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LFUS Littelfuse

Littelfuse, Inc. engages in supplying of circuit protection products for the electronics, automotive and electrical industries. The company offers electromechanical and electronic switch and control devices for commercial and specialty vehicles and sensors for automobile safety systems. It operates through the following segments: Electronics, Automotive, and Industrial. The Electronics segment includes the broadest and deepest portfolio of overvoltage and overcurrent solutions. The Automotive segment maintains a direct sales force to service all the major automotive OEMs and system suppliers domestically. The Industrial segment consists of power fuses and holders, protection relays and controls and other circuit protection products for use in various industrial applications such as oil, gas, mining, alternative energy, electric vehicle infrastructure, non-residential construction, HVAC systems, elevators and other industrial equipment. The company was founded by Edward V. Sundt in 1927 and is headquartered in Chicago, IL.

Company profile

Ticker
LFUS
Exchange
CEO
David Heinzmann
Employees
Incorporated
Location
Fiscal year end
SEC CIK
IRS number
363795742

LFUS stock data

(
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Calendar

18 Feb 21
13 Apr 21
26 Dec 21
Quarter (USD)
Dec 20 Sep 20 Jun 20 Mar 20
Revenue
Cost of revenue
Operating income
Operating margin
Net income
Net profit margin
Cash on hand
Change in cash
Diluted EPS
Annual (USD)
Dec 20 Dec 19 Dec 18 Dec 17
Revenue
Cost of revenue
Operating income
Operating margin
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Diluted EPS

Financial data from Littelfuse earnings reports.

Date Owner Security Transaction Code Indirect 10b5-1 $Price #Shares $Value #Remaining
1 Apr 21 Zommer Nathan Common Stock Sell Dispose S No Yes 266.9 741 197.77K 262,510
1 Apr 21 Zommer Nathan Common Stock Sell Dispose S No Yes 265.96 1,059 281.65K 263,251
1 Apr 21 Zommer Nathan Common Stock Sell Dispose S No Yes 264.9 700 185.43K 264,310
8 Mar 21 Grillo Anthony Common Stock Other Aquire J No No 259.18 30 7.78K 47,434
8 Mar 21 Hunter Gordon Common Stock Other Aquire J No No 259.18 4 1.04K 23,205
8 Mar 21 William P Noglows Common Stock Other Aquire J No No 259.18 3 777.54 20,380
8 Mar 21 Major John E Common Stock Other Aquire J No No 259.18 21 5.44K 21,406

Data for the last complete 13F reporting period. To see the most recent changes to ownership, click the ownership history button above.

95.2% owned by funds/institutions
13F holders
Current Prev Q Change
Total holders 311 284 +9.5%
Opened positions 51 34 +50.0%
Closed positions 24 40 -40.0%
Increased positions 98 94 +4.3%
Reduced positions 122 110 +10.9%
13F shares
Current Prev Q Change
Total value 5.97B 11.06B -46.0%
Total shares 23.37M 22.93M +1.9%
Total puts 1.9K 2.3K -17.4%
Total calls 9K 8.4K +7.1%
Total put/call ratio 0.2 0.3 -22.9%
Largest owners
Shares Value Change
Vanguard 2.22M $566.16M +5.2%
BLK Blackrock 2.04M $518.75M +2.4%
TROW T. Rowe Price 1.93M $490.84M +2.2%
ATAC Neuberger Berman 1.01M $257.43M -1.8%
IVZ Invesco 804.56K $204.89M +0.6%
JPM JPMorgan Chase & Co. 787.89K $200.65M +63.6%
Alliancebernstein 787.81K $200.62M -6.5%
Mairs & Power 719.48K $183.22M +10.5%
IPXAF Impax Asset Management 682.16K $172.82M +2.8%
Massachusetts Financial Services 622.31K $158.48M +18.8%
Largest transactions
Shares Bought/sold Change
JPM JPMorgan Chase & Co. 787.89K +306.33K +63.6%
Norges Bank 295.08K +295.08K NEW
Vulcan Value Partners 158.65K -140.69K -47.0%
Victory Capital Management 251.76K -124.38K -33.1%
Lord, Abbett & Co. 318.68K +117.06K +58.1%
JHG Janus Henderson 3.64K -111.72K -96.8%
Vanguard 2.22M +109.86K +5.2%
First Trust Advisors 187.61K +104.16K +124.8%
TimesSquare Capital Management 340.83K -99.62K -22.6%
Massachusetts Financial Services 622.31K +98.56K +18.8%

Financial report summary

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Risks
  • The Company engages in strategic acquisitions and may not realize the anticipated benefits of the acquisitions and / or may encounter difficulties in integrating these businesses.
  • Changes in U.S. and other countries trade policy, including the imposition of tariffs and the resulting consequences, may have a material adverse impact on our business and results of operations.
  • The COVID-19 pandemic could have a material adverse effect on our ability to operate, results of operations, financial condition, liquidity, and capital investments.
  • Reorganization activities may lead to additional costs and material adverse effects.
  • A decline in expected profitability of the Company or individual reporting units of the Company could result in the impairment of assets, including goodwill and other long-lived assets.
  • Fixed costs may reduce operating results if sales fall below expectations.
Management Discussion
  • Net sales decreased by $58.2 million, or 3.9%, in 2020 compared to 2019. The decrease was primarily driven by production disruptions during the first half of 2020 due to temporary closures of several of the company’s manufacturing facilities and reduced demand due to customer shutdowns, resulting from government directives due to the impact of COVID-19. This was partially offset by volume increases across all of the company’s businesses in the second half of 2020, led by higher production levels, increased demand from work-from-home and stay-at-home trends, and higher demand in a number of other end markets that the Company sells into, such as passenger vehicles, and $7.7 million or 0.5% of favorable changes in foreign exchange rates. The Company recognized net income of $130.0 million, or $5.29 per diluted share, in 2020 compared to net income of $139.1 million, or $5.60 per diluted share in 2019. The decrease in net income is primarily due to the second quarter goodwill impairment charge of $33.8 million, lower sales in the first half of 2020 driven by COVID-19 production disruptions partially offset by a net increase in foreign exchange gains of $20.1 million and operating expense cost reductions.
Content analysis
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Positive
Negative
Uncertain
Constraining
Legalese
Litigous
Readability
H.S. freshman Avg
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Patents

APP
Utility
High Breaking Capacity Chip Fuse
25 Mar 21
A high breaking capacity chip fuse including a bottom insulative layer, a first intermediate insulative layer, a second intermediate insulative layer, and a top insulative layer disposed in a stacked arrangement in the aforementioned order, a fusible element disposed between the first and second intermediate insulative layers and extending between electrically conductive first and second terminals at opposing longitudinal ends of the bottom insulative layer, the first intermediate insulative layer, the second intermediate insulative layer, and the top insulative layer, wherein the first and second intermediate insulative layers are formed of porous ceramic.
APP
Utility
Semiconductor Chip Contact Structure, Device Assembly, and Method of Fabrication
25 Mar 21
A semiconductor device structure may include a semiconductor device, disposed at least in part in a semiconductor substrate, and a first insulator layer, disposed on a surface of the semiconductor device, and comprising a first contact aperture, disposed within the first insulator layer.
APP
Utility
Semiconductor Device Having Side-diffused Trench Plug
25 Mar 21
A semiconductor device structure may include a substrate having a substrate base comprising a first dopant type; a semiconductor layer disposed on a surface of the substrate base, the semiconductor layer comprising a second dopant type and having an upper surface; and a semiconductor plug assembly comprising a semiconductor plug disposed within the semiconductor layer, the semiconductor plug extending from an upper surface of the semiconductor layer and having a depth at least equal to a thickness of the semiconductor layer, the semiconductor plug having a first boundary, the first boundary formed within the semiconductor layer, and having a second boundary, the second boundary formed within the semiconductor layer and disposed opposite the first boundary, wherein the first boundary and second boundary extend perpendicularly to the surface of the substrate base.
GRANT
Utility
Asymmetric transient voltage suppressor device and methods for formation
23 Mar 21
A transient voltage suppression (TVS) device, may include: a substrate base formed in a substrate, the substrate base comprising a semiconductor of a first conductivity type; and an epitaxial layer, disposed on the substrate base, on a first side of the substrate, and comprising a semiconductor of a second conductivity type.
APP
Utility
PPTC Material with Low Percolation Threshold for Conductive Filler
18 Mar 21
A polymeric positive temperature coefficient (PPTC) device including a PPTC body, a first electrode disposed on a first side of the PPTC body, and a second electrode disposed on a second side of the PPTC body, wherein the PPTC body is formed of a PPTC material that includes a polymer matrix and a conductive filler, wherein the conductive filler defines 20%-39% by volume of the PPTC material.