M 18.94M -5.7%
Total puts 51.2K 47.7K +7.3%
Total calls 114.5K 80.1K +42.9%
Total put/call ratio 0.4 0.6 -24.9%
Largest owners
Shares Value Change
Wasatch Advisors 2.92M $298.29M +2.5%
FMR 1.37M $140.17M +9.0%
Harel Insurance Investments & Financial Services 1.3M $132.9M 0.0%
Renaissance Technologies 1.16M $119.06M -3.7%
Menora Mivtachim 1M $102.57M -3.6%
Acadian Asset Management 985.06K $100.74M -0.7%
Adage Capital Partners GP, L.L.C. 962.49K $98.45M +1.1%
Clal Insurance Enterprises 889.94K $90.94M -0.7%
Vanguard 798.93K $81.72M +3.1%
IVZ Invesco 620.68K $63.49M +29.7%
Largest transactions
Shares Bought/sold Change
Migdal Insurance & Financial 0 -1.23M EXIT
IVZ Invesco 620.68K +142.15K +29.7%
Noked Capital 0 -120.18K EXIT
Noked Israel 0 -120.18K EXIT
FMR 1.37M +112.93K +9.0%
Wasatch Advisors 2.92M +71.01K +2.5%
1832 Asset Management 180K +70K +63.6%
GS Goldman Sachs 13.77K -51.6K -78.9%
JPM JPMorgan Chase & Co. 91.58K +51.29K +127.3%
Intrinsic Edge Capital Management 50K +50K NEW

Financial report summary

Onto InnovationFormFactorRudolph
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No filings


Hybrid metrology method and system
19 Oct 21
A method and system are presented for use in measuring characteristic(s) of patterned structures.
Test structure design for metrology measurements in patterned samples
12 Oct 21
A test structure for use in metrology measurements of a sample pattern formed by periodicity of unit cells, each formed of pattern features arranged in a spaced-apart relationship along a pattern axis, the test structure comprising a test pattern, which is formed by a main pattern which includes main pattern features of one or more of the unit cells and has a symmetry plane, and a predetermined auxiliary pattern including at least two spaced apart auxiliary features located within at least some of those features of the main pattern, parameters of which are to be controlled during metrology measurements.
Layer detection for high aspect ratio etch control
31 Aug 21
Controlling an etch process applied to a multi-layered structure, by calculating a spectral derivative of reflectance of an illuminated region of interest of a multi-layered structure during an etch process applied to the multi-layered structure, identifying in the spectral derivative a discontinuity that indicates that an edge of a void formed by the etch process at the region of interest has crossed a layer boundary of the multi-layered structure, determining that the crossed layer boundary corresponds to a preselected layer boundary of the multi-layered structure, and applying a predefined control action to the etch process responsive to determining that the crossed layer boundary corresponds to the preselected layer boundary of the multi -layered structure.
Accurate Raman Spectroscopy
22 Jul 21
A method, a system, and a non-transitory computer readable medium for Raman spectroscopy.
Tem-based Metrology Method and System
15 Jul 21
A metrology method for use in determining one or more parameters of a three-dimensional patterned structure, the method including performing a fitting procedure between measured TEM image data of the patterned structure and simulated TEM image data of the patterned structure, determining a measured Lamellae position of at least one measured TEM image in the TEM image data from a best fit condition between the measured and simulated data, and generating output data indicative of the simulated TEM image data corresponding to the best fit condition to thereby enable determination therefrom of the one or more parameters of the structure.