Company profile

Richard K. Templeton
Incorporated in
Fiscal year end
IRS number

TXN stock data



22 Apr 20
6 Jul 20
31 Dec 20


Company financial data Financial data

Quarter (USD) Mar 20 Dec 19 Sep 19 Jun 19
Revenue 3.33B 3.35B 3.77B 3.67B
Net income 1.17B 1.07B 1.43B 1.31B
Diluted EPS 1.24 1.12 1.49 1.36
Net profit margin 35.27% 31.94% 37.79% 35.58%
Operating income 1.24B 1.25B 1.59B 1.51B
Net change in cash 81M -1.46B 80M 93M
Cash on hand 2.52B 2.44B 3.89B 3.81B
Cost of revenue 1.24B 1.25B 1.33B 1.31B
Annual (USD) Dec 19 Dec 18 Dec 17 Dec 16
Revenue 14.38B 15.78B 14.96B 13.37B
Net income 5.02B 5.58B 3.68B 3.6B
Diluted EPS 5.24 5.59 3.61 3.48
Net profit margin 34.88% 35.35% 24.61% 26.89%
Operating income 5.72B 6.71B 6.08B 4.86B
Net change in cash -1M 782M 502M 154M
Cash on hand 2.44B 2.44B 1.66B 1.15B
Cost of revenue 5.22B 5.51B 5.35B 5.11B

Financial data from company earnings reports

Date Owner Security Transaction Code 10b5-1 $Price #Shares $Value #Remaining
19 Jun 20 Clark Janet F Stock Units Common Stock Grant Aquire A No 125.98 218.29 27.5K 5,593.84
19 Jun 20 Kirk Ronald Stock Units Common Stock Grant Aquire A No 125.98 304.28 38.33K 3,563.58
19 Jun 20 Patsley Pamela H Stock Units Common Stock Grant Aquire A No 125.98 281.13 35.42K 51,177.05
19 Jun 20 Michael D. Hsu Stock Units Common Stock Grant Aquire A No 125.98 218.29 27.5K 218.29
11 May 20 Bahai Ahmad Common Stock Sell Dispose S No 115.57 3,185 368.09K 23,983
11 May 20 Bahai Ahmad Common Stock Option exercise Aquire M No 52.93 3,185 168.58K 27,168
11 May 20 Bahai Ahmad NQ Stock Option Common Stock Option exercise Dispose M No 52.93 3,185 168.58K 10,000
83.8% owned by funds/institutions
13F holders
Current Prev Q Change
Total holders 1492 1610 -7.3%
Opened positions 98 216 -54.6%
Closed positions 216 119 +81.5%
Increased positions 578 612 -5.6%
Reduced positions 635 543 +16.9%
13F shares
Current Prev Q Change
Total value 686.37B 826.78B -17.0%
Total shares 769.41M 793.4M -3.0%
Total puts 7.19M 8.38M -14.2%
Total calls 6.29M 7.45M -15.6%
Total put/call ratio 1.1 1.1 +1.6%
Largest owners
Shares Value Change
Vanguard 91M $9.09B +2.8%
BLK BlackRock 69.82M $6.98B +0.8%
STT State Street 40.87M $4.08B +1.9%
JPM JPMorgan Chase & Co. 29.95M $2.99B +1.7%
Primecap Management 28.28M $2.83B -11.0%
BAC Bank of America 21.9M $2.19B -7.8%
Wellington Management 21.56M $2.15B +115.6%
Massachusetts Financial Services 21.42M $2.14B -9.3%
N Price T Rowe Associates 17.45M $1.74B -20.3%
Geode Capital Management 15.75M $1.57B +1.3%
Largest transactions
Shares Bought/sold Change
Wellington Management 21.56M +11.56M +115.6%
Norges Bank 0 -10.47M EXIT
Capital International Investors 1.83M -9.04M -83.1%
Capital Research Global Investors 2.81M -6.03M -68.3%
N Price T Rowe Associates 17.45M -4.44M -20.3%
Charles Schwab Investment Management 10.97M +3.54M +47.7%
Primecap Management 28.28M -3.48M -11.0%
BK Bank Of New York Mellon 14.42M +3.36M +30.4%
Sands Capital Management 907.37K -3.26M -78.2%
Charles Schwab Investment Advisory 0 -2.87M EXIT

Financial report summary

Management Discussion
  • ITEM 2. Management’s discussion and analysis of financial condition and results of operations
  • We design, make and sell semiconductors to electronics designers and manufacturers all over the world. For many years, we have run our business with three overarching ambitions in mind. First, we will act like owners who will own the company for decades. Second, we will adapt and succeed in a world that is ever changing. And third, we will be a company that we are personally proud to be a part of and that we would want as our neighbor. When we are successful in achieving these ambitions, our employees, customers, communities and shareholders all win.
  • •A strong foundation of manufacturing and technology. We invest in manufacturing technologies and do most of our manufacturing in-house. This strategic decision to directly control our manufacturing helps ensure a consistent supply of products for our customers and also allows us to invest in technology that differentiates the features of our products. We have focused on creating a competitive manufacturing cost advantage by investing in our advanced analog 300-millimeter capacity, which has about a 40% cost advantage per unpackaged chip over 200-millimeter. To strengthen this advantage, we are moving forward with our plan to build our new 300-millimeter wafer fabrication facility in Richardson, Texas, as 300-millimeter wafers will continue to support the majority of our Analog growth.
Content analysis ?
8th grade Good
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Removed: accrual, accrued, adjusted, application, applied, approach, ASC, beginning, borrowing, Broadest, classification, commencement, consumed, detailed, determining, earlier, estate, evaluated, evaluating, exercise, expansion, extend, force, frequently, Greenock, grow, guidance, Hedging, inception, incremental, January, lease, leased, lifetime, maintenance, methodology, package, payment, permitted, phase, planning, practical, present, prior, real, recognition, renewal, reported, resulted, Retirement, retrospective, Scotland, size, Specifically, standard, Targeted, terminate, ultimately, underlying, update, waiting


Powertrain Architecture for a Vehicle Utilizing an On-board Charger
2 Jul 20
Techniques related to powertrain architectures for vehicles (such as hybrid electric vehicle/electric vehicles) utilizing an on-board charger are disclosed.
Package Moisture Control and Leak Mitigation for High Vacuum Sealed Devices
2 Jul 20
A device and method of forming the device that includes a first substrate having a cavity on a bottom surface of the first substrate and MEMS components formed on the first substrate and in the cavity; a second substrate having an upper surface; a first metal bond that extends around a perimeter of the cavity and forming a first connection between the bottom surface of first substrate and the upper surface of the second substrate; a second metal bond that extends around a perimeter of the first metal bond and spaced from the first metal bond, the second metal bond forming a second connection between the bottom surface of the first substrate and the upper surface of the second substrate; where the MEMS components are hermetically sealed between the first and second substrates.
Isolated Protrusion/recession Features In Microelectromechanical Systems
2 Jul 20
In described examples, a microelectromechanical system (MEMS) includes a first element and a second element.
Multi-pass Plating Process with Intermediate Rinse and Dry
2 Jul 20
A method includes electroplate depositing a first metal layer to a first thickness on a metal seed layer, rinsing the first metal layer with deionized water, and after the first rinse process, drying the wafer.
Mems Via with Enhanced Electrical and Mechanical Integrity
2 Jul 20
Described examples include a micromechanical device having a substrate.