UNITED STATES
SECURITIES AND EXCHANGE COMMISSION
WASHINGTON, D.C. 20549
 
FORM 20-F
 
ANNUAL REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE
SECURITIES EXCHANGE ACT OF 1934
For the fiscal year ended December 31, 20082010
Commission file number 1-31994
 
Semiconductor Manufacturing International Corporation
(Exact name of Registrant as specified in its charter)
Not Applicable
(Translation of Registrant’s name into English)

 
Cayman Islands
(Jurisdiction of incorporation or organization)
18 Zhangjiang Road, Pudong New Area, Shanghai, China 201203
(Address of principal executive offices)
Ms. Morning Wu, ActingMr. Gary Tseng, Chief Financial Officer
Telephone: (8621) 3861-0000
Facsimile: (8621) 3895-3568
(Name, Telephone, E-mail and/or Facsimile Number and Address of Company Contact Person)
 
Securities registered or to be registered pursuant to Section 12(b) of the Act.
   
Title of each class Name of each exchange on which registered
   
Ordinary Shares, par value US$0.0004 The Stock Exchange of Hong Kong Limited*
American Depositary Shares The New York Stock Exchange, Inc.
Securities registered or to be registered pursuant to Section 12(g) of the Act.
None
(Title of Class)
Securities for which there is a reporting obligation pursuant to Section 15(d) of the Act.
None
(Title of Class)
 
Indicate the number of outstanding shares of each of the issuer’s classes of capital or ordinary shares as of the close of the period covered by the annual report.
As of December 31, 2008,2010, there were 22,327,784,82727,334,063,747 ordinary shares, par value US$0.0004 per share, outstanding, of which 3,154,359,5502,229,887,950 ordinary shares were held in the form of 63,087,19144,597,759 ADSs. Each ADS represents 50 ordinary shares.
Indicate by check mark if the registrant is a well-known seasoned issuer, as defined in Rule 405 of the Securities Act. Yesþ Noo
If this report is an annual or transition report, indicate by check mark if the registrant is not required to file reports pursuant to Section 13 or 15 (d) of the Securities Exchange Act of 1934. Yeso Noþ
Indicate by check mark whether the registrant: (1) has filed all reports required to be filed by Section 13 or 15(d) of the Securities Exchange Act of 1934 during the preceding 12 months (or for such shorter period that the registrant was required to file such reports), and (2) has been subject to such filing requirements for the past 90 days. Yesþ Noo
Indicate by check mark whether the registrant has submitted electronically and posted on its corporate Web site, if any, every Interactive Data File required to be submitted and posted pursuant to Rule 405 of Regulation S-T (§232.405 of this chapter) during the preceding 12 months (or for such shorter period that the registrant was required to submit and post such files).Yeso Noþ
Indicate by check mark whether the registrant is a large accelerated filer, an accelerated filer, or a non-accelerated filer. See definition of “accelerated filer and large accelerated filer” in Rule 12b-2 of the Securities Exchange Act of 1934 (Check one):
 
Large accelerated filerþ Accelerated filero Non-accelerated fileroSmaller reporting companyo
(Do not check if a smaller reporting company)
Indicate by check mark which basis of accounting the registrant has used to prepare the financial statements included in this filing:
     
U.S. GAAPþ International Financial Reporting Standards as issued
Othero
by the International Accounting Standards Boardo Other
If this is an annual report, indicate by check mark whether the registrant is a shell company (as defined in Rule 12b-2 of the Securities Exchange Act of 1934). Yeso Noþ
* Not for trading, but only in connection with the listing of American Depositary Shares on the New York Stock Exchange, Inc.
 
 

 


CAUTIONARY STATEMENT FOR PURPOSES OF THE “SAFE HARBOR” PROVISIONS OF THE PRIVATE SECURITIES LITIGATION REFORM ACT OF 1995
   
 
 
  4
 
  4
 
  4
 
  24
49
 
  49
 
  69
 
  86
 
  88
 
  92
 
  93
 
  100
 
  101
 
PART II  
101
 
  101
 
  102
 
  102
 
  102
 
  103
 
  103
 
  103
 
  
103


 
Item 16F. Change in Registrant Certifying Accountant  
 
  104
 
PART III  
105
 
  105
 
  105
 
  105
 
  107
 
 Exhibit 4.4EX-4.11
 Exhibit 4.5EX-4.12
 Exhibit 8.1EX-4.13
 Exhibit 12.1EX-4.14
 Exhibit 12.2EX-4.15
 Exhibit 13.1EX-8.1
 Exhibit 99.1EX-12.1
EX-12.2
EX-13.1
EX-99.1
EX-101 INSTANCE DOCUMENT
EX-101 SCHEMA DOCUMENT
EX-101 CALCULATION LINKBASE DOCUMENT
EX-101 LABELS LINKBASE DOCUMENT
EX-101 PRESENTATION LINKBASE DOCUMENT
EX-101 DEFINITION LINKBASE DOCUMENT

 

2


CAUTIONARY STATEMENT FOR PURPOSES OF THE “SAFE HARBOR” PROVISIONS OF THE PRIVATE SECURITIES LITIGATION REFORM ACT OF 1995
This annual report contains, in addition to historical information, “forward-looking statements” within the meaning of the “safe harbor” provisions of the U.S. Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on SMIC’s current assumptions, expectations and projections about future events. SMIC uses words like “believe,” “anticipate,” “intend,” “estimate,” “expect,” “project” and similar expressions to identify forward looking statements, although not all forward-looking statements contain these words. These forward-looking statements are necessarily estimates reflecting the best judgment of SMIC’s senior management and involve significant risks, both known and unknown, uncertainties and other factors that may cause SMIC’s actual performance, financial condition or results of operations to be materially different from those suggested by the forward-looking statements including, among others, risks associated with cyclicality and market conditions in the semiconductor industry, intense competition, timely wafer acceptance by SMIC’s customers, timely introduction of new technologies, SMIC’s ability to ramp new products into volume, supply and demand for semiconductor foundry services, our anticipated capital expenditures for 2011, our anticipated investments in research and development, anticipated changes to our liability for unrecognized tax benefits, industry overcapacity, shortages in equipment, components and raw materials, availability of manufacturing capacity the current global financial crisis, orders or judgments from pending litigation and financial stability in end markets.
Except as required by law, SMIC undertakes no obligation and does not intend to update any forward-looking statement, whether as a result of new information, future events or otherwise.
ADDITIONAL INFORMATION
References in this annual report to:
“Average selling price of wafers” are to simplified average selling price which is calculated as total revenue divided by total shipments.
“China” or the “PRC” are to the People’s Republic of China, excluding for the purpose of this annual report, Hong Kong, Macau and Taiwan;
“Company” or “SMIC” are to Semiconductor Manufacturing International Corporation;
“EUR” are to Euros;
“global offering” are to the initial public offering of our ADSs and our ordinary shares, which offering was completed on March 18, 2004;
“HK$” are to Hong Kong dollars;
“Jpy” are to Japanese Yen;
“NYSE” or “New York Stock Exchange” are to the New York Stock Exchange, Inc.;
“Rmb” or “RMB” are to Renminbi;
“SEC” are to the U.S. Securities and Exchange Commission;
“SEHK”, “HKSE” or “Hong Kong Stock Exchange” are to The Stock Exchange of Hong Kong Limited; and
“US$” or “USD” are to U.S. dollars.
“Average selling price of wafers” are to simplified average selling price which is calculated as total revenue divided by total shipments.
“China” or the “PRC” are to the People’s Republic of China, excluding for the purpose of this annual report, Hong Kong, Macau and Taiwan;
“Company” or “SMIC” are to Semiconductor Manufacturing International Corporation;
“EUR” are to Euros;
“global offering” are to the initial public offering of our ADSs and our ordinary shares, which offering was completed on March 18, 2004;
“HK$” are to Hong Kong dollars;
“NYSE” or “New York Stock Exchange” are to the New York Stock Exchange, Inc.;
“Rmb” or “RMB” are to Renminbi;
“SEC” are to the U.S. Securities and Exchange Commission;
“SEHK”, “HKSE” or “Hong Kong Stock Exchange” are to The Stock Exchange of Hong Kong Limited; and

 

3


“US$” or “USD” are to U.S. dollars.
All references in this annual report to silicon wafer quantities are to 8-inch wafer equivalents, unless otherwise specified. Conversion of quantities of 12-inch wafers to 8-inch wafer equivalents is achieved by multiplying the number of 12-inch wafers by 2.25. When we refer to the capacity of wafer fabrication facilities, we are referring to the installed capacity based on specifications established by the manufacturers of the equipment used in those facilities. References to key process technology nodes, such as 0.35 micron, 0.25 micron, 0.18 micron, 0.15 micron, 0.13 micron, 90 nanometer, and 65 nanometer and 45 nanometer include the stated resolution of the process technology, as well as intermediate resolutions are down to but not including the next key process technology node of finer resolution. For example, when we state “0.25 micron process technology,” that also includes 0.22 micron, 0.21 micron, 0.20 micron and 0.19 micron technologies.technologies and “0.18 micron process technology” also includes 0.17 micron and 0.16 micron technologies; “0.15 micron process technology” includes 0.14 micron technology; and “0.13 micron process technology” includes 0.11 micron and 0.10 micron technologies. References to “U.S. GAAP” mean the generally accepted accounting principles in the United States. Unless otherwise indicated, our financial information presented in this annual report has been prepared in accordance with U.S. GAAP.
All references to our ordinary shares in this annual report gives effect to the 10-for-1 share split we effected in the form of a share dividend immediately prior to the completion of the global offering. All references to price per ordinary share and price per preference share reflect the share split referenced above.
The “Glossary of Technical Terms” contained in Annex A of this annual report sets forth the description of certain technical terms and definitions used in this annual report.
PART I
Item 1. Identity of Directors, Senior Management and Advisors
Not applicable.
Item 2. Offer Statistics and Expected Timetable
Not applicable.
Item 3. Key Information
Selected Consolidated Financial Data
The selected consolidated financial data presented below as of and for the years ended December 31, 2006, 20072008, 2009 and 20082010 are derived from, and should be read in conjunction with, and are qualified in their entirety by reference to, our audited consolidated financial statements, including the related notes, included elsewhere in this annual report. The selected consolidated financial data as of and for the years ended December 31, 20042006 and 20052007 is derived from our audited consolidated financial statements not included in this annual report. The selected consolidated financial data presented below has been prepared in accordance with U.S. GAAP.
                     
  For the year ended December 31, 
  2004  2005  2006  2007  2008 
  (in US$ thousands, except for per share, per ADS data, percentages, and operating data) 
                     
Statement of Operations Data:
                    
Sales $974,664  $1,171,319  $1,465,323  $1,549,765  $1,353,711 
 
Cost of sales(1)
  716,225   1,105,134   1,338,155   1,397,038   1,412,851 
Gross profit  258,439   66,185   127,168   152,727   (59,140)

 

4


                                        
 For the year ended December 31,  For the year ended December 31,
 2004 2005 2006 2007 2008  2006 2007 2008 2009 2010
 (in US$ thousands, except for per share, per ADS data, percentages, and operating data)  (in US$ thousands, except for share, ADS, percentages, and operating data)
 
Operating expenses: 
Statement of Operations Data:
 
Sales $1,465,323 $1,549,765 $1,353,711 $1,070,387 $1,554,788 
Cost of sales(1)
 1,338,155 1,397,038 1,412,851 1,184,589 1,244,714 
Gross profit (loss) 127,168 152,727  (59,140)  (114,202) 310,074 
Operating expenses (income): 
Research and development 74,113 78,865 94,171 97,034 102,240  94,171 97,034 102,240 160,754 174,900 
General and administrative 54,038 35,701 47,365 74,490 58,841  47,365 74,490 67,037 218,688 43,762 
Selling and marketing 10,384 17,713 18,231 18,716 20,661  18,231 18,716 20,661 26,566 29,498 
Litigation settlement 16,695         269,637  
Amortization of acquired intangible assets 24,393 27,071 32,191 35,064 27,168 
Impairment loss of long-lived assets   106,741 138,295 8,442 
Loss (gain) from sale of plant and equipment and other fixed assets  (43,122)  (28,651)  (2,877) 3,832  (658)
Other operating income      (16,493)
  
Amortization of acquired intangible assets 14,368 20,946 24,393 27,071 32,191 
 
Impairment loss of long-lived assets     106,741 
 
Income from sale of plant and equipment and other fixed assets    (43,122)  (28,651)  (2,877)
 
Total operating expenses 169,598 153,225 141,038 188,659 317,797 
Total operating expenses, net 141,038 188,659 325,993 852,836 266,620 
  
Income (loss) from operations 88,841  (87,040)  (13,870)  (35,932)  (376,937)  (13,870)  (35,932)  (385,132)  (967,038) 43,455 
Other income (expenses):  
  
Interest income 10,587 11,356 14,916 12,349 11,542  14,916 12,349 11,542 2,591 4,127 
  
Interest expense  (13,698)  (38,784)  (50,926)  (37,936)  (50,767)  (50,926)  (37,936)  (50,767)  (24,699)  (22,656)
  
Change in the fair value of commitment to issue shares and warrants     (30,101)  (29,815)
 
Foreign currency exchange gain (loss) 8,218  (3,355)  (21,912) 11,250 3,230   (21,912) 11,250 11,425 7,302 5,025 
Other, net 2,441 4,462 1,821 2,238 7,429  1,821 2,238 7,429 4,626 8,772 
  
Total other income (expense), net 7,548  (26,322)  (56,101)  (12,100)  (28,566)
Total other expense, net  (56,101)  (12,100)  (20,371)  (40,280)  (34,547)
  
Income (loss) before income tax 96,389  (113,362)  (69,971)  (48,032)  (405,503)  (69,971)  (48,032)  (405,503)  (1,007,319) 8,907 
 
Income tax benefit (expense) 24,928 29,720  (26,433) 46,624 4,818 
 
Gain (loss) from equity investment  (4,201)  (4,013)  (444)  (1,782) 285 
 
Net income (loss) before cumulative effect of a change in accounting principle  (49,244)  (22,324)  (432,380)  (962,478) 14,011 
 
Cumulative effect of a change in accounting principle 5,154     

 

5


                     
  For the year ended December 31, 
  2004  2005  2006  2007  2008 
  (in US$ thousands, except for per share, per ADS data, percentages, and operating data) 
                     
Income tax benefit (expense)  (186)  (285)  24,928   29,720   (26,433)
                     
Minority interest     251   (19)  2,856   (7,851)
                     
Loss from equity investment     (1,379)  (4,201)  (4,013)  (444)
                     
Net (loss) income before cumulative effect of a change in accounting principle  96,203   (114,775)  (49,263)  (19,468)  (440,231)
                     
Cumulative effect of a change in accounting principle        5,154       
                     
Net (loss) income  96,203   (114,775)  (44,109)  (19,468)  (440,231)
                     
Deemed dividend on preference shares(2)
  18,840             
                     
Income (loss) attributable to holders of ordinary shares  77,363   (114,775)  (44,109)  (19,468)  (440,231)
                     
Income (loss) per ordinary share, basic $0.01  $(0.00) $(0.00) $(0.00) $(0.02)
                     
Income (loss) per ordinary share, diluted $0.00  $(0.00) $(0.00) $(0.00) $(0.02)
                     
Ordinary shares used in calculating basic income (loss) per ordinary share(4)
  14,199,163,517   18,184,429,255   18,334,498,923   18,501,940,489   18,682,544,866 
                     
Ordinary shares used in calculating diluted income (loss) per ordinary share(3)(4)
  17,934,393,066   18,184,429,255   18,334,498,923   18,501,940,489   18,682,544,866 

6


                               
 For the year ended December 31,  For the year ended December 31,
 2004 2005 2006 2007 2008  2006 2007 2008 2009 2010
 (in US$ thousands, except for per share, per ADS data, percentages, and operating data)  (in US$ thousands, except for share, ADS, percentages, and operating data)
Net income (loss)  (44,090)  (22,324)  (432,380)  (962,478) 14,011 
  
Income (loss) per ADS,basic(5)
 $0.27 $(0.32) $(0.12) $(0.05) $(1.18)
Accretion of interest to noncontrolling interest  (19) 2,856  (7,851)  (1,060)  (1,050)
  
Income (loss) per ADS,diluted(5)
 $0.22 $(0.32) $(0.12) $(0.05) $(1.18)
Loss attributed to noncontrolling interest     140 
  
ADS used in calculating basic income (loss) per ADS(5)
 283,983,270 363,688,585 366,689,978 370,038,810 373,650,897 
Income (loss) attributable to Semiconductor Manufacturing International Corporation  (44,109)  (19,468)  (440,231)  (963,537) 13,100 
  
ADS used in calculating diluted income (loss) per ADS(5)
 358,687,861 363,688,585 366,689,978 370,038,810 373,650,897 
Earnings (loss) per share, basic $(0.00) $(0.00) $(0.02) $(0.04) $0.00 
  
Earnings (loss) per share, diluted $(0.00) $(0.00) $(0.02) $(0.04) $0.00 
 
Shares used in calculating basic earnings (loss) per share(2)(3)
 18,334,498,923 18,501,940,489 18,682,544,866 22,359,237,084 24,258,437,559 
 
Shares used in calculating diluted earnings (loss) per share(3)
 18,334,498,923 18,501,940,489 18,682,544,866 22,359,237,084 25,416,597,405 
 
Earnings (loss) per ADS, basic(3)
 $(0.12) $(0.05) $(1.18) $(2.15) $0.03 
 
Earnings (loss) per ADS, diluted(3)
 $(0.12) $(0.05) $(1.18) $(2.15) $0.03 
 
ADS used in calculating basic earnings (loss) per ADS 366,689,978 370,038,810 373,650,897 447,184,742 485,168,751 
 
ADS used in calculating diluted earnings (loss) per ADS 366,689,978 370,038,810 373,650,897 447,184,742 508,331,948 
Other Financial Data:
  
Gross margin  26.50%  5.70%  8.70%  9.90%  -4.40%  8.70%  9.90%  -4.40%  -10.67%  19.94%
 
Operating margin  9.10%  -7.40%  -0.90%  -2.30%  -27.80%  -0.90%  -2.30%  -27.80%  -90.05%  2.79%
Net margin  9.90%  -9.80%  -3.00%  -1.30%  -32.50%  -3.00%  -1.30%  -32.50%  -89.92%  0.90%
  
Operating Data:
  
Wafers shipped (in 8” equivalents)  
Total 943,463 1,347,302 1,614,888 1,849,957 1,611,208  1,614,888 1,849,957 1,611,208 1,376,663 1,985,974 
ASP(6)
 1,033 869 907 838 840 
ASP(4)
 907 838 840 778 783 
 
(1) Including amortization of deferred stockshare-based compensation for employees directly involved in manufacturing activities.


(2)Deemed dividend represents the difference between the sale and conversion prices of warrants to purchase convertible preference shares we issued and their respective fair market values.
(3) Anti-dilutive preference shares, options and warrants were excluded from the weighted average ordinary shares outstanding for the diluted per share calculation.
 
(4)All share information has been adjusted retroactively to reflect the 10-for-1 share split effected upon completion of the global offering of our ordinary shares in March 2004.
(5)(3) Fifty ordinary shares equals one ADS.
 
(6)(4) Total sales/total wafers shipped.
                     
  As of December 31,
  2006 2007 2008 2009 2010
  (in US$ thousands)
Balance Sheet Data:
                    
                     
Cash and cash equivalents $363,620  $469,284  $450,230  $443,463  $515,808 
                     
Restricted cash        6,255   20,360   161,350 
Short-term investments  57,951   7,638   19,928      2,454 
                     
Accounts receivable, net of allowances  252,185   298,388   199,372   204,290   206,623 
Inventories  275,179   248,310   171,637   193,705   213,404 
Total current assets  1,049,666   1,075,302   926,858   907,058   1,179,102 
Prepaid land use rights  38,323   57,552   74,293   78,112   78,798 
                     
Plant and equipment, net  3,244,401   3,202,958   2,963,386   2,251,614   2,351,863 
Total assets  4,541,292   4,708,444   4,270,622   3,524,077   3,902,693 
Total current liabilities  677,362   930,190   899,773   1,031,523   1,399,345 
Total long-term liabilities  817,710   730,790   578,689   661,472   294,806 
                     
Total liabilities  1,495,072   1,660,980   1,478,462   1,692,995   1,694,152 
                     
Noncontrolling interest  38,800   34,944   42,795   34,842   39,004 
Equity:                    
Ordinary shares, $0.0004 par value, 50,000,000,000 shares authorized 18,432,756,463, 18,558,919,712, 22,327,784,827, 22,375,886,604 and 27,334,063,747 shares issued and outstanding at December 31, 2006, 2007, 2008, 2009 and 2010, respectively  7,373   7,424   8,931   8,950   10,934 
Additional paid-in capital  3,288,765   3,313,376   3,489,382   3,499,723   3,858,643 
Accumulated other comprehensive loss (income)  92   (2)  (439)  (386)  (1,092)
Accumulated deficit  (288,810)  (308,279)  (748,509)  (1,712,047)  (1,698,946)
Total equity $3,007,420  $3,012,519  $2,749,365  $1,796,240  $2,169,537 

 

7


                     
  As of December 31, 
  2004  2005  2006  2007  2008 
  (in US$ thousands) 
                     
Balance Sheet Data:
                    
                     
Cash and cash equivalents $607,173  $585,797  $363,620  $469,284  $450,230 
                     
Restricted cash              6,255 
Short-term investments  20,364   13,796   57,951   7,638   19,928 
                     
Accounts receivable, net of allowances  169,188   241,334   252,185   298,388   199,372 
Inventories  144,018   191,238   275,179   248,310   171,637 
Total current assets  955,418   1,047,465   1,049,666   1,075,302   926,858 
Land use rights, net  39,198   34,768   38,323   57,552   74,293 
                     
Plant and equipment, net  3,311,925   3,285,631   3,244,401   3,202,958   2,963,386 
Total assets  4,384,276   4,586,633   4,541,292   4,708,444   4,270,622 
Total current liabilities  723,871   896,038   677,362   930,190   899,773 
Total long-term liabilities  544,462   622,497   817,710   730,790   578,689 
                     
Total liabilities  1,268,333   1,518,535   1,495,072   1,660,980   1,478,462 
                     
Minority interest     38,782   38,800   34,944   42,795 
Stockholders’ equity $3,115,942  $3,029,316  $3,007,420  $3,012,519  $2,749,365 
                     
  For the year ended December 31,
  2006 2007 2008 2009 2010
  (in US$ thousands)
Cash Flow Data:
                    
                     
Net income (loss) $(44,090) $(22,324) $(432,380) $(962,478) $14,011 
Adjustments to reconcile net income (loss) to net cash provided by operating activities:                    
Depreciation  919,616   706,277   761,809   748,185   584,242 
Net cash provided by operating activities  769,649   672,465   569,782   283,566   694,613 
Purchases of plant and equipment  (882,580)  (717,171)  (669,055)  (217,269)  (491,539)
Net cash used in investing activities  (917,369)  (642,344)  (761,713)  (211,498)  (538,713)
Net cash provided by (used in) financing activities  (74,440)  75,637   173,314   (78,902)  (37,851)
Net increase (decrease) in cash and cash equivalents $(222,177) $105,664  $(19,054) $(6,767) $72,346 

 

8


                     
  For the year ended December 31, 
  2004  2005  2006  2007  2008 
  (in US$ thousands, except percentages) 
                     
Cash Flow Data:
                    
                     
Net income (loss) $96,203  $(114,775) $(49,263) $(19,468) $(440,231)
Adjustments to reconcile net loss to net cash provided by (used in) operating activities:                    
Depreciation and amortization  456,961   769,472   919,616   706,277   761,809 
Net cash provided by operating activities  518,662   648,105   769,649   672,465   569,782 
Purchases of plant and equipment  (1,838,773)  (872,519)  (882,580)  (717,171)  (669,055)
Net cash used in investing activities  (1,826,787)  (859,652)  (917,369)  (643,344)  (761,713)
Net cash provided by (used in) financing activities  1,469,764   190,364   (74,440)  76,637   173,314 
Net increase (decrease) in cash and cash equivalents $161,896  $(21,376) $(222,177) $105,664  $(19,054)
Other Financial Data:                    
Gross margin  26.50%  5.70%  8.70%  9.90%  -4.40%
Operating margin  9.10%  -7.40%  -0.90%  -2.30%  -27.80%
Net margin  9.90%  -9.80%  -3.00%  -1.30%  -32.50%
Risk Factors
Risks Related to Our Financial Condition and Business
We may not be able to achieve or maintain a level of profitability, primarily due to our high fixed costs and correspondingly high levels of depreciation expenses.
Our losses from operations totaled $35.9$963.5 million in 2007 and $376.92009, while income from operations totaled $13.1 million in 2008.2010. We may not be able to achieve or maintain profitability on an annual or quarterly basis, primarily because our business is characterized by high fixed costs relating to equipment purchases, which result in correspondingly high levels of depreciation expenses. We will continue to incur high capital expenditures and depreciation expenses as we equip and ramp up additional fabs, expand our capacity at our existing fabs and construct new fabs.
The cyclical nature of the semiconductor industry and periodic overcapacity in the industry make our business and operating results particularly vulnerable to economic downturns, such as the current global economic crisis.
The semiconductor industry has historically been highly cyclical and, at various times, has experienced significant downturns characterized by fluctuations in end-user demand, reduced demand for integrated circuits, rapid erosion of average selling prices and production overcapacity. Companies in the semiconductor industry have expanded aggressively during periods of increased demand in order to have the capacity needed to meet expected demand in the future. If actual demand does not increase or declines, or if companies in the industry expand too aggressively in light of the actual increase in demand, the industry will generally experience a period in which industry-wide capacity exceeds demand, as was the case in the first quarter of 2009 during the current global economic crisis.2009.
During the current global economic crisis, the United States and other countries around the world have been experiencing deteriorating economic conditions. There has been an     An erosion of global consumer confidence amidst concerns over declining asset values, inflation, energy costs, geopolitical issues, the availability and cost of credit, rising unemployment, and the stability and solvency of financial institutions, financial markets, businesses and sovereign nations.nations could have an adverse effect on our results of operations.

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Adverse economic conditions could cause our expenses to vary materially from our expectations. The failure of financial institutions could negatively impact our treasury operations, as the financial condition of such parties may deteriorate rapidly and without notice in times orof market volatility and disruption. Other income and expense could vary materially from expectations depending on changes in interest rates, borrowing costs and currency exchange rates. Economic downturns may also may lead to restructuring actions and associated expenses.
During periods when industry-wide capacity exceeds demand, as was the case in the first quarter of 2009, during the current global economic crisis, our operations are subject to more intense competition, and our results of operations are likely to suffer because of the resulting pricing pressure and capacity underutilization. Severe pricing pressure could result in the overall foundry industry becoming less profitable, at least for the duration of the downturn, and could prevent us from achieving or maintaining profitability. We expect that industry cyclicality will continue. In addition, a slowdown in the growth in demand for or the continued reduction in selling prices of, devices that use semiconductors may decrease the demand for our services and reduce our profit margins. If we cannot take appropriate or effective actions in a timely manner during the current and any future economic downturns, such as reducing our costs to sufficiently offset declines in demand for our services, our business and operating results may be adversely affected. A prolonged period of economic decline could have a material adverse effect on our results of operations. Economic uncertainty also makes it difficult for us to make accurate forecasts of revenue, gross margin and expenses.
The loan agreements entered into by members of the Group contain certain restrictions that
limit our flexibility in operating our business.
     The terms of certain of the existing loan agreements entered into by members of the Group contain, and certain future indebtedness of the Group would likely contain, a number of restrictive covenants that impose significant operating and financial restrictions on the Group, including restrictions on the ability of members the Group to, among other things:
pay dividends;
pay shareholder loans; and
consolidate, merge or sell or otherwise dispose of any of our assets under certain conditions.
     In addition, certain loan agreements of the Group contain, and any future loan agreements may contain, cross-default clauses whereby a default under one of the loan agreements may constitute an event of default under the other loan agreements. We may also be required to satisfy and maintain specified financial ratios and other financial covenants. The Group’s ability to meet such financial ratios and other covenants can be affected by events beyond our control, and we cannot assure you that we will meet these ratios and comply with such covenants in the future. A breach of any of these covenants would result in a default under the existing loan agreements of the Group, which may allow the lenders to declare all amounts outstanding thereunder to be due and payable after the lapse of the relevant grace period and terminate all commitments to extend further credit, any of which could result in an event of default under the Terms and Conditions of the Notes.


The impact of deteriorating economic conditions on our customers and suppliers could adversely affect our business.
Customer financial difficulties have resulted, and could result in the future, in increases in bad debt write-offs and additions to reserves in our receivables portfolio. In particular, our exposure to certain financially troubled customers could have an adverse affect on our results of operations. In addition, we depend on suppliers of raw materials, such as silicon wafers, gases and chemicals, and spare equipment parts, in order to maintain our production processes. Our business may be disrupted if we are unable to obtain these raw materials from our suppliers—andsuppliers-and our suppliers from their suppliers—duesuppliers-due to the insolvency of key suppliers who may be unable to obtain credit. Although the operations of certain of our suppliers were disrupted by the March 2011 earthquake in Japan, our business was not materially impacted by the natural disaster.
The former trend of increasing demandDemand instability for foundry services has slowed down, primarily as amay result of the current global economic crisis. As a result, we may achievein a lower rate of return on investments than previously anticipated and our business and operating results may be adversely affected.
Until the onset of the current global economic crisis, the demand for foundry services by IDMs, fabless semiconductor companies and systems companies had been increasing in recent years. We made significant investments in anticipation of the continuation of this trend. TheA reversal of this trend as a result of the current global economic crisis will likely result in a lower rate of return on our investments than anticipated. For example, some IDMs have changedmay change their strategy and targetedtarget greater internal production, and consequently they have reducedmay reduce their outsourcing of wafer fabrication. In addition, as a result of the currentDuring industry downturn, in order to maintain their equipment’s utilization rates, these IDMs may allocate a smaller portion of their fabricating needs to foundry service providers and perform a greater amount of foundry services for system companies and fabless semiconductor companies.companies in order to maintain their equipment’s utilization rates. As a result, our business and operating results may be adversely affected.
Our results of operations may fluctuate from year to year, which may make it difficult to predict our future performance which may be below our expectations or those of the public market analysts and investors in these periods.
Our sales, expenses, and results of operations may fluctuate significantly from year to year due to a number of factors, many of which are outside our control. Our business and operations are subject to a number of factors, including:
our customers’ sales outlook, purchasing patterns and inventory adjustments based on general economic conditions or other factors;
the loss of one or more key customers or the significant reduction or postponement of orders from such customers;
timing of new technology development and the qualification of this technology by our customers;

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our customers’ sales outlook, purchasing patterns and inventory adjustments based on general economic conditions or other factors;
the loss of one or more key customers or the significant reduction or postponement of orders from such customers;
timing of new technology development and the qualification of this technology by our customers;
timing of our expansion and development of our facilities;
our ability to obtain equipment and raw materials; and
our ability to obtain financing in a timely manner.
timing of our expansion and development of our facilities;
our ability to obtain equipment and raw materials; and
our ability to obtain financing in a timely manner.
Due to the factors noted above and other risks discussed in this section, many of which are beyond our control, you should not rely on year-to-year comparisons to predict our future performance. Unfavorable changes in any of the above factors may adversely affect our business and operating results. In addition, our operating results may be below the expectations of public market analysts and investors in some future periods.


If we are unable to maintain high capacity utilization, optimize the technology and product mix of our services or improve our yields, our margins may substantially decline, thereby adversely affecting our operating results.
Our ability to achieve and maintain profitability depends, in part, on our ability to:
maintain high capacity utilization, which is the actual number of wafers we produce in relation to our capacity;
maintain high capacity utilization, which is the actual number of wafers we produce in relation to our capacity;
optimize our technology and product mix, which is the relative number of wafers fabricated utilizing higher margin technologies as compared to commodity and lower margin technologies; and
continuously maintain and improve our yield, which is the percentage of usable fabricated devices on a wafer.
optimize our technology and product mix, which is the relative number of wafers fabricated utilizing higher margin technologies as compared to commodity and lower margin technologies; and
continuously maintain and improve our yield, which is the percentage of usable fabricated devices on a wafer.
Our capacity utilization affects our operating results because a large percentage of our costs are fixed. In general, more advanced technologies sell for higher prices and higher margins. Therefore, our technology and product mix has a direct impact upon our average selling prices and overall margins. Our yields directly affect our ability to attract and retain customers, as well as the price of our services. If we are unable to maintain high capacity utilization, optimize the technology and product mix of our wafer production and continuously improve our yields, our margins may substantially decline, thereby adversely affecting our operating results.
Our rapidcontinuing expansion has presentedmay present significant challenges to our management and administrative systems and resources, and as a result, we may experience difficulties managing our growth, which may adversely affect our business and operating results.
Since our inception in 2000, we have grown rapidly. Our wafer shipment and sales grew from zero in 2000 to 1,611,2081,985,974 wafers and US$1.41.55 billion in 2008.2010. During this period, we commenced commercial production at two 8-inch fabs (which includes our Shanghai mega fab and Tianjin fab) and one 12-inch mega fab in Beijing, and the range of process technologies we offered grew significantly. We arehave also in the process of ramping up one additional 12-inch fab at our Shanghai site and have already undertaken management contracts to manage the operations of wafer manufacturing facilities in Chengdu and Wuhan, China. In addition, we are constructing one additionalequipping our new 8-inch fab in Shenzhen. At December 31, 2000, we had 122 employees; and at December 31, 2008,2010, we had 10,59810,076 employees. We may hire a significant number of additional employees asfor our fabs in Tianjin, Beijing and Shanghai increaseto meet future increases in production capacity. This expansion, as well as our participation in a joint venture with Toppan Printing Co., Ltd. in Shanghai and a joint venture with United Test and Assembly Center Ltd. to establish an assembly and testing facility in Chengdu (which joint venture, we have substantially exited in 2011), and the management of wafer manufacturing facilities in Chengdu (which fab agreement was subsequently terminated in 2010) and Wuhan, China, have presented, and continue to present, significant challenges for our management and administrative systems and resources. If we fail to develop and maintain management and administrative systems and resources sufficient to keep pace with our planned growth, we may experience difficulties managing our growth and our business and operating results could be adversely affected.
If we lose one or more of our key personnel without obtaining adequate replacements in a timely manner or if we are unable to retain and recruit skilled personnel, our operations could become disrupted and the growth of our business could be delayed or restricted.
Our success depends on the continued service of our key executive officers, and in particular, Richard Ru Gin Chang,David NK Wang, our President and Chief Executive Officer. We do not carry key person insurance on any of our personnel. If we lose the services of any of our key executive officers, it could be very difficult to find, relocate and integrate adequate replacement personnel into our operations, which could seriously harm our operations and the growth of our business.

 

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We will require an increased number of experienced executives, engineers and other skilled employees in the future to implement our growth plans. There is intense competition for the services of these personnel in the semiconductor industry. In addition, we expect demand for skilled and experienced personnel in China to increase in the future as new wafer fabrication facilities and other similar high technology businesses are established there. If we are unable to retain our existing personnel or attract, assimilate and retain new experienced personnel in the future, our operations could become disrupted and the growth of our business could be delayed or restricted.
Our customers generally do not place purchase orders far in advance, which makes it difficult for us to predict our future sales, adjust our production costs and efficiently allocate our capacity on a timely basis and could therefore have an adverse effect on our business and operating results.
Our customers generally do not place purchase orders far in advance of the required shipping dates. In addition, due to the cyclical nature of the semiconductor industry, our customers’ purchase orders have varied significantly from period to period. As a result, we do not typically operate with any significant backlog, which makes it difficult for us to forecast our sales in future periods. Also, since our cost of sales and operating expenses have high fixed cost components, including depreciation and employee costs, we may be unable to adjust our cost structure in a timely manner to compensate for shortfalls in sales. Our current and anticipated customers may not place orders with us in accordance with our expectations or at all. As a result, it may be difficult to plan our capacity, which requires significant lead time to ramp-up and cannot be altered easily. If our capacity does not match our customer demand, we will either be burdened with expensive and unutilized overcapacity or unable to support our customers’ requirements, both of which could have an adverse effect on our business and results of operations.
Our sales cycles can be long, which could adversely affect our operating results and cause our income stream to be unpredictable.
Our sales cycles, which measure the time between our first contact with a customer and the first shipment of product orders to the customer, vary substantially and can last as long as one year or more, particularly for new technologies. Sales cycles to IDM customers typically take relatively longer since they usually require our engineers to become familiar with the customer’s proprietary technology before production can commence. In addition, even after we make the initial product shipments, it may take the customer several more months to reach full production of that product using our foundry services. As a result of these long sales cycles, we may be required to invest substantial time and incur significant expenses in advance of the receipt of any product order and related revenue. Orders ultimately received may not be in accordance with our expectation with respect to product, volume, price or other terms, which could adversely affect our operating results and cause our income stream to be unpredictable.
We must consistently anticipate trends in technology development or else we will be unable to maintain or increase our business and operating margins.
The semiconductor industry is developing rapidly and the related technology is constantly evolving. If we are unable to anticipate the trends in technology development and rapidly develop and implement new and innovative technology that our customers require, we may not be able to produce sufficiently advanced products at competitive prices. As the life cycle for a process technology matures, the average selling price falls. Accordingly, unless we continually upgrade our capability to manufacture any new products that our customers design, our customers may use the services of our competitors instead of ours and the average selling prices of our wafers may fall, which could adversely affect our business and operating margins.


Our sales are dependent upon a small number of customers and any decrease in sales to any of them could adversely affect our results of operations.
We have been dependent on a small number of customers for a substantial portion of our business. For the year ended December 31, 2008,2010, our five largest customers accounted for 58.2%53.7% of our total sales. We expect that we will continue to be dependent upon a relatively limited number of customers for a significant portion of our sales. Sales generated from these customers, individually or in the aggregate, may not reach or exceed our expectations or historical levels in any future period. Our sales could be significantly reduced if any of these customers cancels or reduces its orders, significantly changes its product delivery schedule, or demands lower prices, which could have an adverse effect on our results of operations.

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Since our operating cash flows will not be sufficient to cover our planned capital expenditures, we will require additional external financing, which may not be available on acceptable terms or at all. Any failure to raise adequate funds in a timely manner could adversely affect our business and operating results.
In 2008,2010, our capital expenditures totaled approximately US$666728 million and we currently expect our capital expenditures in 20092011 to total approximately US$190 million1 billion which is subject to be adjustedadjustment based on market conditions. These capital expenditures will be used primarily to expand our operations at our mega-fabsmega-fab in ShanghaiBeijing and Beijing.12-inch fab in Shanghai. In addition, our actual expenditures may exceed our planned expenditures for a variety of reasons, including changes in our business plan, our process technology, market conditions, equipment prices, customer requirements or interest rates. Future acquisitions, mergers, strategic investments, or other developments also may require additional financing. The amount of capital required to meet our growth and development targets is difficult to predict in the highly cyclical and rapidly changing semiconductor industry.
Our operating cash flows may not be sufficient to meet our capital expenditure requirements in 2009.2011. If our operating cash flows are insufficient, we plan to fund the expected shortfall through bank loans. If necessary, we will also explore other forms of external financing. Our ability to obtain external financing is subject to a variety of uncertainties, including:
  our future financial condition, results of operations and cash flows;
 
  general market conditions for financing activities of semiconductor companies;
 
  our future stock price; and
 
  our future credit rating.
External financing may not be available in a timely manner, on acceptable terms, or at all. Since our capacity expansion is a key component of our overall business strategy, any failure to raise adequate funds could adversely affect our business and operating results.
The construction and equipping of new fabs and the expansion of existing fabs are subject to certain risks that could result in delays or cost overruns, which could require us to expend additional capital and adversely affect our business and operating results.


We plan to continue to expand our business through the development of new and existing fabs. There are a number of events that could delay these expansion projects or increase the costs of building and equipping these or future fabs in accordance with our plans. Such potential events include, but are not limited to:
  shortages and late delivery of building materials and facility equipment;
 
  delays in the delivery, installation, commissioning and qualification of our manufacturing equipment;
 
  seasonal factors, such as a long and intensive wet season that limits construction;
 
  labor disputes;
 
  design or construction changes with respect to building spaces or equipment layout;
 
  delays in securing the necessary governmental approvals and land use rights; and
 
  technological, capacity and other changes to our plans for new fabs necessitated by changes in market conditions.
As a result, our projections relating to capacity, process technology capabilities or technology developments may significantly differ from actual capacity, process technology capabilities or technology developments.
Delays in the construction and equipping or expansion of any of our fabs could result in the loss or delayed receipt of earnings, an increase in financing costs, or the failure to meet profit and earnings projections, any of which could adversely affect our business and operating results.

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If we cannot compete successfully in our industry, particularly in China, our results of operations and financial condition will be adversely affected.
The worldwide semiconductor foundry industry is highly competitive. We compete with other foundries, such as TSMC, United Microelectronics Corporation, or UMC, and Chartered Semiconductor Manufacturing Ltd., or Chartered Semiconductor,GlobalFoundries, as well as the foundry services offered by some IDMs, such as IBM.Samsung Electronics. We also compete with smaller semiconductor foundries in China, Korea, Malaysia and other countries. Some of our competitors have greater access to capital and substantially higher capacity, longer or more established relationships with their customers, superior research and development capability, and greater marketing and other resources than we do. As a result, these companies may be able to compete more aggressively over a longer period of time than we can.
Our competitors have established operations in mainland China in order to compete for the growing domestic market in China. TSMC has commenced commercial production at its fab in China, and UMC has established a relationship with a fab in commercial production in China. We understand that the ability of these fabs to manufacture wafers using certain more advanced technologies is subject to restrictions by the home jurisdiction of TSMC and UMC. SuchUMC; however, such restrictions could be reduced or lifted at any time, which may lead to increased domestic competition with such competitors and adversely affect our business and operating results.
Our ability to compete successfully depends to some extent upon factors outside of our control, including import and export controls, exchange controls, exchange rate fluctuations, interest rate fluctuations and political developments. If we cannot compete successfully in our industry or are unable to maintain our position as a leading foundry in China, our results of operations and financial condition will be adversely affected.


We may be unable to obtain in a timely manner and at a reasonable cost the equipment necessary for our business and therefore may be unable to achieve our expansion plans or meet our customers’ orders, which could negatively impact our competitiveness, financial condition and results of operations.
The semiconductor industry is capital-intensive and requires investment in advanced equipment that is available from a limited number of manufacturers. The market for equipment used in semiconductor foundries is characterized, from time to time, by significant demand, limited supply and long delivery cycles. Our business plan depends upon our ability to obtain our required equipment in a timely manner and at acceptable prices. During times of significant demand for the types of equipment we use, lead times for delivery can be as long as one year. Shortages of equipment could result in an increase in equipment prices and longer delivery times. If we are unable to obtain equipment in a timely manner and at a reasonable cost, we may be unable to achieve our expansion plans or meet our customers’ orders, which could negatively impact our competitiveness, financial condition, and results of operations.
We expect to have an ongoing need to obtain licenses for the proprietary technology of others, which subjects us to the payment of license fees and potential delays in the development and marketing of our products.
While we continue to develop and pursue patent protection for our own technologies, we expect to continue to rely on third party license arrangements to enable us to manufacture certain advanced wafers. As of December 31, 2008,2010, we had been granted four hundred fifty six1,596 patents worldwide, of which, fifty three are57 were in Taiwan, fifty four are140 were in the U.S., and three hundred forty nine are1,399 were in China, whereas we believe our competitors and other industry participants have been issued numerous more patents concerning wafer fabrication in multiple jurisdictions. Our limited patent portfolio may in the future adversely affect our ability to obtain licenses to the proprietary technology of others on favorable license terms due to our inability to offer cross-licensing arrangements. The fees associated with such licenses could adversely affect our financial condition and operating results. They might also render our services less competitive. If for any reason we are unable to license necessary technology on acceptable terms, it may become necessary for us to develop alternative technology internally, which could be costly and delay the marketing and delivery of key products and therefore have an adverse effect on our business and operating results. In addition, we may be unable to independently develop the technology required by our customers on a timely basis or at all, in which case our customers may purchase wafers from our competitors.

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We may be subject to claims of intellectual property rights infringement owing to the nature of our industry, our limited patent portfolio and limitations of the indemnification provisions in our technology license agreements. These claims could adversely affect our business and operating results.
There is frequent intellectual property litigation, involving patents, copyrights, trade secrets, mask works and other intellectual property subject matters, in our industry. In some cases, a company can avoid or settle litigation on favorable terms because it possesses patents that can be asserted against the plaintiff. The limited size of our current patent portfolio will not likelyis unlikely to place us in such a bargaining position. Moreover, some of our technology license agreements with our major technology partners do not provide for us to be indemnified in the event that the processes we license pursuant to such agreements infringe third party intellectual property rights. We could be sued for allegedly infringing one or more patents as to which we will be unable to obtain a license and unable to design around. As a result, we would be foreclosed from manufacturing or selling the products which are dependent upon such technology, which could have a material adverse


effect on our business. We may litigate the issues of whether these patents are valid or infringed, but in the event of a loss we could be required to pay substantial monetary damages and be enjoined from further production or sale of such products.
If we breach the terms and conditions of a settlement agreement regarding the patent and trade secret litigation with TSMC, we may be required to accelerate the payment of the then outstanding amounts due under the settlement agreement. If we are unable to successfully defend ourselves within the current ongoing litigation with TSMC, we may be required to pay damages, obtain a license from TSMC, or discontinue sales of certain of our products.
On August 25, 2006, TSMC filed a lawsuit against the Company and certain subsidiaries, namely SMIC (Shanghai), SMIC (Beijing) and SM IC (Americas) in the Superior Court of the State of California, County of Alameda for alleged breach of a settlement agreement, alleged breach of promissory notes and alleged trade secret misappropriation by the Company. TSMC seeks, among other things, damages, injunctive relief, attorneys’ fees, and the acceleration of the remaining payments outstanding under that settlement agreement.
In the present litigation, TSMC alleges that the Company has incorporated TSMC trade secrets in the manufacture of the Company’s 0.13 micron or smaller process products. TSMC further alleges that as a result of this claimed breach, TSMC’s patent license is terminated and the covenant not to sue is no longer in effect with respect to the Company’s larger process products. The Company has vigorously denied all allegations of misappropriation. The Court has made no finding that TSMC’s claims are valid. The Court has set a trial date of September 8, 2009.
On September 13, 2006, the Company announced that in addition to filing a response strongly denying the allegations of TSMC in the United States lawsuit, it filed on September 12, 2006, a cross-complaint against TSMC seeking, among other things, damages for TSMC’s breach of contract and breach of implied covenant of good faith and fair dealing.
On November 16, 2006, the High Court in Beijing, the People’s Republic of China, accepted the filing of a complaint by the Company and its wholly-owned subsidiaries, namely, SMIC (Shanghai) and SMIC (Beijing), regarding the unfair competition arising from the breach of bona fide (i.e. integrity, good faith) principle and commercial defamation by TSMC (“PRC Complaint”). In the PRC Complaint, the Company is seeking, among other things, an injunction to stop TSMC’s infringing acts, public apology from TSMC to the Company and compensation from TSMC to the Company, including profits gained by TSMC from their infringing acts.
On August 14, 2007, the Company filed an amended cross-complaint against TSMC seeking, among other things, damages for TSMC’s breach of contract and breach of patent license agreement. TSMC thereafter denied the allegations of the Company’s amended cross-complaint and subsequently filed additional claims that the Company breached a settlement agreement by filing an action in the Beijing High Court. The Company has denied these additional claims by TSMC.
On August 15-17, 2007, the California Court held a preliminary injunction hearing on TSMC’s motion to enjoin use of certain process recipes in certain of the Company’s 0.13 micron logic process flows.
On September 7, 2007, the Court denied TSMC’s preliminary injunction motion, thereby leaving unaffected the Company’s development and sales. However, the court required the Company to provide 10 days’ advance notice to TSMC if the Company plans to disclose logic technology to non-SMIC entities under certain circumstances, to allow TSMC to object to the planned disclosure.
In May 2008, TSMC filed a motion in the California Court for summary adjudication against the Company on several of the Company’s cross claims. The Company opposed the motion and on August 6, 2008, the Court granted in part and denied in part TSMC’s motion.
On June 23, 2008, the Company filed in the California court a cross-complaint against TSMC seeking, among other things, damages for TSMC’s unlawful misappropriation of trade secrets from SMIC to improve its competitive position against SMIC.
On July 10, 2008, the California Court held a preliminary injunction hearing on TSMC’s motion to enjoin disclosure of information on certain process recipes in the Company’s 0.30 micron logic process flows to 3rd parties. On August 8, 2008, the Court granted-in-part TSMC’s motion and preliminarily enjoined SMIC from disclosing fourteen 0.30 ìm process steps. On October 3, 2008, SMIC filed a notice of appeal of the Court’s August 8, 2008 Order with the California Court of Appeal. This appeal is currently pending.

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During the pre-trial proceedings in the matter, questions arose regarding the actual terms of the 2005 Settlement Agreement between SMIC and TSMC. Accordingly, the California Court held a preliminary trial on January 13 to 16, 2009, limited to a determination of the terms of the Settlement Agreement and an interpretation of any requirements to “meet and confer” prior to institution of litigation. On March 10, 2009, the Court issued a Statement of Decision finding, in part, that an agreement between the parties was executed on January 30, 2005, and thereafter amended on February 2, 2005, as urged by TSMC. The Company believes the Court’s ruling is erroneous. The ruling may be appealed by SMIC following the filing of a final judgment by the Court in this matter.
On May 1, 2009, the Company filed motions for summary adjudication against TSMC’s claims for breach of promissory notes and violation of The California Uniform Trade Secrets Act. The motions will be heard by the Court on July 17, 2009.
The California Court has further scheduled a trial upon all liability issues related to a selected list of TSMC trade secret claims and SMIC trade secret claims to commence on September 8, 2009.
In the Company’s action in the Beijing High People’s Court, following an unsuccessful challenge to that Court’s jurisdiction by TSMC, the Court has held evidentiary hearings on October 15, October 29, and November 25, 2008. The Court rendered its first-instance judgment on June 10, 2009. Claims of SMIC against TSMC were not supported by the Court in the first-instance judgment. The first-instance judgment is not final and either TSMC or SMIC may further appeal to the PRC Supreme People’s Court according to the law.
If TSMC were to succeed on its claims in the United States, we may be ordered to pay damages for breach of contract and discontinue sales of certain of our products in the United States or elsewhere.
The occurrence of any of these events could have a material adverse effect on our business and operating results and, in any event, the cost of litigation is substantial.
If our relationships with our technology partners deteriorate or we are unable to enter into new technology alliances, we may not be able to continue providing our customers with leading edge process technology, which could adversely affect our competitive position and operating results.
Enhancing our process technologies is critical to our ability to provide high quality services for our customers. We intend to continue to advance our process technologies through internal research and development efforts and technology alliances with other companies. Although we have an internal research and development team focused on developing new process technologies, we depend upon our technology partners to advance our portfolio of process technologies. We currently have joint technology development arrangements and technology sharing arrangements with several companies and research institutes. If we are unable to continue our technology alliances with these entities, or maintain on mutually beneficial terms any of our other joint development arrangements, research and development alliances and other similar agreements, or are unable to enter into new technology alliances with other leading developers of semiconductor technology, we may not be able to continue providing our customers with leading edge process technology, which could adversely affect our competitive position and operating results.
Global or regional economic, political and social conditions could adversely affect our business and operating results.
External factors such as potential terrorist attacks, acts of war, financial crises, such as the current global economic crisis, natural disaster, or geopolitical and social turmoil in those parts of the world that serve as markets for our products could significantly adversely affect our business and operating results in ways that cannot presently be predicted. These uncertainties could make it difficult for our customers and us to accurately plan future business activities. More generally, these geopolitical, social and economic conditions could result in increased volatility in worldwide financial markets and economies that could adversely impact our sales. We are not insured for losses and interruptions caused by terrorist acts or acts of war. Therefore, any of these events or circumstances could adversely affect our business and operating results. In the event of a natural disaster such as the March 2011 earthquake in Japan, our suppliers’ operations could be disrupted although in this particular case our business and operating results were not materially adversely impacted.

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The recent outbreak of the H1N1 swine flu, the recurrence of an outbreak of the H5N1H1N1 strain of bird flu (Avian Flu), Severe Acute Respiratory Syndrome (SARS), or an outbreak of any other similar epidemic could, directly or indirectly, adversely affect our operating results.
The recent outbreak     Past outbreaks of the H1N1 virus, commonly known as swine flu, in North America and Europe has caused governments to take measures to prevent spread of the virus. In addition, there have been reports of swine flu cases in Asia. If the H1N1 virus further spreads, the epidemicThe spread of epidemics could negatively affect the economy. For example, past occurrences of epidemics such as SARS have caused different degrees of damage to the national and local economies in China. If any of our employees are identified as a possible source of spreading the H1N1 virus, the Avian Flu or any other similar epidemic, we may be required to quarantine employees that are suspected of being infected, as well as others that have come into contact with those employees. We may also be required to disinfect our affected premises, which could cause a temporary suspension of our manufacturing capacity, thus adversely affecting our operations. The currentA recurrence of an outbreak of the H1N1 virus or a recurrence of an outbreak of SARS, Avian Flu or other similar epidemic could restrict the level of economic activities generally and/or slow down or disrupt our business activities which could in turn adversely affect our results of operations.


Exchange rate fluctuations could increase our costs, which could adversely affect our operating results and the value of our ADSs.
Our financial statements are prepared in U.S. dollars. Our sales are generally denominated in U.S. dollars and our operating expenses and capital expenditures are generally denominated in U.S. dollars, Japanese Yen, Euros and Renminbi. Although we enter into foreign currency forward exchange contracts, we are still affected by fluctuations in exchange rates between the U.S. dollar and each of the Japanese Yen, the Euro and the Renminbi. Any significant fluctuations among these currencies may lead to an increase in our costs, which could adversely affect our operating results. See “—Risks“-Risks Related to Conducting Operations in China—China — Devaluation or appreciation in the value of the Renminbi or restrictions on convertibility of the Renminbi could adversely affect our business and operating results” for a discussion of risks relating to the Renminbi.
Fluctuations in the exchange rate of the Hong Kong dollar against the U.S. dollar will affect the U.S. dollar value of the ADSs, since our ordinary shares are listed and traded on the Hong Kong Stock Exchange and the price of such shares are denominated in Hong Kong dollars. While the Hong Kong government has continued to pursue a pegged exchange rate policy, with the Hong Kong dollar trading in the range of HK$7.757.7498 to HK$7.857.8069 per US$1.00 for 2008,2010, we cannot assure you that such policy will be maintained. Exchange rate fluctuations also will affect the amount of U.S. dollars received upon the payment of any cash dividends or other distributions paid in Hong Kong dollars and the Hong Kong dollar proceeds received from any sales of ordinary shares. Therefore, such fluctuations could also adversely affect the value of our ADSs.
If we fail to maintain an effective system of internal control over financial reporting, we may not be able to accurately report our financial results or prevent fraud and, because of the inherent limitation of internal control over financial reporting, material misstatements due to error or fraud may not be prevented or detected on a timely basis.
We are subject to reporting obligations under the United States securities laws. The SEC, as required by Section 404 of the Sarbanes-Oxley Act of 2002, or the Sarbanes-Oxley Act, adopted rules requiring public companies to include a management report on such company’s internal controls over financial reporting in its annual report, which contains management’s assessment of the effectiveness of the company’s internal controls over financial reporting. In addition, an independent registered public accounting firm must attest to the effectiveness of the company’s internal controls over financial reporting. Our management has concluded that our internal controls over our financial reporting were not effectively maintained as of December 31, 2008 are effective.2009. We have taken remedial steps to improve our internal controls and management concluded that our internal controls over financial reporting were effectively maintained as of December 31, 2010. However, we cannot assure you that in the future we or our independent registered public accounting firm will not identify material weaknesses during the Section 404 of the Sarbanes-Oxley Act audit process or for other reasons. In addition, because of the inherent limitations of internal control over financial reporting, including the possibility of collusion or improper management override of controls, material misstatements due to error or fraud may not be prevented or detected on a timely basis. As a result, if we fail to maintain effective internal controls over financial reporting or should we be unable to prevent or detect material misstatements due to error or fraud on a timely basis, investors could lose confidence in the reliability of our financial statements, which in turn could harm our business and negatively impact the trading price of our securities. Furthermore, we have incurred and expect to continue to incur considerable costs and to use significant management time and other resources in an effort to comply with Section 404 and other requirements of the Sarbanes-Oxley Act.

 

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We have twice settled pending litigation with TSMC at a substantial cost to us, and, if we materially breach our 2009 settlement agreement with TSMC (or certain related documents), we could be required to pay substantial liquidated damages in addition to the money damages or other remedies TSMC may be entitled to in connection with such material breach.
     Taiwan Semiconductor Manufacturing Company, Limited (“TSMC”) has brought legal claims against us and our personnel on several occasions since 2002. On January 31, 2005, we entered into a settlement agreement with TSMC and agreed to pay them $175 million in installments over a period of six years (the “2005 Settlement Agreement”).
     On August 25, 2006, TSMC filed a new lawsuit against us and certain of our subsidiaries in the Superior Court of the State of California for alleged breach of the 2005 Settlement Agreement between us and TSMC, alleged breach of promissory notes and alleged trade secret misappropriation by us. We filed counterclaims against TSMC in the same court in September 2006 and also filed suit against TSMC in Beijing in November 2006. We settled these 2006 lawsuits with TSMC (the “Settled Actions”) on November 9, 2009 with a settlement agreement (the “2009 Settlement Agreement”) which replaced the 2005 Settlement Agreement.
     Under the terms of the 2009 Settlement Agreement, our obligation to make the remaining payments of approximately US$40 million under the 2005 Settlement Agreement was terminated, but we agreed to pay TSMC an aggregate of US$200 million over a period of four years and committed, subject to certain terms and conditions, to issue TSMC 1,789,493,218 of our shares and one or more warrants exercisable within three years of issuance to subscribe for an aggregate of 695,914,030 of our shares, subject to adjustment, at a purchase price of HK$1.30 per share, subject to adjustment. See “Item 10 — Additional Disclosure — Other Contracts” for a more detailed description of the share and warrant issuance agreement entered into by us and TSMC in connection with the 2009 Settlement Agreement and the warrant agreement to be entered into (subject to receipt of required government and regulatory approvals) between us and TSMC in connection with the 2009 Settlement Agreement. The 1,789,493,218 common shares and the warrant to purchase 695,914,030 common shares, subject to adjustment, were issued on July 5, 2010. In addition, the 2009 Settlement Agreement terminated that certain patent cross license agreement that was entered into in connection with the 2005 Settlement Agreement under which we had previously cross-licensed patent portfolios with TSMC (the “2005 Patent Cross-License”).
     Under the 2009 Settlement Agreement, both parties released the other from all claims arising out of or related to claims and counterclaims that were or could have been brought in the Settled Actions, but this release does not apply to claims of breach of the 2009 Settlement Agreement. In addition, each party covenanted not to sue the other for misappropriation or infringement of intellectual property rights, but this covenant not to sue did not extend to claims for breach of the 2009 Settlement Agreement or claims for patent or trademark infringement.
     Further, the 2009 Settlement Agreement provides that if we materially breach the 2009 Settlement Agreement or certain related documents and fail to cure that breach within 30 days after notice from TSMC, that we will pay TSMC liquidated damages, in addition to any damages arising from such breach, in the amount of US$44 million plus a royalty equal to 5% of our gross revenues derived from foundry services in respect of our 90nm and larger manufacturing processes during the period commencing on the date of the breach and ending on the date that is twenty years from the date of the 2009 Settlement Agreement.
     There can be no assurance that TSMC will not sue us again in the future. For example, TSMC is not prohibited under the 2009 Settlement Agreement from bringing infringement claims against us which could not have been brought in the Settled Actions. Further, we are subject to several obligations under the 2009 Settlement Agreement, including obligations to protect


the confidentiality of certain information, and TSMC could, in the future, allege a breach by us of the 2009 Settlement Agreement. If TSMC were successful in a claim of material breach by us of the 2009 Settlement Agreement (or certain related documents), we have agreed to pay substantial liquidated damages as described above.
     TSMC is a competitor of ours and has substantially greater resources than we do to investigate and pursue legal actions. If TSMC successfully brings additional legal actions against us, we could be subject to significant penalties which could include monetary payments and/or injunctive relief such as requirements to discontinue sales of products.
     The occurrence of any of these events could have a material adverse effect on our business and operating results and, in any event, the cost of litigation could be substantial.


Risks Related to Manufacturing
Our manufacturing processes are highly complex, costly and potentially vulnerable to impurities and other disruptions, which could significantly increase our costs and delay product shipments to our customers.
Our manufacturing processes are highly complex, require advanced and costly equipment, demand a high degree of precision and may have to be modified to improve yields and product performance. Dust and other impurities, difficulties in the fabrication process or defects with respect to the equipment or facilities used can lower yields, cause quality control problems, interrupt production or result in losses of products in process. As system complexity has increased and process technology has become more advanced, manufacturing tolerances have been reduced and requirements for precision have become even more demanding. As a result, we may experience production difficulties, which could significantly increase our costs and delay product shipments to our customers.
We may have difficulty in ramping up production, which could cause delays in product deliveries and loss of customers and adversely affect our business and operating results.
As is common in the semiconductor industry, we may experience difficulty in ramping up production at new or existing facilities, such as our Beijing mega-fab in which we expect to add a significant amount of new equipment. This could be due to a variety of factors, including hiring and training of new personnel, implementing new fabrication processes, recalibrating and re-qualifying existing processes and the inability to achieve required yield levels.
In the future, we may face construction delays or interruptions, infrastructure failure, or delays in upgrading or expanding existing facilities or changing our process technologies, which may adversely affect our ability to ramp up production in accordance with our plans. Our failure to ramp up our production on a timely basis could cause delays in product deliveries, which may result in the loss of customers and sales. It could also prevent us from recouping our investments in a timely manner or at all, and adversely affect our business and operating results.
We have formed joint ventures that, if not successful, may adversely impact our business and operating results.
In July 2004, we announced an agreement with Toppan Printing Co., Ltd., to establish Toppan SMIC Electronics (Shanghai) Co., Ltd., a joint venture in Shanghai, to manufacture color filters and micro-lenses for CMOS image sensors. In May 2005, we announced an agreement with United Test and Assembly Center Ltd. to establish a joint venture in Chengdu to provide assembly and testing services for memory and logic devices. On March 1, 2011, the Company deconsolidated AT as its majority ownership interest was reduced to 10%. As a result, all previously preferred securities issued were cancelled. The Company retained a 10% interest in AT and will account for such investment under the cost method in future periods as it no longer has controlling financial interest nor significant influence in AT. No cash or other consideration was received by the Company in conjunction with disposition.
The results of the joint ventures are reflected in our operating results to the extent of our ownership interest, and losses of the joint ventures could adversely impact our operating results. For example, as a result of our ownership of Toppan SMIC Electronics (Shanghai) Co., Ltd., we recorded a lossgain of US$0.440.3 million in 2008.2010. Integration of assets and operations being contributed by each partner will involve complex activities that must be completed in a short period of time. The joint ventures are likely to continue to face numerous challenges in commencing their operations and operating successfully. The business of the joint ventures will be subject to operational risks that would normally arise for these types of businesses pertaining to manufacturing, sales, service, marketing, and corporate functions. Competition in the CMOS image sensor market and semiconductor assembly and testing industry will involve challenges from well-established companies with substantial resources and significant market share.


If the joint ventures are not successful or less successful than we anticipate, we may incur higher costs for performing assembly and testing services through our current partners or for manufacturing color filters and micro-lenses, which typically require mature technologies and thus command a lower wafer price and generate lower margins, at our existing fabs. Either result may adversely affect our business and operating results.
If we are unable to obtain raw materials and spare parts in a timely manner, our production schedules could be delayed and our costs could increase.
We depend on suppliers of raw materials, such as silicon wafers, gases and chemicals, and spare equipment parts, in order to maintain our production processes. To maintain operations, we must obtain from our suppliers sufficient quantities of quality raw materials and spare equipment parts at acceptable prices and in a timely manner. The most important raw material used in our production is silicon in the form of raw wafers. We currently purchase approximately 68.0%74% of our overall raw wafer requirements from our top three raw wafer suppliers. In addition, a portion of our gas and chemical requirements currently must be sourced from outside China. We may not be able to obtain adequate supplies of raw materials and spare parts in a timely manner and at a reasonable cost. In addition, from time to time, we may need to reject raw materials and parts that do not meet our specifications, resulting in potential delays or declines in output. If the supply of raw materials and necessary spare parts is substantially reduced or if there are significant increases in their prices, we may incur additional costs to acquire sufficient quantities of these parts and materials to maintain our production schedules and commitments to customers.

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Our production may be interrupted, limited or delayed if we cannot maintain sufficient sources of fresh water and electricity, which could adversely affect our business and operating results.
The semiconductor fabrication process requires extensive amounts of fresh water and a stable source of electricity. As our production capabilities increase and our business grows, our requirements for these resources will grow substantially. While we have not, to date, experienced any instances of the lack of sufficient supplies of water or material disruptions in the electricity supply to any of our fabs, we may not have access to sufficient supplies of water and electricity to accommodate our planned growth. Droughts, pipeline interruptions, power interruptions, electricity shortages or government intervention, particularly in the form of rationing, are factors that could restrict our access to these utilities in the areas in which our fabs are located. In particular, our fab in Tianjin and our Beijing mega-fab are located in areas that are susceptible to severe water shortages during the summer months. If there is an insufficient supply of fresh water or electricity to satisfy our requirements, we may need to limit or delay our production, which could adversely affect our business and operating results. In addition, a power outage, even of very limited duration, could result in a loss of wafers in production and a deterioration in yield.
Our operations may be delayed or interrupted due to natural disasters which could adversely affect our business and operating results.
We depend on suppliers of raw materials, such as silicon wafers, gases and chemicals, and spare equipment parts, in order to maintain our production processes in addition to requiring extensive amounts of fresh water and a stable source of electricity. The occurrence of natural disasters such as earthquakes may disrupt this required access to goods and services provided by our suppliers as well as access to fresh water and electricity. As a result, our production could be limited or delayed due to the disruption of access to required supplies, in addition to possible damage caused to our manufacturing


equipment and related infrastructure, which could adversely affect our business and operating results. Our business and operating results were not materially impacted by Japan’s earthquake in March 2011.
We are subject to the risk of damage due to fires or explosions because the materials we use in our manufacturing processes are highly flammable. Such damage could temporarily reduce our manufacturing capacity, thereby adversely affecting our business and operating results.
We use highly flammable materials such as silane and hydrogen in our manufacturing processes and are therefore subject to the risk of loss arising from explosions and fires. While we have not, to date, experienced any explosion or fire due to the nature of our raw materials, the risk of explosion and fire associated with these materials cannot be completely eliminated. Although we maintain comprehensive fire insurance and insurance for the loss of property and the loss of profit resulting from business interruption, our insurance coverage may not be sufficient to cover all of our potential losses due to an explosion or fire. If any of our fabs were to be damaged or cease operations as a result of an explosion or fire, it could temporarily reduce our manufacturing capacity, which could adversely affect our business and operating results.
Our Beijing mega-fab is located in an area that is susceptible to seasonal dust storms, which could create impurities in the production process at these facilities and require us to take additional measures or spend additional capital to further insulate these fabs from dust, thereby adversely affecting our business and operating results.
The location of our Beijing mega-fab makes it susceptible to seasonal dust storms, which could cause dust particles to enter the buildings and affect the production process. Although we are constructing precautionary filtration systems, these may not adequately insulate the Beijing mega-fab against dust contamination. If dust were to affect production in the Beijing mega-fab, we could experience quality control problems, losses of products in process and delays in shipping products to our customers. In addition, we may have to spend additional capital to further insulate the Beijing mega-fab from dust if our current precautionary measures are insufficient. The occurrence of any of these events could adversely affect our business and operating results.
Our operations may be delayed or interrupted and our business could suffer as a result of steps we may be required to take in order to comply with environmental regulations.
We are subject to a variety of Chinese environmental regulations relating to the use, discharge and disposal of toxic or otherwise hazardous materials used in our production processes. Any failure or any claim that we have failed to comply with these regulations could cause delays in our production and capacity expansion and affect our company’s public image, either of which could harm our business. In addition, any failure to comply with these regulations could subject us to substantial fines or other liabilities or require us to suspend or adversely modify our operations.

 

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Risks Related to Conducting Operations in China
Our business is subject to extensive government regulation and benefits from certain government incentives, and changes in these regulations or incentives could adversely affect our business and operating results.
The Chinese government has broad discretion and authority to regulate the technology industry in China. China’s government has also implemented policies from time to time to regulate economic expansion in China. The economy of China has been transitioning from a planned economy to a market-oriented economy. Although in recent years the Chinese government has implemented measures emphasizing the utilization of market forces for economic reform, the reduction of state ownership of productive assets, and the establishment of sound corporate governance in business enterprises, a substantial portion of productive assets in China is still owned by the Chinese government. In addition, the Chinese government continues to play a significant role in regulating industrial development. It also exercises significant control over China’s economic growth through the allocation of resources, controlling payment of foreign currency-denominated obligations, setting monetary policy, and providing preferential treatment to particular industries or companies. New regulations or the readjustment of previously implemented regulations could require us to change our business plan, increase our costs or limit our ability to sell products and conduct activities in China, which could adversely affect our business and operating results.
In addition, the Chinese government and provincial and local governments have provided, and continue to provide, various incentives to domestic companies in the semiconductor industry, including our company, in order to encourage the development of the industry. Such incentives include tax rebates, reduced tax rates, favorable lending policies, and other measures. Any of these incentives could be reduced or eliminated by governmental authorities at any time. For example, in 2004,the past, the Chinese government announced that by April 1, 2005, the preferential value-added tax policies, which previously entitled certain qualified companies to receive a refund of the amount exceeding 3% of the actual value-added tax burden relating to self-made integrated circuit product sales, would be eliminated. While we have not previously benefited materially from such preferential value-added tax policies, any reduction or elimination of other incentives currently provided to us could adversely affect our business and operating results.
Because our business model depends on growth in the electronics manufacturing supply chain in China, any slowdown in this growth could adversely affect our business and operating results.
Our business is dependent upon the economy and the business environment in China. In particular, our growth strategy is based upon the assumption that demand in China for devices that use semiconductors will continue to grow. Therefore, any slowdown in the growth of consumer demand in China for products that use semiconductors, such as computers, mobile phones or other consumer electronics, could have a serious adverse effect on our business. In addition, our business plan assumes that an increasing number of non-domestic IDMs, fabless semiconductor companies and systems companies will establish operations in China. Any decline in the rate of migration to China of semiconductor design companies or companies that require semiconductors as components for their products could adversely affect our business and operating results.
Limits placed on exports into China could substantially harm our business and operating results.
The growth of our business will depend on the ability of our suppliers to export, and our ability to import, equipment, materials, spare parts, process know-how and other technologies and hardware into China. Any restrictions placed on the import and export of these products and technologies could adversely impact our growth and substantially harm our


business. In particular, the United States requires our suppliers and us to obtain licenses to export certain products, equipment, materials, spare parts and technologies from that country. If we or our suppliers are unable to obtain export licenses in a timely manner, our business and operating results could be adversely affected.
In July 1996, thirty-three countries ratified the Wassenaar Arrangement on Export Controls for Conventional Arms and Dual-Use Goods and Technologies, which established a worldwide arrangement to restrict the transfer of conventional arms and dual-use goods and technologies. Under the terms of the Wassenaar Arrangement, the participating countries, including the United States, have restricted exports to China of technology, equipment, materials and spare parts that potentially may be used for military purposes in addition to their commercial applications. To the extent that technology, equipment, materials or spare parts used in our manufacturing processes are or become subject to the restrictions of the arrangement, our ability to procure these products and technology could be impaired, which could adversely affect our business and operating results. There could also be a change in the export license regulatory regime in the countries from which we purchase our equipment, materials and spare parts that could delay our ability to obtain export licenses for the equipment, materials, spare parts and technology we require to conduct our business.

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Devaluation or appreciation in the value of the Renminbi or restrictions on convertibility of the Renminbi could adversely affect our business and operating results.
The value of the Renminbi is subject to changes in China’s governmental policies and to international economic and political developments. Since 1994, the conversion of Renminbi into foreign currencies, including Hong Kong and U.S. dollars, has been based on rates set by the People’s Bank of China (“PBOC”), which are set daily based on the previous day’s interbank foreign exchange market rates and current exchange rates on the world financial markets. The Renminbi to U.S. dollar exchange rate experienced significant volatility prior to 1994, including periods of sharp devaluation. On July 21, 2005, the PBOC announced an adjustment of the exchange rate of the U.S. dollar to Renminbi from 1:8.27 to 1:8.11 and modified the system by which the exchange rates are determined. The central parity rate of the U.S. Dollar to Renminbi was set at 6.83466.6227 on December 31, 20082010 versus 7.30466.8282 on December 28, 200731, 2009 by PBOC. The cumulative appreciation of the Renminbi against the U.S. dollar in 20082010 was approximately 6.43%3.0%. There remains significant international pressure on the PRC government to adopt an even more flexible currency policy, which could result in a further and more significant appreciation of the Renminbi against the U.S. dollar. As a result, the exchange rate may become volatile and the Renminbi may be devalued again against the U.S. dollar or other currencies, or the Renminbi may be permitted to enter into a full or limited free float, which may result in an appreciation in the value of the Renminbi against the U.S. dollar, any of which could have an adverse affect on our business and operating results.
In the past, financial markets in many Asian countries have experienced severe volatility and, as a result, some Asian currencies have experienced significant devaluation from time to time. The devaluation of some Asian currencies may have the effect of rendering exports from China more expensive and less competitive and therefore place pressure on China’s government to devalue the Renminbi. An appreciation in the value of the Renminbi could have a similar effect. Any devaluation of the Renminbi could result in an increase in volatility of Asian currency and capital markets. Future volatility of Asian financial markets could have an adverse impact on our ability to expand our product sales into Asian markets outside of China.
We receive a portion of our sales in Renminbi, which is currently not a freely convertible currency. For the year ended December 31, 2008,2010, approximately 5.4%10.2% of our sales were denominated in Renminbi. While we have used these proceeds for the payment of our Renminbi expenses, we may in the future need to convert these sales into foreign currencies to allow us to purchase imported materials and equipment, particularly as we expect the proportion of our sales to China-based companies to


increase in the future. Under China’s existing foreign exchange regulations, payments of current account items, including profit distributions, interest payments and expenditures from trade may be made in foreign currencies without government approval, except for certain procedural requirements. The Chinese government may, however, at its discretion, restrict access in the future to foreign currencies for current account transactions and prohibit us from converting our Renminbi sales into foreign currencies. If this were to occur, we may not be able to meet our foreign currency payment obligations.
China’s entry into the World Trade Organization has resulted in lower Chinese tariff levels, which benefit our competitors from outside China and could adversely affect our business and operating results.
As a result of joining the World Trade Organization, or WTO, China has reduced its average rate of import tariffs to 11.5%9.8% in 2003 and will reduce itmay further by 2010.decrease. The import tariff for some information technology-related products has been reduced to zero. As a consequence, we expect stronger competition in China from our foreign competitors, particularly in terms of product pricing, which could adversely affect our business and operating results.
China’s legal system embodies uncertainties that could adversely affect our business and operating results.
Since 1979, many new laws and regulations covering general economic matters have been promulgated in China. Despite this activity to develop the legal system, China’s system of laws is not yet complete. Even where adequate law exists in China, enforcement of existing laws or contracts based on existing law may be uncertain and sporadic, and it may be difficult to obtain swift and equitable enforcement or to obtain enforcement of a judgment by a court of another jurisdiction. The relative inexperience of China’s judiciary in many cases creates additional uncertainty as to the outcome of any litigation. In addition, interpretation of statutes and regulations may be subject to government policies reflecting domestic political changes.
Our activities in China will be subject to administrative review and approval by various national and local agencies of China’s government. See “Item 4—Information4-Information on the Company—Regulation.Company-Regulation.” Because of the changes occurring in China’s legal and regulatory structure, we may not be able to secure the requisite governmental approval for our activities. Failure to obtain the requisite governmental approval for any of our activities could adversely affect our business and operating results.

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Our corporate structure may restrict our ability to receive dividends from, and transfer funds to, our Chinese operating subsidiaries, which could restrict our ability to act in response to changing market conditions and reallocate funds from one Chinese subsidiary to another in a timely manner.
We are a Cayman Islands holding company and substantially all of our operations are conducted through our Chinese operating subsidiaries, Semiconductor Manufacturing International (Shanghai) Corporation, or SMIC Shanghai, Semiconductor Manufacturing International (Beijing) Corporation, or SMIC Beijing, and Semiconductor Manufacturing International (Tianjin) Corporation. The ability of these subsidiaries to distribute dividends and other payments to us may be restricted by factors that include changes in applicable foreign exchange and other laws and regulations. In particular, under Chinese law, these operating subsidiaries may only pay dividends after 10% of their net profit has been set aside as reserve funds, unless such reserves have reached at least 50% of their respective registered capital. In addition, the profit available for distribution from our Chinese operating subsidiaries is determined in accordance with generally accepted accounting principles in China. This calculation may differ from the one performed in accordance with U.S. GAAP. As a result, we may not have sufficient distributions from our Chinese subsidiaries to enable necessary profit distributions to us


or any distributions to our shareholders in the future, which calculation would be based upon our financial statements prepared under U.S. GAAP.
Distributions by our Chinese subsidiaries to us may be subject to governmental approval and taxation. Any transfer of funds from our company to our Chinese subsidiaries, either as a shareholder loan or as an increase in registered capital, is subject to registration or approval of Chinese governmental authorities, including the relevant administration of foreign exchange and/or the relevant examining and approval authority. In addition, it is not permitted under Chinese law for our Chinese subsidiaries to directly lend money to each other. Therefore, it is difficult to change our capital expenditure plans once the relevant funds have been remitted from our company to our Chinese subsidiaries. These limitations on the free flow of funds between us and our Chinese subsidiaries could restrict our ability to act in response to changing market conditions and reallocate funds from one Chinese subsidiary to another in a timely manner.

 

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Risks Related to Ownership of Our Shares and ADSs and Our Trading Markets
Future sales of securities by us or our shareholders may decrease the value of your investment.
Future sales by us or our existing shareholders of substantial amounts of our ordinary shares or ADSs in the public markets could adversely affect market prices prevailing from time to time.
We cannot predict the effect, if any, of any such future sales or of the perception that any such future sales will occur, on the market price for our ordinary shares or ADSs.
Holders of our ADSs will not have the same voting rights as the holders of our shares and may not receive voting materials in time to be able to exercise their right to vote.
Holders of our ADSs may not be able to exercise voting rights attaching to the shares evidenced by our ADSs on an individual basis. Holders of our ADSs have appointed the depositary or its nominee as their representative to exercise the voting rights attaching to the shares represented by the ADSs. You may not receive voting materials in time to instruct the depositary to vote, and it is possible that you, or persons who hold their ADSs through brokers, dealers or other third parties, will not have the opportunity to exercise a right to vote.
You may not be able to participate in rights offerings and may experience dilution of your holdings as a result.
We may from time to time distribute rights to our shareholders, including rights to acquire our securities. Under the deposit agreement for the ADSs, the depositary will not offer those rights to ADS holders unless both the rights and the underlying securities to be distributed to ADS holders are either registered under the Securities Act or exempt from registration under the Securities Act with respect to all holders of ADSs. We are under no obligation to file a registration statement with respect to any such rights or underlying securities or to endeavor to cause such a registration statement to be declared effective. In addition, we may not be able to take advantage of any exemptions from registration under the Securities Act. Accordingly, holders of our ADSs may be unable to participate in our rights offerings and may experience dilution in their holdings as a result.
The laws of the Cayman Islands and China may not provide our shareholders with benefits provided to shareholders of corporations incorporated in the United States.
Our corporate affairs are governed by our memorandum and articles of association, by the Companies Law (Revised) and the common law of the Cayman Islands. The rights of shareholders to take action against our directors, actions by minority shareholders and the fiduciary responsibilities of our directors to us under Cayman Islands law are to a large extent governed by the common law of the Cayman Islands. The common law in the Cayman Islands is derived in part from comparatively limited judicial precedent in the Cayman Islands and from English common law, the decisions of whose courts are of persuasive authority but are not binding on a court in the Cayman Islands. The rights of our shareholders and the fiduciary responsibilities of our directors under Cayman Islands law are not as clearly established as they would be under statutes or judicial precedents in the United States. In particular, the Cayman Islands have a less developed body of securities laws as compared to the United States. Therefore, our public shareholders may have more difficulty protecting their interests in the face of actions by our management, directors or controlling shareholders than would shareholders of a corporation incorporated in a jurisdiction in the United States. In addition, Cayman Islands companies may not have standing to initiate a shareholder derivative action before the federal courts of the United States.


It may be difficult for you to enforce any judgment obtained in the United States against our company, which may limit the remedies otherwise available to our shareholders.
Substantially all of our assets are located outside the United States. Almost all of our current operations are conducted in China. Moreover, a number of our directors and officers are nationals or residents of countries other than the United States. All or a substantial portion of the assets of these persons are located outside the United States. As a result, it may be difficult for you to effect service of process within the United States upon these persons. In addition, there is uncertainty as to whether the courts of the Cayman Islands or China would recognize or enforce judgments of United States courts obtained against us or such persons predicated upon the civil liability provisions of the securities law of the United States or any state thereof, or be competent to hear original actions brought in the Cayman Islands or China, respectively, against us or such persons predicated upon the securities laws of the United States or any state thereof. See “Item 4—4 — Information on the Company—Company — Business Overview—Overview — Enforceability of Civil Liabilities.

 

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Item 4. Information on the Company
History and Development of the Company
We were established as an exempted company under the laws of the Cayman Islands on April 3, 2000. Our legal name is Semiconductor Manufacturing International Corporation. Our principal place of business is 18 Zhangjiang Road, Pudong New Area, Shanghai, China 201203, telephone number: (86) 21-3861-0000. Our registered office is located at PO Box 309, Ugland House, Grand Cayman, KY1-1104, Cayman Islands. Since our global offering, we have been listed on the New York Stock Exchange under the symbol “SMI” and the Stock Exchange of Hong Kong under the stock code “0981.”“0981.HK”
We were founded by Dr. Richard Ru Gin Chang, our Chief Executive Officer and President, who has more than 29 years of experience in the semiconductor industry. In August 2000, we started construction of the first fabfabrication facility (fab) in our Shanghai mega-fab. The first fab in the Shanghai mega-fab which commenced pilot production in September 2001. That fab2001 and the portion of our second fab in our Shanghai mega-fab which provides aluminum interconnects, commenced commercial production in January 2002. The portion of this second fab which providesin our Shanghai mega-fab was completed in two stages, commencing commercial production in January 2002 (for aluminum interconnects) and January 2003 (for copper interconnects and ainterconnects). The third fab in our Shanghai mega-fab also commenced commercial production in January 2003. All of the fabs comprising the Shanghai mega-fab are located in the Zhangjiang High-Tech Park. In January 2004, we completed the acquisition of an 8-inch wafer fab located in the Xiqing Economic Development Area in Tianjin, China, andwhich commenced mass production in May 2004. We commencedstarted construction of our Beijing mega-fab in the Beijing Economic and Technological Development Area in December 2002. The Beijing mega-fab consists of three twelve-inchtwo 12-inch fabs and commenced commercial production in March 2005. The Beijing mega-fab is mainland China’s first 12-inch fab. In January 2008, the Company announced its plan to start a new IC production project in Shenzhen with extensive support from the Shenzhen municipal government. The project broke ground in the first half of 2008.
We have entered into an agreement with Toppan Printing Co., Ltd., to establish Toppan SMIC Electronics (Shanghai) Co., Ltd., to manufacturewhich manufactures color filters and micro-lenses for CMOS image sensors and a joint venture agreement with United Test and Assembly Center Ltd. to provide assembly and testing services in Chengdu, China focusing on memory and logic devices.devices (which joint venture, we have substantially existed in 2011). We have also entered into agreements to manage the operations of wafer manufacturing facilities (fabs) in Chengdu and Wuhan, China. The Chengdu fab agreement was subsequently terminated in 2010. We maintain customer service and marketing offices in Japan, Europe, and the United States, and aas well as representative office in Hong Kong.
The foundry industry requires a significant amount of capital expenditures in order to construct, equip, and ramp up fabs. We incurred capital expenditures of US$912666 million, US$860190 million, and US$666728 million in 2006, 20072008, 2009 and 2008,2010, respectively, for these purposes. We anticipate that in 2009,2011, we will incur approximately US$190 million of1 billion in capital expenditures, subject to be adjustedadjustment based on market conditions, principally to expand our operations at our mega-fabsmega-fab in Shanghai and Beijing and fab in Tianjin and new fab in Shenzhen.Beijing. If our operating cash flows are insufficient, we plan to fund the expected shortfall through bank loans. If necessary, we will also explore other forms of external financing.
Our fabs had an aggregate capacity, as of December 31, 2008,2010, of 160,500171,725 8-inch wafer equivalents per month for wafer fabrication. We anticipate a slightan increase toin aggregate capacity by the end of 2009 subject to market conditions.2011.
For additional information, see “Item 5—5 — Operating and Financial Review and Prospects—Prospects - Factors that Impact Our Results of Operations—Operations — Substantial Capital Expenditures” and “—Capacity“Capacity Expansion.”


Business Overview
We are one of the leading semiconductor foundries in the world. We operate three 8-inch wafer fabrication facilities in our Shanghai mega-fab located in the Zhangjiang High-Tech Park in Shanghai, China, an 8-inch wafer fab in Tianjin, China and a 12-inch wafer fab in our Beijing mega-fab located in the Beijing Economic and Technological Development Area in Beijing, China. These fabs had an aggregate capacity as of December 31, 20082010 of 160,500171,725 8-inch wafer equivalents per month for wafer fabrication which positions us as the leading foundry in China. In addition, we have a 12-inch fab in Shanghai currently engaged primarily in research and development activities, and a 8-inch fab under construction in Shenzhen. We have also entered into agreements to manage the operations of wafer manufacturing facilities in Chengdu and Wuhan, China. We also operate a fab at our Shanghai site which produces solar cells and modules. Due to the unique nature of solar cells and modules, this fab is not considered a part of our Shanghai mega-fab.

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We currently provide semiconductor fabrication services using 0.35 micron down to 6540 nanometer process technology for the following devices:
  logic technologies, including standard logic, mixed-signal, RF and high voltage circuits;
 
  memory technologies, including DRAM, SRAM, Flash, and EEPROM; and
 
  specialty technologies, including LCoS,LCOS, and CIS.
During     In 2010, the Company recorded an impairment loss of $8,442,050 associated with the disposal of fixed assets with outdated technologies.
        In 2009, the effect of adverse market conditions and significant changes in the Company’s operation strategy lead to the Company’s identification and commitment to abandon a group of long-lived assets. This group of long-lived assets was equipped with outdated technologies and no longer received vendor support. As of December 31, 2009, this group of assets ceased to be used. As a result, the Company recorded an impairment loss of $104,676,535 after writing down the carrying value of these assets to zero.
     In the first quarter of 2008, the Company reached an agreement with our customers to completely exit the commodity DRAM business. The conversion of DRAM capacity into logic production was completed on schedule in the fourth quarter.quarter of 2008. As a result, our Beijing 300mm logic capacity has placed us in a better position to serve our global and China customers. In connection with the decision to exit the commodity DRAM business, we recorded an impairment loss of $105.8 million$105,774,000 on long-lived assets during the first quarter of 2008.
In addition to wafer fabrication, our service offerings include a comprehensive portfolio of intellectual property consisting of libraries and circuit design blocks, design support, mask-making, wafer probing, gold/solder bumping and redistribution layer manufacturing. We also work with our partners to provide assembly and testing services.
We have a global and diversified customer base that includes some of the world’s leading IDMs and fabless semiconductor companies.


Our Industry
The Semiconductor Industry
Since the invention of the first semiconductor transistor in 1947, integrated circuits have become critical components in an increasingly broad range of electronics applications, including personal computers, wired and wireless communications equipment, televisions, consumer electronics and automotive and industrial control applications. Advancements in semiconductor design techniques and process technologies have allowed for the mass production of increasingly smaller and more powerful semiconductor devices at lower costs. This has resulted in the availability and proliferation of more complex integrated circuits with higher functionality. These integrated circuits may now each contain up to millions of transistors.
The key raw material for a semiconductor foundry is a “raw wafer,” which is a circular silicon plate. Raw wafers are available in different diameters (e.g., 5-inch, 6-inch, 8-inch or 12-inch) to meet the capabilities of different equipment. A fab capable of manufacturing integrated circuits on an 8-inch raw wafer is commonly described as an 8-inch fab. A raw wafer with a larger diameter has a greater surface area and consequently yields a greater number of integrated circuit dies. One method that foundries attempt to use to maintain their competitiveness is to increase the diameter of the wafers they use in manufacturing, such as the recent trend toward developing 12-inch wafers, each of which has approximately 2.25 times the number of gross dies achievable on an 8-inch wafer. In addition, since 12-inch fabs have been constructed more recently, the equipment used in these fabs permits smaller line-width process technologies to be utilized. However, this equipment is more expensive than equipment for the fabrication of 8-inch wafers as the market for this equipment is less mature with fewer suppliers and the technology involved is more complex.
Process technologies are the set of specifications and parameters implemented for manufacturing the circuitry on integrated circuits. The transistor circuitry on an integrated circuit typically follows lines that are less than one micron wide (1/1,000,000 of a meter). The line-widths of the circuitry, or the minimum physical dimensions of the transistor gate of integrated circuits in production, is used as a general rule for classifying generations of process technology of integrated circuits. Progress in the advancement of the integrated circuit has been driven by the scaling, or downsizing, of its components, primarily the transistors. By systematically shrinking the size of the transistors, the number of allowable transistors per die increases, and thus the number of dies on a given wafer, has also increased. Our current process technology ranges from 0.35 micron to 45-nanometer.40-nanometer.
Importance of Integrated Circuits for China’s Domestic Market and China’s Emergence as a Global Electronics Manufacturing Center
China has emerged as a global manufacturing center for electronic products that are sold both within China and abroad. In recent years, numerous international companies have established facilities in China for the manufacture of a variety of electronic products, including household appliances, computers, mobile phones, telecommunications equipment, digital consumer products and products with industrial applications. An increasing number of electronic systems manufacturers are relocating production facilities from the United States, Taiwan, and Southeast Asia to China. China is establishing itself as a favorable manufacturing location due to its well educated labor force, significantly lower costs of operations, large domestic market for semiconductors and cultural similarities and geographical proximity to Japan, Hong Kong, Taiwan, Singapore and Korea, among other factors. Such production growth represents additional potential demand for semiconductors manufactured in China.

 

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Increasing Importance of the Semiconductor Foundry Industry
As the cost of establishing new fabrication capacity has continued to rise, foundries have progressed from simply providing manufacturing capacity to becoming key strategic partners offering research and development capabilities and manufacturing process technologies. There have historically been a limited number of semiconductor foundries in the industry due to the high barriers to entry, which include significant capital commitments, scarcity of qualified engineers and advanced intellectual property and technology requirements. Many IDMs have begun outsourcing their fabrication requirements for complex and high performance semiconductor devices to foundries in order to supplement their own internal capacities and become more cost competitive. In addition, fabless semiconductor companies have shifted from relying on the excess fabrication capacity of IDMs to utilizing independent foundries to meet the majority of their wafer production needs.


Our Fabs
The table below sets forth a summary of our current fabs:
       
  Shanghai Mega-Fab Beijing Mega-Fab Tianjin
Number and Type of fab (3) 8-inch fabs
(1)
12-inch fab in R&D phase
 (2) 12-inch fabs (1) 8-inch fab
Pilot production commencement September 2001 July 2004 February 2004
Commercial production commencement January 2002 March 2005 May 2004
Wafer size 8-inch
12-inch (being equipped)
 12-inch 8-inch
Production clean room size 34,610 m2 23,876 m2 8,463 m2
In addition to our Shanghai mega-fab, we have twoan additional fabsfab at our Shanghai site. A portion of one facility in Shanghai is being leased to Toppan SMIC Electronics (Shanghai) Co., Ltd., which manufactures color filters and micro-lenses for CMOS image sensors. The other fab in Shanghai manufactures solar cells and modules. Most of the administrative and management functions of our fabs in different locations are centralized at our corporate headquarters in the Zhangjiang High-Tech Park in the Pudong New Area of Shanghai.
Additionally, we have one 8-inch fab under construction in Shenzhen. The expansion plan for this project will be adjusted based on overall market conditions.
Management of Fabs
We also have undertaken agreements relating to wafer manufacturing facilities in Chengdu and Wuhan, China. Under these agreements, we do not own any equity interest but will manage the operations of the facilities.

 

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Our Services
Wafer Fabrication Services
We currently provide semiconductor fabrication services using 0.35 micron down to 6545 nanometer technology for the following devices:
logic technologies, including standard logic, mixed-signal, RF and high voltage circuits;
logic technologies, including standard logic, mixed-signal, RF and high voltage circuits;
memory technologies, including SRAM, Flash, EEPROM and Mask ROM; and
specialty technologies, including LCoS, and CIS.
memory technologies, including DRAM, SRAM, Flash, EEPROM and Mask ROM; and
specialty technologies, including LCoS, and CIS.
These semiconductors are used in various computing, communications, consumer and industrial applications, such as computers, mobile telephones, digital televisions, digital cameras, DVD players, entertainment devices, other consumer electronics devices and automotive and industrial applications.
Our Technologies
We manufacture the following types of semiconductors:
  Logic Semiconductors. Logic semiconductors process digital data to control the operation of electronic systems. The largest segment of the logic market, standard logic devices, includes microprocessors, microcontrollers, DSPs and graphic chips. Logic semiconductors are used in communications devices, computers and consumer products, with the most advanced logic semiconductors dedicated primarily to computing applications.
  Mixed-Signal and RF. Analog/digital semiconductors combine analog and digital devices on a single semiconductor to process both analog signals and digital data. We make 0.35 micron to 0.13 micron55 nanometer mixed-signal and RF semiconductors using the CMOS process. The primary uses of mixed-signal semiconductors are in hard disk drives, wireless communications equipment and network communications equipment, while RF semiconductors are primarily used in communications devices, such as cell phones.
  High Voltage. High voltage semiconductors are semiconductor devices that can drive high voltage electricity to systems that require voltage of between five volts to several hundred volts. Our high voltage technologies provide solutions for display driver integrated circuits, power supplies, power management, telecommunications, automotive electronics and industrial controls.
  Memory Semiconductors. Memory semiconductors, which are used in electronic systems to store data and program instructions, are generally classified as either volatile memory, which lose their data content when power supplies are switched off, or non-volatile memory, which retain their data content without the need for a constant power supply. Examples of volatile memory include SRAM and DRAM, and examples of non-volatile memory include electrically erasable programmable read-only memory, or EEPROM, NAND Flash and OTP. Memory semiconductors are used in communications devices, computers and many consumer products.
Specialty Semiconductors.
  LCoS. LCoS microdisplays are tiny, high resolution, low power displays designed for high definition televisions, projectors and other products that use or rely on displays. Compared with other display technologies, such as liquid crystal and plasma, LCoS displays have higher resolution and higher fill factor, resulting in superior images, colors and performance. LCoS process technology represents an enhancement of mixed-signal CMOS process technology with the addition of a highly reflective mirror layer.
  CIS. CIS devices are sensors that are used in a wide range of camera-related systems, such as digital cameras, digital video cameras, handset cameras, personal computer cameras and surveillance cameras, which integrate image-capturing


capabilities onto a chip. CIS is rapidly becoming a cost-effective and low power replacement for competing charged-coupled devices, or CCDs. Since CIS devices are fabricated with CMOS technology, they are easier to produce and more cost-effective than CCDs. By combining camera functions on a chip, from the capture of photos to the output of digital bits, CMOS image sensors reduce the parts required for a digital camera system, which in turn enhances reliability, facilitates miniaturization, and enables on-chip programming. Our CIS process is based on our CIS array technology.

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We are one of the leading foundries in the world in terms of the process technologies that we are capable of using in the manufacturing of semiconductors.
                                        
 Month and    Month and  
 year of    year of  
 commencement Process technology  commencement Process technology
 of commercial (in microns)  of commercial (in microns)
Fab production of initial fab 2006 2007 2008 2009  production of initial fab 2007 2008 2009 2010
Wafer fabrication:  
Shanghai Mega-fab (8”) January 2002 0.35/0.25/ 0.35/0.25/ 0.35/0.25/ 0.35/0.25/  January 2002 0.35/0.25/ 0.35/0.25/ 0.35/0.25/ 0.35/0.25/ 
   0.18/0.15/ 0.18/0.15/ 0.18/0.15/ 0.18/0.15/  0.18/0.15/ 0.18/0.15/ 0.18/0.15/ 0.18/0.15/ 
 0.13/0.11/0.09 0.13/0.11/0.09 0.13/0.11/0.09 0.13/0.11/0.09  0.13/0.11/0.09 0.13/0.11/0.09 0.13/0.11 0.13/0.11 
 
Shanghai fab (12”)    0.09 0.11/0.09/0.065    0.09 0.11/0.09 0.11/0.09/0.045 
 
Beijing Mega-fab (12”) March 2005 0.15/0.13/0.11/ 0.13/0.11/ 0.18/0.13/ 0.18/0.13/0.09/0.065  March 2005 0.13/0.11/ 0.18/0.13/ 0.18/0.13/0.09/0.065 0.18/0.13/0.09/0.065 
 0.10/0.09 0.10/0.09 0.09  0.10/0.09 0.09 
 
Tianjin fab (8”) May 2004 0.35/0.25/ 0.35/0.25/ 0.35/0.25/ 0.35/0.25  May 2004 0.35/0.25/ 0.35/0.25/ 0.35/0.25 0.35/0.25 
   0.18/0.15 0.18/0.15 0.18/0.15 0.18/0.15  0.18/0.15 0.18/0.15 0.18/0.15 0.18/0.15 
The following table sets forth a percentage breakdown of wafer sales by process technology for the years ended December 31, 2006, 2007,2008, 2009, and 20082010 and each of the quarters in the year ended December 31, 2008:2010:
                                                        
 For the  For the
 For the For the three months ended year ended  For the For the three months ended year ended
Process year ended December 31, March 31, June 30, September 30, December 31, December 31, 
Technologies 2006 2007 2008 2008 2008 2008 2008 
 (based on sales in US$)  year ended December 31, March 31, June 30, September 30, December 31, December 31,
0.13 micron and below  49.60%  53.10%  44.70%  41.30%  44.50%  45.50%  43.90%
Process Technologies 2008 2009 2010 2010 2010 2010 2010
 (based on sales in US$) 
0.065 micron  0.01%  0.98%  1.70%  3.72%  7.08%  8.58%  5.43%
0.09 micron  17.60%  15.13%  18.66%  19.87%  16.19%  15.38%  17.44%
0.13 micron  26.29%  34.96%  35.52%  32.16%  32.95%  31.95%  33.08%
0.15 micron  5.70%  2.90%  4.30%  2.10%  2.00%  2.20%  2.70%  2.70%  2.12%  1.50%  1.78%  2.34%  1.22%  1.71%
0.18 micron  35.70%  30.50%  32.10%  37.70%  33.90%  32.50%  34.10%  34.10%  27.27%  24.16%  26.81%  25.60%  26.52%  25.81%
0.25 micron  2.00%  0.70%  0.50%  0.60%  0.50%  0.60%  0.60%  0.60%  0.44%  0.26%  0.56%  0.51%  0.53%  0.47%
0.35 micron  7.00%  12.80%  18.40%  18.30%  19.10%  19.20%  18.70%  18.70%  19.10%  18.20%  15.10%  15.33%  15.82%  16.06%
  
Total  100.00%  100.00%  100.00%  100.00%  100.00%  100.00%  100.00%  100.00%  100.00%  100.00%  100.00%  100.00%  100.00%  100.00%

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Manufacturing Capacity
We currently manufacture 8-inch silicon wafers based on proprietary designs provided by our customers or third party designers. Since commencing commercial production, we have the largest 8-inch wafer fabrication capacity among the semiconductor foundries in China. We have the most advanced process technology among foundries in China. In January 2003, we commenced commercial production using 0.13 micron copper interconnects process technology. We are currently one of the few fabs in China to offer 0.13 micron copper interconnects process technology and both 90 nanometer and 65 nanometer wafer fabrication process technology.
             
Fab 2008 2009 2010
Wafer Fabrication:
            
Wafer fabrication capacity as of year-end(1):
            
Shanghai mega-fab  88,000   85,000   86,000 
             
Beijing mega-fab  40,500   42,750   52,425 
             
Tianjin fab  32,000   34,300   33,300 
             
Total monthly wafer fabrication capacity as of year-end(1)
  160,500(2)  162,050(2)  171,725(2)
             
Wafer fabrication capacity utilization  86%  75%  95%


The following table sets forth the historical capacity of our wafer fabrication and copper interconnects fabs as December 31, 2008:2010:
             
Fab 2006  2007  2008 
Wafer Fabrication:
            
Wafer fabrication capacity as of year-end(1):
            
Shanghai mega-fab  106,000   98,000   88,000 
             
Beijing mega-fab  56,250   65,250   40,500 
             
Tianjin fab  20,000   22,000   32,000 
             
Total monthly wafer fabrication capacity as of year-end(1)
  182,250(3)  185,250(3)  160,500(3)
             
Wafer fabrication capacity utilization  90%  91%  86%
All output and capacity data is provided as 8-inch wafers or 8-inch wafer equivalents per month.
Alloutput and capacity data is provided as 8-inch wafers or 8-inch wafer equivalents per month.
(1) Conversion of 12-inch wafers to 8-inch wafer equivalents is achieved by multiplying the number of 12-inch wafers by 2.25.
 
(2) Reflects wafers fabricated using the copper interconnects line and does not include wafers fabricated using the aluminum interconnects line. As a small number of wafers produced by our aluminum interconnects lines also utilize the copper interconnects capabilities, our reported capacity and output data for our copper interconnects line overlaps to a limited extent with such data for our aluminum interconnects line.
(3)Mega fab structure includes copper interconnects in the total monthly capacity.
As of December 31, 2008,2010, our aggregate wafer fabrication capacity was 160,500171,725 8-inch wafer equivalents per month for wafer fabrication.
A key factor influencing our profit margins is our capacity utilization. Because a high percentage of our cost of sales is of a fixed nature, operations at or near full capacity have a significant positive effect on output and profitability. In 2005 ourOur wafer fabs had an average annual utilization rate of 89%,86% in 2006, our wafer fabs had an average annual utilization rate of 90%,2008, 75% in 2009, and 95% in 2007, our wafer fabs had an average annual utilization rate of 91%. In 2008 our wafer fabs had an average utilization of 86%.2010. Factors affecting utilization rates are the overall industry conditions, the level of customer orders, the complexity of the wafers and of the mix of wafers produced, mechanical failures and other operational disruptions such as the expansion of capacity or the relocation of equipment, and our ability to manage the production facilities and product flows efficiently. In addition,Before 2008, we havehad manufactured DRAM to fill our production lines when the volume demand of other products does not fully utilize our available capacity. As a result, our utilization rate has historically remained high.

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We determine the capacity of a fab based on the capacity ratings given by manufacturers of the equipment used in the fab, adjusted for, among other factors, actual output during uninterrupted trial runs, expected down time due to setup for production runs and approximately one to two days of scheduled annual maintenance, and expected product mix. Because these factors include subjective elements, our measurement of capacity utilization rates may not be comparable to those of our competitors. All of our fabs currently operate 24 hours per day, seven days per week, except during periods of annual maintenance. Employees in our fabs work shifts of 12 hours each day on a two-days-on, two-days-off basis.
We have often used DRAM as the initial product to test the production capabilities at a new fab. This is because DRAM requires higher process accuracy, more precise process control and a higher degree of engineering skills and operational disciplines, and can therefore assist in early identification of any potential process, equipment or fab-related production problems. This DRAM is either manufactured on a foundry basis for our customers or sold by us to the market through our distributors under technology licensing and royalty arrangements. However, the market for DRAM devices has also been more volatile and susceptible to sudden price drops in recent years. We expect that our production of DRAM wafers as a percentage of our overall production will decrease. During the first quarter of 2008, the Company reached an agreement with our customers to completely exit the commodity DRAM business. The conversion of DRAM capacity into logic production was completed on schedule in the fourth quarter of 2008. As a result, our Beijing 300mm logic capacity has placed us in a better position to serve our global and China customers. In connection with the decision to exit the commodity DRAM business, we recorded an impairment loss of $105.8 million on long-lived assets during the first quarter of 2008.
Capacity Expansion Plans
We intend to maintain our strategy of expanding capacity and improving our process technology to meet both the capacity requirements and the technological needs of our customers. Our capital expenditures in 20072009 were approximately US$860190 million and our capital expenditures in 20082010 were approximately US$666728 million. We currently expect that our capital expenditures in 20092011 will be approximately US$190 million1 billion, subject to be adjustedadjustment based on market conditions, which we plan to fund through our operating cash flows and bank loans. If necessary, we will also explore other forms of external financing. We plan to use this capital primarily to expand our operations at our mega-fabsmega-fab in ShanghaiBeijing and Beijing.our fab in Shanghai. In addition, our actual expenditures may exceed our planned expenditures for a variety of reasons, including changes in our business plan, our process technology, market conditions, equipment prices, or customer requirements. We will monitor the global economy, the semiconductor industry, the demands of our customers, and our cash flow from operations to adjust our capital expenditure plans.


We also will seek to participate in strategic partnerships to meet the demands of our customers. For example, in July 2004, we entered into an agreement with Toppan Printing Co., Ltd., to establish Toppan SMIC Electronics (Shanghai) Co., Ltd., a joint venture in Shanghai, for the manufacture of color filters and micro-lenses for CMOS image sensors. These products are increasingly being used in consumer products such as mobile phone cameras, digital cameras and automobile and home security applications. Toppan SMIC Electronics (Shanghai) Co., Ltd. commenced production in December 2005. We hold a 30% equity interest in Toppan SMIC Electronics (Shanghai) Co., Ltd.


Our Integrated Solutions
In addition to wafer fabrication, we provide our customers with a range of complementary services, from circuit design support and mask-making to wafer level probing and testing. This range of services is supported by our network of partners that assist in providing design, probing, final testing, packaging, assembly and distribution services.

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The diagram below sets forth our service model and our key points of interaction with our customers:
(FLOW CHART)(FLOW CHART)
 
(1) A portion of this work is outsourced to our service partners.
 
(2) A portion of these services are outsourced to our service partners.


Design Support Services
Our design support services include providing our customers with access to the fundamental technology files and intellectual property libraries that facilitate customers’ own integrated circuit design. We also offer design reference flows and access to our design center alliance, as well as layout services. In addition, we collaborate with industry leaders in electronic design automation, library and intellectual property services to create a worldwide network of expertise, resources and services that are available to implement and produce a customer’s designs. As of December 31, 2008, we employed over 200 engineers devoted solely to design support services.
Libraries
As part of the necessary building blocks for our customers’ semiconductor designs, we offer libraries of compatible designs for portions of semiconductors, such as standard cells, I/O and selected memory blocks, in addition to technology files. We have a dedicated team of engineers who work with our research and development department to develop, license or acquire from third parties selected key libraries early on in the development of new process technologies so that our customers can quickly design sophisticated integrated circuits that utilize the new process technologies. We also have arrangements with other providers of libraries to provide our customers with access to a broad library portfolio for their designs. In particular, we offer a portfolio of ASIC library and design kits for a wide range of tested and verified circuit applications and design-flow implementation. These include standard cell, I/O and memory compilers in from 0.35 micron 0.25 micron, 0.18 micron, 0.15 micron, 0.13 micron, 90 nanometer, and 65down to 40 nanometer process technologies. They have been developed primarily through our third party alliances, as well as by our internal research and development team, to facilitate easy design reuse and fast integration into the overall design system. We are currently developing additional libraries. Our library partners include ARM, Synopsys, Inc., VeriSilicon, and Virage Logic.

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Intellectual Property
Together with the intellectual property developed by our internal design team, our alliances with intellectual property providers enable us to offer foundational designs ranging from 0.35 micron to 6555 nanometer and relating to mixed-signal, embedded memory, high-speed interface, digital peripheral device controllers, and embedded processors, among others. We use our own and third party design expertise to realize the functions of these various types of intellectual property. Our intellectual property partners include ARM, MIPS, Virage, Synopsys, and Verisilicon.
Design Reference Flows
Customers implementing designs on our processes can utilize our design reference flows. These flows have been created using design tools developed by our electronic design automation partners, including Cadence Design Systems, Inc., Magma Design Automation, Inc., Mentor Graphics Corporation, and Synopsys, Inc. They include training guides and sample test cases to provide a step-by-step explanation on how the hierarchical design flow works.
Design Center Alliance
If a customer requires assistance in designing its semiconductors, we are able to recommend design partners from among our extensive design services network. This network consists of design companies that we have successfully worked with in the past. In addition, we are also able to offer our own internal design team members to help our clients to complete their designs.


Mask-making Services
Many of our foundry customers utilize our mask-making services.
While most of our mask-making services are for customers that also utilize our wafer fabrication services as part of our overall foundry service, we also produce masks for other domestic and overseas fabs as a separate revenue-generating service. Our mask shop also cooperates with our research and development department to develop new technologies and designs.
Our mask-making facility, which is located in Shanghai, includes a 3,750 square meters clean room with up to class I specifications. At present, our mask shop offers both five-inch by five-inch, six-inch by six-inch, and seven-inch round reticles. Our facility is capable of producing binary masks, optical proximity correction masks and phase shift masks. Our mask facility also offers mask repair services. As of December 31, 2008, we had 183 personnel employed in our mask shop.
We also offer a multi-project wafer service that allows the cost of manufacturing one mask set to be shared among several customers. See “—“Item 4 — Customers and Markets” for more details regarding this service.
Intellectual property protection is a key focus of our mask-making services. See “—Intellectual“Intellectual Property” for more details regarding the intellectual property protection measures we have instituted in our mask facility.
Wafer Probing, Assembly and Testing Services
We have our own probing facilities in Shanghai and Beijing that provide test program development, probe card fabrication, wafer probing, failure analysis, and failure testing. We also outsource these services to our partners for those customers that request them.
Our probing facility in Shanghai occupies a clean room space of 3,000 square meters, and our probing facility in Beijing occupies a clean room space of 1,400 square meters. Both facilities are rated at class 1,000 cleanliness and are equipped with advanced testers, probers and laser repair machines for logic, memory, and mixed-signal products. The probing facility in Beijing supports testing of Beijing’s 12-inch wafers and Tianjin’s 8-inch wafers. We employ more than 200 personnel to provide these probing services. We have testing equipment for memory, logic and mixed signal applications, including some equipment that has been consigned to our Shanghai facility by our customers. This consigned testing equipment has been specially designed and built by our customers in order to probe their particular products at our facility.
Our facility with United Test and Assembly Center Ltd. is located in Chengdu, China and provides both assembly and testing services for 8-inch and 12-inch wafers. This facility focuses on memory and discrete devices. Our facility in Chengdu occupies a total area of 215,000 square meters. Construction area is 40,668 square meters, including approximately 11,000 square meters of clean room area.area (which joint venture, we have substantially exited in 2011). We have also established a network of partners that provide additional probing services, as well as assembly and testing services, for our customers that request these additional services. We have relationships with assembly and testing partners, including Amkor Assembly & Test (Shanghai) Co., Ltd. and ST Assembly Test Services Ltd., which have helped to enhance the range of services that we are able to offer our customers.

 

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Customers and Markets
Our customers include IDMs, fabless semiconductor companies and systems companies. The following table sets forth the breakdown of our sales by customer type for 2006, 20072008, 2009 and 2008:2010:
                                                
 For the year ended December 31,  For the year ended December 31,
 2006 2007 2008  2008 2009 2010
Customer Type Sales Percentage Sales Percentage Sales Percentage  Sales Percentage Sales Percentage Sales Percentage
 (in US$ thousands, except percentages)  (in US$ thousands, except percentages)
Fabless semiconductor companies 601,200  41.00% 720,416  46.50% 768,707  56.80% 768,707  56.80% 710,142  66.34% 1,111,436  71.48%
Integrated device manufacturers 737,275  50.30% 634,607  40.90% 341,933  25.30% 341,933  25.30% 175,092  16.36% 252,480  16.24%
Systems companies and others 126,848  8.70% 194,742  12.60% 243,072  17.90% 243,071  17.90% 185,153  17.30% 190,873  12.28%
              
 
Total 1,465,323  100.00% 1,549,765  100.00% 1,353,711  100.00% 1,353,711  100.00% 1,070,387  100.00% 1,554,789  100.00%
             
We categorize our sales geographically based on the headquarter of customer operations and is not related to shipment destination. The following table sets forth the geographical distribution of our sales and percentage of sales for 2006, 20072008, 2009 and 2008:2010:
                                                
 For the year ended December 31,  For the year ended December 31,
 2006 2007 2008  2008 2009 2010
Region Sales Percentage Sales Percentage Sales Percentage  Sales Percentage Sales Percentage Sales Percentage
 (in US$ thousands, except percentages)  (in US$ thousands, except percentages)
United States 602,506  41.10% 657,603  42.40% 766,708  56.70% 766,708  56.70% 632,047  59.05% 851,914  54.79%
Europe 440,328  30.00% 328,710  21.20% 92,573  6.80% 92,573  6.80% 20,807  1.94% 39,178  2.52%
Asia Pacific (excluding Japan and Taiwan)(1) 168,608  11.50% 227,973  14.70% 269,611  19.90%
Asia Pacific (excluding Japan and Taiwan)(1)
 269,611  19.90% 250,224  23.38% 487,400  31.35%
Taiwan 153,058  10.50% 183,114  11.80% 185,849  13.70% 185,849  13.70% 157,624  14.73% 173,109  11.13%
Japan 100,823  6.90% 152,365  9.90% 38,970  2.90% 38,970  2.90% 9,685  0.90% 3,188  0.21%
              
 
Total $1,465,323  100.00% $1,549,765  100.00% 1,353,711  100.00% 1,353,711  100.00% 1,070,387  100.00% 1,554,789  100.00%
             

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We have a global and diversified customer base that includes IDMs. Although we are not dependent on any single customer, a significant portion of our sales is attributable to a relatively small number of our customers. Our sales could be significantly reduced if any of these customers cancels or reduces its orders, significantly changes its product delivery schedule or demands lower prices.
Our President and Chief Executive Officer, Richard Ru Gin Chang, and his wife together hold shareholding interests of less than 0.1% in one of our five largest customers in 2006, 2007 and 2008, Texas Instruments.
During     In the first quarter of 2008, the Company reached an agreement with our customers to completely exit the commodity DRAM business. The conversion of DRAM capacity into logic production was completed on schedule in the fourth quarter.quarter of 2008. As a result, our Beijing 300mm logic capacity has placed us in a better position to serve our global and China customers. In connection with the decision to exit the commodity DRAM business, we recorded an impairment loss of $105.8 million$105,774,000 on long-lived assets during the first quarter of 2008.
The following table sets forth a breakdown of our sales by application type for 2006, 20072008, 2009 and 2008:2010:


                                                
 For the year ended December 31,  For the year ended December 31,
 2006 2007 2008  2008 2009 2010
Application Type(1) Sales Percentage Sales Percentage Sales Percentage  Sales Percentage Sales Percentage Sales Percentage
 (in US$ thousands, except percentages)  (in US$ thousands, except percentages)
Computing 498,135  34.00% 402,262  26.00% 106,184  7.80% 106,184  7.80% 55,431  5.18% 52,293  3.36%
Communications 618,911  42.20% 695,645  44.90% 696,399  51.50% 696,399  51.50% 531,876  49.69% 756,882  48.68%
Consumer 280,873  19.20% 323,230  20.90% 430,282  31.80% 430,282  31.80% 407,775  38.10% 628,355  40.41%
Others 67,404  4.60% 128,628  8.20% 120,846  8.90% 120,846  8.90% 75,305  7.03% 117,258  7.55%
                            
  
Total $1,465,323  100.00% $1,549,765  100.00% 1,353,711  100.00% 1,353,711  100.00% 1,070,387  100.00% 1,554,789  100.00%
                            
 
(1) “Computing” consists of integrated circuits such as hard disk drive controllers, DVD-ROM/CD-ROM driver integrated circuits, graphic processors and other components that are commonly used in personal digital assistants and desktop and notebook computers and peripherals. “Communications” consists of integrated circuits used in digital subscriber lines, digital signal processors, wireless LAN, LAN controllers, LCD drivers, handset components and caller ID devices. “Consumer” consists of integrated circuits used for DVD players, game consoles, digital cameras, smart cards and toys.

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The following table sets forth a breakdown of our sales by service type for 2006, 20072008, 2009 and 2008:2010:
                                                
 For the year ended December 31,  For the year ended December 31,
 2006 2007 2008  2008 2009 2010
Service Type Sales Percentage Sales Percentage Sales Percentage  Sales Percentage Sales Percentage Sales Percentage
 (in US$ thousands, except percentages)  (in US$ thousands, except percentages)
Fabrication of memory wafers 476,970  32.60% 428,355  27.60% 71,935  5.30% 71,935  5.30% 35,648  3.33% 20,592  1.32%
Fabrication of logic wafers(1)
 923,411  63.00% 985,776  63.60% 1,139,535  84.20% 1,139,535  84.20% 959,689  89.66% 1,416,250  91.09%
Other(2)
 64,942  4.40% 135,634  8.80% 142,241  10.50% 142,241  10.50% 75,050  7.01% 117,947  7.59%
                            
  
Total $1,465,323  100.00% $1,549,765  100.00% 1,353,711  100.00% 1,353,711  100.00% 1,070,387  100.00% 1,554,789  100.00%
                            
 
(1) Includes copper interconnects and memory devices whose manufacturing process is similar to that for a logic device.
 
(2) Includes mask-making and probing, etc.
We have customer service and marketing offices located in California, Milan, Shanghai, and Tokyo and a representative office in Hong Kong. Our Shanghai office serves China and other non-Japan Asian markets, our California office serves the North American market, and our Milan and Tokyo offices serve the European and Japanese markets, respectively. We also sell some products through sales agents in selected markets.
We also provide our customers with the ability to share costs through our multi-project wafer processing “shuttle service.” This service allows customers to share costs with other customers by processing multiple designs on a single mask set.
We provide our customers with 24-hour online access to necessary information to conduct business with us. From our technical capabilities to a customer’s order status, we provide an online solution for our customers. From wafer fabrication, wafer sorting and assembly to final testing and shipping, our data center electronically transfers data, work-in-progress tracking, yield/cycle-time reports, and quality/engineering data to customers.


Our sales cycle, meaning the time between our first contact with a customer in relation to a particular product and our first shipment of that product to the customer, typically lasts between three months to one year, depending on the type of process and product technology involved in the product we are requested to fabricate. Because of the fast-changing technology and functionality in integrated circuit design, foundry customers generally do not place purchase orders far in advance to fabricate a particular type of product. However, we engage in discussions with customers commencing in advance of the placement of purchase orders regarding customers’ expected fabrication requirements. See “Risk Factors—Factors — Risks Related to Our Financial Condition and Business—Business — Our sales cycles can be long, which could adversely affect our operating results and cause our income stream to be unpredictable.”
See “Item 5—5 — Operating and Financial Review and Prospects—Prospects — Sales” for a description of the seasonality of our business.
Research and Development
Our research and development activities are principally directed toward the development and implementation of more advanced and lower cost process technology. We spent US$94.2 million in 2006, US$97.0 million in 2007, and US$102.2 million in 2008, US$160.8 million in 2009 and US$174.9 million in 2010 on research and development expenses, which represented 6.4%7.6%, 6.3%,15.0% and 7.6%11.2% respectively, of our sales in those respective years. Our research and development costs are partially offset by related government subsidies and include non-recurring engineering costs associated with the ramp-up of a new wafer facility. We plan to continue to invest significant amounts in research and development in 20092011 for our 65 and 45 nanometer manufacturing process.
The research and development efforts were focused primarily on our logic platform and system-on-chip (SOC) business. 2008 markedapplications. SMIC in 2010 has achieved many milestones for SMIC.significant milestones. Early on in the year, Synopsis and SMIC released an enhanced 90-nanometer hierarchical, multi-voltage RTL-to-GDSII reference design flow that will benefit advanced synthesis with built-in capability of design-for-test and design-for-manufacturing. In April, working with a leading China domestic fabless, we developed a 90 nanometer digital photo frame chip, which is one of the most integrated multimedia SOC in the market. For advanced CMOS logic, the Company demonstrated a silicon success in our 45-nanometer process ahead of schedule, and also added new intellectual properties in 65 nanometer and 90 nanometer technology services. In addition, the Company successfully developed a 0.11 micronshipped 100,000 8-inch wafers to Galaxycore using CMOS image sensor (CIS) process technology. In May, Synopsys announced the immediate availability of silicon-proven and USB logo-certified DesignWare USB 2.0 nanoPhy intellectual property for 65-nanometer (nm) low-leakage (LL) process technology. In addition, the Company has longstanding partnership with leading fabless companies to include 65nm LL and 40nm LL process technologies. For system-on-chip (SOC) front, ARM and SMIC agreed to collaborate on the development of ARM leading physical IP library platform for 65nm LL and 40nm LL technology one of the most advanced process technologies for CIS currently available in the industry. In Non-Volatile Memory (NVM)nodes. Our 65nm LL technology the 0.13um ETox went intosuccessfully moves to volume production in early 2008 and 90nm ETox is currentlyQ3 2009, mostly implemented at our 300mm facility in risk production now. OurBeijing.
     We employ approximately 451 research and development in Micro-Electromechanical System (MEMS) areas also advanced to risk production for the 1st customer in 2008. Other areas of phase-change memory, HV, mix-signal-signal, and RF technologies were also successfully advanced for smaller size, less power, and lower cost to meet customer demands.

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We employ over 800 research and development personnel.engineers. This research and development team includes many experienced semiconductor engineers with advanced degrees from leading universities around the world, as well as top graduates from the leading universities in China. We believe this combination has enabled us to quickly bring our technology in line with the semiconductor industry technology roadmap and ensures that we will have skilled personnel to lead our technology advancement in the future.
Intellectual Property
While we continue to develop and patent our own technologies, we expect to have an ongoing need to obtain licenses for the proprietary technologies of third parties to enable us to manufacture certain advanced wafers for our customers. As of 20082010 year-end, we have been granted five hundred fifty seven1,596 patents, and have more than one thousand nine hundred ninety three3,237, patent applications pending worldwide. We believe our competitors and other industry participants have numerous patents concerning wafer fabrication and related technologies in multiple countries.
We implement a variety of measures to protect the intellectual property and related interests of our company, customers and technology partners. We require our employees to execute a confidential information and invention assignment agreement


relating to non-competition and intellectual property protection issues prior to commencing their employment at our company. Access to customer information is granted to employees strictly on a need-to-know basis both during and after mask tooling.
We have applied for trademarks relating to our corporate logo, English trade name “SMIC”, and Chinese trade name(CHINESE CHARACTER) in the United States, China, Hong Kong and Taiwan. We have been granted registration of trademarks for our corporate logo in China, English trade name in China and Taiwan, and Chinese trade name in Hong Kong, United States and China (except a dispute in China for certain applied product/service category). There can be no assurance that other trademarks registration will be granted.
Competition
We compete internationally and domestically with dedicated foundry service providers, as well as with semiconductor companies that allocate a portion of their fabrication capacity to foundry operations. While the principal elements of competition in the wafer foundry market include technical competence, production speed and cycle time, time-to-market, research and development quality, available capacity, yields, customer service and price, we seek to compete on the basis of process technology capabilities, performance, quality and service, rather than solely on price. The level of competition differs according to the process technology involved.
Our competitors and potential competitors include other pure-play foundries such as TSMC, UMC and Chartered Semiconductor.GlobalFoundries. TSMC has commenced commercial production at its fab in China, and UMC has established a relationship with a fab in commercial production in China. Another group of potential competitors consists of IDMs that have established their own foundry capabilities. These includecapabilities such as, Fujitsu Limited, IBM, Samsung Electronics Co., Ltd. and Toshiba. IDMs are primarily dedicated to fabricating integrated circuits for the end products of their respective affiliates. See “Risk Factors—RisksFactors-Risks Related to Our Financial Condition and Business—Business — If we cannot compete successfully in our industry, particularly in China, our results of operations and financial condition will be adversely affected.”
Quality and Reliability
We have implemented quality assurance measures relating to material quality control, monitoring of our in-line processes and wafer-level reliability control at every stage of our operations from technology development to production. By combining advanced quality assurance procedures and e-commerce technology, we monitor all processes, services and materials in our mask-making, wafer fabrication and probing facilities. These quality assurance measures include inspection of incoming materials, supplier and subcontractor management, manufacturing environmental control and monitoring, in-line defect monitoring, engineering change control, calibration monitoring, chemical analysis and visual inspection. Quality assurance measures also include on-going process and product reliability monitors and failure tracking for early identification of production problems.

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We incorporate reliability control in our entire production process and have adopted a system that enables us to track and record wafer-, package- and product-level reliability data throughout the development, qualification and production stages of the relevant process or device. This data enables us to identify problems at an early stage and provide an immediate diagnosis and solution, so as to further reduce our failure rate.
We achieved ISO 9001:2000 certification from the British Standards Institute with zero-defect performance for our Fab 1 in July 2002 and for our Fab 2 and Fab 3B in March 2003. The ISO 9001 quality standards were established by the International Standards Organization, an organization formed by delegates from member countries to establish international quality assurance standards for products and manufacturing processes. International Standards Organization certification is required in connection with sales of industrial products in many countries. To further enhance our quality management system, we obtained TS 16949:2002 certification from the British Standards Institute (BSI) in February 2004. This is an International Standards
     In September 2008, our S2/Fab 8 passed the BSI ISO 27001:2005 with “zero defect” — an outstanding achievement for us. This BSI ISO27001 audit is the expansion of the information security management systems certification review, which was an added certification to the original mask shop and design center services. ISO27001 is a widely recognized information security standard in the industry.


Organization quality management certification that relates to automobile applications and primarily measures a device’s ability to handle extreme changes in temperature. In January 2005, we obtained TL9000 Quality Management System certification from BSI. This is a management certification relating to the telecommunications industry and evaluates research and development, production and installation and maintenance of communication product and services.
Raw Materials
Our fabrication processes uses many raw materials, primarily silicon wafers, chemicals, gases, and various types of precious and other metals. Raw material costs constituted 18.3% of our manufacturing costs in 2006,19%, 18% and 21% of our manufacturing costs in 20072008, 2009 and 19% of our manufacturing costs in 2008.2010, respectively.
The three largest components of raw material costs—costs — raw wafers, chemicals and gases—gases - accounted for approximately 43%40%, 21%20% and 11%9%, respectively, of our raw material costs in 2006,2008, approximately 47%38%, 20%21%, and 10%, respectively, of our raw material costs in 2007,2009, and approximately 40%37%, 20%22%, and 9%10%, respectively, of our raw materials in 2008.2010. Most of our raw materials generally are available from several suppliers, but substantially all of our principal materials requirements must currently be sourced from outside China.
The most important raw material used in our production is silicon in the form of raw wafers. In 2008,2010, we purchased approximately 68.0%73.7% of our overall raw wafer requirements from our three major raw wafer suppliers. The prices of our principal raw material are not considered to be volatile.
     For 2010, our largest and five largest raw materials suppliers accounted for approximately 8.01% and 33.52%, respectively, of our overall raw materials purchases. For 2009, our largest and five largest raw materials suppliers accounted for approximately 11.2% and 43.2%, respectively, of our overall raw materials purchases. For 2008, our largest and five largest raw materials suppliers accounted for approximately 8.0% and 32.3%, respectively, of our overall raw materials purchases. For 2007, our largest and five largest raw materials suppliers accounted for approximately 14.0% and 48.2%, respectively, of our overall raw materials purchases. For 2006, our largest and five largest raw materials suppliers accounted for approximately 14.7% and 46.1%, respectively, of our overall raw materials purchases. Having made all reasonable inquiry, we are not aware of any director or shareholder (which to the knowledge of our directors own more than 5% of our issued share capital) or their respective associates, which had shareholding interests in any of our five largest suppliers. Most of our materials are imported free of value-added tax and import duties due to concessions granted to our industry in China.
Electricity and Water
We use substantial amounts of electricity in our manufacturing process. This electricity is sourced from the Pudong Electricity Corporation (for Shanghai), the Beijing Municipal Electricity Department, the Tianjin Municipal Electricity Department, the PiXian Municipal Electricity Department (for Chengdu), and the Shenzhen PanGuShi Municipal Electricity Department. We maintain Uninterrupted Power Supply (UPS) systems and emergency back-up generators to power life safety and critical equipment and systems for emergencies.
The semiconductor manufacturing process also uses extensive amounts of fresh water. We source our fresh water for our Shanghai mega-fab from Pudong Vivendi Water Corporation Limited, for our Beijing mega-fab from Beijing Waterworks Group Co. Ltd., for our Tianjin fab from the Tianjin Municipal Water Department, for our Chengdu facility from the Xipu Water Corporation, Ltd., and for our Shenzhen facility from Grand Industrial Zone Water Company of Shenzhen. Because Beijing and Tianjin are subject to potential water shortages in the summer, our fabs in Beijing and Tianjin are equipped with back-up reservoirs. We have taken steps to reduce fresh water consumption in our fabs and capture rainwater for use at our Beijing and Tianjin facilities, and our water recycling systems in each of our fabs allow us to recycle 40%up to 70% of the water used during the manufacturing process. The Beijing site is also equipped to use recycled/treated industrial waste water from the Beijing Economic and Technological Development Area for non-critical operations.

 

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Regulation
Integrated circuit industry in China is subject to substantial regulation by the Chinese government. This section sets forth a summary of the most significant Chinese regulations that affect our business in China.
Scope of Regulation
TheSeveral Policies to Encourage the Development of Software and Integrated Circuit Industry, or the Integrated Circuit Policies, promulgated by the State Council of The People’s Republic of China on June 24, 2000, together with other ancillary laws and regulations, regulates integrated circuit production enterprises, or ICPEs. The State Council issued the Integrated Circuit Policies in order to encourage the development of the software and integrated circuits industry in China. The Integrated Circuit Policies form the basis for a series of laws and regulations that set out in detail the preferential policies relating to ICPEs. Such laws and regulations include:
  theNotice of the Ministry of Finance, the State Administration of Taxation and the General Administration of Customs on Relevant Taxation Policy Encouraging the Further Development of the Software Industry and the Integrated Circuit Industry,or the Integrated Circuit Notice, jointly issued by the Ministry of Finance, the State Administration of Taxation and the General Administration of Customs on September 22, 2000, as amended by theNotice of the Ministry of Finance and the State Administration of Taxation on Approval Procedure Concerning Foreign Invested Enterprises’ Implementing Enterprise Income Tax Policies of the Software and Integrated Circuit Industry, or the Approval Notice, jointly issued by the Ministry of Finance and the State Administration of Taxation on July 1, 2005;
 
  theNotice of the Ministry of Finance, the State Administration of Taxation on Taxation Policies Concerning the Tax Policies for Further Encouraging the Development of the Software and the Integrated Circuit Industry, or the Further Development Taxation Notice, jointly issued by the Ministry of Finance and the State Administration of Taxation on October 10, 2002, as amended byNotice of the Ministry of Finance, the State Administration of Taxation on Termination of Value-added Tax Refund Policies for Integrated Circuits, or the Termination Notice, jointly issued by the Ministry of Finance and the State Administration of Taxation on October 25, 2004;
 
  theNotice of the Ministry of Finance on Taxation Policies Concerning the Import of Self-used Raw Materials and Consumables by Part of Integrated Circuit Production Enterprises, or the Raw Materials Taxation Notice, issued by the Ministry of Finance on August 24, 2002;
 
  theNotice on Taxation Policies Concerning the Import of Construction Materials Specially used for Clean Rooms by Part of the Integrated Circuit Production Enterprises, or the Construction Materials Taxation Notice, issued by the Ministry of Finance on September 26, 2002;
 
  theNotice by the Ministry of Finance and the State Administration of Taxation on Increasing Tax Refund Rate for Export of Certain Information Technology(IT) Products, or the Export Notice, issued by the Ministry of Finance and the State Administration of Taxation on December 10, 2004;
 
  theMeasures for the Accreditation of the Integrated Circuit Enterprise Encouraged by the State (For Trial Implementation), or the Accreditation Measures, jointly issued by the National Development and Reform Commission, the Ministry of Information Industry, the State Administration of Taxation and the General Administration of Customs on October 21, 2005; and


  theInterim Measures for the Management of the Special Fund for the Research and Development of the Integrated Circuit Industry,or the Fund Measures, jointly issued by the Ministry of Finance, the Ministry of Information Industry and the National Development and Reform Commission on March 23, 2005.

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Preferential Industrial Policies Relating to ICPEs
ICPEs which are duly accredited in accordance with relevant laws and regulations may qualify for preferential industrial policies. Under the Integrated Circuit Policies, accreditation of ICPEs is determined by the competent examination and approval authorities responsible for integrated circuit projects after consultation with relevant taxation authorities. Under the Accreditation Measures, an integrated circuit enterprise refers to an independent legal entity duly established in the PRC (except for Hong Kong, Macao, and Taiwan) engaging in the fabrication, package, or testing of integrated circuit chips and the production of mono-crystalline silicon of six inches or above, excluding the integrated circuit design enterprise. The accreditation of ICPEs is included in the accreditation of the integrated circuit enterprises. Such accreditation is determined by the competent authorities consisting of the National Development and Reform Commission, the Ministry of Information Industry, the State Administration of Taxation and the General Administration of Customs, which jointly designate the China Semiconductor Industrial Association as the accreditation institution. Any enterprise qualified under the requirements set forth in the Accreditation Measures is entitled to apply to the China Semiconductor Association for the Accreditation of the ICPEs. The accreditation of ICPEs is annually reviewed. If the enterprise fails to apply for the annual review in time, it shall be deemed as giving up such accreditation and if the enterprise fails in the annual review, the accreditation will also be canceled.
SMIC Shanghai, SMIC Beijing, and SMIC Tianjin have been accredited as ICPEs and are entitled to the preferential industrial policies described below.
Encouragement of Domestic Investment in ICPEs
Pursuant to theInterim Provisions on Promoting Industrial Structure Adjustment, or the Interim Provisions, issued by the State Council on December 2, 2005, and theCatalogue for the Guidance of Industrial Structure Adjustment, or the Guidance Catalogue, which is the basis and criteria for implementing the Interim Provisions, issued by the National Development and Reform Commission and all the State Council Institutions on December 2, 2005, the Chinese government encourages (i) the design and fabrication of large scale integrated circuits with a line width of less than 1.2 micron, (ii) the fabrication of the equipment of large scale integrated circuit and (iii) the fabrication of mixed integrated circuits. Under the Interim Provisions, imported equipment that is used for a qualifying domestic investment project and that falls within such project’s approved total investment amount is exempt from custom duties and import-linked value-added tax, except for such equipment listed in theCatalogue of Import Commodities for Domestic Investment Projects Not Entitled to Tax Exemptions, as stipulated by the State Council and amended in 2006.
Encouragement of Foreign Investment in ICPEs
Pursuant to the Integrated Circuit Policies and theGuideline Catalogue of Foreign Investment Industriespromulgated jointly by the State Development and Reform Commission and the Ministry of Commerce on October 11, 2007, the following foreign investment categories are encouraged:
  design of integrated circuits;
 
  fabrication of large scale integrated circuits with a line width of less than 0.18 micron (including 0.18 micron);
 
  fabrication of analog and analog digital integrated circuits with a line width of less than 0.8 micron (including 0.8 micron);


  advanced packaging and testing of BGA, PGA, CSP, MCM;
 
  fabrication of mixed integrated circuits.
Foreign investment in such encouraged projects may enjoy preferential treatment as stipulated by the laws and regulations.
Preferential Taxation Policies
Preferential Value-added     Semiconductor Manufacturing International Corporation is a tax-exempted company incorporated in the Cayman Islands.
     Prior to January 1, 2008, the subsidiaries incorporated in the PRC were governed by the Income Tax Policy
Under Article 1Law of the Further Development TaxationPRC Concerning Foreign Investment and Foreign Enterprises and various local income tax laws (the “FEIT Laws”).
     On March 16, 2007, the National People’s Congress of China enacted a new Enterprise Income Tax Law (“New EIT Law”), which became effective January 1, 2008. Under the New EIT Law, domestically- owned enterprises and foreign invested enterprises (“FIEs”) are subject to a uniform tax rate of 25%. The New EIT Law also provides a transition period starting from its effective date for those enterprises which were established before the promulgation date of the New EIT Law and which are entitled to a preferential lower tax rate and/or tax holiday under the FEIT Law or other related regulations. Based on the New EIT Law, the tax rate of such enterprises will transition to the uniform tax rate throughout a five-year period. Tax holidays that were enjoyed under the FEIT Laws may to be enjoyed until the end of the holiday. FEIT Law tax holidays that have not started because the enterprise is not profitable will take effect regardless whether the FIEs are profitable in 2008.
     According to Guofa [2007] No. 39 — the Notice (October 10, 2002 No. 70 [2002] Cai-Shui),of the State Council Concerning Implementation of Transitional Rules for Enterprise Income Tax Incentives effective from January 1, 20022008, enterprises that enjoyed preferential tax rates shall gradually transit to the endstatutory tax rate over 5 years after the new EIT Law is effective. Enterprises that enjoyed a tax rate of 15% under the FEIT Law shall be levied rates of 18% in 2008, 20% in 2009, 22% in 2010, 24% in 2011 and 25% in 2012 and thereafter.
     On February 22, 2008, the sale of integrated circuits (including monocrystalline silicon chips) is subject to a value-added tax levy of 17%. After the value-added tax is levied, the taxpayer is to be entitled to a refund for the portion exceeding 3% of the actual value-added tax burden. The tax refund was required to be used by the enterprise for the research and development of integrated circuits and to increase production.
Under the Termination Notice (No. 174 [2004] of the Ministry of Finance), as of April 1, 2005, implementation of Article 1 of the Further Development Taxation Notice was terminated.
Under the Export Notice (No. 200 [2004] Cai-Shui), as of November 1, 2004, the tax refund rate for exports of electronic integrated circuits and micro-assemblies is to increase from 13% to 17%.

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Preferential Enterprise Income Tax Policies
Under Article 42 of the Integrated Circuit Policies (No. 18 [2000] Guo-Fa),Article 2(3) of the Integrated Circuit (Notice No. 25 [2000] Cai-Shui)and Article 1 ofPRC government promulgated Caishui Circular [2008] No.1, the Notice byof the Ministry of Finance and the State Administration of Taxation on SeveralTax concerning Certain Enterprise Income Tax Preferential Policies for Income Tax (No. 1 [2000] Cai-Shui(“Circular No.1”), ICPEs. Pursuant to Circular No.1, integrated circuit production enterprises whose total investment exceeds Rmb 8,000RMB8,000 million (approximately US$967$1,095 million) or whose integrated circuits have a line-widthline width of less than 0.25 micron are entitled to preferential tax treatment similar to that granted for foreign investment inrate of 15%. If the energy and communications industries. SMIC Shanghai, SMIC Beijing and SMIC Tianjinoperation period is more than 15 years, those enterprises are entitled to a full exemption from FEITincome tax for five years starting withfrom the first profitable year of positive accumulated earningsafter utilizing all prior years’ tax losses and a 50% reduction for the following five years or “five year exemptionyears. SMIS, SMIB and five year reduction”.SMIT have met such accreditation requirements.
From January 1, 2002     On February 9, 2011, the State Council of China issued Guo Fa [2011] No.4, the Notice on Certain Policies to Further Encourage the endDevelopment of 2010, investors in ICPEsthe Software and Integrated Circuit Industries(“Circular No.4”), to provide various incentives from tax, investment and financing, and R&D perspectives for the software and integrated circuit packaging enterprises that reinvest their after-income-tax profits from ICPEsindustries. In particular, Circular No.4 reinstates certain EIT incentives stipulated by Circular No.1 for the purpose of increasing the registered capital in the ICPEs, or to establish other ICPEssoftware and integrated circuit packaging enterprises for a period of operation of not less than five years, are entitled to a refund of 40% of the total amount of enterprise income tax paid on the reinvested portion. If the investment is withdrawn before the period of operation reaches five years, the amount of enterprise income tax refunded shall be repaid. From January 1, 2002 to the end of 2010, domestic or foreign investors that reinvest their after income-tax profits from sources within China in order to establish ICPEs or integrated circuit package enterprises in China’s western regions for a period of operation of not less than five years are entitled to a refund of 80% of total amount of enterprise income tax paid on the reinvested portion. If the investment is withdrawn before the period of operation reaches five years, the amount of enterprise income tax refunded shall be repaid.
On March 16, 2007, the National People’s Congress, the PRC legislature, approved and promulgated a new tax law named Enterprise Income Tax Law, On December 6, 2007, the PRC State Council issued the Implementation Regulations of the Enterprise Income Tax Law, both of which became effective on January 1, 2008.The Enterprise Income Tax Law and its Implementation Regulations, or the new EIT law, FIEs and domestic companies are subject to a uniform tax rate of 25%. The new EIT law eliminates or modifies most of the tax exemptions, reductions and preferential treatments available under the previous tax laws and regulations. The State Council issued the Notice of the State Council on the Implementation of the Transitional Preferential Policies in respect of Enterprise Income Tax on December 26, 2007, enterprises that were established before March 16, 2007 and already enjoy preferential tax treatments will (i) in the case of preferential tax rates, continue to enjoy the tax rates which will be gradually increased to the new tax rates within five years from January 1, 2008 or (ii) in the case of preferential tax exemption or reduction for a specified term, continue to enjoy the preferential tax holiday until the expiration of such term. Thus, SMIC Shanghai, SMIC Beijing and SMIC Tianjin could fall into condition (ii) and may be entitled to the “five year exemption and five year reduction” as subject to the final recognition by the PRC tax authorities. While the new EIT Law equalizes the tax rates for FIEs and domestic companies, preferential tax treatment would continue to be given to companies in certain encouraged sectors and to entities classified as high and new technology enterprises supported by the PRC government, whether FIEs or domesticcircular enterprises. According to the new EIT Law, entities that qualify as high and new technology enterprises especially supported by the PRC government are expected to benefit from a tax rate of 15% as compared to the uniform tax rate of 25%. Implementation Regulations of the Enterprise Income Tax Law, a high and new technology enterprise shall have core self-owned intellectual properties and its products shall be within the scope provided by “the high-technology field highly supported by the State”.
Under the new EIT law, dividends, interests, rent, royalties and gains on transfers of property payable by a foreign-invested enterprise in the PRC to its foreign investor who is a non-resident enterprise will be subject to a 10% withholding tax, unless such non-resident enterprise’s jurisdiction of incorporation has a tax treaty with the PRC that provides for a reduced rate of withholding tax. The Cayman Islands, where SMIC is incorporated, does not have such a tax treaty with the PRC. If SMIC is considered a non-resident enterprise, this new 10% withholding tax imposed on SMIC’s dividend income received from SMIC Shanghai, SMIC Beijing and SMIC Tianjin would reduce its net income and have an adverse effect on its operating results.
Under the new EIT law, an enterprise established outside the PRC with its “de facto management body” within the PRC is considered a resident enterprise and will be subject to the enterprise income tax at the rate of 25% on its worldwide income. The “de facto management body” is defined as the organizational body that effectively exercises overall management and control over production and business operations, personnel, finance and accounting, and properties of the enterprise. It remains unclear how the PRC tax authorities will interpret such a broad definition. Substantially the majority of management members of SMIC are based in the PRC. If the PRC tax authorities subsequently determine that SMIC should be classified as a resident enterprise, then SMIC’s worldwide income will be subject to income tax at a uniform rate of 25%, which may have a material adverse effect on SMIC’s financial condition and results of operations. Notwithstanding the foregoing provision, the new EIT law also provides that, if a resident enterprise directly invests in another resident enterprise, the dividends received by the investing resident enterprise from the invested enterprise are exempted from income tax, subject to certain conditions. Therefore, if SMIC is classified as a resident enterprise, the dividends received from our PRC subsidiary may be exempted from income tax and the dividends paid to our non-PRC shareholders and gains derived by our non-PRC shareholders from transferring our shares or ADSs may be subject to 10% withholding tax. However, it remains unclear how the PRC tax authorities will interpret the PRC tax resident treatment of an offshore company, like SMIC, having indirect ownership interests in PRC enterprises through intermediary holding vehicles.

 

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Exemption of Customs Duties and Import-related Value-added Tax
Under the Integrated Circuit Policies (No. 18 [2000] Guo-Fa) and the Integrated Circuit Notice (No. 25 [2000] Cai-Shui), ICPEs whose total investment exceeds Rmb 8,000 million or whose integrated circuits have a line-width of less than 0.25 micron are exempt from customs duties and import-related value-added tax for the raw materials and consumables used for production purposes.
Under the Integrated Circuit Notice, integrated circuit technology, production equipment, and equipment and instruments specialized for use in fabricating integrated circuits that are imported by a duly accredited ICPE are, with the exception of commodities listed in theCatalogue of Imported Commodities for Foreign Investment Projects Not Entitled to Tax Exemptionsand theCatalogue of Imported Commodities for Domestic Investment Projects Not Entitled to Tax Exemptions as stipulated by the Ministry of Finance and all the State Council Institutions and Departments and amended in 2006, exempt from customs duties and import-related value-added tax.
Under the Construction Materials Taxation Notice (No. 152 [2002] Cai-Shui), commencing January 1, 2001, the importation of construction materials, auxiliary equipment and spare parts for the production of integrated circuits, specifically for clean rooms (as listed in the annex to the Construction Materials Taxation Notice), by ICPEs whose total investment exceeds Rmb 8,000 million or whose integrated circuits have a linewidth of less than 0.25 micron is exempt from customs duties and import-related value-added tax.
Preferential Policies Encouraging Research and Development
The new Corporate Income Tax (“CIT”) hasEIT Law and the Implementation Regulations of the new EIT Law have provided tax incentives in relation to technologies as a means to encourage advancement and adoption of new technologies. Among these incentives is theThe new EIT Law provides an additional 50% additional tax deduction of the research and development (“R&D”) expenses (generally known as “R&D Super-Deduction”). In December 2008, the State Administration of Taxation (“SAT”) issued a circular, Guoshuifa [2008] No.116 (“Circular 116”) with retrospective effective date from 1 January 2008, to provide the implementation rules for the R&D Super-Deduction. An enterprise is allowed to claim an additonal deduction of 50% of R&D expenses incurred forfrom the research and development of new technologies, new products, and new craftsmanship. Iftechniques on the R&D expenses result in anbasis of the actual deductions when relevant enterprise has no intangible asset to be formed and calculated into the enterprise is allowed tocurrent gains and losses. If intangible assets have been formed, they shall be amortized the intangible asset based onat 150% of the cost of the capitalized R&D costs.intangible assets.
Legal Framework Concerning the Protection of Intellectual Property Relating to Integrated Circuits
China has formulated various laws and regulations on intellectual property protection in respect of integrated circuits including:
  thePatent Law of the People’s Republic of China, adopted at the fourth meeting of the Standing Committee of the Sixth National People’s Congress on March 12, 1984, effective April 1, 1985 and amended by the Ninth National People’s Congress on August 25, 2000;2000 and third amended by the Eleventh People’s Congress on December 27, 2008, effective October 1, 2009;
 
  theParis Convention for the Protection of Industrial Propertyof the World Intellectual Property Organization, in which China became a member state as of March 19, 1985;
 
  theGeneral Principles of the Civil Law of the People’s Republic of Chinaadopted at the fourth session of the Sixth National People’s Congress on April 12, 1986, effective January 1, 1987.1987 and revised at the thirtieth session of the Tenth National People’s Congress on October 28, 2007. In this legislation, intellectual property rights were defined in China’s basic civil law for the first time as the civil rights of citizens and legal persons;
 
  theCopyright Law of the People’s Republic of China, adopted by the 15th meeting of the Seventh National People’s Congress Standing Committee on September 7, 1990, effective June 1, 1991 and amended by the Ninth National People’s Congress on October 27, 2000;2001;
 
  theRegulations for the Protection of the Layout Design of Integrated Circuits, or the Layout Design Regulations, adopted April 2, 2001 at the thirty-sixth session of the executive meeting of the State Council, effective October 1, 2001; and


  the World Intellectual Property Organization’sWashington Treaty on Intellectual Property in Respect of Integrated Circuits, for which China was among the first signatory states in 1990.

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Protection of the Layout Design of Integrated Circuits
Under the Layout Design Regulations, layout design of an integrated circuit refers to a three dimensional configuration in an integrated circuit that has two or more components, with at least one of these being an active component, and part or all of the interconnected circuitry or the three-dimensional configuration prepared for the production of integrated circuits.
Chinese natural persons, legal persons or other organizations that create layout designs are entitled to the proprietary rights in the layout designs in accordance with the Layout Design Regulations. Foreign persons or enterprises that create layout designs and have them first put into commercial use in China are entitled to the proprietary rights in the layout designs in accordance with the Layout Design Regulations. Foreign persons or enterprises that create layout designs and that are from a country that has signed agreements with China regarding the protection of layout designs, or is a party to an international treaty concerning the protection of layout designs to which China is also a party, are entitled to the proprietary rights of the layout designs in accordance with the Layout Design Regulations.
Proprietary Rights in Layout Design of Integrated Circuits
Holders of proprietary rights in a layout design are entitled to the following proprietary rights:
 to duplicate the whole protected layout design or any part of the design that is original; and
 
 to make commercial use of the protected layout design, the integrated circuit containing the layout design, or commodities containing the integrated circuit.
Proprietary rights in layout designs become valid after being registered with the administrative department of the State Council responsible for intellectual property. Unregistered layout designs are not protected by the Layout Design Regulations.
The protection period of the proprietary rights in a layout design is ten years, commencing from the date of the application for registration of the layout design or the date that it is put into commercial use anywhere in the world, whichever is earlier. However, regardless of whether or not a layout design is registered, or whether or not it is put into commercial use, it is not protected after 15 years from the time of its creation.
Registration of a Layout Design
The administrative departments of the State Council responsible for intellectual property are responsible for the registration of layout designs and accepting applications for the registration of layout designs. If an application for a layout design registration is not made with the administrative department of the State Council responsible for intellectual property within two years after it has been put into commercial use anywhere in the world, the administrative department of the State Council responsible for intellectual property will not register the application. A holder of proprietary rights in a layout design may transfer the proprietary rights or give permission for other parties to use the layout design.
Compulsory Licenses for Exploitation of Patents in Respect of Semiconductor Technology


Under the Patent Law and the Implementing Regulations of the Patent Law, after three years from the date of granting the patent rights, any person or enterprise that has made good faith reasonable proposals to the holder of proprietary rights seeking a license to those rights, but has been unable to obtain such license after an extended period of time, may request the administrative department responsible for patents under the State Council to grant a compulsory license for the relevant patent. However, where a compulsory license involves semiconductor technology, the implementation of a compulsory license is restricted to public and non-commercial uses, or to uses that counteract anti-competitive actions, as determined by judicial or administrative procedures.

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PRC Tax for “Resident Enterprises”
Under China’s New EIT Law, we may be classified as a “resident enterprise” of China. This classification could result in unfavorable tax consequences to us and our non-PRC shareholders. The implementing rules of the New EIT Law define de facto management bodies as “management bodies that exercises substantial and overall management and control over the production and operations, personnel, accounting, and properties” of the enterprise. Currently no official interpretation or application of this new “resident enterprise” classification is available, therefore it is unclear how tax authorities will determine tax residency based on the facts of each case.
If the PRC tax authorities determine that our Cayman Islands holding company is a “resident enterprise” for PRC enterprise income tax purposes, a number of unfavorable PRC tax consequences could follow. First, we may be subject to enterprise income tax at a rate of 25% on our worldwide taxable income as well as PRC enterprise income tax reporting obligations. Second, although under the New EIT Law and its implementing rules dividends income between qualified resident enterprises is exempted income, it is not clear what is considered a qualified resident enterprise under the New EIT Law. Finally, it is possible that future guidance issued with respect to the new “resident enterprise” classification could result in a situation in which a 10% withholding tax is imposed on dividends we pay to our non-PRC shareholders and with respect to gains derived by our non-PRC shareholders from transferring our shares or ADSs. Similarly, these unfavorable consequences could apply to our other overseas intermediary holding companies if they are classified as a PRC resident enterprises.
Environmental Regulation
Our Chinese subsidiaries are subject to a variety of Chinese environmental laws and regulations promulgated by the central and local governments concerning examination and acceptance of environmental protection measures in construction projects, the use, discharge and disposal of toxic and hazardous materials, the discharge and disposal of waste water, solid waste, and waste gases, control of industrial noise and fire prevention. These laws and regulations set out detailed procedures that must be implemented throughout a project’s construction and operation phases.
A key document that must be submitted for the approval of a project’s construction is an environmental impact assessment report that is reviewed by the relevant environmental protection authorities. Upon completion of construction, and prior to commencement of operations, an additional examination and acceptance by the relevant environmental authority of such projects is also required. Within one month after receiving approval of the environmental impact assessment report, a semiconductor manufacturer is required to apply to and register with the competent environmental authority the types and quantities of liquid, solid and gaseous wastes it plans to discharge, the manner of discharge or disposal, as well as the level of industrial noise and other related factors. If the above wastes and noise are found by the authorities to have been managed within regulatory levels, renewable discharge registrations for the above wastes and noise are then issued for a specified period of time. SMIC Shanghai, SMIC Beijing, SMIC Tianjin, and SMIC Chengdu have all received approval with respect to their relevant environmental impact assessment reports and discharge registrations.
From time to time during the operation of our Chinese subsidiaries, and also prior to renewal of the necessary discharge registrations, the relevant environmental protection authority will monitor and audit the level of environmental protection


compliance of these subsidiaries. Discharge of liquid, solid or gaseous waste over permitted levels may result in imposition of fines, imposition of a time period within which rectification must occur or even suspension of operations.
Enforceability Of Civil Liabilities
We are a Cayman Islands holding company. We are incorporated in the Cayman Islands because of the following benefits associated with being a Cayman Islands corporation:
  political and economic stability;
 
  an effective judicial system;
 
  a favorable tax system;
 
  the absence of exchange control or currency restrictions; and
 
  the availability of professional and support services.

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However, the Cayman Islands have a less developed body of securities laws as compared to the United States and provides significantly less protection for investors. In addition, Cayman Islands companies may not have standing to sue before the federal courts of the United States. Substantially all of our assets are located outside the United States. In addition, most of our directors and officers are nationals and/or residents of countries other than the United States, and all or a substantial portion of our or such persons’ assets are located outside the United States. As a result, it may be difficult for a shareholder to effect service of process within the United States upon us or such persons or to enforce against them or against us, judgments obtained in United States courts, including judgments predicated upon the civil liability provisions of the securities laws of the United States or any state thereof.
Conyers Dill & Pearman, our counsel as to Cayman Islands law, Slaughter and May, our counsel as to Hong Kong law, and Fangda Partners, our counsel as to Chinese law, have advised us that there is uncertainty as to whether the courts of the Cayman Islands, Hong Kong and China, respectively, would:
  recognize or enforce judgments of United States courts obtained against us or our directors or officers predicated upon the civil liability provisions of the securities laws of the United States or any state thereof, or
 
  be competent to hear original actions brought in each respective jurisdiction, against us or our directors or officers predicated upon the securities laws of the United States or any state thereof.
Conyers Dill & Pearman has further advised us that a final and conclusive judgment in the federal or state courts of the United States under which a sum of money is payable, other than a sum payable in respect of taxes, fines, penalties or similar charges, may be subject to enforcement proceedings as a debt in the Courts of the Cayman Islands under the common law doctrine of obligation.


Organizational Structure
We operate primarily through three wholly owned subsidiaries in China. The chart below sets forth our significant operating subsidiaries or affiliates, including their jurisdictions of incorporation and principal activities:activities as of December 31, 2010:
         
    Attributable  
  equity
Place and date of equity interest Principal
Name of company incorporation/establishment held Activity
Garrison Consultants Limited (“Garrison”)Samoa
April 3, 2000
100%Consultancy services
BetterwayBetter Way Enterprises Limited (“Better Way”) Samoa
April 5, 2000
  100% TradingProvision of semiconductor productsmarketing related activities
         
Semiconductor Manufacturing International (Shanghai) Corporation (“SMIC Shanghai” or “SMIS”
“SMIS”)*#
 PRC
December 21, 2000
  100% Manufacturing and trading of semiconductor products
         
SMIC, Americas United States of America
June 22, 2001
  100% MarketingProvision of marketing related
activities
         
Semiconductor Manufacturing International (Beijing) Corporation (“SMIC Beijing” or “SMIB”
“SMIB”)*#
 PRC
July 25, 2002
  100% Manufacturing and trading of semiconductor products
         
SMIC Japan Corporation* Japan
October 8, 2002
  100% MarketingProvision of marketing related
activities
         
SMIC Europe S.R.L. Italy
July 3, 2003
  100% MarketingProvision of marketing related
activities

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Attributable
Place and date ofequity interestPrincipal
Name of companyincorporation/establishmentheldActivity
Semiconductor Manufacturing International (Tianjin) Corporation (“SMIC Tianjin” or “SMIT”
“SMIT”)*#
 PRC
November 3, 2003
  100% Manufacturing and trading of semiconductor products
         
SMIC Commercial (Shanghai) Limited Company (formerly SMIC Consulting Corporation) *# The PRC
September 30, 2003
  100% Operation of a convenience store
         
Semiconductor Manufacturing International (AT) Corporation (“AT”)* (Note 1) Cayman Islands
July 26, 2004
  57.366.3% Investment holding
         
Semiconductor Manufacturing International (Chengdu) Corporation (“SMIC Chengdu” or “SMICD”
“SMICD”) *# (Note 1)
 The PRC
December 28, 2004
  57.366.3% Manufacturing and trading of semiconductor products
         
Semiconductor Manufacturing International
(Solar (Solar Cell) Corporation
 Cayman Islands
June 30, 2005
  100% Investment holding


         
Attributable
equity
Place and date ofinterestPrincipal
Name of companyincorporation/establishmentheldActivity
SMIC Energy Technology (Shanghai) Corporation (“Energy Science)*# PRC
September 9, 2005
  100% Manufacturing and trading of solar cells and modulesrelated semiconductor products
         
SMIC Development (Chengdu) Corporation*# The PRC
December 29, 2005
  100% Construction, operation, management of SMICD’s living quarter, schools and supermarket
         
Magnificent Tower Limited British Virgin Islands
January 5, 2006
  100% Investment Holdingholding
         
Semiconductor Manufacturing International (BVI) Corporation (“SMIC (BVI)”)* British Virgin Islands
April 26, 2007
  100% Trading of semiconductor productsInvestment holding
         
SMIC AT (HK) Company Limited (“SMIC AT (HK)”)* (Note 1) Hong Kong
October 22, 2007February 11, 2008
  57.366.3% Investment Holdingholding
         
SMIC Solar Cell (HK) Company Limited (“SMIC Solar Cell (HK)”)* Hong Kong
October 23,December 3, 2007
  100% Investment Holdingholding
         
SMIC Shanghai (HK) Company Limited (“SMIC SH (HK)”)* Hong Kong
November 1,December 3, 2007
  100% Investment Holdingholding
         
SMIC Beijing (HK) Company Limited (“SMIC BJ (HK)”)* Hong Kong
November 2,December 3, 2007
  100% Investment Holdingholding
         
SMIC Tianjin (HK) Company Limited (“SMIC TJ (HK)”)* Hong Kong
November 2,December 3, 2007
  100% Investment Holdingholding
         
SMIC Shanghai (Cayman) Corporation (“SMIC SH (Cayman)”)* Cayman Islands
November 8, 2007
  100% Investment Holdingholding
         
SMIC Beijing (Cayman) Corporation (“SMIC BJ (Cayman)”)* Cayman Islands
November 8, 2007
  100% Investment Holdingholding

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Attributable
Place and date ofequity interestPrincipal
Name of companyincorporation/establishmentheldActivity
SMIC Tianjin (Cayman) Corporation (“SMIC TJ (Cayman)”)* Cayman Islands
November 8, 2007
  100% Investment Holdingholding
         
SMIC (Wuhan) Development Corporation*# PRC
March 27, 2007
  100% Construction, operation, management of living quarter, schools
         
Admiral Investment Holdings Limited British Virgin Islands
October 10, 2007
  100% Investment Holdingholding


         
Attributable
equity
Place and date ofinterestPrincipal
Name of companyincorporation/establishmentheldActivity
SMIC Shenzhen (Cayman) Corporation Cayman Islands
January 21, 2008
  100% Investment Holdingholding
         
SMIC Shenzhen (HK) Company Limited Hong Kong
January 29, 2008
  100% Investment Holdingholding
         
SilTech Semiconductor Corporation Cayman Islands
February 13, 2008
  10097.7% Investment Holding
         
SilTech Semiconductor (Hong Kong) Corporation Limited* Hong Kong
March 20, 2008
  10097.7% Investment Holdingholding
         
Semiconductor Manufacturing International (Shenzhen) Corporation*# PRC
March 20, 2008
  100% Manufacturing and trading of semiconductor products
  
SilTech Semiconductor (Shanghai) Corporation LimitedPRC
March 3, 2009
97.7%Manufacturing and trading of semiconductor products
Brite Semiconductor CorporationCayman Islands44.2%Investment Holding
Brite Semiconductor Corporation Hong Kong LimitedHong Kong44.2%Investment Holding
Brite Semiconductor CorporationPRC44.2%Design House
Note 1:Please refer to Note 30 (Subsequent Events) to the consolidated financial statements for details regarding the subsequent changes of the company’s shareholding.
 
# Companies registered as wholly-owned foreign enterprises in thePeople’s Republic of China. (“PRC”), excluding for the purpose of this report, Hong Kong, Macau, and Taiwan.
 
* For identification purposes only.


Property, plant and equipment
Equipment
The quality and level of technology of the equipment used in the semiconductor fabrication process are important because they dictate the limits of the process technology that we use. Advances in process technology cannot be achieved without corresponding advances in equipment technology. The principal pieces of equipment used by us to fabricate semiconductors are scanners, cleaners and track equipment, inspection equipment, etchers, furnaces, wet stations, strippers, implanters, sputterers, CVD equipment, testers and probers. We source substantially all of our equipment from vendors located in the United States, Europe and Japan.
In implementing our capacity expansion and technology advancement plans, we expect to make significant purchases of equipment required for semiconductor fabrication. Some of the equipment is available from a limited number of vendors and/or is manufactured in relatively limited quantities, and in some cases has only recently become commercially available. Our ability to obtain certain kinds of equipment from outside of China may be subject to restrictions. See “Risk Factors—Factors — Risks Related to Conducting Operations in China—LimitsChina-Limits placed on exports into China could substantially harm our business and operating results.”
We maintain our equipment through a combination of in-house maintenance and outside contracting to our equipment vendors. We decide whether to maintain ourselves, or subcontract the maintenance of, a particular piece of equipment based on a variety of factors, including cost, complexity and regularity of the required periodic maintenance and the availability of maintenance personnel in China. Most of our equipment vendors offer maintenance services through technicians based in China.

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Property
Our corporate headquarters and our mega-fab in Shanghai occupy 367,895 square meters of land, for which we hold valid land use rights certificates. These fabs currently occupy approximately 45% of this total land area. We also hold valid land use rights for the 240,140 square meters of land that comprise our Beijing site, approximately 75% of which will be occupied by the Beijing mega-fab. In 2005, we received land use rights certificates for 215,733 square meters of land in Tianjin, which is occupied by the Tianjin fab. We own all of the buildings and equipment for our fabs, except for certain customer-owned tooling provided to our Shanghai operations for test production on a consignment basis from our customers.
The following table sets forth the location, size and primary use of our real properties and whether such real properties are owned or leased.
       
      Owned(1)or
  Size   Leased
Location (Land/Building) Primary Use (Land/Building)
  (in square meters)    
Zhangjiang High-Tech Park, Pudong New Area, Shanghai 367,895/530,831/164,795 Wafer fabrication owned/owned
Beijing Economic and Technological Development Area 240,140/506,562/143,017 Wafer fabrication owned/owned
Xiqing Economic Development Area, Tianjin 215,733/61,990 Wafer fabricationowned/owned
Shenzhen Export Processing Zone, Shenzhen Pingshan New Area, Guangdong200,060/225,986 Wafer fabrication owned/owned
Export Processing Zone (West Area), Chengdu 252,831/215,874/35,850 Assembly and Test owned/owned
Japan na/55 Marketing activities na/leased
USA na/743 Marketing activities na/leased


Owned(1) or
SizeLeased
Location(Land/Building)Primary Use(Land/Building)
(in square meters)
Italy na/280 Marketing activities na/leased
Hong Kong(2)
 na/300 Representative Office na/owned
 
(1) With respect to land located in China, “ownership” refers to holding a valid land use rights certificate. All land within municipal zones in China is owned by the Chinese government. Limited liability companies, joint stock companies, foreign-invested enterprises, privately held companies and individual natural persons must pay fees to be granted rights to use land within municipal zones. Legal use of land is evidenced and sanctioned by land use certificates issued by the local municipal administration of land resources. Land use rights granted for industrial purposes are limited to a term of no more than 50 years.
 
(2) In February 2006, we purchased approximately 300 square meter of property in Hong Kong through our indirect wholly-owned subsidiary, Magnificent Tower Limited, a company incorporated in the British Virgin Islands.
The construction of our 8-inch fab in Shenzhen began in 2008 in an effort to expand our production capacity and is expected to commence commercial production in 2010.2011. We plan to gradually increase the capacity in the Shenzhen fab based on market conditions. This project will be financed through our operating cash flows as well as through external financing. See “Risk Factors—Factors — Risks Related to Our Financial Condition and Business—Business — Since our operating cash flows will not be sufficient to cover our planned capital expenditures, we will require additional external financing, which may not be available on acceptable terms or at all. Any failure to raise adequate funds in a timely manner could adversely affect our business and operating results,” and “Risk Factors—Factors — Risks Related to Our Financial Condition and Business—Business — The construction and equipping of new fabs and the expansion of existing fabs are subject to certain risks that could result in delays or cost overruns, which could require us to expend additional capital and adversely affect our business and operating results.”
Our right to continued use of the land is subject to our continued compliance with the land use agreement that each of our Chinese subsidiaries has executed. The Chinese government has reserved the right to revoke our land use rights for special eminent domain purposes, in which case the government will compensate us. In addition, pursuant to an amendment to its domestic bank loan agreements, SMIC Beijing and SMIC Tianjin have pledged a portion of its land use right to the lenders. See “Item 5—5 — Operating and Financial Review and Prospects—Prospects — Liquidity and Capital Resources.”
For a description concerning our capacity, capacity utilization rate and capacity expansion plans, please see “Item 5-Operating5 — Operating and Financial Review and Prospects-FactorsProspects — Factors that Impact our Results of Operations.”

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Risk Management and Insurance
     We have been OHSAS18001 certified since September 2003. Our health and safety management philosophy is based on incident prevention, and frequent safety audits. Incident preventionwhich is achieved through:
  mandatoryMandatory staff and vendor safety training;
 
  complianceCompliance of equipment and facilities to safety criteria, including the Semiconductor Equipment and Materials International and Chinese National Fire Protection Association standards;standards
A culture of accountability, whereby managers and employees are held responsible for the their own and their group’s safety performance;
Regularly scheduled audits; and
 
  standardStandard management procedures established by our environmental, health and safety committee.procedures.


Regularly scheduled safety audits are performed in accordance with established world standards, and we have been qualified under OHSAS 18001 internal auditing standards as of September 2003.
We have established a corporate risk management committee and at each fab, an emergency response centerEmergency Response Center (ERC), to respond to all emergencies. The facility monitoringERCs are staffed 24 hours a day and control system and security monitoring room located within our emergency response center are where all emergency responses begin. These rooms are equipped with 24-hour safety and security monitoring systems such as closed circuit television, gas monitoring systems, chemical dispensing systems, very early smoke detection apparatus, public announcement systems, and fire alarm monitoring systems.
Each department conducts emergency drills on a quarterlyregular basis in accordance with our emergency response plan to address all possible emergency situations that could arise. These emergency scenarios include fires, gas leakages, chemical spills, and power losses.
We maintain insurance with respect to our facilities, equipment, and inventories. The insurance for the fabs and their equipment covers, subject to some limitations, various risks, including industrial accidents and natural disasters, generally up to their respective replacement values and loss due to business interruption. We have not made any significant claims under these insurance policies. Equipment and inventories in transit are also insured.
Environmental Matters
The semiconductor production process generates gaseous chemical wastes, liquid waste, waste water, and other industrial wastes in various stages of the fabrication process. We have installed various types of pollution control equipment for the treatment of gaseous chemical waste and liquid waste and equipment for the recycling of treated water in our fabs. Our operations are subject to regulation and periodic monitoring by PRC’s State Environmental Protection Bureau, as well as local environmental protection authorities, including those under the Shanghai Pudong Municipal Government, the Beijing Municipal Government, the Tianjin Municipal Government, and the Chengdu Municipal Government, which may in some cases establish stricter standards than those imposed by the State Environmental Protection Bureau. The Chinese national and local environmental laws and regulations impose fees for the discharge of waste substances above prescribed levels, require the payment of fines for serious violations, and authorize the Chinese national and local governments to suspend any facility that fails to comply with orders requiring it to cease or remedy operations causing environmental damage. No such penalties have been imposed on us or any of our subsidiaries for violations of environmental pollution.
We believe our pollution control measures are effective, complying with the requirements applicable to the semiconductor industry in China and comparable to other countries. Waste generated from our operations, including acid waste, alkaline waste, flammable waste, toxic waste, oxidizing waste, and self-igniting waste, are collected and sorted for proper disposal. Furthermore, we have in many cases implemented waste reduction steps beyond the scope of current regulatory requirements. In addition, we continuously investigate methods to lower our energy consumption, including making existing processes more efficient and introducing green energyreclaiming waste heat.
The ISO14001 standard is a voluntary standard and part of a comprehensive series of standards for environmental management published by the International Standards Organization. The ISO14001standardISO14001 standard cover environmental management principles, systems and supporting techniques. StartingSMIC first received ISO14001 certification in August 2002,2002.
In addition, all operating fabs have since achieved ISO14001 certification.
Furthermore, by March of 2007, these fabscurrently in operation have been third-party certified to be compliant with the RoHS (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment) Directive of the European Union, which bans the use of various chemicals determined to be harmful to the environment. Once the Shenzhen facility is in operation, it too will undergo certification for ISO14001 and RoHS compliance.

 

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Item 4A. Unresolved Staff Comments
Not applicable.
Item 5. Operating and Financial Review and Prospects
Overview
We were founded in April 2000. In 2000 and 2001, our company was in its development stage and did not have any sales. During this period, we established our management structure, acquired land use rights, constructed, equipped and commenced the ramp-up of production at our 8-inch wafer facilities in Shanghai which are referred to as the Shanghai mega-fab, and began our research and development activities. The first fab in the Shanghai mega-fab and thea portion of our second fab, commenced commercial production in January 2002. The remaining portion of our second fab and a third fab commenced commercial production in January 2003. In January 2004, we acquired an 8-inch fab in Tianjin, China, which we refer to as our Fab 7, from MCEL, a wholly owned subsidiary of Motorola. The first fab in the Beijing mega-fab commenced commercial production in March of 2005. As of December 31, 2008,2010, we had reached total wafer fabrication capacity of 160,500171,725 8-inch wafer equivalents per month. Our wafers shipped and sales increaseddecreased from 1,614,888 wafers and US$1,465.3 million for 2006 to 1,849,957 wafers and US$1,549.8 million for 2007 and decreased to 1,611,208 wafers and US$1,353.7 million for 2008.2008 to 1,376,663 wafers and US$1,070.4 million for 2009 and then increased to 1,985,974 wafers and US$1,554.8 million for 2010.
We manage our business and measure our results of operations based on a single operating segment. We anticipate a slightan increase toin aggregate capacity by the end of 20092011 subject to market conditions. As we increase our capacity and corresponding wafer production, we benefitanticipate benefits from economies of scale. When our capacity utilization is high, these economies of scale enable us to reduce our per wafer production cost and improve our margins. On the other hand, when our capacity utilization rate is low, our unused capacity results in higher per wafer production cost and decreased margins.
Factors that Impact Our Results of Operations

Cyclicality of the Semiconductor Industry
The semiconductor industry is highly cyclical due mainly to the cyclicality of demand in the markets of the products that use semiconductors. As these markets fluctuate, the semiconductor market also fluctuates. This fluctuation in the semiconductor market is exacerbated by the tendency of semiconductor companies, including foundries, to make capital investments in plant and equipment during periods of high demand since it may require several years to plan, construct and commence operations at a fab. Absent sustained growth in demand, this increase in capacity often leads to overcapacity in the semiconductor market, which in the past has led to a significant underutilization of capacity and a sharp drop in semiconductor prices. The semiconductor industry is generally slow to react to declines in demand due to its capital-intensive nature and the need to make commitments for equipment purchases well in advance of the planned expansion.
Substantial Capital Expenditures
The semiconductor foundry industry is characterized by substantial capital expenditures. This is particularly true for our company as we have recently constructed and equipped fabs and are continuing to construct and equip new fabs. In connection with the construction and ramp-up of our capacity since our inception, we incurred capital expenditures of US$912666 million, US$860190 million, and US$666728 million in 2006, 2007,2008, 2009, and 20082010 respectively. We depreciate our manufacturing machinery and equipment on a straight-line basis over an estimated useful life of five to seven years. We recorded depreciation and amortization of US$919.6 million, US$706.3, and US$761.8 million, US$748.2, and US$584.2 million in 2006, 2007,2008, 2009, and 20082010, respectively.


The semiconductor industry is also characterized by rapid changes in technology, frequently resulting in obsolescence of process technologies and products. As a result, our research and development efforts are essential to our overall success. We spent approximately US$94.2 million in 2006, US$97.0 million in 2007, and US$102.2 million in 2008, US$160.8 million in 2009, and US$174.9 million in 2010 for research and development, which represented 6.4%7.6%, 6.3%15.0%, and 7.6%11.2% respectively, of our sales for 2006, 2007,2008, 2009, and 2008.2010. Our research and development costs are partially offset by related government subsidies and include non-recurring engineering costs associated with the ramp-up of a new wafer facility. In 2008, we continued to equip our new 12-inch fab at the Shanghai mega-fab.

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We currently expect that our capital expenditures in 20092011 will be approximately US$190 million1 billion, subject to be adjustedadjustment based on market conditions, which we plan to fund through our operating cash flows and bank loans in order to expand our operations. If necessary, we will also explore other forms of external financing. In addition, our actual expenditures may exceed our planned expenditures for a variety of reasons, including changes in our business plan, our process technology, market conditions, equipment prices, or customer requirements. We will monitor the global economy, the semiconductor industry, the demands of our customers, and our cash flow from operations to adjust our capital expenditure plans.
Capacity Expansion
We have expanded, and plan to continue to expand, our capacity through internal growth and acquisitions. An increase in capacity may have a significant effect on our results of operations, both by allowing us to produce and sell more wafers and achieve higher sales, and as a cost component in the form of acquisition costs and depreciation expenses. We anticipate a slightan increase to aggregate capacity by the end of 20092011 subject to market conditions.
Pricing
We price our foundry services on either a per wafer or a per die basis, taking into account the complexity of the technology, the prevailing market conditions, the order size, the cycle time, the strength and history of our relationship with the customer, and our capacity utilization. Since a majority of our costs and expenses are fixed or semi-fixed, fluctuations in the average selling prices of semiconductor wafers have historically had a substantial impact on our margins. The average selling price of the wafers we shipped increased 0.2%0.6% from US$838778 per wafer in 20072009 to US$840783 per wafer in 2008.2010.
The following table sets forth a percentage breakdown of wafer sales by process technology for the years ended December 31, 2006, 20072008, 2009 and 20082010 and each of the quarters in the year ended December 31, 2008:2010:
                                                        
 For the  For the
 For the For the three months ended year ended  For the For the three months ended year ended
Process year ended December 31, March 31, June 30, September 30, December 31, December 31, 
Technologies 2006 2007 2008 2008 2008 2008 2008 
 (based on sales in US$)  year ended December 31, March 31, June 30, September 30, December 31, December 31,
0.13 micron and below  49.60%  53.10%  44.70%  41.30%  44.50%  45.50%  43.90%
Process Technologies 2008 2009 2010 2010 2010 2010 2010
 (based on sales in US$) 
0.065 micron  0.01%  0.98%  1.70%  3.72%  7.08%  8.58%  5.43%
0.09 micron  17.60%  15.13%  18.66%  19.87%  16.19%  15.38%  17.44%
0.13 micron  26.29%  34.96%  35.52%  32.16%  32.95%  31.95%  33.08%
0.15 micron  5.70%  2.90%  4.30%  2.10%  2.00%  2.20%  2.70%  2.70%  2.12%  1.50%  1.78%  2.34%  1.22%  1.71%
0.18 micron  35.70%  30.50%  32.10%  37.70%  33.90%  32.50%  34.10%  34.10%  27.27%  24.16%  26.81%  25.60%  26.52%  25.81%
0.25 micron  2.00%  0.70%  0.50%  0.60%  0.50%  0.60%  0.60%  0.60%  0.44%  0.26%  0.56%  0.51%  0.53%  0.47%
0.35 micron  7.00%  12.80%  18.40%  18.30%  19.10%  19.20%  18.70%  18.70%  19.10%  18.20%  15.10%  15.33%  15.82%  16.06%
  
Total  100.00%  100.00%  100.00%  100.00%  100.00%  100.00%  100.00%  100.00%  100.00%  100.00%  100.00%  100.00%  100.00%  100.00%


Change in Process Mix and Technology Migration
Because the price of wafers processed with different technologies varies significantly, the mix of wafers that we produce is among the primary factors that affect our sales and profitability. The value of a wafer is determined principally by the complexity of the process technology used to fabricate the wafer. In addition, production of devices with higher levels of functionality and greater system-level integration requires more fabrication steps, and these devices generally sell for higher prices.

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Prices for wafers of a given level of technology generally decline over the relevant process technology life cycle. As a result, we and our competitors are continuously in the process of developing and acquiring advanced process technologies and migrating our customers to use such technologies to maintain or improve our profit margins. This technology migration requires continuous investment in research and development and technology-related acquisitions, and we expect to continue to spend a substantial amount of capital on upgrading our technologies.
Our initial sales after commencing commercial operations in 2002 consisted mainly of DRAM fabricated and sold on a foundry basis, as well as commodity-type DRAM fabricated using technology licensed from a third party and sold by us to distributors. This commodity-type DRAM was fabricated during our start-up phase in order to test and ramp up our facilities and train our personnel. As our business has grown and our fabs have matured, we have produced proportionately less commodity-type DRAM and more logic products and memory products utilizing more advanced technologies, which generally command a higher margin. During the first quarter of 2008, the Company reached an agreement with our customers to completely exit the commodity DRAM business. The conversion of DRAM capacity into logic production was completed on schedule in the fourth quarter.quarter of 2008. As a result, our Beijing 300mm logic capacity has placed us in a better position to serve our global and China customers. In connection with the decision to exit the commodity DRAM business, we recorded an impairment loss of $105.8 million on long-lived assets during the first quarter of 2008.
The following table sets forth a breakdown of our sales by service type for 2006, 20072008, 2009 and 2008:2010:
                                                
 For the year ended December 31,  For the year ended December 31, 
 2006 2007 2008  2008 2009 2010 
Service Type Sales Percentage Sales Percentage Sales Percentage  Sales Percentage Sales Percentage Sales Percentage 
 (in US$ thousands, except percentages)  (in US$ thousands, except percentages) 
Fabrication of memory wafers 476,970  32.60% 428,355  27.60% 71,935  5.30% 71,935  5.30% 35,648  3.33% 20,592  1.32%
Fabrication of logic wafers(1)
 923,411  63.00% 985,776  63.60% 1,139,535  84.20% 1,139,535  84.20% 959,689  89.66% 1,416,250  91.09%
Other(2)
 64,942  4.40% 135,634  8.80% 142,241  10.50% 142,241  10.50% 75,050  7.01% 117,947  7.59%
                            
 
Total $1,465,323  100.00% $1,549,765  100.00% 1,353,711  100.00% $1,353,711  100.00% 1,070,387  100.00% 1,554,789  100.00%
                            
 
(1) Includes copper interconnects and memory devices whose manufacturing process is similar to that for a logic device.
 
(2) Includes mask-making and probing, etc.
Capacity Utilization Rates


Operations at or near full capacity have a significant positive effect on our profitability because a substantial percentage of our cost of sales is of a fixed nature. In 2006, 20072008, 2009 and 2008,2010, approximately 59%46%, 47%,49% and 46%40% respectively, of our cost of sales consisted of depreciation expenses, which are fixed costs. If we increase our utilization rates, the number of wafers we fabricate will increase, and therefore our average fixed costs per wafer will decrease. Therefore, our capacity utilization rates have a significant effect on our margins. Our utilization rates have varied from period to period due to capacity ramp-ups and fluctuations in customer orders. Our annual capacity utilization rate was 89.6% in 2006, 91.0% in 2007, and 86.0% in 2008.2008, 75.0% in 2009, and 95% in 2010. Factors affecting utilization rates are the overall industry conditions, the level of customer orders, the complexity of the wafers and of the mix of wafers produced, mechanical failures and other operational disruptions such as the expansion of capacity or the relocation of equipment, and our ability to manage the production facilities and product flows efficiently.

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Our capacity is determined by us based on the capacity ratings for each piece of equipment, as specified by the manufacturers of such equipment, adjusted for, among other factors, actual output during uninterrupted trial runs, expected down time due to set up for production runs and maintenance, and expected product mix. Because these factors include subjective elements, our measurement of capacity utilization rates may not be comparable to those of our competitors.
Yield Rates
Yield per wafer is the ratio of the number of functional dies on that wafer to the maximum number of dies that can be produced on that wafer. A significant portion of our services, particularly our memory semiconductor wafer fabrication services, is priced on a per die basis.
We continuously upgrade the process technologies that we use. At the beginning of each technology migration, the yield utilizing the new technology is generally lower, sometimes substantially lower, than the yield under the then-current technology. This is because it requires time to stabilize, optimize and test a new process technology. We do not ship wafers to a customer until we have achieved that customer’s minimum yield requirements. Yield is generally improved through the expertise and cooperation of our research and development personnel, process engineers, and equipment suppliers.
Critical Accounting Policies
The methods, estimates and judgments we use in applying our accounting policies have a significant impact on the results we report in our financial statements. Some of our accounting policies require us to make difficult and subjective judgments, often as a result of the need to make estimates of matters that are inherently uncertain. Below we have summarized our accounting policies that we believe are both important to the portrayal of our financial results and involve the need to make estimates about the effect of matters that are inherently uncertain. We also have other policies that we consider to be key accounting policies. However, these policies do not meet the definition of critical accounting estimates because they do not generally require us to make estimates or judgments that are difficult or subjective.
     Please see “Item 8 — Financial Information — Litigation” regarding the Accounting Treatment for the 2005 and 2009 Settlement Agreements with TSMC.
Inventory


Inventories are stated at the lower of cost or market. Market represents the net realizable value for finished goods and work-in-progress. Inventory cost is determined using standard cost and an allocation of the cost variances arising in the period of production, which approximates actual costs determined on the weighted average basis. We determine the standard cost of each wafer based on estimates of the materials, labor, and other costs incurred in each process step associated with the manufacture of our products. We allocate labor and overhead costs to each step in the wafer production process based on normal fab capacity, with costs arising from abnormal under-utilization of capacity expensed when incurred. The unit cost of a wafer generally decreases as fixed overhead charges, such as depreciation expense on the facility and semiconductor equipment, are allocated over a larger number of units produced.
We estimate the net realizable value for such finished goods and work-in-progress based primarily upon the latest invoice prices and current market conditions. If the market value of a good drops below its carrying value, we record a write-off to cost of sales for the difference between the carrying cost and the market value. During the years ended December 31, 2006, 20072008, 2009 and 2008,2010, the Company recorded inventory write downs of US$16.140.8 million, US$22.726.3 million and US$40.819.9 million, respectively, to reflect a decline in the estimated market value of the inventory we held. We carry out an inventory review at each quarter-end.
Depreciation and Amortization
We operate in a capital-intensive business. We periodically review and assess the estimated useful life of our assets based on expected use by the Company, taking into account effects of obsolescence, demand, and other economic factors. The net book value of our plant and equipment, including prepaid land use rights, at December 31, 20082010 was US$3,0382,430.7 million. Depreciation of manufacturing buildings and related improvements is provided on a straight-line basis over the estimated useful life of 25 years and commences from the date the facility is ready for its intended use. Depreciation of our manufacturing machinery and equipment, as well as our facility, machinery and equipment, is provided on a straight-line basis over the estimated useful life, commencing from the date that the equipment is placed into productive use. A 5 to 7 year useful life is used for manufacturing machinery and equipment while a 10 year useful life is used for facility, machinery and equipment. Amortization of land use rights is over the term of the land use right agreement, which ranges from 50 to 70 years. Amortization of intangible assets is computed using the straight-line method over the expected useful life of the assets ranging from 3 to 10 years. The estimated useful life and dates that the equipment is placed into productive use reflects our estimate of the periods that we intend to derive future economic benefits from the use of our plant and equipment and land use rights.

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Long-lived Assets
The Company assesses the impairment of long-lived assets when events or changes in circumstances indicate that the carrying value of the assets or the asset group may not be recoverable. Factors that we consider in deciding when to perform an impairment review include, but are not limited to significant under-performance of a business or product line in relation to expectations, significant negative industry or economic trends, and significant changes or planned changes in our use of the assets. An impairment analysis is performed at the lowest level of identifiable independent cash flows for an asset or asset group. We make subjective judgments in determining the independent cash flows that can be related to specific asset group based on our asset usage model and manufacturing capabilities. We measure the recoverability of assets that will continue to be used in our operations by comparing the carrying value of the asset group to our estimate of the related total future undiscounted cash flows. If an asset group’s carrying value is not recoverable through the related undiscounted cash flows, the impairment loss is measured by comparing the difference between the asset group’s carrying value and its fair value, based on the best information available, including market prices or discounted cash flow analysis.


In order to remain technologically competitive in our industry, we have entered into technology transfer and technology license arrangements with third parties in an attempt to advance our process technologies. The payments made for such technology licenses are recorded as an intangible asset or as a deferred cost and amortized on a straight-line basis over the estimated useful life of the asset. We routinely review the remaining estimated useful lives of these intangible assets and deferred costs. We also evaluate these intangible assets and deferred costs for impairment whenever events or changes in circumstances indicate that their carrying amounts may not be recoverable.
We have continued to construct, acquire, and expand our manufacturing facilities since our inception. We will continue to review impairment factors as described above and, as a result, impairment charges may be necessary in the future as circumstances change.
     In 2010, the Company recorded an impairment loss of $8.4 million associated with the disposal of fixed assets with outdated technologies.
     In 2009, the effect of adverse market conditions and significant changes in the Company’s operation strategy lead to the Company’s identification and commitment to abandon a group of long-lived assets. This group of long-lived assets is equipped with outdated technologies and no longer receives vendor support. As of December 31, 2009, this group of assets ceased to be used. As a result, the Company recorded an impairment loss of $104.7 million after writing down the carrying value of these assets to zero.
During the first quarter of 2008, the Company reached an agreement with our customers to completely exit the commodity DRAM business. The conversion of DRAM capacity into logic production was completed on schedule in the fourth quarter. As a result, our Beijing 300mm logic capacity has placed us in a better position to serve our global and China customers. In connection with the decision to exit the commodity DRAM business, we recorded an impairment loss of $105.8 million on long-lived assets during the first quarter of 2008.
Income Taxes
     Current income taxes are provided for in accordance with the laws of the relevant taxing authorities.
     As part of the process of preparing financial statements, we are required to estimate our income taxes in each of the jurisdictions in which it operates. When we have net operating loss carry forwards or temporary differences in the amount of tax recorded for tax purposes and accounting purposes, we may be able to reduce the amount of tax that we would otherwise be required to pay in future periods. We recognize all existing future tax benefits arising from these tax attributes as deferred tax assets and then establish a valuation allowance equal to the extent, if any, that it is more likely than not that such deferred tax assets will not be realized. We record an income tax benefit or expense when there is a net change in our total deferred tax assets and liabilities in a period. The ultimate realization of the deferred tax assets depends upon the generation of future taxable income during the periods in which the net operating losses and temporary differences become deductible. We account for income taxes using the asset and liability method. We record a valuation allowance to reduce our deferred tax assets to the amount that we believe is more likely than not to be realized. In assessing the need for a valuation allowance, we consider all positive and negative evidence, including past performance, the general outlook of the semiconductor industry, business conditions caused by the global economic downturn, projected future taxable income and recent financial performance. Forming a conclusion that a valuation allowance is not required is difficult when there is negative evidence such as cumulative losses in recent years.


     Because the determination of the amount of valuation allowance is based, in part, on our forecast of future profitability, it is inherently uncertain and subjective. Changes in market conditions and our assumptions may cause the actual future profitability to differ materially from our current expectation, which may require us to increase or decrease the amount of valuation allowance that we have recorded.
     The Company has no material uncertain tax positions as of December 31, 2010 or unrecognized tax benefit which would favorably affect the effective income tax rate in future periods. The Company classifies interest and/or penalties related to income tax matters in income tax expense. As of MarchDecember 31, 20082010, the sensitivityamount of interest and penalties related to uncertain tax positions is immaterial. The Company does not anticipate any significant increases or decreases to its liability for unrecognized tax benefits within the fair values to an independent change of one point in the discount rate were as follows:
             
  Excess of carrying value    
  over estimated fair value  Impact of one point change in the discount rate 
Reporting Unit (in millions)  (in millions) 
     +1 point  -1 point 
 
SMIB  -105.8   -129.2   -81.4 
next 12 months.
Revenue Recognition
We manufacture semiconductor wafers for our customers based on the customers’ designs and specifications pursuant to manufacturing agreements and purchase orders. We also sell certain semiconductor standard products to customers. Customers do not have any rights of return except pursuant to warranty provisions, which returns have been minimal. We typically perform tests of our products prior to shipment to identify yield of acceptable products per wafer. Occasionally, product tests performed after shipment identify yields below the level agreed with the customer. In those circumstances, the customer arrangement may provide for a reduction to the price paid or for its costs to ship replacement products. We estimate the amount of sales returns and the cost of replacement products based on the historical trend of returns and warranty replacements relative to sales and any current information regarding specific customer yield issues that may exceed historical trends. We recognize revenue upon shipment and title transfer, if all other criteria have been met. We also provide certain services such as mask making and probing and revenue is recognized when our services are completed.

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     The Company provides management services to certain government-owned foundries. Service revenue is recognized when persuasive evidence of an arrangement exists, service has been performed, the fee is fixed or determinable, and collectability is reasonably assured.


Share-based Compensation Expense
Our share-based employee compensation plans are described in more detail under “—Share“Share Ownership.” We grant stock options to our employees and we record a compensation charge for the excess of the fair value of the stock at the measurement date over the amount an employee must pay to acquire the stock. We amortize share-based compensation using the straight-line method over the vesting periods of the related options, which are generally four years.
We grant stock options to our employees and certain non-employees. Prior to January 1, 2006, we accounted for share-based compensation in accordance with Accounting Principles Board Opinion No. 25, (“APB 25”), “Accounting for Stock Issued to Employees,” and related interpretations. We also followed the disclosure requirements of SFAS No. 123, “Accounting for Stock-Based Compensation”, as amended by SFAS 148, “Accounting for Stock-Based Compensation-Transition and Disclosure.” As a result, no expense was recognized for options to purchase our ordinary shares that were granted with an exercise price equal to fair market value at the day of the grant prior to January 1, 2006. Effective January 1, 2006, we adopted the provisions of Statement of Financial Accounting Standards No. 123(R), (“SFAS 123(R)”) “Share-Based Payment,” which establishes accounting for equity instruments exchanged for services. Under the provisions of SFAS 123(R), share-basedShare-based compensation cost is measured at the grant date, based on the fair value of the award, and is recognizedrecognised, net of expected forfeitures, as an expense over the employee’s requisite service period (generally the vesting period of the equity grant). We elected to adopt the modified prospective transition method as provided by SFAS 123(R) and, accordingly, financial statement amounts for the prior periods presented in this report have not been restated to reflect the fair value method of expensing share-based compensation. As a result of adopting SFAS 123 (R) on January 1, 2006, we recognized a benefit of US$5.2 million as a result of the cumulative effect of a change in accounting principle, in relation to the forfeiture rate applied on the unvested portion of the stock options. Our total actual share-based compensation expense for the year ended December 31, 2006, 2007 and 2008 was US$23.5, US$20.6, and US$11.6 million respectively.


The fair value of options and shares issued pursuant to our option plans at the grant date was estimated using the Black-Scholes option pricing model. This model was developed for use in estimating the fair value of traded options that have no vesting restrictions and are fully transferable. In addition, option-pricing models require the input of highly subjective assumptions, including the expected term of the options, the estimated forfeiture rates and the expected stock price volatility. The expected term of options granted represents the period of time that options granted are expected to be outstanding. We estimated forfeiture rates using historical data to estimate option exercise and employee termination within the pricing formula. We use projected volatility rates based upon the company’s historical volatility rates. BecauseThese assumptions are inherently uncertain. Different assumptions and judgements would affect our employee stock options issued under our 2001 Stock Plan, 2001 Regulation S Stock Plan, 2001 Preference Shares Stock Plan and 2001 Regulation S Preference Shares Stock Plan had characteristics significantly different from those of publicly traded options, and because changes in the subjective input assumptions can materially affect the fair value estimate, in management’s opinion, the existing models do not necessarily provide a reliable single measurecalculation of the fair value of our stock options.
Inflation
Although there can be no assurance as to the impact in future periods, we believe that, to date, inflation in China has not had a material impact on ourunderlying ordinary shares for the options granted, and the valuation results and the amount of operations. Inflation in China was approximately 1.5%, 4.8%, and 5.9% in 2006, 2007, and 2008, respectively.share-based compensation would also vary accordingly.


Income Tax
As an exempted company incorporated in the Cayman Islands, we are exempt from Cayman Islands taxation. Our Chinese subsidiaries are subject to taxation pursuant to Enterprise Income Tax Law and various local income tax laws. Under relevant regulations and after approval by the local Tax Bureau, our Shanghai, Beijing and Tianjin subsidiaries will becomeare entitled to a full exemption from foreign enterprise income tax, or FEIT, for five years starting with the first year of positive accumulated earnings, and a 50% reduction for the following five years. The tax holiday enjoyed by our Shanghai subsidiary took effect in 2004 when SMIS completed its first profit-making year. As of December 31, 2008,2010, both Beijing and Tianjin entities were in accumulative loss positions and as a result the tax holiday had not yet takenbegun to take effect.
According     Under the FEIT Laws, SMICD was qualified to PRCenjoy a 5-year tax regulations, the Company’s Chengdu subsidiary is entitled to aholiday (2-year full exemption from FEIT for two years startingfollowed by 3-year half reduction) subsequent to its first profit-making year after utilizing all prior tax losses or 2008 in accordance with the first year of positive accumulated earningsNew EIT Law. SMICD was in a loss position and a 50% reduction for the following three years. Astax holiday began as of December 31, 2008 SMICD was still in a loss position. Pursuant to the New EIT Law, the tax holiday began in 2008 at the statutory tax rate of 25% despite the fact that SMICD had yet to be profitable.. The applicable income tax rate for 2010, 2011 and 2012 is 12.5%, and thereafter is 25%, respectively.

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Our other subsidiaries are subject to their respective jurisdictions’ income tax laws, including Japan, United States, and Europe. Our income tax obligations to date have been minimal.
We account for income taxes in accordance with SFAS No. 109, “Accounting for Income Taxes.” SFAS No. 109 requiresusing an asset and liability approach for financial accounting and reporting for income tax purposes. Under the asset and liability method, deferred income taxes are recognized for temporary differences, net operating loss carry-forwards and credits by applying enacted statutory tax rates applicable to future years. Deferred tax assets are reduced by a valuation allowance when, in the opinion of management, it is more likely than not that some portion or all of the deferred tax assets will not be realized. We conduct this analysis on a quarterly basis. As of December 31, 2008,2010, the Company has recognized deferred tax assets including $55.5$185.4 million from net operating loss carry forward and $59.2$62.1 million from temporary difference between the tax and book base of certain fixed assets. We provided full valuation allowance on net operating loss carry forward as we believe it is more likely than not that it would not to be realized. The temporary difference generated from depreciation of fixed assets relates specially to one of the Company’s subsidiaries and this subsidiary has achieved profitability in prior years and is expected to continue to be profitable based on the current forecast. We have recognized $20.3$163.8 million valuation allowance based on the analysis on available positive and negative evidences, including profitability, utilization and production efficiency, industry cyclical risk and technology development risk.
Effective January 1, 2007, the Company adopted FASB Interpretation No. 48 “Accounting for Uncertainty in Income Taxes — an Interpretation of FASB Statement 109” (“FIN 48”), which prescribes a more-likely-than-not threshold for financial statement recognition and measurement of a tax position taken or expected to be taken in a tax return. This interpretation also provides guidance on de-recognition of income tax assets and liabilities, classification of current and deferred income tax assets and liabilities, accounting for interest and penalties associated with tax positions, accounting for income taxes in interim periods and income tax disclosures.
     The Company has no material uncertain tax positions as of December 31, 2010 or unrecognized tax benefit which would favorably affect the effective income tax rate in future periods. The Company classifies interest and/or penalties related to income tax matters in income tax expense. As of December 31, 2010, the amount of interest and penalties related to uncertain tax positions is immaterial. The Company does not anticipate any significant increases or decreases to its liability for unrecognized tax benefits within the next 12 months.
On March 16, 2007, the National People’s Congress, the PRC legislature, approved and promulgated a new tax law named Enterprise Income Tax Law,Law. On December 6, 2007, the PRC State Council issued the Implementation Regulations of the


Enterprise Income Tax Law, both of which became effective on January 1, 2008. The Enterprise Income Tax Law and its Implementation Regulations, or the new EIT law, FIEs and domestic companies are subject to a uniform tax rate of 25%. The new EIT law eliminates or modifies most of the tax exemptions, reductions and preferential treatments available under the previous tax laws and regulations. The State Council issued the Notice of the State Council on the Implementation of the Transitional Preferential Policies in respect of Enterprise Income Tax on December 26, 2007, enterprises that were established before March 16, 2007 and already enjoy preferential tax treatments will (i) in the case of preferential tax rates, continue to enjoy the tax rates which will be gradually increased to the new tax rates within five years from January 1, 2008 or (ii) in the case of preferential tax exemption or reduction for a specified term, continue to enjoy the preferential tax holiday until the expiration of such term. Thus, SMIC Shanghai, SMIC Beijing and SMIC Tianjin could fall into condition (ii) and may be entitled to the “five year exemption and five year reduction” as subject to the final recognition by the PRC tax authorities. While the EIT Law equalizes the tax rates for FIEs and domestic companies, preferential tax treatment would continue to be given to companies in certain encouraged sectors and to entities classified as high and new technology enterprises companies supported by the PRC government, whether FIEs or domestic companies. According to the new EIT Law, entities that qualify as high and new technology enterprises especially supported by the PRC government are expected to benefit from a tax rate of 15% as compared to the uniform tax rate of 25%. Implementation Regulations of the Enterprise Income Tax Law, a high and new technology enterprise shall have core self-owned intellectual properties and its products shall be within the scope provided by “the high-technology field highly supported by the State”.
Under the new EIT law, dividends, interests, rent, royalties and gains on transfers of property payable by a foreign-invested enterprise in the PRC to its foreign investor who is a non-resident enterprise will be subject to a 10% withholding tax, unless such non-resident enterprise’s jurisdiction of incorporation has a tax treaty with the PRC that provides for a reduced rate of withholding tax. The Cayman Islands, where SMIC is incorporated, does not have such a tax treaty with the PRC. If SMIC is considered a non-resident enterprise, this new 10% withholding tax imposed on SMIC’s dividend income received from SMIC Shanghai, SMIC Beijing and SMIC Tianjin would reduce its net income and have an adverse effect on its operating results.
Under the new EIT law, an enterprise established outside the PRC with its “de facto management body” within the PRC is considered a resident enterprise and will be subject to the enterprise income tax at the rate of 25% on its worldwide income and foreign tax credit may be applicable. The “de facto management body” is defined as the organizational body that effectively exercises overall management and control over production and business operations, personnel, finance and accounting, and properties of the enterprise. It remains unclear how the PRC tax authorities will interpret such a broad definition. Substantially the majority of management members of SMIC are based in the PRC. If the PRC tax authorities subsequently determine that SMIC should be classified as a resident enterprise, then SMIC’s worldwide income will be subject to income tax at a uniform rate of 25%, which may have a material adverse effect on SMIC’s financial condition and results of operations. Notwithstanding the foregoing provision, the new EIT law also provides that, if a resident enterprise directly invests in another resident enterprise, the dividends received by the investing resident enterprise from the invested enterprise are exempted from income tax, subject to certain conditions. Therefore, if SMIC is classified as a resident enterprise, the dividends received from our PRC subsidiary may be exempted from income tax. However, it remains unclear how the PRC tax authorities will interpret the PRC tax resident treatment of an offshore company, like SMIC, having indirect ownership interests in PRC enterprises through intermediary holding vehicles.

 

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On February 22, 2008, the PRC government promulgated Caishui (2008) No.1, the Notice of the Ministry of Finance and State Administration of Tax concerning Certain Enterprise Income Tax Preferential Policies (“Caishui No.1”). Pursuant to Caishui No.1, integrated circuit production enterprises whose total investment exceeds RMB8,000 million (approximately $1,095 million) or whose integrated circuits have a line width of less than 0.25 micron are entitled to preferential tax rate of 15%. If the operation period is more than 15 years, those enterprises are entitled to a full exemption from income tax for five years starting from the first profitable year after utilizing all prior years’ tax losses and 50% reduction for the following five years. SMIS, SMIB and SMIT have met such accreditation requirements.
Foreign Currency Fluctuations
Our sales are generally denominated in U.S. dollars and our operating expenses and capital expenditures are generally denominated in U.S. dollars, Japanese Yen, Euros and Renminbi. Accordingly, we are affected by fluctuations in exchange rates between the U.S. dollar and each of the Japanese Yen, the Euro and the Renminbi. See “Risk Factors—Factors — Risks Related to Conducting Operations in China—China — Devaluation or appreciation in the value of the Renminbi or restrictions on convertibility of the Renminbi could adversely affect our operating results” and “Risk Factors—Factors - Risks Related to Our Financial Condition and Business—Business — Exchange rate fluctuations could increase our costs, which could adversely affect our operating results and the value of our ADSs” for a discussion of the effects on our company of fluctuating exchange rates and Item 11-Quantative11 — Quantative and Qualitative Disclosures About Market Risk-ForeignRisk — Foreign Exchange Rate Fluctuation Risk” for a discussion of our efforts to minimize such risks.


Recent Accounting Pronouncements
In December 2007,April 2010, the FASB issued SFAS No. 141, “Business Combinations: (Revised 2007)ASU 2010-17, “Revenue Recognition — Milestone Method (Topic 605) (“SFAS 141R”). SFAS 141RThis guidance is relevant to provide on defining a milestone and determining when it may be appropriate to apply the milestone method of revenue recognition for research or development transactions. Research or development arrangements frequently include payment provisions whereby a portion or all transactionsof the consideration is contingent upon milestone events such as successful completion of phases in a study or eventsachieving a specific result from the research or development efforts. Specifically, this guidance amends the affect vendors that provide research or development deliverables in an arrangement in which one entity obtains control over one or more other businesses. SFAS 141R requires an acquirer topayments are contingent upon achieving uncertain future events or circumstances. A vendor can recognize any assets and non-controlling interest acquired and liabilities assumedconsideration that is contingent upon achievement of a milestone in its entirety as revenue in the period in which the milestone is achieved only if the milestone meets all criteria to be measured at fair value asconsidered substantive should based on: (1) be commensurate with either of the acquisition date. Liabilitiesfollowing: (a) the vendor’s performance to achieve milestone, (b) the enhancement of the value of the item delivered as a result of a specific outcome resulting from the vendor’s performance to achieve the milestone; (2) relate solely to past performance; or (3) be reasonable relative to all deliverables and payment terms in the arrangement. In addition, a vendor that is affected by the amendments required to provide all of the following: (1) a description of the overall arrangement; (2) a description of each milestone and related to contingent considerationconsideration; (3) a determination of whether each milestone is considered substantive; (4) the factors that the entity considered in determining whether the milestone or milestones are recognized and measured at fair value on the date of acquisition rather than at a later date whensubstantive; or (5) the amount of consideration recognized during the consideration may be resolved beyond a reasonable doubt. This revised approach replaces SFAS 141’s cost allocation process in which the cost of an acquisition was allocated to the individual assets acquired and liabilities assumed based on their respective fair value. SFAS 141R requires any acquisition-related costs and restructuring costs to be expensed as incurred as opposed to allocating such costs to the assets acquired and liabilities assumed as previously required by SFAS 141. Under SFAS 141R, an acquirer recognizes liabilities for a restructuring plan in purchase accounting only if the requirements of SFAS 146, “Accounting for Costs Associated with Exit or Disposal Activities”, are met. SFAS 141R allowsperiod for the recognition of pre-acquisition contingencies at fair value only if these contingencies are likely to materialize. If this criterionmilestone or milestones. This guidance is not met at the acquisition date, then the acquirer accounts for the non-contractual contingency in accordance with recognition criteria set forth under SFAS 5, “Accounting for Contingencies”, in which case no amount should be recognized in purchase accounting. SFAS 141R is effective as of the beginning of an entity’s first fiscal year that begins after December 15, 2008. The adoption of SFAS 141R will change the Company’s accounting treatment for business combination on a prospective basis beginning on January 1, 2009.
In December 2007, the FASB issued SFAS No. 160, Non-controlling Interestsfor milestones achieved in Consolidated Financial Statements — an Amendment of ARB No. 51” (“SFAS 160”). This Statement amends ARB 51, Consolidated Financial Statements, to establish accounting and reporting standards for the non-controlling interest in a subsidiary and for the deconsolidation of a subsidiary. It clarifies that a non-controlling interest in a subsidiary is an ownership interest in the consolidated entity and should be reported as equity on the financial statements. SFAS 160 requires consolidated net income to be reported at amounts that include the amounts attributable to both the parent and the non-controlling interest. Furthermore, disclosure of the amounts of consolidated net income attributable to the parent and to the non-controlling interest is required on the face of the financial statements. SFAS 160 is effective as of the beginning of an entity’s first fiscal year that begins after December 15, 2008. The Company will incorporate the presentation requirements outlined by SFAS No. 160 on January 1, 2009.
In March 2008, the FASB issued SFAS No. 161, “Disclosures about Derivative Instruments and Hedging Activities — an amendment of FASB Statement No. 133” (“SFAS 161”). SFAS 161 enhances the required disclosures under SFAS 133, “Accounting for Derivative Instruments and Hedging Activities”, in order to provide the investing community additional transparency in an entity’s financial statements and to more adequately disclose the impact investments in derivative instruments and use of hedging have on financial position, operating results and cash flows. SFAS 161 is effective for fiscal years, and interim periods beginning after November 15, 2008, with early application allowed. SFAS 161 does not change the accounting treatment for derivative instruments and will change the Company’s disclosure for derivative instruments and hedging activities on January 1, 2009.

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In April, 2008, the FASB issued FSP. FAS 142-3, “Determination of the Useful Life of Intangible Assets” (“FSP 142- 3”). In determining the useful life of acquired intangible assets, FSP 142-3 removes the requirement to consider whether an intangible asset can be renewed without substantial cost of material modifications to the existing terms and conditions and, instead, requires an entity to consider its own historical experience in renewing similar arrangements. FSP 142-3 also requires expanded disclosure related to the determination of intangible asset useful lives. FSP 142-3 is effective for fiscalwithin those years, beginning on or after DecemberJune 15, 2008. The guidance for determining the useful life of a recognized intangible asset must be applied prospectively to intangible assets acquired after the effective date. Early adoption is prohibited.2010. The adoption of FSP 142-3ASU 2010-17 will not have a material impact on the Company’s consolidated financial position or result of operations.
In November 2008, the Emerging Issues Task Force issued EITF No. 08-6, “Equity Method Investment Accounting Considerations” (“EITF 08-6”) that addresses how the initial carrying value of an equity method investment should be determined, how an impairment assessment of an underlying indefinite-lived intangible asset of an equity method investment should be performed, how an equity method investee’s issuance of shares should be accounted for, and how to account for a change in an investment from the equity method to the cost method. EITF 08-6 shall be effective in fiscal years beginning on or after December 15, 2008, and interim periods within those fiscal years. EITF 08-6 shall be applied prospectively with early application prohibited. The impact of adopting EITF 08-6 will not have a material impact on our consolidated financial condition or results of operations.
Incentives from the Chinese government
The chart below sets forth a brief summary of the material incentives received by our Chinese subsidiaries from the Chinese government. Our Shanghai, Beijing, and Tianjin subsidiaries are qualified as integrated circuit production enterprises under the Chinese government’sSeveral Policies to Encourage the Development of Software and Integrated Circuit Industry. Under these policies, any company that engages in the semiconductor industry in China and has a total investment size in excess of 8,000 million Renminbi (approximately US$964 million) and fabricates integrated circuits that have a linewidth of less than 0.25 micron are entitled to the last three benefits listed below. For a more detailed discussion of these incentives, see “Item 4—Information4-Information on the Company—Regulation.Company-Regulation.
   
Incentive SMIC Shanghai, SMIC Beijing, and SMIC Tianjin
Preferential Value-added Tax PoliciesPolicies. 17% VAT rate.
  17% tax refund rate for exports reduced to 13% as of January 1, 2004.
  13% tax refund rate for exports increased to 17% as of November 1, 2004.
   
Preferential Enterprise Income Tax Policies Five-year full exemption and five-year 50% reduction upon approval from the local tax bureau.
   
Preferential Customs Duties and Import-related VAT Policies Exemption from customs duties with respect to its equipment, spare parts and raw materials.
  
Exemption from import-related VAT with respect to its equipment, spare parts and raw materials.
  
Exemption from VAT for imported equipment will no longer applyapplied as of July 1, 2009 and a 17% VAT rate will apply.


Operating Results
Sales
We generate our sales primarily from fabricating semiconductors. We also derive a relatively small portion of our sales from the mask-making, wafer probing, and other services that we perform for third parties separately from our foundry services.

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In 2008,2010, fabless semiconductor companies accounted for 56.8%71.5%, IDMs accounted for 25.3%16.2% and systems and other companies accounted for 17.9%12.3%, respectively, of our sales. Although we are not dependent on any single customer, a significant portion of our net sales is attributable to a relatively small number of our customers. In 2006, 2007,2008, 2009, and 20082010 our five largest customers accounted for approximately 59.5%58.2%, 60.0%, and 58.2%53.7% of our sales, respectively.
Cost of sales
Our cost of sales consists principally of:
depreciation and amortization;
depreciation and amortization;
overhead, including maintenance of production equipment, indirect materials, including chemicals, gases and various types of precious and other metals, utilities and royalties;
direct materials, which consist of raw wafer costs;
labor, including amortization of deferred stock compensation for employees directly involved in manufacturing activities; and
production support, including facilities, utilities, quality control, automated systems and management functions.
overhead, including maintenance of production equipment, indirect materials, including chemicals, gases and various types of precious and other metals, utilities and royalties;
direct materials, which consist of raw wafer costs;
labor, including amortization of deferred stock compensation for employees directly involved in manufacturing activities; and
production support, including facilities, utilities, quality control, automated systems and management functions.
Our depreciation expenses attributable to cost of sales were US$786.7 million in 2006, US$657.8 million in 2007, and US$663.1 million in 2008.2008, US$575.1 million in 2009, and US$497.6 million in 2010.
Operating expenses (income)
Our operating expenses (income) consist of:
  Research and development expenses. Research and development expenses consist primarily of salaries and benefits of research and development personnel, materials costs, depreciation and maintenance on the equipment used in our research and development efforts, contracted technology development costs, and the costs associated with the ramp-up of new fabs but are partially offset by related government subsidies.
  General and administrative expenses. General and administrative expenses consist primarily of salaries and benefits for our administrative, finance and human resource personnel, commercial insurance, fees for professional services, bad debt expenses, foreign exchange gains and losses from operating activities. Foreign exchange gains and losses relate primarily to period-end translation adjustments due to exchange rate fluctuations that affect payables and receivables directly related to our operations.


  Selling and marketing expenses. Selling and marketing expenses consist primarily of salaries and benefits of personnel engaged in sales and marketing activities, costs of customer wafer samples, other marketing incentives and related marketing expenses.
  Amortization of acquired intangible assets.Amortization of acquired intangible assets consist primarily of the cost associated with the purchase of technology, licenses, and patent licenses.
Income from sale of plant and equipment and other fixed assets.In 2008, the Company sold plant, equipment and other fixed assets with a carrying value of US$7,542,561 for US$10,419,736, which resulted in a gain on disposal of US$2,877,175.
Other income (expenses)
Our other income (expenses) consists of:
interest income, which has been primarily derived from cash equivalents and short-term investments and interest on share purchase receivables;
interest expenses, net of capitalized portions and government interest subsidies, which have been primarily attributable to our bank loans and the imputed interest rate on an outstanding interest-free promissory note; and
other income and expense items, such as those relating to the employee living quarters and school; and
foreign exchange gains and losses relating to financing and investing activities, including forward contracts.

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interest income, which has been primarily derived from cash equivalents and short-term investments and interest on share purchase receivables;
interest expenses, net of capitalized portions and government interest subsidies, which have been primarily attributable to our bank loans and the imputed interest rate on an outstanding interest-free promissory note; and
other income and expense items, such as those relating to the employee living quarters and school; and
foreign exchange gains and losses relating to financing and investing activities, including forward contracts.
Comparisons of Results of Operations
Consolidated Financial Data
The summary consolidated financial data presented below as of and for the years ended December 31, 2006, 2007,2008, 2009, and 20082010 are derived from, and should be read in conjunction with, and are qualified in their entirety by reference to, our audited consolidated financial statements, including the related notes, included elsewhere in this annual report. The summary consolidated financial data as of and for the years ended December 31, 20042006 and 20052007 is derived from our audited consolidated financial statements not included in this annual report. The summary consolidated financial data presented below has been prepared in accordance with U.S. GAAP.
                                        
 For the year ended December 31,  For the year ended December 31,
 2004 2005 2006 2007 2008  2006 2007 2008 2009 2010
 (in US$ thousands, except for per share, per ADS data, percentages, and operating data)  (in US$ thousands, except for share, ADS, percentages, and operating data)
Statement of Operations Data:
  
Sales $974,664 $1,171,319 $1,465,323 $1,549,765 $1,353,711  $1,465,323 $1,549,765 $1,353,711 $1,070,387 $1,554,788 
Cost of sales(1)
 716,225 1,105,134 1,338,155 1,397,038 1,412,851  1,338,155 1,397,038 1,412,851 1,184,589 1,244,714 
Gross profit (loss) 258,439 66,185 127,168 152,727  (59,140) 127,168 152,727  (59,140)  (114,202) 310,074 
Operating expenses: 
Operating expenses (income): 
Research and development 74,113 78,865 94,171 97,034 102,240  94,171 97,034 102,240 160,754 174,900 
General and administrative 54,038 35,701 47,365 74,490 58,841  47,365 74,490 67,037 218,688 43,762 
Selling and marketing 10,384 17,713 18,231 18,716 20,661  18,231 18,716 20,661 26,566 29,498 
Litigation settlement 16,695     
Amortization of acquired intangible assets 14,368 20,946 24,393 27,071 32,191  24,393 27,071 32,191 35,064 27,168 
Impairment loss of long-lived assets     106,741 
Income from sale of plant and equipment and other fixed assets   (43,122) (28,651)  (2,877)
Total operating expenses 169,598 153,225 141,038 188,659 317,797 

 

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  For the year ended December 31, 
  2004  2005  2006  2007  2008 
  (in US$ thousands, except for per share, per ADS data, percentages, and operating data) 
Income (loss) from operations  88,841   (87,040)  (13,870)  (35,932)  (376,937)
Other income (expenses):                    
Interest income  10,587   11,356   14,916   12,349   11,542 
Interest expense  (13,698)  (38,784)  (50,926)  (37,936)  (50,767)
Foreign currency exchange gain (loss)  8,218   (3,355)  (21,912)  11,250   3,230 
Other, net  2,441   4,462   1,821   2,238   7,429 
Total other income (expense), net  7,548   (26,322)  (56,101)  (12,100)  (28,566)
Income (loss) before income tax  96,389   (113,362)  (69,971)  (48,032)  (405,503)
Income tax — current  (186)  (285)  24,928   29,720   (26,433)
Minority interest     251   (19)  2,856   (7,851)
Loss from equity investment     (1,379)  (4,201)  (4,013)  (444)
Net (loss) income before cumulative effect of a change in accounting principle  96,203   (114,775)  (49,263)  (19,468)  (440,231)
Cumulative effect of a change in accounting principle        5,154       
Net (loss) income  96,203   (114,775)  (44,109)  (19,468)  (440,231)
Deemed dividend on preference shares(2)
  18,840             
Income (loss) attributable to holders of ordinary shares $77,363  $(114,775) $(44,109) $(19,468)  (440,231)
Income (loss) per ordinary share, basic $0.01  $(0.00) $(0.00) $(0.00) $(0.02)
Income (loss) per ordinary share, diluted $0.00  $(0.00) $(0.00) $(0.00) $(0.02)
Ordinary shares used in calculating basic income (loss) per ordinary share(4)
  14,199,163,517   18,184,429,255   18,334,498,923   18,501,940,489   18,682,544,866 
Ordinary shares used in calculating diluted income (loss) per ordinary share(3)(4)
  17,934,393,066   18,184,429,255   18,334,498,923   18,501,940,489   18,682,544,866 
Income (loss) per ADS, basic(5)
 $0.27  $(0.32) $(0.12) $(0.05) $(1.18)
Income (loss) per ADS, diluted(5)
 $0.22  $(0.32) $(0.12) $(0.05) $(1.18)
                     
  For the year ended December 31,
  2006 2007 2008 2009 2010
  (in US$ thousands, except for share, ADS, percentages, and operating data)
Impairment loss of long-lived assets        106,741   138,295   8,442 
Loss (gain) from sale of plant and equipment and other fixed assets  (43,122)  (28,651)  (2,877)  3,832   (658)
Litigation settlement           269,637    
Total operating expenses, net  141,038   188,659   325,993   852,836   266,620 
Income (loss) from operations  (13,870)  (35,932)  (385,132)  (967,038)  43,455 
Other income (expenses):                    
Interest income  14,916   12,349   11,542   2,591   4,127 
Interest expense  (50,926)  (37,936)  (50,767)  (24,699)  (22,656)
Change in the fair value of commitment to issue shares and warrants           (30,101)  (29,815)
Foreign currency exchange gain (loss)  (21,912)  11,250   11,425   7,302   5,025 
Other, net  1,821   2,238   7,429   4,626   8,772 
Total other expense, net  (56,101)  (12,100)  (20,371)  (40,281)  (34,547)
Income (loss) before income tax  (69,971)  (48,032)  (405,503)  (1,007,319)  8,907 
Income tax benefit (expense)  24,928   29,720   (26,433)  46,624   4,818 
Gain (loss) from equity investment  (4,201)  (4,013)  (444)  (1,782)  285 
Net income (loss) before cumulative effect of a change in accounting principle  (49,244)  (22,324)  (432,380)  (962,478)  14,011 
Cumulative effect of a change in accounting principle  5,154             
Net income (loss)  (44,090)  (22,324)  (432,380)  (962,478)  14,011 
Accretion of interest to noncontrolling interest  (19)  2,856   (7,851)  (1,060)  (1,060)
Loss attributable to noncontrolling interest              140 
Income (loss) attributable to Semiconductor Manufacturing International Corporation $(44,109) $(19,468) $(440,231) $(963,537) $13,100 
Earnings (loss) per ordinary share, basic $(0.00) $(0.00) $(0.02) $(0.04) $0.00 
Earnings (loss) per ordinary share, diluted $(0.00) $(0.00) $(0.02) $(0.04) $0.00 
Shares used in calculating basic earnings (loss) per share(3)
  18,334,498,923   18,501,940,489   18,682,544,866   22,359,237,084   24,258,437,559 
Shares used in calculating diluted earnings (loss) per share(2)
  18,334,498,923   18,501,940,489   18,682,544,866   22,359,237,084   25,416,597,405 

 

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 For the year ended December 31,  For the year ended December 31,
 2004 2005 2006 2007 2008  2006 2007 2008 2009 2010
 (in US$ thousands, except for per share, per ADS data, percentages, and operating data)  (in US$ thousands, except for share, ADS, percentages, and operating data)
ADS used in calculating basic income (loss) per ADS(5)
 283,983,270 363,688,585 366,689,978 370,038,810 373,650,897 
ADS used in calculating diluted income (loss) per ADS(5)
 358,687,861 363,688,585 366,689,978 370,038,810 373,650,897 
Earnings (loss) per ADS, basic(3)
 $(0.12) $(0.05) $(1.18) $(2.15) $0.00 
Earnings (loss) per ADS, diluted(3)
 $(0.12) $(0.05) $(1.18) $(2.15) $0.00 
ADS used in calculating basic loss per ADS(3)
 366,689,978 370,038,810 373,650,897 447,184,742 485,168,751 
ADS used in calculating diluted loss per ADS(3)
 366,689,978 370,038,810 373,650,897 447,184,742 508,331,948 
 
Other Financial Data:
  
Gross margin  26.50%  5.70%  8.70%  9.90%  -4.40%  8.70%  9.90%  -4.40%  -10.67%  19.94%
Operating margin  9.10%  -7.40%  -0.90%  -2.30%  -27.80%  -0.90%  -2.30% -27.80%  -90.05%  2.79%
Net margin  9.90%  -9.80%  -3.00%  -1.30%  -32.50%  -3.00%  -1.30% -32.50%  -89.92%  0.90%
 
Operating Data:
  
Wafers shipped (in 8” equivalents)  
Total 943,463 1,347,302 1,614,888 1,849,957 1,611,208  1,614,888 1,849,957 1,611,208 1,376,663 1,985,974 
ASP(6)
 1,033 869 907 838 840 
ASP(4)
 907 838 840 778 783 
 
(1) Including amortization of deferred stockshare-based compensation for employees directly involved in manufacturing activities.
 
(2)Deemed dividend represents the difference between the sale and conversion prices of warrants to purchase convertible preference shares we issued and their respective fair market values.
(3) Anti-dilutive preference shares, options and warrants were excluded from the weighted average ordinary shares outstanding for the diluted per share calculation. For 2005, 2006, 2007, 2008 and 2008 basic income2009 earnings (loss) per share did not differ from diluted loss per share.
 
(4)All share information has been adjusted retroactively to reflect the 10-for-1 share split effected upon completion of the global offering of our ordinary shares in March 2004 (the “Global Offering”).
(5)(3) Fifty ordinary shares equals one ADS.
 
(6)(4) Total sales/total wafers shipped.
Comparisons of the Years Ended December 31, 2006, 20072008, 2009 and 20082010
Year Ended December 31, 20082010 Compared to Year Ended December 31, 20072009
Sales.Sales decreasedincreased by 12.7%45.3% from US$1,549.81,070.4 million for 20072009 to US$1,353.71,554.8 million for 2008,2010, primarily due to an increase in overall wafer shipments. For the transition of DRAM production to logic production infull year 2010, the Beijing fab and the sharp market downturn experienced in the fourth quarter. However, consistent with our stated strategy of focusing on the non-DRAM business, non-DRAM revenue has grown by 14.3% for the same period. The number of wafers the Company shipped decreased by 12.9%, from 1,849,957 8-inch wafer equivalents to 1,611,208 8-inch wafer equivalents, while the number of logic onlyoverall wafer shipments increased by 24.9% between the two periods.were 1,985,974 units of 8-inch equivalent wafers, up 44.3% year-on-year. The average selling price of the wafers the Company shipped remained relatively flat, with a slight increase of 0.2%increased by 0.6% from US$838778 per wafer to US$840 per wafer. Due to the exit from the commodity783. Excluding DRAM business, the percentage of wafer revenues that used 0.13 micron and below process technology decreased from 53.1% to 43.9% between these two periods. However, if DRAM revenue, is excluded, the percentage of wafer revenues that used 0.13 micron and below process technology increased from 24.9%47.5% to 38.2%54.5% between these two periods.
Cost of sales and gross profit (loss).Cost of sales increased by 5.1% from US$1,184.6 million for 2009 to US$1,244.7 million for 2010. Out of the total cost of sales for 2010, US$497.6 million was attributable to depreciation of plant and equipment and another $2.8 million was attributable to amortization of deferred costs and share-based compensation costs. Out of the total cost of sales for 2009, US$575.1 million was attributable to depreciation of plant and equipment and another $23.5 million was attributable to amortization of deferred costs and share-based compensation costs. The Company had a gross profit of US$310.1


million for 2010 compared to a gross loss of US$114.2 million in 2009. Gross margins were 19.9% in 2010 compared to (10.7)% in 2009. The increase in gross margins was due to higher overall wafer shipments in 2010 driven by the market recovery from the 2009 global recession and $75.5 million decrease in depreciation expense.
Operating income (expenses) and income (loss) from operations.Operating expenses decreased by 68.7% from US$852.8 million for 2009 to US$266.6 million for 2010 primarily due to charges related to settlement of litigation, bad debt provision and plant and equipment impairment loss in 2009. We recorded litigation settlement expense, bad debt expense and impairment loss of US$269.6 million, US$115.8 million and US$138.3 million, respectively, in 2009.
Research and development expenses increased by 8.8% from US$160.8 million for 2009 to US$174.9 million for 2010, due to an increase expenses associated with 65nm and 45nm technology development.
General and administrative expenses decreased by 80.0% to US$43.8 million for 2010 from US$218.7 million for 2009, primarily due to bad debt expenses of US$115.8 million recorded in 2009.
Selling and marketing expenses increased by 11.1% from US$26.6 million for 2009 to US$29.5 million for 2010, due to an increase in sales and marketing activities.
The amortization of acquired intangible assets decreased from US$35.1 million for 2009 to US$27.2 million for 2010.
Impairment of plant and equipment.In 2010, the Company recorded an impairment loss of $8.4 million associated with the disposal of fixed assets with outdated technologies compared to an impairment loss of $104.7 million recorded in 2009 in connection with certain obsolete assets that were held to be abandoned.
As a result, the Company’s income from operations was US$43.5 million in 2010 compared to loss from operations of US$967.0 million in 2009. Operating margin was 1.4% and (90.3)%, for 2010 and 2009, respectively.
Other income (expenses).Other expenses decreased from US$40.3 million in 2009 to US$34.5 million in 2010. The foreign exchange gain, combining the operating and non-operating activities, was US$5.0 million in 2010 as compared to US$7.3 million in 2009.
Net income (loss).Due to the factors described above, the Company recorded a net income of US$14.0 million in 2010 compared to a net loss of US$962.5 million in 2009.
Year Ended December 31, 2009 Compared to Year Ended December 31, 2008
Sales.Sales decreased by 20.9% from US$1,353.7 million for 2008 to US$1,070.4 million for 2009, primarily due to a decrease in overall wafer shipments. For the full year 2009, the overall wafer shipments were 1,376,663 units of 8-inch equivalent wafers, down 14.6% year-on-year. The average selling price of the wafers the Company shipped decreased by 7.5% from US$840 per wafer to US$778. Excluding DRAM revenue, the percentage of wafer revenues that used 0.13 micron and below process technology increased from 38.2% to 44.2% between these two periods.
Cost of sales and gross profit.Cost of sales increaseddecreased by 1.1%16.2% from US$1,397.0 million for 2007 to US$1,412.9 million for 2008.2008 to US$1,184.6 million for 2009. Out of the total cost of sales for 2009, US$575.1 million was attributable to depreciation of plant and equipment and another $23.5 million was attributable to amortization of deferred costs and share-based compensation costs. Out of the total cost of sales for 2008, US$663.1 million was attributable to depreciation of plant and equipment and another US$28.4 million was attributable to amortization of deferred costs and share-based compensation costs. Out of the total cost of sales for 2007, US$657.8 million was attributable to depreciation of plant and equipment and another US$33.8$28.4 million was attributable to amortization of deferred costs and share-based compensation costs. The Company had a gross loss of


US$59.1114.2 million for 20082009 compared to a gross profitloss of US$152.759.1 million in 2007.2008. Gross margins were -4.4%(10.7)% in 20082009 compared to 9.9%(4.4)% in 2007.2008. The decrease in gross margins was due to the transition of DRAM production to logic production in the Beijing fab which resulted in lower utilization, as well as the write down of DRAM inventories and the sharp market downturn experienced in the fourth quarter.first quarter of 2009.

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Operating expenses and loss from operations.Operating expenses increased by 68.4%161.6% from US$188.7 million for 2007 to US$317.8326.0 million for 2008 to US$852.8 million for 2009 primarily due to the impairment charge recorded in 2008 in connection with the decisioncharges related to exit the commodity DRAM business. The Company received less income from the salesettlement of equipment and fixed assets, which income was US$28.7 million in 2007 compared to US$2.9 million in 2008.
As described in “Note 13. — Acquired intangible assets, net”, the amortization of acquired intangible assets increased from US$27.1 million for 2007 to US$32.2 million for 2008.litigation.
Research and development expenses increased by 5.4%57.2% from US$97.0 million for 2007 to US$102.2 million for 2008.2008 to US$160.8 million for 2009. The Company received an increase infewer government subsidies for research and& development expenses in 2008; however, expenses associated with 45-nanometer and 65-nanometer technology development, as well as expenses incurred for the Shanghai 12-inch project, also increased in2009 compared to 2008.
General and administrative expenses decreasedincreased by 21.1%226.4% to US$58.8218.7 million for 2009 from US$67.0 million for 2008, from US$74.5 million for 2007, primarily due to a decreasean increase in bad debt provision, contingent liability and legal fees as well as a foreign exchange gain from operating activities of US$8.2 million recorded in 2008, while a foreign exchange loss from operating activities of US$3.1 million was recorded in 2007.fees.
Selling and marketing expenses increased by 10.7%28.6% from US$18.7 million for 2007 to US$20.7 million for 2008 to US$26.6 million for 2009, due to an increase in sales and marketing activities.
DuringThe amortization of acquired intangible assets increased from US$32.2 million for 2008 to US$35.1 million for 2009.
Additional charges were recognized under operating expense in the firstfourth quarter of 2008,2009, of which $269.6 million was related to the Company reached an agreementsettlement of litigation and $138.3 million was related to long-lived asset impairment. The total amount of the settlement litigation charge including the portion classified under non-operating expense was $299.7 million.
Impairment of plant and equipment.In 2009, the effect of adverse market conditions and significant changes in the Company’s operation strategy lead to the Company’s identification and commitment to abandon a group of long-lived assets. This group of long-lived assets is equipped with certain customers to discontinue productionoutdated technologies and no longer receives vendor support. As of DRAM products and subsequently the Company decided to exit the commodity DRAM business. The Company considered these actionsDecember 31, 2009, this group of assets ceased to be an indicator of impairment in regard to plant and equipment ofused. As a result, the Company’s Beijing facilities. The Company recorded an impairment loss of $105.8$104.7 million during the first quarter of 2008, equal to the excess ofafter writing down the carrying value over the fair value of the plant and equipment utilizing a discounted cash flow approach. For the purpose of the analysis, a discount rate of 9% has been used on the expected cash flows to be generated over the remaining useful lives of primary manufacturing machinery and equipments of approximately 5 years.zero.
As a result, the Company’s loss from operations was US$376.9963.5 million in 20082009 compared to loss from operations of US$35.9440.2 million in 2007.2008. Operating margin was negative 27.8%(90.3)% and 2.3%(28.4)%, respectively, for these two years.2009 and 2008 respectively.
Other income (expenses).Other expenses increased from US$12.1 million in 2007 to US$28.620.4 million in 2008 primarily due to an increase in interest expense. This increase in interest expense, from US$37.940.3 million in 2007 to US$50.8 million in 2008, was2009 primarily due to a decreasechange in interest subsidy. Foreign exchange gain from non-operating activities decreased from US$11.3the fair value of the commitment to grant shares and warrants in the amount of $30.1 million in 2007related to US$3.2 million in 2008.the litigation settlement. Total foreign exchange gain, combining the operating and non-operating activities, was US$11.47.3 million in 20082009 as compared to US$8.111.4 million in 2007.2008.
Net loss.Due to the factors described above, the Company recorded a net loss of US$440.2963.5 million in 20082009 compared to a net loss of US$19.5 million for 2007.
Year Ended December 31, 2007 Compared to Year Ended December 31, 2006
Sales.Sales increased by 5.8% from US$1,465.3 million for 2006 to US$1,549.8 million for 2007, primarily as a result of the increase in the Company’s manufacturing capacity and ability to use such capacity to increase sales. The number of wafers the Company shipped increased by 14.6%, from 1,614,888 8-inch wafer equivalents to 1,849,957 8-inch wafer equivalents, between these two periods. The average selling price of the wafers the Company shipped decreased by 7.6% from US$907 per wafer to US$838 per wafer primarily due to the decline in DRAM average selling price. The percentage of wafer revenues that used 0.13 micron and below process technology increased from 49.6% to 53.1% between these two periods.
Cost of sales and gross profit.Cost of sales increased by 4.4 % from US$1,338.2 million for 2006 to US$1,397.0 million for 2007. This increase was primarily due to the significant increase in wafer shipments as well as subcontracting costs associated with turn-key services. The Company had a gross profit of US$152.7 million for 2007 compared to a gross profit of US$127.2440.2 million in 2006. Gross margins were 9.9 % in 2007 compared2008 attributable to 8.7 % in 2006. The increase in gross margins was primarily due to a decrease in depreciation expenses.ordinary shareholders.

 

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Operating expenses and loss from operations.Operating expenses increased by 33.8% from US$141.0 million for 2006 to US$188.7 million for 2007 primarily due to the combination of a $27.1M increase in general and administrative expenses and a $14.5 million decrease of income received from the sale of plant and equipments, from $43.1 million in 2006 compared to $28.7 million in 2007.
As described in “Note 11. — Acquired intangible assets, net”, the amortization of acquired intangible assets increased from US$24.4 million for 2006 to US$27.1 million for 2007.
Research and development expenses increased by 3.0% from US$94.2 million for 2006 to US$97.0 million for 2007. This increase in research and development expenses resulted primarily from an increase in material and other production related expenses associated with 65nm technology development and the start-up costs associated with the new Shanghai 12-inch project.
General and administrative expenses increased by 57.2% to US$74.5 million for 2007 from US$47.4 million for 2006, primarily due to an increase in personnel related expenses, legal fees and tax related expenses.
Selling and marketing expenses increased by 2.7% from US$18.2 million for 2006 to US$18.7 million for 2007, due to an increase in sales and marketing personnel expenses.
As a result, the Company’s loss from operations was US$35.9 million in 2007 compared to loss from operations of US$13.9 million in 2006. Operating margin was negative 2.3% and 0.9%, respectively, for these two years.
Other income (expenses).Other expenses decreased from US$56.1 million in 2006 to US$12.1 million in 2007. This decrease was primarily attributable to the decrease in interest expense from US$51.0 million in 2006 to US$37.9 million in 2007, and the decrease in foreign exchange loss from US$21.9 million in 2006 to a gain of US$11.2 million in 2007.
Net loss.Due to the factors described above, the Company had a net loss of US$19.5 million in 2007 compared to a net loss of US$44.1 million for 2006.
Liquidity and Capital Resources
The following table sets forth a condensed summary of our audited statements of cash flows for the periods indicated:
            
 For the year ended             
 December 31,  For the year ended
 2006 2007 2008  December 31,
 (in US$ thousands)  2008 2009 2010
  (in US$ thousands)
Net cash provided by operating activities:
  
Net loss before cumulative effect of change in accounting principle $(49,263) $(19,468) $(440,231)
Depreciation and amortization 919,616 706,277 761,809 
Net income (loss) $(432,380) $(962,478) $14,011 
Depreciation 761,809 748,185 584,242 
Total 769,649 672,465 569,782  569,782 283,566 694,613 
 
Net cash used in investing activities:
  
Purchase of property, plant and equipment  (882,581)  (717,171)  (669,055)  (669,055)  (217,269)  (491,539)
Total  (917,369)  (643,344)  (761,713)  (761,713)  (211,498)  (583,713)
 
Net cash provided by (used in) financing activities:
  
Proceeds from short-term borrowings 255,004 201,658 422,575  422,575 726,897 716,676 
Proceeds from long-term debt 785,345 262,248 285,930  285,930 100,946 10,000 
Total  (74,440) 76,637 173,314  173,314  (78,902)  (37,851)
Net increase (decrease) in cash and cash equivalents
 $(222,177) $105,664 $(19,054) $(19,054) $(6,767) $72,346 

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Operating Activities
     As of December 31, 2010, we had US$515.8 million in cash and cash equivalents. These cash and cash equivalents were held in the form of United States dollars, Japanese Yen, European Euros, and Chinese Renminbi. Our net cash provided by operating activities in 2010 was US$694.6 million, which was primarily due to the income attributable to holders of ordinary shares of US$13.1 million, an increase of US$19.7 million in inventories, an increase of US$2.4 million in accounts receivable, an increase of US$34.2 million in accounts payable relating to the purchase of materials and inventories, and the add-back of US$584.2 million in depreciation and amortization relating to commercial production.
     As of December 31, 2009, we had US$443.5 million in cash and cash equivalents. These cash and cash equivalents were held in the form of United States dollars, Japanese Yen, European Euros, and Chinese Renminbi. Our net cash provided by operating activities in 2009 was US$283.6 million, which was primarily due to the loss attributable to holders of ordinary shares of US$963.5 million, an increase of US$22.1 million in inventories, an increase of US$95.4 million in accounts receivable, an increase of US$35.8 million in accounts payable relating to the purchase of materials and inventories, and the add-back of US$748.2 million in depreciation and amortization relating to commercial production.
As of December 31, 2008, we had US$450.2 million in cash and cash equivalents. These cash and cash equivalents arewere held in the form of United States dollars, Japanese Yen, European Euros, and Chinese Renminbi. Our net cash provided by operating activities in 2008 was US$569.8 million, which was primarily due to the loss attributable to holders of ordinary shares of US$440.2 million, a decrease of US$76.7 million in inventories, a decrease of US$99.097.8 million in accounts receivable and an increase of US$76.8 million in accounts payable relating to the purchase of materials and inventories, and the add-back of US$761.8 million in depreciation and amortization relating to commercial production.


As of December 31, 2007, we had US$469.3 million in cash and cash equivalents. These cash and cash equivalents are held in the form of United States dollars, Japanese Yen, European Euros, and Chinese Renminbi. Our net cash provided by operating activities in 2007 was US$672.5 million, which was primarily due to the loss attributable to holders of ordinary shares of US$19.5 million, a decrease of US$26.9 million in inventories, an increase of US$46.2 million in accounts receivable due to an increase in sales and an increase of US$19.9 million in accounts payable relating to the purchase of materials and inventories, and the add-back of US$706.3 million in depreciation and amortization relating to commercial production.
As of December 31, 2006, we had US$363.6 million in cash and cash equivalents. These cash and cash equivalents are held in the form of United States dollars, Japanese Yen, European Euros, and Chinese Renminbi. Our net cash provided by operating activities in 2006 was US$769.6 million, which was primarily due to the loss attributable to holders of ordinary shares of US$44.1 million, an increase of US$83.9 million in inventories due to the increase in commercial production, an increase of US$10.9 million in accounts receivable due to an increase in sales and an increase of US$24.7 million in accounts payable relating to the purchase of materials and inventories, and the add-back of US$919.6 million in depreciation and amortization relating to commercial production.
Investing Activities
Our net cash used in investing activities was US$583.7 million in 2010, US$211.5 million in 2009, and US$761.7 million in 2008, US$643.3 million in 2007, and US$917.4 million in 2006. This was2008. These amounts were primarily attributable to purchases of plant and equipment and land use rights for our mega-fabs in Shanghai and Beijing, and Tianjin fab in these periods as well as costs associated with the Shanghai fab construction.
Financing Activities
     Our net cash used in financing activities in 2010 was US$37.8 million. This was primarily derived from US$716.7 million in proceeds from short-term borrowings, US$10.0 million in proceeds from long-term debt, US$631.5 million in the repayment of short-term borrowings, US$254.4 million in the repayment of long-term debt, US$80.0 million in the repayment of promissory notes and US$199 million in proceeds from issuance of ordinary shares.
     Our net cash used in financing activities in 2009 was US$78.9 million. This was primarily derived from US$726.9 million in proceeds from short-term borrowings, US$100.9 million in proceeds from long-term debt, US$641.3 million in the repayment of short-term borrowings, and US$241.7 million in the repayment of long-term debt.
Our net cash provided by financing activities in 2008 was US$173.3 million. This was primarily derived from US$422.6 million in proceeds from short-term borrowings, US$285.9 million in proceeds from long-term debt, US$328.3 million in the repayment of short-term borrowings, and US$345.8 million in the repayment of long-term debt.
Our net cash used in financing activities in 2007 was US$76.6 million. This was primarily derived from US$201.7 million in proceeds from short-term borrowings, US$262.2 million in proceeds from long-term debt, US$165.7 million in the repayment of short-term borrowings, and US$195.6 million in the repayment of long-term debt. In addition, US$168.1 million came from proceeds from the issuance of ordinary shares.
Our net cash used in financing activities in 2006 was US$74.4 million. This was primarily derived from US$255.0 million in proceeds from short-term borrowings, US$785.3 million in proceeds from long-term debt, US$449.5 million in the repayment of short-term borrowings, and US$635.6 million in the repayment of long-term debt.
In 2009, the Company has already acquired new credit facilities totaling approximately US$240 million.

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Capital Expenditures
We incurred capital expenditures of US$912666 million, US$860190 million and US$666728 million in 2006, 20072008, 2009 and 2008,2010, respectively. We currently expect our capital expenditures in 20092011 to total approximately US$190 million,1 billion, subject to be adjustedadjustment based on market conditions. We have financed our substantial capital expenditure requirements through the proceeds received in our global offering, several rounds of private financing, cash flows from operations, and bank borrowings. OnceIn addition, once a fab is in operation at acceptable capacity and yield rates, it can provide significant cash flows.
Any transfer of funds from our company to our Chinese subsidiaries, either as a shareholder loan or as an increase in registered capital, is subject to registration or approval of Chinese governmental authorities, including the relevant administration of foreign exchange and/or the relevant examining and approval authority. In addition, it is not permitted under Chinese law for our Chinese subsidiaries to directly lend money to each other. Therefore, it is difficult to change our capital expenditure plans once the relevant funds have been remitted from our company to our Chinese subsidiaries. These limitations on the free flow of funds between us and our Chinese subsidiaries could restrict our ability to act in response to changing market conditions and reallocate funds from one Chinese subsidiary to another in a timely manner.
The global economy has deteriorated and there has been unprecedented financial market volatility. These conditions have resulted in a reduction in demand in the foundry industry, which in turn have resulted in declines in orders or in some instances, customers requesting for a deferment of deliveries on existing orders.     Our cash flows from operations have historically exceeded operating income, reflecting our significant non-cash depreciation expenses. Our operating cash flows may not be sufficient to meet our capital expenditure requirements in 2009.2011. If our operating cash flows are insufficient, we plan to fund the expected shortfall through bank loans. If necessary, we will also explore other forms of external financing.
We cannot predict the timing, strength or duration of any economic deterioration or subsequent economic recovery, worldwide, or in the foundry industry.     If the current economic or market conditions persist or deteriorate, further, our business, financial condition and results of operations could be materially and adversely affected. Therefore there can be no assurance that our business will generate and continue to generate sufficient cash flow to fund our liquidity needs in the future as cash flow generation may be affected by, among other factors, sales levels, capacity utilization, industry business conditions as well as global economic conditions.


Commitments
As of December 31, 2008,2010, we had commitments of US$7.483.0 million for facilities construction obligations for our Shanghai, Beijing, Tianjin, fabs and living quarters, and our testing facility and living quarters in Chengdu, and Shenzhen facilities. The Company had commitments of US$52.2558.1 million to purchase machinery and equipment for the Shanghai, Beijing, Shenzhen and Tianjin fabs, and the testing facility in Chengdu.fabs.
For additional information, see “Item 5—5 — Operating and Financial Review and Prospects—FactorsProspects-Factors that Impact Our Results of Operations—SubstantialOperations-Substantial Capital Expenditures” and “—Capacity“Capacity Expansion.”
As of December 31, 2008, our2010, the Company’s outstanding long-term liabilities primarily consisted of US$897.1512.0 million in secured bank loans, of which US$360.6 million is classified as the current portion of long-term loans. The long-term loans are repayable in installments thatwhich commenced in June 2006, with the last payment due in AugustDecember 2012.
2006 Loan Facility (SMIC Shanghai).In June 2006, Semiconductor Manufacturing International (Shanghai) Corporation (“SMIC Shanghai”) entered into a USD denominated long-term facility arrangement for US$600.0 million with a consortium of international and PRC banks. Of thisbanks.The principal amount US$393.0 millionis repayable beginning December 2006 in ten semi-annual installments. The interest rate is variable and determined as LIBOR +1.00%. In August 2010, the facility was used to repayfully repaid.
2009 USD & RMB Loan Facility.In June 2009, SMIC Shanghai entered into the Shanghai USD & RMB loan, a two-year loan facility in the principal amount outstanding underof US$80 million and RMB200 million respectively with The Export-Import Bank of China. This facility is secured by the manufacturing equipment located in SMIC Shanghai’s bank facilities from December 2001 and January 2004. The remaining principal amount was12-inch fab. This two-year loan facility will be used to finance future expansion and general corporate requirementneeds for SMIC Shanghai.Shanghai’s 12-inch fab. As of December 31, 2007,2010, SMIC Shanghai had fully drawn down US$80 million and RMB200 million (US$29.4 million), respectively, on this loan facility. The principal amount is repayable starting from December 2006 in ten semi-annual installments. As of December 31, 2008, SMIC Shanghai had repaid US$334.0 million according to the repayment schedule.June 2011. In 2008,2010, the interest rate on the loan ranged from 2.47%2.00% to 5.76%4.86%. The interest expense incurred in 2006, 20072010 and 20082009 was US$13.5 million, US$17.33.6 million and US$17.01.3 million, respectively, of which US$1.6 million, US$3.31.1 million and US$5.40.1 million waswere capitalized as additions to assets under construction in 2006, 20072010 and 2008,2009, respectively.
The total outstanding balance of this long-term facilitythe facilities is collateralized by certain plant and equipment located in SMIC Shanghai 8-inch fabs at thewith an original cost of US$1,871366 million as of December 31, 2008.

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The long-term loan agreement entered into in June 2006 contains the following covenants:2010.
Any of the following in respect of SMIC Shanghai would constitute an event of default during the term of the loan agreement (unless otherwise waived by the lenders to such agreement):
Financial covenants for the Borrower (SMIC Shanghai) including:
1. Consolidated Tangible Net Worth of no less than US$1,200 million;
2. Consolidated Total Borrowings to Consolidated Tangible Net Worth of:
(a) no more than 60% for periods up to and including December 31, 2008; and
(b) no more than 45% thereafter;
3. Consolidated Total Borrowings to trailing preceding four quarters EBITDA not to exceed 1.50x.
4. Debt Service Coverage Ratio of no less than 1.5x. Debt Service Coverage Ratio means trailing four quarters EBITDA divided by scheduled principal repayments and interest expense for all bank borrowings (including hire purchases, leases and other borrowed monies) for the same period.
Financial covenants for the Guarantor (the Company) including:
1. Consolidated Tangible Net Worth of no less than US$2,300 million;
2. Consolidated Net Borrowings to Consolidated Tangible Net Worth of:
(a) no more than 50% for period up to and including June 30, 2009;
(b) no more than 40% thereafter.
3. Consolidated Net Borrowings to trailing four quarters EBITDA of:
(a) no more than 1.50x for periods up to and including June 30, 2009;
(b) no more than 1.30x thereafter.
The Company and its related subsidiary have complied with these covenants (unless otherwise waived by the lenders to such agreement) as of December 31, 2008.
2005 Loan Facility (SMIC Beijing). In May 2005, Semiconductor Manufacturing International (Beijing) Corporation (“SMIC Beijing”) entered into a five year USD denominated loan facility in the aggregate principal amount of US$600.0 million, with a syndicate of financial institutions based in the PRC. This five-year bank loan waswill be used to expand the capacity of SMIC Beijing’s fabs. This facility is secured by the manufacturing equipment located in the SMIC Beijing 12-inch fabs. The drawdown period ofCompany has guaranteed SMIC Beijing’s obligations under this facility was twelve months from the sign off date of the agreement.facility. As of December 31, 2006,2010, SMIC Beijing had fully drawn-downrepaid US$600.0 million on this309.0 million. On June 26, 2009, SMIC Beijing amended the syndicated loan facility.agreement to defer the commencement of the three remaining semi-annual payments December 28, 2011. The amendment includes a provision for mandatory early repayment of a portion of the outstanding balance if SMIC Beijing’s financial performance exceeds certain pre-determined benchmarks. The amendment has been accounted for as a modification as the terms of the amended instrument are not substantially different from the original terms. The interest rate on this loan facility in 20082010 ranged from 3.46%2.64% to 6.38%2.95%. The principal amount is repayable starting in December 2007 in six semi-annual installments. As of December 2008, SMIC Beijing had repaid an aggregated amount of US$300.0 million according to the repayment schedule. The interest expense incurred in 2006, 20072010, 2009 and 2008 was US$28.58.4 million, US$42.210.2 million and US$25.6 million, of which US$0.52.8 million, US$2.30.5 million and US$1.6 million waswere capitalized as additions to assets under construction in 2006, 20072010, 2009 and 2008, respectively.
The total outstanding balance of the SMIC Beijing USD syndicate loan is collateralized by certain plant and equipment at thewith an original cost of US$1,047.01,314 million as of December 31, 2008.2010.


Any of the following in respect of SMIC Beijing would constitute an event of default during the term of the loan agreement (unless otherwise waived by the lenders to such agreement):agreement:
1. Where [Net profit + depreciation + amortization + financial expenses — (increase of accounts receivable and advanced payments + increase of inventory — increase in accounts payable and advanced receipts)]/ financial expenses <1; and
2. (Total liability — borrowings from shareholders, including principal and interest)/Total assets > 60% (when SMIC Beijing’s capacity is less than 20,000 12-inch wafers per month); and (Total liability -borrowings— borrowings from shareholders, including principal and interest)/Total assets > 50% (when SMIC Beijing’s capacity exceeds 20,000 12-inch wafers per month).
SMIC Beijing has complied with these covenants (unless otherwise waived by the lenders to such agreement) as of December 31, 2008.2010.

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2005 EUR Loan Facility.On December 15, 2005, the Company entered into a EUR denominated long-term loan facility agreement in the aggregate principal amount of EUR 85EUR85 million (equivalent to approximately US$105 million) with ABN Amro Bank N.V. Commerz Bank N.V., Shanghai Branch. The drawdowndraw down period of the facility ends on the earlier of (i) thirty six months after the execution of the agreement or (ii) the date on which the loans have been fully drawn down. Each draw down made under the facility shall be repaid in full by usthe Company in ten equal semi-annual installments starting from May 6, 2006.installments. SMIC Tianjin had drawn down in 2006 and SMIC Shanghai had drawn down in 2007 and 2008.
As of December 31, 2008,2010, SMIC Tianjin had drawdowndrawn down EUR15.1 million, and repaid an aggregate amount of EUR 9.1 million. As of December 31, 2008, the remaining balance is EUR6.0 million, with the approximate US dollar equivalent of US$8.6 million. In 2008, the interest rate on the loan ranged from 3.59%0.97% to 5.87%2.19%. The interest expenseexpenses incurred in 2006, 20072010, 2009 and 2008 waswere US$0.30.04 million, US$0.70.2 million and US$0.6 million of which nil, US$0.07 million, US$0.060.03 million and US$0.1 million waswere capitalized as additions to assets under construction in 2006, 20072010, 2009 and 2008, respectively. As of December 31, 2010, the borrowing of SMIC Tianjin was fully repaid.
As of December 31, 2010, SMIC Shanghai had drawn down EUR56.9 million and repaid an aggregated amount of EUR37.7 million. As of December 31, 2010, the remaining balance was EUR19.2 million, the equivalent of US$25.4 million. In 2010, the interest rate on the loan ranged from 0.99% to 2.58%. The interest expenses incurred in 2010, 2009 and 2008 were US$0.6 million, US$1.1 million and US$2.1 million, of which US$0.2 million, US$0.03 million and US$0.7 million were capitalized as additions to assets under construction in 2010, 2009 and 2008, respectively.
The total outstanding balance of the facility is collateralized by certain of SMIC Tianjin plant andShanghai’s equipment at the original cost of US$21.8115 million as of December 31, 2008.2010.
As of December 31, 2008, SMIC Shanghai had drawdown EUR56.9 million and repaid an aggregate amount of EUR12.1 million. As of December 31, 2008, the remaining balance is EUR 44.8 million, with the approximate US dollar equivalent of US$63.4 million. In 2008, the interest rate on the loan ranged from 3.01% to 6.12%. The interest expenses incurred in 2007 and 2008 were US$0.3 million and US$2.1 million of which US$0.02 million and US$0.7 million was capitalized additions to assets under construction in 2007 and 2008, respectively.
The total outstanding balance of the facility is collateralized by certain SMIC Shanghai’s plant and equipment at the original cost of US$114.5 million as of December 31, 2008.
2006 Loan Facility (SMIC Tianjin). In May 2006, Semiconductor Manufacturing International (Tianjin) Corporation (“SMIC TianjinTianjin”) entered into a loan facility in the aggregate principal amount of US$300.0 million from a consortium of international and Chinese banks. This facility is secured by the manufacturing equipment located in our Tianjin fab, except for the manufacturing equipment purchased using the EUR denominated loan. The Company has guaranteed SMIC Tianjin’s obligations under this facility. As of December 31, 20082010, SMIC Tianjin had drawn down US$259.0259 million from the facility. The principal amount is repayable starting from February 2010 in six semi-annual installments. As of December 31, 2010, SMIC Tianjin had early repaid US$172.7 million. In 2008,2010, the interest rate on the loan ranged from 3.11%1.69% to 6.03%2.00%. The interest expenses incurred in 2007for the years ended December 31, 2010, 2009 and 2008 were US$0.32.3 million, US$8.0 million and US$9.1 million, of which US$0.02nil, US$1.55 million and US$1.8 million were capitalized as additions to assets under construction in 20072010, 2009 and 2008, respectively.
The total outstanding balance of the facility is collateralized by certain plant and equipment with an original cost of US$627.4627 million as of December 31, 2008, which are located in our Tianjin fab, except for the manufacturing equipment purchased using the EUR denominated loan, and our land use rights and plant in proportion to the principal amount outstanding under this facility and the EUR denominated loan.2010.


Any of the following in respect of SMIC Tianjin would constitute an event of default during the term of the loan agreement (unless otherwise waived by the lenders to such agreement):agreement:
1. [Net profit + depreciation + amortization + financial expenses — (increase of accounts receivable and advanced payments + increase of inventory — increase in accounts payable and advanced receipts)]/ financial expenses < 1; and
2. The ratio of total debt to total assets is more than 60% during the ramp up period of SMIC Tianjin and more than 40% after the facility is at full capacity.
SMIC Tianjin has complied with these covenants (unless otherwise waived by the lenders to such agreement) as of December 31, 2008.2010.
Short-term Credit Agreements.As of December 31, 2008, we2010, the Company had tentwenty short-term credit agreements that provided total credit facilities up to US$267.8582.8 million on a revolving credit basis. As of December 31, 2008, we2010, the Company had drawn down US$201.2372.0 million under these credit agreements and US$66.6210.8 million iswas available for future borrowings. The outstanding borrowings under the credit agreements are unsecured.unsecured, except for the amount of US$13 million, which is secured by term deposits. The interest expense incurred in 20082010 was US$9.412.0 million. The interest rate on the loans ranged from 1.88%1.11% to 8.75%5.84% in 2008.2010.
Please see “Item 8—8 — Financial Information—DividendsInformation-Dividends and Dividend Policy” on our ability to pay dividends on our ordinary shares.

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Please see “Item 11 — Quantitative and Qualitative Disclosures About Market Risk” regarding the risk of loss related to adverse changes in market prices, including foreign currency exchange rates and interest rates of financial instruments.


Research and Development, Patents and Licenses, etc.
Our research and development activities are principally directed toward the development and implementation of more advanced and lower cost process technology. We spent US$94.2 million in 2006, US$97.0 million in 2007, and US$102.2 million in 2008, US$160.8 in 2009 and US$174.9 in 2010 on research and development expenses, which represented 6.4%7.6%, 6.3%,15.0% and 7.6%11.2%, respectively, of our sales in those respective years. Our research and development costs arewere partially offset by related government subsidies of US$9.9 million,56.2, US$3.130.4 million and US$56.212.0 million in 2006, 20072008, 2009 and 2008,2010 respectively and includeincluded non-recurring engineering costs associated with the ramp-up of a new wafer facility. We plan to continue to invest significant amounts in research and development in 20092011 for our 65 and 45 nanometer manufacturing process.
The research and development efforts were focused primarily on our logic and system-on-chip (SOC) business. 2008 marked many milestones for SMIC. Early in the year, Synopsis and SMIC released an enhanced 90-nanometer hierarchical, multi-voltage RTL-to-GDSII reference design flow that will benefit advanced synthesis with built-in capability of design-for-test and design-for-manufacturing. In April 2008, working with a leading Chinese domestic fabless company, we developed a 90 nanometer digital photo frame chip, which is one of the most integrated multimedia SOC in the market. For advanced CMOS logic, the Company demonstrated a silicon success in our 45-nanometer process ahead of schedule, and also added new intellectual properties in 65 nanometer and 90 nanometer technology services. In addition, the Company successfully developed a 0.11 micron CMOS image sensor (CIS) process technology. In Non-Volatile Memory (NVM) technology, the 0.13um ETox went into production in early 2008 and 90nm ETox is currently in risk production. Our research and development in Micro-Electromechanical System (MEMS) areas also advanced to risk production for the first customer in 2008. Other areas of phase-change memory, HV, mix-signal-signal, and RF technologies were also successfully advanced for smaller size, less power, and lower cost to meet customer demands.
We employ over 800approximately 451 research and development personnel.engineers. This research and development team includes many experienced semiconductor engineers with advanced degrees from leading universities around the world, as well as top graduates from the leading universities in China. We believe this combination has enabled us to quickly bring our technology in line with the semiconductor industry technology roadmap and ensures that we will have skilled personnel to lead our technology advancement in the future.
Trend Information
See “Item 5—5 — Operating and Financial Review and Prospects—FactorsProspects-Factors that Impact Our Results of Operations” for a discussion of the most significant recent trends affecting our operations.
Off-Balance Sheet Arrangements
We have not entered into any off-balance sheet transactions.

 

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Tabular Disclosure of Contractual Obligations
Set forth in the table below are the aggregate amounts, as of December 31, 2008,2010, of our future cash payment obligations under our existing debt arrangements on a consolidated basis:
                     
  Payments due by period 
Contractual obligations Total  Less than 1 year  1 — 3 years  3 — 5 years  After 5 years 
  (consolidated) 
  (in US$ thousands) 
Secured Long-Term Debt(1)
  897,147   360,629   536,518       
Operating Lease Obligations(2)
  9,721   6,056   270   441   2,954 
Purchase Obligations(3)
  59,594   59,594          
Other Long-Term Obligations(4)
  120,204   78,446   37,204   4,554    
 
Total Contractual Obligations $1,086,666  $504,725  $573,992  $4,995  $2,954 
                     
  Payments due by period
Contractual obligations Total Less than 1 year 1 - 3 years 3 - 5 years After 5 years
  (consolidated, in US$ thousands)
Short-Term Borrowings(1)
 $372,055  $372,055  $  $  $ 
Secured long-term loans(1)
  512,055   333,459   178,596       
Interest payments(2)
  26,523   21,165   5,358       
Operating Lease obligations(3)
  6,362   1,231   584   604   3,979 
Purchase Obligations(4)
  641,076   641,076          
Other Long-Term Obligations(5)
  90,717   34,390   28,560   27,767    
Total Contractual Obligations $1,648,788  $1,403,376  $213,098  $28,371  $3,979 
(1) 
(1)Interest was computed using rates in effect on December 31, 2008 withinThese amounts represent outstanding borrowings. Refer to F-29, “Indebtedness”, for a description of the range of 2.47% to 6.38%.short-term and long-term borrowings.
 
(2) These amounts represent estimated interest payments on short-term borrowings and long-term debts. The estimated interest payments are based on the weighted average interest rates incurred during the year ended December 31, 2010, ranging between 1.82% and 2.86%.
(3)Represents our obligations to make lease payments to use the land on which our fabs are located in Shanghai and other office equipment we have leased.
 
(3)(4) Represents commitments for construction or purchase of semiconductor equipment, and other property or services.
 
(4)(5) Includes the remaining installment payments relating to the settlement with TSMC and the other long-term liabilities relating to certain license agreements.TSMC.


Item 6. Directors, Senior Management and Employees
Directors and Senior Management
Members of our board of directors are elected by our shareholders. As of May 31, 2009,2011, our board of directors consists of seven directors and one alternate director.directors.
The following table sets forth the names of our directors and executive officers, including our founder, as of May 31, 2009.     Our executive officers are appointed by, and serve at the discretion of, our board of directors. The following table sets forth the names, age and positions of our directors and executive officers as of May 31, 2011.
       
Name Age Position
Directors
      
Yang Yuan WangJiang Shang Zhou  7464  Chairman, Independent Non-executiveNon-Executive Director
Richard Ru Gin ChangDavid N. K. Wang  6164  Founder, President, Chief Executive Officer and Executive Director
Chen Shanzhi42Non-Executive Director
Gao Yonggang46Non-Executive Director
Zhou Jie  4143  Non-executiveNon-Executive Director
Wang Zheng Gang58Non-executive Director (Alternate director to Zhou Jie)
Tsuyoshi Kawanishi  8082  Independent Non-executiveNon-Executive Director
Lip-Bu Tan  4951  Independent Non-executive Director
Jiang Shang Zhou62Independent Non-executive Director
Edward S Yang71Independent Non-executiveNon-Executive Director
       
Senior Managers
      
Morning WuChris Chi  5259  Acting Chief Financial Officer and Chief AccountingBusiness Officer
Marco MoraSimon Yang  51  Chief Operating Officer
Chiou-FengGary Tseng54Chief Financial Officer
Barry Quan59Chief Administrative Officer
Anne Chen  52Vice President of Corporate Marketing & Sales Office
Anne Wai Yui Chen4749  Company Secretary, Hong Kong Representative and Chief Compliance Officer
Zhou Mei Sheng53Vice President of Technology Research and Development
John Peng46Associate Vice President and General Manager of China BU
Jiang Shang Zhou
Chairman of the Board, Independent Non-executive Director
Yang Yuan Wangis currently the Chairman andDr. Jiang Shang Zhou has been a Director since 2001. Professor Wang has more than 41 years of experience related to the semiconductor industry. He2006 and is currently the Chairman of SMIC Shanghai, SMIC Beijing, SMIC Chengdu, SMIC Tianjin, SMIC Energy Technology (Shanghai) Corporation andthe Board. Dr. Jiang is also a director of SMIC Shenzhen. Hecertain of our subsidiaries. Dr. Jiang is also the Chief ScientistChairman of the Institute of Microelectronics, Peking University, and Academician of Chinese Science Academy. He is a fellow of the Chinese Academy of Sciences, The Institute of Electrical and Electronics Engineers (USA), The Institute of Electrical Engineers (UK) and Chinese Institute of Electronics (China).

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Founder, President, Chief Executive Officer and Executive Director
Richard Ru Gin Changfounded our company in April 2000 and is currently President, Chief Executive Officer and Executive Director. Dr. Chang is also a director of SMIC Shanghai, SMIC Beijing, SMIC Tianjin, SMIC Shenzhen and SMIC Energy Technology (Shanghai) Corporation, and each of their direct and indirect parent companies. He is also a director of SMIC Japan Corporation, SMIC, Americas, SilTech Semiconductor (Hong Kong) Corporation Limited, Admiral Investment Holdings Limited and Magnificent Tower Limited, Semiconductor Manufacturing International (AT) Corporation and its two wholly owned subsidiaries including SMIC Chengdu. Dr. Chang has more than 30 years of semiconductor experience in foundry operations, wafer fabrication and research and development. From 1998 to 1999, Dr. Chang was President of Worldwide Semiconductor Manufacturing Corp., or WSMC, after joining the company in 1997. Prior to joining WSMC, Dr. Chang worked for 20 years at Texas Instruments Incorporated, where he helped build and manage the technology development and operations often semiconductor fabs and integrated circuit operations in the United States, Japan, Singapore, Italy and Taiwan. Dr. Chang received a PhD in Electrical Engineering from Southern Methodist University and a master’s degree in Engineering Science from the State University of New York. In December 2003, Dr. Chang was selected by the China Center of Information Development as one of the ten“China IT Economic People of 2003” for his role in influencing and contributing to the development of China’s information technology industry. In September 2004, Dr. Chang received The Magnolia Silver Award. The award recognizes Dr. Chang’s contributions to Shanghai’s economy, social development and international interchange and cooperation. In April 2005, Dr. Chang received The International Scientific and Technological Cooperation Award of The People’s Republic of China. In February 2006, he was elected the 2004-2005 China Semiconductor Industry Leader. Semiconductor International China named Dr. Chang its Fab Person of the Year in 2007, and SEMI China recognized him with its 2008 Industry Outstanding Contribution award. Semiconductor International China named Dr. Chang its Fab Person of the Year in 2007, and SEMI China recognized him with its 2008 Industry Outstanding Contribution award.
Non-executive Director
Zhou Jiehas beenAssociation, a Director since 2009. Mr. Zhou is an executive director and the executive deputy CEO of Shanghai Industrial Holdings Limited. He is also an executive director and the executive vice president of Shanghai Industrial Investment (Holdings) Co. Ltd., and a director of Shanghai Industrial Pharmaceutical Investment Co. Ltd., Chia Tai Qingchunbao Pharmaceutical Co. Ltd., Shanghai Sunway Biotech Co. Ltd. and The Wing Fat Printing Co. Ltd., a non-executive director of Shanghai Fudan-Zhangjiang Bio-Pharmaceutical Co. Ltd. and the chairman of the supervisory committee of Bright Dairy and Food Co. Ltd. Mr. Zhou graduated from Shanghai Jiaotong University with a master’s degree in management science and engineering. He was the deputy general manager of the investment banking head office of Shanghai Wanguo Holdings Ltd. (now Shenyin & Wanguo Securities Co. Ltd.), and had held the positions of the chairman and general manager of Shanghai S.I. Capital Co. Ltd. He has over 10 years’ experience in investment banking and capital markets operation.
Wang Zheng Ganghas been a Director since 2007 and he is currently the alternate director to Mr. Zhou Jie. Mr. Wang is the chief representative of the Shanghai Representative Office of Shanghai Industrial Holdings Limited and chairman of SIIC Management (Shanghai) Ltd. He is also the vice chairman of Bright Dairy and Food Co. Ltd, a director of Shanghai Urban Development (Holdings) Co. Ltd., Shanghai Hu-Ning Expressway (Shanghai Section) Co. Ltd. and Shanghai SIIC South Pacific Hotel Co. Ltd. He was the head of Shanghai Dongfeng Rubber No. 2 Factory, Principal of Shanghai Dongfeng Farm, vice chairman and general manager of Shanghai Agricultural Industrial and Commercial Corp. Ltd. and a director and general manager of SIIC Africa Enterprise Ltd. and general manager of the enterprise management department of Shanghai Industrial Investment (Holdings) Co. Ltd. He graduated from the School of Management of Fudan University with a master’s degree in economics and has over 31 years’ experience in enterprise management.
Independent Non-executive Directors
Tsuyoshi Kawanishihas been a Director since 2001 and is also the chairman of SMIC Japan Corporation. Mr. Kawanishi has more than 50 years of experience in the electronics industry with Toshiba Corporation, where he served as, among other positions, senior executive vice president and senior advisor. Mr. Kawanishi currently serves on the board of directors of Asyst Technologies, Inc., FTD Technology Pte. Ltd. and T.C.S. Japan, and acts as an advisor to Accenture Ltd., Kinetic Holdings Corporation and a number of private companies. Mr. Kawanishi is also the chairman of the Society of Semiconductor Industry Seniors in Japan and the Chairman of the SIP Consortium of Japan.
Lip-Bu Tanhas been a Director since 2002 and is a director of SMIC Tianjin. Mr.Tan is the Founder and Chairman of Walden International, an international venture capital firm founded in 1984. Mr. Tan is also President and Chief Executive Officer of Cadence Design Systems, Inc. Mr. Tan is currently a director of Cadence Design Systems Inc., Flextronics International Ltd., Global Semiconductor Alliance and SINA Corporation and several other private companies. He holds an M.S. in Nuclear Engineering from the Massachusetts Institute of Technology, an M.B.A. from the University of San Francisco and a B.S. from Nanyang University, Singapore.

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Jiang Shang Zhouhas been a Director since 2006. Mr. Jiang is currently a committee member of the Shanghai Municipal Standing Committee of Chinese People’s Political Consultative Conference, a specialized committee member of the Shanghai Municipal Advisory Committee for Descion-making, andDecision making. Dr. Jiang was also the deputy secretary general of Shanghai Government, a director of Committee for Friendship with Foreign Countries of Shanghai Political Consultative Conference, an officer of and a director commissioner of Shanghai State Owned Assets PlanningPlacing and Investment Committee. Mr. Jiang was also the deputy secretary general of Shanghai Government,Committee officer of the Shanghai Chemical Industrial District LeaderLender Team Office,Officer, officer of Shanghai International Automobile City Leader Team Office and officer of the Shanghai Fuel Cell Electric Vehicles (863 major project) Leader Team Office. Mr.Dr. Jiang received his bachelor’s degree from Tsinghua University in telecommunications and his master’s and doctorate degree in information technology from the department of electrical engineering of the Swiss Federal Institute of Technology Zurich Communication System Group.


Edward S YangDavid N.K. Wang
President, Chief Executive Officer and Executive Director
Dr. David N.K. Wang joined SMIC as President, CEO, and Executive Director in November 2009. He also is a director of almost all of the Group’s subsidiaries. A well known executive with extensive experience in the global semiconductor industry, Dr. Wang previously was CEO of Huahong (Group) Co., Ltd. and Chairman of Huahong NEC, a subsidiary of Huahong Group between 2005 and 2007. Prior to this, Dr. Wang was the Executive Vice President of Applied Materials and President of Applied Materials Asia, where he was responsible for Applied Materials’ business strategy, planning, and execution throughout Asia with a particular focus on building infrastructure worldwide. Before joining Applied Materials, Dr. Wang conducted research and made a number of key breakthroughs in semiconductor technology at Bell Laboratories. A recipient of the SEMI Lifetime Achievement Award, Dr. Wang authored and co-authored over 100 patents and co-developed the Precision 5000, one of the industry’s most successful products and part of the permanent collection of the Smithsonian Institution in Washington, D.C. Dr. Wang also is a member of the Board of Directors of the Global Semiconductor Alliance (GSA). He received his Ph.D. in Materials Science and Engineering from the University of California, Berkeley.
Chen Shanzhi
Non-executive Director
Dr. Chen Shanzhi has been a Director since 2009. Since 1961, Professor YangDr. Chen is currently the SVP, CTO and CIO of China Academy of Telecommunications Technology (Datang Telecom Technology & Industry Group). He is also the Senior Vice President of Datang Telecom Technology & Industry Holdings Co. Ltd., where he is responsible for strategy development, industrial planning, technology and standard development, corporate IT, and strategic alliances and cooperation. Dr. Chen is a member of the expert group of the Information technology of the National High Technology Research and Development Program of China (863 Program). Dr. Chen received his Bachelor degree from Xidian University, Master degree from China Academy of Posts and Telecommunications of Ministry of Posts and Telecommunications and Ph. D. from Beijing University of Posts and Telecommunications. Dr. Chen has 20 years of experience in the field of information and communication technology where he has been involved in semiconductorsresearch and ICdevelopment, technology and strategy management. He has published a book and nearly 100 papers in the domestic and foreign academic conferences and publications, most of which were published by SCI and EI and many of his papers have received awards. At present, he has applied for 10 national invention patents.
Gao Yonggang
Non-executive Director
Mr. Gao Yonggang has been a Director since 2009, and is also a director of several subsidiaries of the Company. Mr. Gao is currently the Chief Financial Officer of China Academy of Telecommunications Technology (Datang Telecom Technology & Industry Group) and the chairman of Datang Capital (Beijing) Co., Ltd. and the executive director of Datang Hi-Tech Venture Capital Investment Co., Ltd. He is also a director and the Senior Vice President of Datang Telecom Technology & Industry Holdings Co., Ltd., a managing director of the China Accounting Society, and a member of the Central Enterprise Youth Federation. Mr. Gao has more than 20 years of experience in the area of financial management and has worked as Chief Financial Officer or person in charge of finance in various industries such as retail, industrial, municipal utilities, and many different type of firms like state-owned enterprises, private, joint venture enterprises, government agencies. In November 2004, he was appointed as the Chief Financial Officer of China Academy of Telecommunications Technology by the State-owned Assets Supervision and Administration Commission. Graduated from Nankai University as a Ph.D. of management, Mr. Gao has in-depth studies in the field of financial investment where he has been involved in a number of key research projects and has many publications in these areas.


Zhou Jie
Non-executive Director
Mr. Zhou Jie has been a Director since 2009. Mr. Zhou is an executive director and the executive vice president of Shanghai Industrial Investment (Holdings) Co. Ltd. (“SIIC”), an executive director and the executive deputy CEO of Shanghai Industrial Holdings Limited (“SIHL”) and the Chairman of SIIC Investment (Shanghai) Co., Ltd.. He is also a director of certain subsidiaries of SIIC and SIHL. Mr. Zhou graduated from Shanghai Jiaotong University with a master’s degree in management science and engineering. He is currently a non-executive director of Shanghai Fudan-Zhangjiang Bio-Pharmaceutical Co. Ltd., and the chairman of the supervisory committee of Shanghai Pharmaceuticals Holdings Co., Ltd.. He was the deputy general manager of the investment banking head office of Shanghai Wanguo Holdings Ltd. (now Shenyin & Wanguo Securities Co. Ltd.) and had held the positions of the chairman and general manager of Shanghai S.I. Capital Co. Ltd. He has over 10 years’ experience in investment banking and capital market operation.
Tsuyoshi Kawanishi
Independent Non-executive Director
Mr. Tsuyoshi Kawanishi has been a Director since 2001 and is also a director of a subsidiary of the Company. Mr. Kawanishi has more than 50 years of experience in the electronics industry with Toshiba Corporation, where he served as, among other positions, senior executive vice president and senior advisor. Mr. Kawanishi is an advisor to Accenture Ltd. and a number of private companies. Mr. Kawanishi has been proactively leading the semiconductor industry through his strong leadership as an engineer, research scientist,advisor to the Semiconductor Equipment and educator. ProfessorMaterials International (SEMI).
Lip-Bu Tan
Independent Non-executive Director
Mr. Lip-Bu Tan has been a Director since 2002 and is also a director of a subsidiary of the Company. Mr. Tan is the Founder and Chairman of Walden International, a leading venture capital firm managing over US$1.9 billion in committed capital. He concurrently serves as President and Chief Executive Officer of Cadence Design Systems, Inc., and has been a member of the Cadence Board of Directors since 2004. He also serves on the Boards of Flextronics International (NASDAQ: FLEX), SINA (NASDAQ: SINA), Inphi (NYSE: IPHI), Global Semiconductor Alliance and several other private companies. Mr. Tan received his B.S. from Nanyang University in Singapore, his MBA from the University of San Francisco, and his M.S. in Nuclear Engineering from the Massachusetts Institute of Technology.
Senior Management
Chris Chi, Chief Business Officer
Prior to joining the Company as Chief Business Officer, Mr. Chi was a consultant for CSquare Consulting. Mr. Chi first joined SMIC in 2008 as Senior Vice President of Corporate Marketing & Sales. From 1981 to 2007, he held management positions with TPO Corporation, Freescale Semiconductor, UMC Europe, UMCi Ltd. Singapore, UMC, Chartered Semiconductor Manufacturing Ltd., and Rockwell International Corporation. Mr. Chi is a Ph.D. candidate in Materials Science and he received his master’s degree in Materials Engineering from the University of California, Los Angeles. With more than 30 years of experience in the semiconductor industry, Mr. Chi is the holder of 5 patents.


Simon Yang, Chief Operating Officer
Prior to joining the Company as Chief Operating Officer in 2010, Dr. Yang was the Chief Technology Officer and Senior Vice President of Operations of Chartered Semiconductor. He first joined SMIC in 2001 as the Vice President of Technology Development and Senior Vice President of Technology and Manufacturing of the Company. From December 2004 to September 2005, he was the Chief Executive Officer and President of CiWest Corporation. Dr. Yang received his PhD in Material Engineering and Master of Science in Physics from Rensselaer Polytechnic Institute, also, he received his Bachelor of Science in Electrical Engineering from Oklahoma State University in 1961 and PhD from Yale University in 1966. Professor Yang was the Chairman of the Department of Electrical Engineering at Columbia University from 1986 to 1990 and from 1992 to 1995. Under his leadership, research laboratories in Telecommunications, Microelectronics, Photonics, and IC at Columbia University were established. Professor Yang joined theShanghai University of Hong Kong (“HKU”) as Chair Professor of Microelectronics in 1997. At HKU, he founded the Hong Kong Jockey Club MRI Engineering Centre and E-Business Technology Institute. Professor Yang was appointed as the chief executive officer of the Hong Kong Applied Science and Technology Research Institute (“ASTRI”) in 2007. At ASTRI, he initiated the new Industrial Collaboration Program and Internship for fresh university graduates. In 2009, he stepped down as ASTRI’s chief executive officer but remains as its senior advisor. Professor Yang has 7 US patents and publishedTechnology. With more than 200 journal papers and two popular textbooks that were translated into Chinese, Japanese, Italian and Korean. He is a fellow of the Institute of Electrical and Electronics Engineers. Professor Yang also served as an independent non-executive director of Fulbond Holdings Limited (Stock Code: 1041), the shares of which are listed on the Main Board of HKSE, from March 30, 2001 to January 3, 2007.
Senior Management
Morning Wujoined our company as Associate Vice President of Finance and Accounting in January 2003 and was appointed as Acting Chief Financial Officer and Chief Accounting Officer on March 28, 2005. Ms. Wu has over 27 years of experience in the investment and finance field. Prior to joining us, Ms. Wu held management positions with First Taiwan Securities Inc. and Grand Cathay Securities Co. Ltd. Her responsibilities at these companies included strategic planning, mergers & acquisitions and designing and monitoring risk management systems. She holds a license for Accounting and Auditor with the Senior Civil Service Examination of Taiwan. Ms. Wu obtained a bachelor’s degree in Accounting from the National Chengchi University, Taiwan and received a master’s degree in Accounting from the National Taiwan University.
Marco Morajoined our company in 2000 as Vice President of Operations and was named the Chief Operating Officer in November 2003. Mr. Mora has more than 22 years of experience in the semiconductor industry. Prior to joining us, Mr. Mora held management positions with STMicroelectronics N.V., Texas Instruments Italia S.p.A, Micron Technology Italia S.p.A and WSMC. Mr. Mora received a master’s degree in Physics from the University of Milan.
Chiou-Feng Chenjoined the Company in 2006 as Vice President of Special Technology Development and was appointed as Vice President of Corporate Marketing & Sales in 2009. Mr. Chen has over 20 years of experience in the semiconductor industry. industry, Dr. Yang is a holder of more than of 20 patents and published more than 30 technical articles.
Gary Tseng, Chief Financial Officer
Prior to Joining SMIC,joining the Company in 2010 as Chief Financial Officer, in 2008, Mr. Chen held various management positions withTseng was the Chief Operating Officer at China Solar Corporation, a thin-film solar manufacturing start-up company in Shandong, China. From 2004 to 2005, he founded the Digital Display Manufacturing Co., a plasma display manufacturing start- up company in Shanghai and he was the Chief Executive Officer. From 1999 to 2003, Mr. Tseng was the Chief Investment Officer and Senior Vice President of Quanta Computer Company. From 1997 to 1998, he was the Chief Financial Officer and Senior Vice President of United Microelectronics Corporation. From 1991 to 1997, he was the Chief Financial Officer and Senior Vice President of Taiwan Semiconductor Manufacturing Company SYNTEK Design Technology Ltd., Silicon Storage Technology, Inc., Integrated Memory Technologies,Limited. From 1983 to 1991, Mr. Tseng held management positions as Finance Manager at Philips Taiwan Limited and Inc., Actrans System Inc.Corporate Treasurer for all the Philips companies in Taiwan. In addition, he was the Fab Accounting Manager for Philips Semiconductor operation in USA and Philips Semiconductor packaging operation in Taiwan. Mr. Chen obtained a master degreeTseng received his Master of Business Administration from University of Missouri- Columbia, Missouri in the United States of America and a doctorate degreehis Bachelor of Science in Electronic EngineeringAccounting from National Chiao-TungCheng-Kong University in Taiwan. In addition, Mr. Tseng is a Certified Public Accountant, Certified Management Accountant and Certified Internal Auditor in the USA.
Company SecretaryBarry Quan, Chief Administrative Officer
Barry Quan joined SMIC in 2010. Prior to joining the company as Senior Vice President and Chief Administrative Officer Mr. Quan was a Corporate Vice President at Applied Materials and President of Applied Materials China Holding Company. From November 2005 to 2006, he worked in Huahong Group as Chief Administrative Officer. Prior to Huanghong, Mr. Quan was a Corporate Vice President of Legal Affairs at Applied Materials and was also Applies’s first Ombudsman.
Anne Wai Yui Chen, Company Secretary and Chief Compliance Officer
Ms. Chen joined our companythe Company in 2001 and is ourthe Company’s Hong Kong Representative, Company Secretary and Chief Compliance Officer. Ms. Chen is admitted as a solicitor in Hong Kong, England and Wales and Australia and was admitted as an advocate and solicitor in Singapore. She had served as a deputy adjudicator of the Small Claims Tribunal in Hong Kong in 1999 and ishas served as the President of the Hong Kong Federation of Women Lawyers from 2000 to 2002 and since 2008. Prior to joining usthe Company in 2001, she had been a practicing solicitor in Hong Kong since 1987. Ms. Chen is active in serving the community and has been awarded by the Law Society of Hong Kong the Pro Bono Distinguished Service Award in 2011.
Zhou Mei Sheng, Vice President of Technology and Operations Office
Dr. Zhou joined SMIC in 2010 as Vice President. She leads research and development of advanced technologies in the company. Dr. Zhou also serves as Director for the United Lab Center which is a joint R&D platform between SMIC, universities & research


institutes. Prior to joining the SMIC, Dr. Zhou was a Senior Director of Advanced Module Technology Development of Chartered Semiconductor (later GlobalFoundries) for 5 years.
From 1994 to 2004, she held a number of management positions in Chartered, TSMC, and UMC sequentially in the areas of semiconductor technology development and Fab operation. Dr. Zhou obtained Ph.D. degree in Chemistry from Princeton University, USA and MSc & BSc degrees from Fudan University, China. In the earlier part of her professional career, she lectured and/or conducted researches in some distinguished universities like Fudan University of China, Rochester University of USA and National University of Singapore. Dr. Zhou holds more than 125 US patents, and authored or co-authored over 40 technical papers.
John Peng, Associate Vice President and General Manager of China BU
Mr. Peng first joined SMIC in 2001 and is currently General manager of China Business Unit. Prior to joining SMIC, he was Sr. Operation Director of Wuxi CSMC-HJ Semiconductor Company Limited and was responsible for Fab, PC&MC, Facility and IT. He was also deputy general manager & Fab director in Huajing MOS BU, responsible for China national 908 project AT&T (Lucent) technology transfer and built China most advanced 6” fab in 1996. He also published more than 10 technical articles.
He received his Bachelor’s degree in Physics from Sichuan University. He is a Ph.D. candidate in Microelectronics of Southeast University and he received his master’s degree in Microelectronics from Xidian University in 1988.
Except as described below in Item“Item 10 -“Additional Information — Material Contracts — Share Purchase Agreement with Datang” and “Item 10 - Additional Information - Material Contracts - Subscription Agreement with Country Hill Limited”, no shareholder has a contractual right to designate a person to be elected to our board of directors.

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There are no family relationships among any of our directors and executive officers, including our founder.officers.
Director and Executive Compensation
The aggregate cash compensation that we paid to all of our executive officers as of December 31, 20082010 for services rendered to us and our subsidiaries during 20082010 was approximately US$914,073. Of this amount, we1,654,376. Details of the emoluments paid or payable by the Company to our directors, including David N.K. Wang, our president, and chief executive officer US$218,398and executive director, in salary, housing allowances, other allowances and benefits in kind in 2008. We currently do not provide cash compensation to directors that2010 are not employees.set out as below:
                                 
  David N.K.  Chen  Gao  Zhou  Tsuyoshi  Lip-Bu  Jiang    
  Wang  Shanzhi  Yong Gang  Jie  Kawanishi  Tan  Shang Zhou  Total 
  (in US$)  (in US$)  (in US$)  (in US$)  (in US$)  (in US$)  (in US$)  (in US$) 
Salaries and other benefits1
 $344,264  $45,000  $45,000  $  $45,000  $60,000  $180,000  $719,264 
Discretionary bonus2 3
 $225,923  $  $  $  $  $  $  $225,923 
Stock Option Benefits4
 $1,099,719  $14,569  $14,569  $  $28,518  $28,518  $254,092  $1,439,985 
Total
 $1,669,906  $59,569  $59,569  $  $73,518  $88,518  $434,092  $2,385,172 
Note:
1.David N.K. Wang’s salaries and other benefits in 2010, include 2 months of service since joining the Company in November 2009 which was paid in 2010.
2.David N.K. Wang is entitled to a performance bonus of 75% of his annual salary, payable if and when the Company achieves profitability over one fiscal year.
3.David N.K. Wang’s discretionary bonus will be paid in 2011.
4.On February 23, 2010, Dr. Wang was granted an option to purchase 62,697,553 ordinary shares at a price of HK$0.77 per ordinary share, and an award of 26,870,379 Restricted Share Units. None of these awards had been vested as of December 31, 2010. Expenses recognized by the Company during the year ended December 31, 2010 in accordance with U.S.GAAP do not represent the actual benefits received by the recipient in 2010. The individual actual benefits to be realized upon exercise could be more or less than the accounting expenses recognized by the Company as stated above.
We do not provide pension, retirement or similar benefits to our executive officers and directors except statutorily required benefits.
In 2008, the Board did not grant2010, we have granted options orto purchase an aggregate of 157,016,532 ordinary shares under our 2004 Stock Option Plan and awarded an aggregate of 62,022,666 restricted share units under our 2004 Equity Incentive Plan to any director as compensation for their service oncertain of our executive officers and directors. Both our 2004 Stock Option Plan and the Board.2004 Equity Incentive Plan are described below. The exercise price of the options granted to our executive officers in 2010 to purchase ordinary shares under the 2004 Stock Option Plan range from US$0.082 to US$0.099 per share. The expiration dates of these options range from February 22, 2020 to May 23, 2020.


On April 25, 2004, the compensation committee approved a profit-sharing plan for the benefit of our employees, including our executive officers. Under our profit-sharing plan, a participant who is an employee of the company at the end of a fiscal quarter will be eligible to receive a percentage of our profits for that quarter. No compensation was received by our executive officers in 2006, 20072008, 2009 and 20082010 as a result of their participation in this plan.
Board Practices
Board of Directors
As of December 31, 2008, our     Our board of directors consistedconsists of seven directors.directors, Wang Zheng Gang, a former alternate director of Zhou Jie, resigned effective February 14, 2011. Directors may be elected to hold office until the expiration of their respective terms upon a resolution passed at a duly convened shareholdersshareholders’ meeting by holders of a majority of our outstandingthe Company’s issued shares being entitled to vote in person or by proxy at such meeting. Our boardThe Board is divided into three classes with no more than one class of Directors eligible for re-election at anyeach annual general meeting of shareholders, meeting.or AGM.
Each class of Directors will serve a term of three years. The Class I directorsDirectors will hold office until the 2011 annual general meeting of the Company. The Class II Directors will hold office until the 2012 annual general meeting of the Company. The Class III Directors were electedre-elected at the 2010 AGM for a term of three years beginning from June 2, 2008, which isto hold office until the date of the 20082013 annual general meeting of our shareholders. The Class II directors were elected for a term of three years beginning from May 30, 2006, the date of the 2006 annual general meeting our shareholders. The Class III directors were elected for a term of three years beginning from May 23, 2007, which is the date of the 2007 annual general meeting of our shareholders.Company.
The following table sets forth the names and classes of our current directors:
     
Class I Class II Class III
Richard Ru Gin ChangGao Yonggang Lip-Bu TanChen Shanzhi Tsuyoshi Kawanishi
Edward S YangDavid N.K. Wang Jiang Shang ZhouYang Yuan Wang
 Zhou Jie
  Lip-Bu Tan  
Wang Zheng Gang (alternate director to Zhou Jie)


Please see Item 7 “Related Party Transactions — Indemnification Agreements and Service Contracts” for a description of the service contracts we have entered into with our directors.
Committees of Our Board of Directors
Our board of directors has an audit committee and a compensation committee. The composition and responsibilities of these committees are described below.
Audit Committee. As of December 31, 2008,Currently the members of the audit committee wereAudit Committee are Lip-Bu Tan (chairman of audit committee)Audit Committee), Jiang Shang Zhou and Yang Yuan Wang.Gao Yonggang. None of thethese members of the audit committeeAudit Committee has been an executive officer or employee of the company or any of its subsidiaries. See “Related Party Transactions” for a description of transactions between us and the members of the audit committee. In addition to acting as audit committeeAudit Committee member of SMIC, Mr.the company, Lip-Bu Tan currently also serves on the audit committee of two otheranother publicly traded companies, namelycompany, SINA CorporationCorporation. In general and Flextronics International Ltd. Inin accordance with section 303A.07(a)303A.07 (a) of the Listed Company Manual of the New York Stock Exchange, the Board considered and determined that such simultaneous service would not impair the ability of Mr. Tan to effectively serve on our audit committee.Audit Committee.

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The responsibilities of the audit committee include, among other things:
making recommendations to the board of directors concerning the appointment, reappointment, retention, evaluation, oversight and termination of compensating and overseeing the work of our independent auditor, including reviewing the experience, qualifications and performance of the senior members of the independent auditor team, and pre-approving all non-audit services to be provided by our independent auditor;
approving the remuneration and terms of engagement of our independent auditor;
reviewing reports from our independent auditor regarding its internal quality-control procedures and any material issues raised in the most recent review or investigation of such procedures and regarding all relationships between us and the independent auditor;
pre-approving the hiring of any employee or former employee of our independent auditor who was a member of the audit team during the preceding two years;
reviewing our annual and interim financial statements, earnings releases, critical accounting policies and practices used to prepare financial statements, alternative treatments of financial information, the effectiveness of our disclosure controls and procedures and important trends and developments in financial reporting practices and requirements;
reviewing the planning and staffing of internal audits, the organization, responsibilities, plans, results, budget and staffing of our internal audit department and the quality and effectiveness of our internal controls;
reviewing our risk assessment and management policies;
reviewing any legal matters that may have a material impact and the adequacy and effectiveness of our legal and regulatory compliance procedures;


making recommendations to the board of directors concerning the appointment, reappointment, retention, evaluation, oversight and termination of compensating and overseeing the work of our independent auditor, including reviewing the experience, qualifications and performance of the senior members of the independent auditor team, and pre-approving all non-audit services to be provided by our independent auditor;
establishing procedures for the treatment of complaints received by us regarding accounting, internal accounting controls, auditing matters, potential violations of law and questionable accounting or auditing matters; and
obtaining and reviewing reports from management, our internal auditor and our independent auditor regarding compliance with applicable legal and regulatory requirements.
approving the remuneration and terms of engagement of our independent auditor;
During 2010, the audit committee reviewed:
reviewing reports from our independent auditor regarding its internal quality-control procedures and any material issues raised in the most recent review or investigation of such procedures and regarding all relationships between us and the independent auditor;
the financial reports for the year ended December 31, 2009 and the six month period ended June 30, 2010;
the quarterly earnings releases and any updates thereto;
the report and management letter submitted by our outside auditors summarizing the findings of and recommendations from their audit of our financial reports;
our budget for 2010;
the findings and recommendations of our outside consultants regarding our compliance with the requirements of the Sarbanes-Oxley Act;
the effectiveness of our internal control structure in operations and financial reporting integrity and compliance with applicable laws and regulations in collaboration with the Internal Audit Department and reported to our board of directors;
the findings of our risk management committee which assesses risks relating to the company and those of the compliance office, which monitors our compliance with the corporate governance code and insider trading policy;
the audit fees for our outside auditors; and
our outside auditors’ engagement letters
pre-approving the hiring of any employee or former employee of our independent auditor who was a member of the audit team during the preceding two years;
reviewing our annual and interim financial statements, earnings releases, critical accounting policies and practices used to prepare financial statements, alternative treatments of financial information, the effectiveness of our disclosure controls and procedures and important trends and developments in financial reporting practices and requirements;
reviewing the planning and staffing of internal audits, the organization, responsibilities, plans, results, budget and staffing of our internal audit department and the quality and effectiveness of our internal controls;
reviewing our risk assessment and management policies;
reviewing any legal matters that may have a material impact and the adequacy and effectiveness of our legal and regulatory compliance procedures;
establishing procedures for the treatment of complaints received by us regarding accounting, internal accounting controls, auditing matters, potential violations of law and questionable accounting or auditing matters; and
obtaining and reviewing reports from management, our internal auditor and our independent auditor regarding compliance with applicable legal and regulatory requirements.
During 2008, the audit committee reviewed:
the financial reports for the year ended December 31, 2007 and the six month period ended June 30, 2008;
the quarterly earnings releases and any updates thereto;
the report and management letter submitted by our outside auditors summarizing the findings of and recommendations from their audit of our financial reports;
our budget for 2008;
the findings and recommendations of our outside consultants regarding our compliance with the requirements of the Sarbanes-Oxley Act;
the effectiveness of our internal control structure in operations and financial reporting integrity and compliance with applicable laws and regulations in collaboration with the Internal Audit Department and reported to the Board;
the findings of our risk management committee which assesses risks relating to the company and those of the compliance office, which monitors our compliance with the corporate governance code and insider trading policy;
the audit fees for our outside auditors; and
our outside auditors’ engagement letters
The audit committee reports its work, findings, and recommendations to the board of directors during each quarterly board meeting.

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The audit committee meets in person at least on a quarterly basis and on such other occasions as may be required to discuss and vote upon significant issues affecting the audit policy of the company. The regular meeting schedule for a year is planned in the preceding year. The Company’s SecretaryChief Administrative Officer assists the chairman of the audit committee in preparing the agenda for meetings and together with Company Secretary, assists the audit committee in complying with relevant rules and regulations. The relevant papers for the audit committee meetings are dispatched to audit committee members in accordance with applicable rules and regulations governing the company. Members of the audit committee may include matters for discussion in the agenda if the need arises. Upon the conclusion of the audit committee meeting, minutes are circulated to the members of the audit committee for their comment and review prior to their approval of the minutes at the following or the subsequent audit committee meeting.
At each quarterly audit committee meeting, the audit committee reviews with the acting chief financial officer and our outside auditors, the financial statements for the financial period and the financial and accounting principles, policies and controls of the


company and its subsidiaries. In particular, the Committee discusses (i) the changes in accounting policies and practices, if any; (ii) the going concern assumptions, (iii) compliance with accounting standards and applicable rules and other legal requirements in relation to financial reporting and (iv) our internal controls relating to financial reporting. Upon the recommendation of the audit committee, the Board will approve the financial statements.
Compensation Committee. As of December 31, 2008, theThe members of our compensation committee werecurrently consist of Mr. Lip-Bu Tan (chairman of compensation committee)Compensation Committee), Mr. Tsuyoshi Kawanishi and Tsuyoshi Kawanishi. Effective as of February 5, 2009,Mr. Zhou Jie is also a member of the compensation committee.Jie. None of these members of the compensation committee has been an executive officer or employee of the companyCompany or any of its subsidiaries. See “Related Party Transactions” for a description of transactions between us and the members of the compensation committee.
The responsibilities of the compensation committee include, among other things:
approving and overseeing the total compensation package for our executive officers and any other officer, evaluating the performance of and determining and approving the compensation to be paid to our chief executive officer and reviewing the results of our chief executive officer’s evaluation of the performance of our other executive officers;
approving and overseeing the total compensation package for our executive officers and any other officer, evaluating the performance of and determining and approving the compensation to be paid to our chief executive officer and reviewing the results of our chief executive officer’s evaluation of the performance of our other executive officers;
reviewing and making recommendations to our board of directors with respect to director compensation, including equity-based compensation;
administering and periodically reviewing and making recommendations to the board of directors regarding the long-term incentive compensation or equity plans made available to the directors, employees and consultants;
reviewing and making recommendations to the board of directors regarding executive compensation philosophy, strategy and principles and reviewing new and existing employment, consulting, retirement and severance agreements proposed for the company’s executive officers; and
ensuring appropriate oversight of our human resources policies and reviewing strategies established to fulfill our ethical, legal and human resources responsibilities.
reviewing and making recommendations to our board of directors with respect to director compensation, including equity-based compensation;
administering and periodically reviewing and making recommendations to the board of directors regarding the long-term incentive compensation or equity plans made available to the directors, employees and consultants;
reviewing and making recommendations to the board of directors regarding executive compensation philosophy, strategy and principles and reviewing new and existing employment, consulting, retirement and severance agreements proposed for the company’s executive officers; and
ensuring appropriate oversight of our human resources policies and reviewing strategies established to fulfill our ethical, legal and human resources responsibilities.
In 2007, the compensation committee reviewed the total compensation package for Richard Ru Gin Chang , who is the president and chief executive officer, and awarded Richard Ru Gin Chang an annual salary of US$157,477. No changes were made to Richard Ru Gin Chang’s annual salary for 2008.
In addition to reviewing the remuneration of the non-executive directors and the members of our management, the compensation committee reviewed and approved the granting of stock options and restricted share units pursuant to the terms of the Option Plans in 2008.2010. The compensation committeeCompensation Committee also reviewed and approved on at least a quarterly basis any exception to the compensation guidelines and leave of absence policy of the Company.
The compensation committeeCompensation Committee reports its work, findings and recommendations to the board of directors during each quarterly board meeting.

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The compensation committeeCompensation Committee meets in person at least on a quarterly basis and on such other occasions as may be required to discuss and vote upon significant issues affecting our compensation policy. The regular meeting schedule for a year is planned in the preceding year. The Company’s SecretaryChief Administrative Officer assists the chairman of the compensation committee in preparing the agenda for meetings and together with Company Secretary, assists the compensation committee in complying with relevant rules and regulations. The relevant papers for the compensation committee meeting are distributed to compensation committee members in accordance with relevant rules and regulations applicable to us. Members of the compensation committee may include matters for discussion in the agenda if the need arises. Upon the conclusion of the compensation committee meeting, minutes are circulated to the members of the


compensation committee for their comment and review prior to their approval of the minutes at the following or a subsequent compensation committee meeting.
Employees
The following table sets forth, as of the dates indicated, the number of our employees serving in the capacities indicated:
                        
 As of December 31,  As of December 31,
Function 2006 2007 2008  2008 2009 2010
Managers 871 916 1,015  1,015 1,064 917 
Professionals(1)
 3,790 4,096 4,465  4,465 4,510 3,920 
Technicians 4,804 4,806 4,837  4,837 4,484 4,970 
Clerical staff 583 287 281  281 249 269 
              
Total(2)
 10,048 10,105 10,598  10,598 10,307 10,076 
              
 
(1) Professionals include engineers, lawyers, accountants and other personnel with specialized qualifications, excluding managers.
 
(2) Includes 275, 27650, 372 and 50145 temporary and part-time employees in 2006, 20072008, 2009 and 2008,2010, respectively.
The following table sets forth, as of the dates indicated, a breakdown of the number of our employees by geographic location:
                        
 As of December 31,  As of December 31,
Location of Facility 2006 2007 2008  2008 2009 2010
Shanghai 6,400 6,292 6,632  6,632 6,460 5,395 
Beijing 1,827 1,877 1,674  1,674 1,552 2,102 
Tianjin 1,073 874 958  958 997 1,439 
Chengdu 715 1,023 1,259  1,259 1,104 792 
Shenzhen   33  33 154 142 
Wuhan   174 
United States 16 18 16  16 17 15 
Europe 7 8 11  11 9 8 
Japan 7 9 8  8 8 3 
Hong Kong 3 4 7  7 6 6 
              
Total 10,048 10,105 10,598  10,598 10,307 10,076 
              
Our employees are not covered by any collective bargaining agreements.

 

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Share Ownership
The table below sets forth the ordinary shares beneficially owned by each of our directors and options to purchase ordinary shares as of May 31, 2009:2011:
                                
 Current Options to Purchase Ordinary Shares Awards of Restricted  Current Options to Purchase Ordinary Shares Awards of Restricted
Name of Director Shareholding Number of Options Exercise Price Share Units  Shareholding Number of Options Exercise Price Share Units
Richard Ru Gin Chang  81,219,500(1)(2)  16,600,000(3) US$0.0348-US$0.31 500,000 
Chen Shanzhi 0  3,145,319(1) US $0.0821   
Gao Yonggang 0  3,145,319(1) US $0.0821   
Jiang Shang Zhou 0  16,674,388(2)(5) US $0.0348 – US $0.0992  6,717,594(3)
David N.K. Wang 0  62,697,553(2) US $0.0992  26,870,379(4)
Tsuyoshi Kawanishi   3,500,000(3) US$0.0348 -US$0.22   0  6,134,877(2) (5) (6) (7) US $0.0348 – US $0.132  
Lip-Bu Tan   2,000,000(3) US$0.0348-US$0.22   0  4,634,877(2) (5) (6) US $0.0348 – US $0.132  
Yang Yuan Wang   2,000,000(3) US$0.0348-US$0.22  
Jiang Shang Zhou   1,000,000(3) US$0.0348  
Edward S Yang 750,000  1,000,000(3) US$0.0348  
Zhou Jie      0     
Wang Zheng Gang     
Henry Shaw (former independent non-executive director who resigned as of January 13, 2009)     
 
Notes:
1.Pursuant to a Charitable Pledge Agreement dated December 1, 2003, Richard Ru Gin Chang and his spouse, Scarlett K. Chang (collectively, the “Donors”) have pledged to transfer 10,000,000 of such ordinary shares as a charitable gift to The Richard and Scarlett Chang Family Foundation, a Delaware nonprofit nonstock corporation organized exclusively for religious, charitable, scientific, literary and education purposes within the meaning of Section 501(c)(3) of the US Internal Revenue Code of 1986, as amended, such transfer to be made in full at or prior to the death of the surviving Donor. In addition, 2,639,550 of such ordinary shares are jointly held by Richard Ru Gin Chang and his spouse, Scarlett K. Chang.Notes:
 
2.(1) 20,000,000On May 24, 2010, each of Mr. Chen and Mr. Gao was granted an option to purchase 3,145,319 ordinary shares at a price per ordinary share of HK$0.59. These options will expire on the earlier of May 23, 2020 or 120 days after termination of the ordinary shares held as a corporate interest. These ordinary shares are held by Jade Capital Company, LLC, a Delaware limited liability company (the “LLC”),director’s service to the Board. As at May 31, 2011, none of which Richard Ru Gin Chang and his spouse, Scarlett K. Chang (collectively, the “Members”), are the sole members. It is the current intent of the Members that all or a portion of the net income of the LLC be used for philanthropic purposes, including but not limited to contributions to charitable organizations that are tax-exempt under Section 501(c)(3) of the US Internal Revenue Code of 1986, as amended.these options have been exercised.
 
3.(2) Each of Richard R. Chang, Tsuyoshi Kawanishi, Lip-Bu Tan, Yang YuanOn February 23, 2010, Mr. Jiang and Dr. Wang Jiang Shang Zhou and Edward S Yang were granted an option to purchase 1,000,000 Ordinary Shares15,674,388 and 62,697,553 ordinary shares, respectively, at a price per Ordinary Sharesordinary share of US$0.0348.HK$0.77. On the same day, each of Mr. Kawanishi and Mr. Tan was granted with an option to purchase 3,134,877 ordinary shares, at a price per ordinary share of HK$0.77. These options will expire on the earlier of February 22, 2020 or 120 days after termination of the director’s service to the Board. As at May 31, 2011, none of these options have been exercised.
(3)On February 23, 2010, Mr. Jiang was granted an award of 6,717,594 Restricted Share Units (each representing the right to receive one ordinary share) pursuant to our 2004 Equity Incentive Plan. 1,679,398 of the ordinary shares under the Restricted Share Units have vested and been issued and subsequently sold on June 2, 2011. The remaining ordinary shares under the Restricted Share Units will fully vest on February 23, 2014.
(4)On February 23, 2010, Dr. Wang was granted an award of 26,870,379 Restricted Share Units (each representing the right to receive one ordinary share) pursuant to our 2004 Equity Incentive Plan. Restricted Share Units will be fully vested on February 23, 2014.
(5)On February 17, 20112009, each of Mr. Jiang, Mr. Kawanishi and Mr. Tan and was granted an option to purchase 1,000,000 ordinary shares at a price per ordinary share of HK$0.27. These options will expire on the earlier of February 17, 2019 or 120 days after termination of the director’s service to the Board. As at May 31, 2009,2011, none of these options have been exercised.
(6)On September 29, 2006, each of Mr. Kawanishi and Mr. Tan was granted an option to purchase 500,000 ordinary shares at a price of US$0.132 per ordinary share. These options will expire on the earlier of September 29, 2016 or 120 days after


termination of the director’s service to the Board. As of May 31, 2011, these options have not been exercised. Mr. Jiang Shang Zhou has declined receipt of such option.
(7)Mr. Kawanishi has been granted options to purchase an aggregate of 1,500,000 ordinary shares, if fully exercised. These options will be expired on July 10, 2012 and January 14, 2014 respectively. As of May 31, 2011, none of these options have been exercised.
The share holdings set forth above excludes shares beneficially owned by entities affiliated with our directors. Each of our directors disclaims beneficial ownership of the shares beneficially owned by such affiliated entity, except to the extent of such director’s pecuniary interest therein as disclosed above.
The exercise price for our options is denominated in Hong Kong dollars. This annual report translates the Hong Kong dollar exercise prices for our options into U.S. dollars based on exchange rates that were in effect as of the applicable option grants dates
On July 11, 2002, the compensation committee issued Mr. Kawanishi an option to purchase 500,000 ordinary shares pursuant to the terms of the 2001 Stock Option Plan. This option will expire on July 11, 2012. On January 15, 2004, the board issued him an option to purchase 1,000,000 ordinary shares pursuant to the terms of the 2001 Stock Option Plan. This option will expire on January 15, 2014. The exercise prices of the options are US$0.05 and US$0.10, respectively.

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On November 10, 2004, the Board granted to each independent non-executive director and non-executive director as of such date, an option to purchase 500,000 ordinary shares at a price per ordinary share of US$0.22. These options vested on March 19, 2005 and will expire on November 10, 2009. Lai Xing Cai (who resigned as non-executive director on February 6, 2006) has declined this option. As of December 31, 2008, no director has exercised such options. The option granted to Mr. Yen-Pong Jou (who retired as an independent non-executive director at the 2006 AGM) lapsed and cancelled on September 27, 2006. The options granted to Dr Albert Yu (who resigned as an Independent Non-executive Director on June 2, 2008) lapsed on September 30, 2008. The options granted to Dr Ta-Lin Hsu (who resigned as an Independent Non-executive Director on September 30, 2008) lapsed on January 29, 2009. The options granted to Mr. Henry Shaw (who resigned as an Independent Non-executive Director on January 13, 2009) will lapse on May 13, 2009.
On April 7, 2004, the compensation committee issued to Richard Ru Gin Chang an option to purchase 100,000 ordinary shares. The exercise price per ordinary share underlying the option was US$0.31. The option will expire on April 7, 2014. On May 11, 2005, the compensation committee issued to Richard Ru Gin Chang an option to purchase 15,000,000 ordinary shares and an award of 2,000,000 restricted share units. The exercise price per ordinary share underlying the option is US$0.196. The option and the award of restricted share units will expire on May 11, 2015. As of December 31, 2008, 1,500,000 RSUs had been issued and vested and 500,000 RSUs had been vested but remained unissued.
On September 29, 2006, the Board granted to each director an option to purchase 500,000 ordinary shares at a price per ordinary share of US$0.132. These options were vested as to 50% on each of May 30, 2007 and May 30, 2008 respectively and will expire on the earlier of September 29, 2016 or 120 days after termination of the director’s service to the Board. As of December 31, 2008, these options have not been exercised. Fang Yao (who resigned as non-executive director on August 30, 2007) and Jiang Shang Zhou have declined such options. The options granted to Dr.Albert Yu (who resigned as an Independent Non-executive Director on June 2, 2008) lapsed on September 30, 2008. The options granted to Dr. Ta-Lin Hsu (who resigned as an Independent Non-executive Director on September 30, 2008) lapsed on January 29, 2009. The options granted to Mr. Henry Shaw (who resigned as an Independent Non-executive Director on January 13, 2009) will lapse on May 13, 2009.
In 2007, the Board did not grant options or restricted share units to any director as compensation for their service on the Board.
In 2008, the Board did not grant options or restricted share units to any director as compensation for their service on the Board.
On February 17, 2009, the Board granted an option to purchase 1,000,000 ordinary shares to each of Richard R. Chang, Tsuyoshi Kawanishi, Lip-Bu Tan, Yang Yuan Wang, Jiang Shang Zhou and Edward S Yang as compensation for their service on the Board.
The compensation committee has issued each of our executive officers options to purchase ordinary shares pursuant to our 2001 Regulation S Stock Option Plan, 2001 Regulation S Preference Shares Stock Plan and the 2004 Stock Option Plan, as applicable, and restricted share units that represent rights to receive ordinary shares pursuant to our 2004 Equity Incentive Plan. The exercise price of the options range from US$0.01 to US$0.35.0.20. The options expire between November 10, 2009September 23, 2011 and September 29, 2016.May 23, 2020. The restricted share units expire between July 26, 20152014 and September 29, 2016.May 23, 2020. The majority of the options and restricted share units are subject to a four-year vesting period. Each executive officer owns less than 1% of the total outstanding shares of the company.
2001 Stock Plan and 2001 Regulation S Stock Plan
On March 28, 2001, our board of directors and shareholders adopted our 2001 Stock Plan and our 2001 Regulation S Stock Plan. Under these plans, our directors, employees and consultants are eligible to acquire ordinary shares pursuant to options. At the time of adoption, 250,000,000 post-split ordinary shares were reserved for issuance under the 2001 Stock Plan and 470,000,000 post-split ordinary shares were reserved for issuance under the 2001 Regulation S Stock Plan. On August 27, 2003, our shareholders approved an increase in the number of authorized shares reserved under the plans of 3,438,900 post-split ordinary shares, increasing the total number of authorized shares reserved under the plans to 723,438,900 post-split ordinary shares. On August 27, 2003, September 22, 2003 and December 4, 2003, our shareholders approved additional increases in the number of shares reserved under our 2001 Regulation S Stock Plan of up to 325,000,000, 21,499,990 and 235,089,480 post-split ordinary shares, respectively, which amounts were to be adjusted from time to time to equal 10% of the post-split ordinary shares issuable upon the conversion of all Series C convertible preference shares and Series D convertible preference shares then outstanding. As of December 31, 2008,2010, there were 998,675,840 post-split ordinary shares authorized for issuance under the plans, 285,423,228185,406,056 post-split ordinary shares subject to outstanding options under the plans and 398,867,596447,999,429 post-split ordinary shares outstanding from the exercise of options granted under the plans. These plans terminate on December 4, 2013 but may be terminated earlier by our board of directors.

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Stock options granted under the 2001 Stock Plan may be incentive stock options, or ISOs, which are intended to qualify for favorable U.S. federal income tax treatment under the provisions of Section 422 of the U.S. Internal Revenue Code of 1986, as amended, or U.S. Internal Revenue Code, or non-qualified stock options, or NSOs, which do not so qualify. Stock options granted under the 2001 Regulation S Stock Plan are NSOs. The aggregate fair market value of the ordinary shares represented by any given optionee’s ISOs that become exercisable in any calendar year may not exceed US$100,000. Stock options in excess of this limit are treated as NSOs.


The board of directors, the compensation committee, and the non-executive option grant committee administer the 2001 Stock Plan and 2001 Regulation S Stock Plan. The compensation committee selected the eligible persons above a certain compensation grade to whom options were granted and determined the grant date, amounts, exercise prices, vesting periods and other relevant terms of the stock options, including whether the options will be ISOs or NSOs. The non-executive option grant committee selected the eligible persons below a certain compensation grade to whom options were granted and determined the grant date, amounts, exercise prices, vesting periods and other relevant terms of stock options within parameters established by the compensation committee and subject to compensation committee ratification. The exercise price of ISOs granted under the 2001 Stock Plan and NSOs granted to residents of California under the 2001 Stock Plan may not be less than 100% and 85%, respectively, of the fair market value of our ordinary shares on the grant date. The exercise price of NSOs not granted to residents of California under either our 2001 Stock Plan or our 2001 Regulation S Stock Plan can be determined by the board of directors, the compensation committee or the non-executive option grant committee in their discretion.
Stock options granted under the 2001 Stock Plan and 2001 Regulation S Stock Plan may be exercised at any time after they vest, and, in certain instances, prior to vesting. Shares purchased when an option is exercised prior to vesting are subject to our right of repurchase to the extent unvested in the event of the termination of service of the optionee. In the event of the termination of service of an optionee, the unvested portion of a stock option is forfeited and the vested portion terminates six months after a termination of service due to the death or permanent disability of the optionee or 30 days after termination of service for any other reason or such longer periods as may be provided for in option agreements with our optionees. Stock options are generally not transferable during the life of the optionee.
In the event of a change of control (as defined in the plans) or a merger of our company, each outstanding stock option may be assumed or an equivalent stock option or right may be substituted by the successor corporation. In the event that no such substitution or assumption occurs, the outstanding stock options will automatically vest and become exercisable for a period of 15 days, after which the stock options will terminate.
We have not issued stock options under the 2001 Stock Plan or the 2001 Regulation S Stock Plan since the completion of the global offering.
2001 Preference Shares Stock Plan and 2001 Regulation S Preference Shares Stock Plan
On April 12, 2001, our board of directors and shareholders adopted our 2001 Preference Shares Stock Plan and our 2001 Regulation S Preference Shares Stock Plan. Under these plans, our directors, employees and consultants were eligible to acquire Series A convertible preference shares prior to the completion of the global offering and ordinary shares upon or following the completion of the global offering, pursuant to options. At the time of adoption, 16,000,000 Series A preference shares and ten times that number of ordinary shares (on a post-split basis) were reserved for issuance under the 2001 Preference Shares Stock Plan, and 20,000,360 Series A convertible preference shares and ten times that number of ordinary shares (on a post-split basis) were reserved for issuance under the 2001 Regulation S Preference Shares Stock Plan. On August 19, 2002, our shareholders approved an increase in the number of shares issuable under the plans of 18,000,180 Series A convertible preference shares, increasing the total number of authorized shares reserved under the plans to 54,000,540 Series A convertible preference shares. On August 27, 2003, our shareholders approved a net decrease in the number of shares issuable under the plans of 343,890 Series A convertible preference shares, decreasing the total number of authorized shares reserved under the plans to 53,656,650 Series A convertible preference shares. Upon the conversion of our preference shares into ordinary shares in connection with the global offering, options granted under the 2001 Preference Shares Stock Plan and the 2001 Regulation S Preference Shares Stock Plan converted into options to purchase ordinary shares. As of December 31, 2008,2010, there were 52,344,60035,669,800 ordinary shares subject to


outstanding options under the plans, and there were 400,747,130400,827,130 ordinary shares outstanding from the exercise of options granted under the plans. Our board of directors has elected not to grant any further options under these plans.

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Stock options granted under the 2001 Preference Shares Stock Plan may be ISOs or NSOs. Stock options granted under the 2001 Regulation S Preference Shares Stock Plan are NSOs. The aggregate fair market value of the shares represented by any given optionee’s ISOs that become exercisable in any calendar year may not exceed US$100,000. Stock options in excess of this limit are treated as NSOs.
The board of directors, the compensation committee and the non-executive option grant committee administer the 2001 Preference Shares Stock Plan and 2001 Regulation S Preference Shares Stock Plan. The compensation committee selected the eligible persons above a certain compensation grade to whom options were granted and determined the grant date, amounts, exercise prices, vesting periods and other relevant terms of the stock options, including whether the options will be ISOs or NSOs. The non-executive option grant committee selected the eligible persons below a certain compensation grade to whom options were granted and determined the grant date, amounts, exercise prices, vesting periods and other relevant terms of stock options within parameters established by the compensation committee and subject to compensation committee ratification. The exercise price of ISOs granted under the 2001 Preference Shares Stock Plan and NSOs granted to residents of California under the 2001 Preference Shares Stock Plan may not be less than 100% and 85%, respectively, of the fair market value of our Series A convertible preference shares on the grant date. The exercise price of NSOs not granted to California residents under either our 2001 Preference Shares Stock Plan or our 2001 Regulation S Preference Shares Stock Plan can be determined by the board of directors, the compensation committee or the non-executive option grant committee in their discretion.
Stock options granted under the 2001 Preference Shares Stock Plan and 2001 Regulation S Preference Shares Stock Plan may be exercised at any time after they vest, and, in certain instances, prior to vesting. Shares purchased when an option is exercised prior to vesting are subject to our right of repurchase to the extent unvested in the event of the termination of service of the optionee. In the event of the termination of service of an optionee, the unvested portion of a stock option is forfeited and the vested portion terminates six months after a termination of service due to the death or permanent disability of the optionee or 30 days after termination of service for any other reason or such longer periods as may be provided for in option agreements with our optionees. Stock options are generally not transferable during the life of the optionee.
In the event of a change of control (as defined in the plans) or a merger of our company, each outstanding stock option may be assumed or an equivalent stock option or right may be substituted by the successor corporation. In the event that no such substitution or assumption occurs, the outstanding stock options will automatically vest and become exercisable for a period of 15 days, after which the stock options will terminate.
We have not issued stock options under the 2001 Preference Shares Stock Plan or the 2001 Regulation S Preference Shares Stock Plan since the completion of the global offering.
2004 Global Equity Incentive Compensation Program
The Company’s shareholders adopted the Stock Option Plan, the EIP and the Employee Stock Purchase Plan (the “ESPP”, together with the Stock Option Plan and the EIP, the “Option Plans”) to attract and retain its employees.
Stock Option Plan


The following is a summary of the principal terms of the Stock Option Plan conditionally adopted by the Company by way of shareholders’ resolution dated February 16, 2004 and Directors’ resolutions passed on January 16, 2004. Adoption of the Stock Option Plan took effect on March 18, 2004 being the first date of dealings in the ordinary shares.
Summary of the terms of the Stock Option Plan
(a) Purpose of the Stock Option Plan
The purposes of the Stock Option Plan are to attract, retain and motivate employees and Directors of, and other service providers to the Company, to provide a means, on and after the Global Offering, of compensating them through the grant of stock options for their contribution to the Company’s growth and profits, and to allow such employees, Directors and service providers to participate in such growth and profitability.

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(b) Who may join
The Compensation Committee may, at its discretion, invite any employee, officer or other service provider of (including, but not limited to, any professional or other adviser of, or consultant or contractor to) the Company whether located in China, the United States or elsewhere to take up options to subscribe for ordinary shares at a price calculated in accordance with sub-paragraph (e) below. The Compensation Committee may also grant stock options to a Director who is not an employee of the Company (“Non Employee Director”).
(c) Stock Options
Stock options granted under the Stock Option Plan (“Stock Options”) shall entitle a participant (“Participant”) of the Stock Option Plan to purchase a specified number of ordinary shares or ADSs (the “Plan Shares”) during a specified period at a price calculated in accordance with sub-paragraph (e) below. Three types of Stock Options may be granted under the Plan, an Incentive Stock Option, a Non-Qualified Stock Option or a Director Option. An Incentive Stock Option is a stock option that falls within the meaning of Section 422 of the U.S. Internal Revenue Code of 1986 and may only be granted to employees of the Company and its subsidiaries from time to time. A Non-Qualified Stock Option is a stock option that is not an Incentive Stock Option. A Director Option is a Non-Qualified Stock Option granted to a Non-Employee Director.
The Company shall issue an Award Document to each Participant of the Stock Option Plan who is granted a Stock Option. The Award Document shall set out the terms and provisions of the grant of a Stock Option to a Participant including applicable vesting dates or the attainment of specified performance goals (as determined by the Compensation Committee or the Administrator (as defined below), as the case may be) by the Participant. The Company may allow a Participant to exercise his or her Stock Options prior to vesting, provided the Participant agrees to enter into a repurchase agreement in respect of the Stock Option with the Company. The Compensation Committee may also (i) accelerate the vesting of a Stock Option, (ii) set the date on which any Stock Option may first become exercisable, or (iii) extend the period during which a Stock Option remains exercisable, except that no Stock Options may be exercised after the tenth anniversary of the date of grant.
The Stock Option Plan does not provide for any payment upon application or acceptance of an option.
(d) Administration of the Stock Option Plan


The Compensation Committee shall be responsible for the administration of the Stock Option Plan. Its responsibilities include granting Stock Options to eligible individuals, determining the number of Plan Shares subject to each Stock Option, and determining the terms and conditions of each Stock Option.
The Compensation Committee is not obliged to grant Stock Options to Participants in uniform terms. Accordingly, the terms and conditions which may be imposed may vary between Participants. Any determination by the Compensation Committee in relation to the carrying out and administering of the Stock Option Plan shall be final and binding. No member of the Compensation Committee shall be liable for any action or determination made in good faith, and the members of the Compensation Committee shall be entitled to indemnification and reimbursement in the manner provided in the Articles.
The Compensation Committee may delegate some or all of its authority under the Stock Option Plan to an individual or individuals (each an “Administrator”) who may either be one or more of the members of the Committee or one or more of the officers of the Company. An individual’s status as an Administrator shall not affect his or her eligibility to participate in the Stock Option Plan. The Compensation Committee shall not delegate its authority to grant Stock Options to executive officers of the Company.
(e) Exercise Price
The exercise price per Plan Share purchasable under a Stock Option shall be fixed by the Committee at the time of grant or by a method specified by the Compensation Committee at the time of grant, but in no event shall be less than the Fair Market Value of a Plan Share on the date such Stock Option is granted.

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The Fair Market Value of a Share will be the higher of (i) the closing price of the ordinary shares on the HKSE’s daily quotation sheet on the applicable date of grant (which must be a business day), and (ii) the average closing price of the ordinary shares on the HKSE (as stated in the relevant daily quotation sheets of the HKSE) for the five business days immediately preceding the date of grant.
The Fair Market Value of the ADSs shall be the highest of (i) the closing price of the ADSs on the NYSE on the applicable date of grant, and (ii) the average closing price of the ADSs on the NYSE for the five business days immediately preceding the date of grant.
(f) Limit of the Stock Option Plan
The     At the annual general meeting of the shareholders held on June 23, 2010, the shareholders of the Company approved an increase to the number of ordinary shares that may be issuedreserved for issuance under the Stock Option Plan and the ESPP (the “Global Limit”) shall not exceed ten percentfrom 1,317,000,000 ordinary shares of the issued and outstandingCompany to 2,434,667,733 ordinary shares immediately following the closing of the Global Offering (i.e., 1,317,000,000).Company.
The number of ordinary shares which may be issued pursuant to any outstanding Stock Options granted and yet to be exercised under the Stock Option Plan and all outstanding purchase rights granted under the Employee Stock Purchase Plan or other employee stock purchase plan of the Company must not exceed in aggregate 30 percent of the issued and outstanding ordinary shares in issuance from time to time.
(g) Individual Limit


The total number of ordinary shares underlying Stock Options or other options granted by the Company to, and the total number of ordinary shares that may be purchased under one or more purchase rights granted under the Employee Stock Purchase Plan or any other employee stock purchase plan granted by the Company by, a Participant (including both exercised and outstanding Stock Options) in any twelve-month period may not exceed at any time one percent (1%) (or 0.1 percent in the case of an independent Non-executive Director) of the then issued and outstanding ordinary shares unless otherwise allowed under the Listing Rules.
(h) Exercise of Option
A Stock Option shall vest, and be exercised, in accordance with the terms of the Stock Option Plan, the relevant Award Document and any rules and procedures established by the Compensation Committee for this purpose. However, the term of each Stock Option shall not exceed ten years from the date of grant.
(i) Director Options
Each non-employee Director may be granted Stock Options to purchase ordinary shares (or an equivalent of ADSs) on the terms set out in the relevant Award Document.
The Directors shall exercise all authority and responsibility with respect to Stock Options granted to Directors subject to the requirements of the Listing Rules.
All non-employee Directors’ Stock Options shall only vest provided that the Director has remained in service as a Director through such vesting date. The unvested portion of a Stock Option granted to a Director shall be forfeited in full if the Director’s service with the Board ends for any reason prior to the applicable vesting date.
Following termination of a non-employee Director’s service on the Board, such non-employee Director (or his or her estate, personal representative or beneficiary, as the case may be) shall be entitled to exercise those of his or her Stock Options which have vested as of the date of such termination within 120 days following such termination.

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(j) Termination or Lapse of Option
A Stock Option shall terminate or lapse automatically on:
(i) the expiry of ten years from the date of grant;
(ii) the termination of a Participant’s employment or service with the Company for a reason set out in sub-paragraph (l) below;
(iii) save as to any contrary directions of the Compensation Committee, in the event of a complete liquidation or dissolution of the Company, all Stock Options outstanding at the time of the liquidationorliquidation or dissolution shall terminate without further action by any person;
(iv) the sale or other divestiture of a subsidiary, division or operating unit of the Company (where the Participant is employed by such subsidiary, division or operating unit); and


(v) termination of the service relationship with a service provider (where the Participant is a service provider of the Company).
(k) Rights are personal to Participant
A Stock Option is personal to the Participant and shall be exercisable by such Participant or his Permitted Transferee (as defined below) only. An option shall not be transferred other than by will, by the laws of descent and distribution or pursuant to a domestic relations order. The Compensation Committee may also, at its discretion and subject to such terms and conditions as it shall specify, permit the transfer of a Stock Option for no consideration to a Participant’s family members or to a trust or partnership established for the benefit of such family members (collectively “Permitted Transferees”). Any Stock Option transferred to a Permitted Transferee shall be further transferable only by will or the laws of descent and distribution or, for no consideration, to another Permitted Transferee of the Participant.
(l) Termination of employment or service
If a Participant’s employment or service with the Company is terminated for the following reasons:
(i) the failure or refusal of the Participant to substantially perform the duties required of him or her as an employee or officer of, or service provider to, the Company;
(ii) any material violation by the Participant of any law or regulation applicable to any business of the Company, or the Participant’s conviction of, or a plea of nolo contendae to, a felony, or any perpetration by the Participant of a common law fraud against the Company; or
(iii) any other misconduct by the Participant that is materially injurious to the financial condition, business or reputation of the Company,
Then all Stock Options granted to the Participant, whether or not then vested, shall immediately laspe.
The Compensation Committee may permit any Incentive Stock Option to convert into a Non-Qualified Stock Option as of a Participant’s termination of employment for purposes of providing such Participant with the benefit of any extended exercise period applicable to Non-Qualified Stock Options when the contract of employment of the holder of Incentive Stock Option terminates.
(m) Change in control of the Company
The Compensation Committee may specify at or after the date of grant of a Stock Option the effect that a Change in Control (as defined in the Stock Option Plan) will have on such Stock Option. The Compensation Committee may also, in contemplation of a Change in Control, accelerate the vesting, exercisability or payment of Stock Options to a date prior to the Change in Control, if the Compensation Committee determines that such action is necessary or advisable to allow the participants to realise fully the value of their share options in connection with such Change in Control.

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(n) Change in the capital structure of the Company


In the event of an alteration in the capital structure of the Company (which includes a capitalization issue, reduction of capital, consolidation, sub-division of Plan Shares, or rights issue to purchase Plan Shares at a price substantially below market value), the Compensation Committee may equitably adjust the number and kind of Plan Shares authorised for issuance in order to preserve, the benefits or potential benefits intended to be made available under the Stock Option Plan. In addition, upon the occurrence of any of the foregoing events, the number of outstanding Stock Options and the number and kind of shares subject to any outstanding Stock Option and the purchase price per share under any outstanding Stock Option shall be equitably adjusted so as to preserve the benefits or potential benefits intended to be made available to Participants.
(o) Period of the Stock Option Plan
The Stock Option Plan shall remain in force for a period of ten years commencing on the date of Shareholders’ approval of the Plan.
(p) Amendments and Termination
The Stock Option Plan may be altered, amended in whole or in part, suspended and terminated by the Board at any time provided alterations or amendments of a material nature or any change to the terms of the Stock Options granted must be approved by the shareholders of the Company, unless such alteration or amendment takes effect automatically under the terms of the Stock Option Plan. For the avoidance of doubt, any alteration or amendment pursuant to the exercise of any authority granted under the Stock Option Plan shall be deemed to take effect automatically under the terms of the Share Option Plan. Any alteration or amendment must be in accordance with the requirements of the Listing Rules or permitted by the HKSE.
If the Stock Option Plan is terminated early by the Board, no further Stock Options may be offered but unless otherwise stated in the Plan, Stock Options granted before such termination shall continue to be valid and exercisable in accordance with the Stock Option Plan.
(q) Voting and dividend rights
No voting rights shall be exercisable and no dividends shall be payable in relation to Stock Options that have not been exercised.
(r) Cancellation of Stock Options
Stock Options granted but not exercised may not be cancelled unless an offer to cancel share options has been made pursuant to Rule 13 of the Hong Kong Code on Takeovers and Mergers and the Hong Kong Securities and Futures commission has consented to such cancellation.
(s) Ranking of Ordinary Shares
The ordinary shares to be allotted upon the exercise of a Stock Option will be subject to the Articles for the time being in force and will rank pari passu with the Plan Shares in issue on the date of such allotment.
Employee Stock Purchase Plan

 

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The following is a summary of the principal terms of the ESPP conditionally adopted by the Company by way of shareholders’ resolutions dated February 16, 2004 and Directors’ resolutions passed on January 16, 2004.
Summary of the terms of the ESPP
(a) Purposes of the ESPP
The purposes of the ESPP are to attract, retain and motivate employees of the Company, to provide a means of compensating the employees for their contributions to the growth and profitability by permitting such employees to purchase the ADSs of the Company at a discount and receive favourable U.S. income tax treatment on a subsequent qualifying disposition of such ADSs.
(b) Who may join
Subject to any contrary directions given by the Compensation Committee, all full-time and regular parttime employees (the “Employees”) of the Company as at the first business day (the “Offering Date”) of a given period specified by the Committee (the “Offering Period”) shall be eligible to enroll in the ESPP. To be eligible to purchase ADSs, all Employees must maintain his or her employment status, without interruption, with the Company through the last day of each Offering Period (the “Purchase Date”)
(c) Offering Period
The ESPP shall be implemented by a series of Offering Periods. An eligible Employee of the Company may elect to participate in the ESPP for any Offering Period by completing the requisite documents. The Compensation Committee shall determine the starting and ending dates of each Offering Period but no Offering Period shall be shorter than 6 months or longer than 27 months.
(d) Employees’ Contributions under the ESPP
All amounts that a Participant contributes (“Contributions”) shall be credited to his or her account under the ESPP. Participants must elect to have payroll deductions made on each payday during the Offering Period in a dollar amount specified in the documents submitted by him or by her. The Compensation Committee may permit Participants to make supplemental Contributions into his or her account, on such terms and subject to such limitations as the Compensation Committee may decide. Participants may, on one occasion only during an Offering Period, decrease the rate of his or her Contributions to his or her account for the Offering Period, including a decrease to zero. The Participant may restore his or her Contributions to the original level, prior to the earlier of,
(i) six months after the effective date of any such decrease; and
(ii) the end of the relevant Offering Period.
(e) Grant of Purchase Right
Each eligible Employee who elects to participate in the ESPP in any given Offering Period shall be granted on the Purchase Date, a right to purchase the Plan Shares (the “Purchase Right”). The Purchase Right of a Participant shall be calculated in accordance with the following formula:


(i) dividing (A) the product of US$25,000 and the number of calendar years during all or part of which the Purchase Right shall be outstanding by (B) the closing price of the Plan Shares on the applicable exchange on which Plan Shares are trading (the “Fair Market Value”) on the applicable exchange of the Plan Shares on the Offering Date; and
(ii) subtracting from the quotient thereof (A) the number of Plan Shares that the Employee has purchased during the calendar year in which the Offering Date occurs under the ESPP or under any other employee stock purchase plan of the Company or any subsidiary of the Company which is intended to qualify under Section 423 of the U.S. International Revenue Code of 1986 plus (B) the number of Plan Shares subject on the Offering Date to any outstanding Purchase Rights granted to the Employee under any related Plan.
If application of the above formula would result in the grant of Purchase Rights covering, in the aggregate, more than the number of Plan Shares that the Compensation Committee has made available for the relevant Offering Period, then the Compensation Committee shall adjust the number of Plan Shares subject to the Purchase Right in order that, following such adjustment, the aggregate number of Plan Shares subject to the purchase Right shall remain within the applicable limit.

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All Purchase Rights outstanding at the tenth anniversary of the Plan shall remain outstanding through and may be exercised upon the relevant Purchase Date, but no additional Purchase Right shall be granted under the ESPP.
(f) Exercise of Purchase Right
Unless a Participant withdraws from the ESPP, his or her Purchase Right shall become exercisable automatically, on the Purchase Date of the relevant Offering Period for the number of Plan Shares obtained by dividing the accumulated Contributions credited to the Participant’s account as of the Purchase Date by the applicable Purchase Price, being an amount not less than 85 percent of the Fair Market Value of the Plan Shares on the Offering Date or on the Purchase Date, whichever is lower (the “Purchase Price”).
The Compensation Committee may credit any Contributions that have been credited to a Participant’s account under the ESPP with interest. Any interest credited to a Participant’s account shall not be used to purchase ADSs and shall instead be paid to the Participant at the end of the relevant Offering Period.
If any portion of a Participant’s accumulated Contributions is not used to purchase ordinary shares on a given Purchase Date, the remaining amount shall be held in the Participant’s account and used for the purchase of Plan Shares under the next Offering Period, unless the Participant withdraws from the next Offering Period.
The exercise of the Purchase Right granted under the ESPP is not subject to any performance target.
(g) Limit of the ESPP
The number of ordinary shares that may be issued under the Stock Option Plan and the ESPP (the “Global Limit”) shall not exceed ten percent of the issued and outstanding ordinary shares immediately following the closing of the Global Offering (i.e., 1,317,000,000).
The number of ordinary shares that may be issued upon exercise of all outstanding Purchase Rights granted under the ESPP or other employee stock purchase plan of the Company or and any outstanding stock options granted under the Stock Option Plan


or other stock option plan of the Company must not exceed, in the aggregate, thirty percent of the issued and outstanding ordinary shares in issuance from time to time.
(h) Period of the ESPP
The ESPP shall continue for a term of ten years from the date of its approval by the Shareholders unless terminated in accordance with sub-paragraph (i).
(i) Amendments and Termination of the ESPP
The Compensation Committee may at any time amend the ESPP in any respect or terminate the ESPP, except that, without the approval of the Company’s shareholders at a meeting duly called, no amendment shall be made in relation to:
(i) increasing the number of ADSs approved for the ESPP; or
(ii) decreasing the Purchase Price per ADSs.
Any alterations or amendments of a material nature or any change to the terms of the Purchase Rights granted must be approved by the shareholders of the Company, unless such alteration or amendment takes effect automatically under the terms of the ESPP. For the avoidance of doubt, any alteration or amendment pursuant to the exercise of any authority granted under the ESPP shall be deemed to take effect automatically under the terms of the ESPP. Any amendment made to the ESPP must be in accordance with the requirements of the Listing Rules or permitted by the SEHK.

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If the ESPP is terminated by the Board prior to the tenth anniversary of the date of Board approval, unless the Compensation Committee has also terminated any Offering Period then in progress, Purchase Rights granted before such termination shall continue to be valid and exercisable in accordance with, and subject to, the terms and conditions of the Plan.
Rule 17.03(9) of the Listing Rules provide that the exercise price of any share option scheme operated by listed issuers may not be lower than effectively the market price of the ordinary shares. As a result of the capital-intensive nature of the Company’s business, we have traditionally relied on share options, rather than cash, as an important means of remunerating its employees. This is common in the industry and we wish to continue this practice. Accordingly, we have applied to and obtained from the SEHK a waiver from strict compliance with Rule 17.03(9) of the Listing Rules such that the Company is allowed to continue to grant options over its ADSs to its employees under the ESPP at an exercise price which is at a discount (up to 15 percent discount) to the lower of market price at the commencement of the offering period or the market price on the purchase date.
Up and until December 31, 2008,2010, the Company has not granted any purchase right under the ESPP.


Item 7. Major Shareholders and Related Party Transactions
Major Shareholders
A. Ordinary Shares
The following table sets forth information regarding the beneficial ownership as of December 31, 20082010 of our ordinary shares, by each shareholder who is known by us to beneficially own 5% or more of our outstanding ordinary shares as of such date.
         
  Number of  Percentage 
Name of Shareholder Shares Held  Held 
Shanghai Industrial Investment (Holdings)        
Company Limited (“SIIC”)  420,008,000(1)  1.88%
         
   1,833,269,340(2)  8.21%
         
Total:  2,253,277,340   10.09%
         
Datang Telecom Technology & Industry Holdings Co., Ltd.  3,699,094,300(3)  16.57%
Donald Smith & Co., Inc.  1,326,812,150(4)  5.94%
                         
  2010 2009 2008
  Number of Share     Number of Share     Number of Share  
Name of Shareholder Held Percentage Held Held Percentage Held Held Percentage Held
Datang Telecom Technology & Industry Holdings Co., Ltd. (“Datang”)  5,227,132,761(1)  19.12%  3,699,094,300  16.53%  3,699,094,300   16.57%
                         
Shanghai Industrial Investment  310,008,000(2)  1.13%  420,008,000  1.88%  420,008,000   1.88%
(Holdings) Company Limited (“SIIC”)  1,833,269,340(3)  6.71%  1,833,269,340  8.19%  1,833,269,340   8.21%
                         
Total  2,143,277,340   7.84%  2,253,277,340   10.07%  2,253,277,340   10.09%
                         
Taiwan Semiconductor Manufacturing  1,789,493,218   6.55%                
Company Limited (“TSMC”)  707,899,976   2.59%                
                         
Total  2,497,393,194   9.14%                
                         
Notes:
 
(1)All such ordinary shares are held by SIIC Treasury (B.V.I.) Limited which is a wholly-owned subsidiary of SIIC. The voting rights of such shares are vested in Shanghai Industrial Holdings Limited (“SIHL”),
(2)All such shares are held by S.I. Technology Production Holdings Limited (“SITPHL”) which is a wholly-owned subsidiary of SIHL. SIHL is an indirect non-wholly owned subsidiary of SIIC which is holding SIHL’s shares through its subsidiaries, which together are entitled to exercise or control the exercise of more than one-third of the voting power at the general meetings of SIHL. By virtue of Part XV of the Securities and Futures Ordinance (Cap. 571 of the laws of Hong Kong), SIIC and its subsidiaries namely, Shanghai Investment Holdings Limited and Shanghai Industrial Investment Treasury Company Limited are deemed to be interested in the 1,833,269,340 Shares held by SITPHL. The Company’s Director as at December 31, 2008, Wang Zheng Gang, is the Chief Representative of the Shanghai Representative Office of SIHL and the chairman of SIIC Management (Shanghai) Limited. It is the Company’s understanding that voting and investment control over the Ordinary Shares beneficially owned by SIHL are maintained by the board of directors of SIHL.
(3) All such shares are held by Datang Holdings (Hongkong) Investment Company Limited which is a wholly-owned subsidiary of Datang Telecom Technology & Industry Holdings Co., Ltd.
(2)All such ordinary shares are held by SIIC Treasury (B.V.I.) Limited which is a wholly-owned subsidiary of SIIC.
(3)All such shares were purchased onare held by S.I. Technology Production Holdings Limited (“SITPHL”) which is an indirect wholly-owned subsidiary of SIIC. SITPHL is a wholly-owned subsidiary of Shanghai Industrial Financial (Holdings) Company Limited (“SIFHCL”) which in turn is a wholly-owned subsidiary of Shanghai Industrial Financial Holdings Limited (“SIFHL”). By virtue of Part XV of the Securities and Futures Ordinance (Cap. 571 of the laws of Hong Kong), SIIC and its subsidiaries, SIFHCL and SIFHL are deemed to be interested in the 1,833,269,340 Shares held by SITPHL. As at December 24, 2008 pursuant to31, 2010, our director, Zhou Jie, is an executive director and the Share Purchase Agreement dated November 6, 2008 between usexecutive vice president of SIIC. He is also an executive director and Datang Telecom Technology & Industrythe executive deputy CEO of Shanghai Industrial Holdings Co., Ltd.Limited. It is the Company’s understanding that voting and investment control over the ordinary shares beneficially owned by SIIC are maintained by the board of directors of SIIC.
 
(4) AccordingOn November 9, 2009, the Company entered into a share and warrant issuance agreement with TSMC whereupon the Company conditionally agreed, subject to receipt of required government and regulatory approvals, to issue to TSMC 1,789,493,218 ordinary shares and a warrant (exercisable within three years of issuance) to subscribe for 695,914,030 ordinary shares of SMIC, subject to adjustment, at a purchase price of HK$1.30 per share (the “Warrant”). The 1,789,493,218 ordinary shares and the Warrant were issued to TSMC on July 5, 2010, pursuant to the share and warrant issuance agreement. As of December 31, 2010, the Schedule 13G filed with the SEC on February 11, 2009 by Donald Smith & Co., Inc., all suchnumber of ordinary shares are owned by advisory clients of Donald Smith & Co., Inc., no one of which,deliverable to the knowledge of Donald Smith & Co., Inc. owns more than 5%TSMC upon exercise of the class. 1,326,812,150 ordinary shares were held inWarrant was adjusted to 707,899,976. TSMC has not exercised any part of the form of 26,536,243 ADSs. Each ADS represents 50 ordinary shares.Warrant.

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     Please see “Item 10. Additional Information — Other Contracts” for a description of the share and warrant issuance agreement and the warrant agreement entered into by us and TSMC.


Each ordinary share is entitled to one vote on all matters upon which the ordinary shares are entitled to vote, including the election of directors. No shareholder has voting rights that are different from those of other shareholders.
B. Preferred Shares
     The following table sets forth information regarding the beneficial ownership as of June 7, 2011 of our convertible preferred shares, by each shareholder who is known by us to beneficially own 5% or more of our outstanding preferred shares as of such date.
         
Name of Shareholder Number of Convertible
Preferred Share Held
 Percentage Held
China Investment Corporation  360,589,053(1)    
   72,117,810(1)    
Total
  432,706,863(2)  100%
Note:
(1)On April 18, 2011, the Company entered into a subscription agreement with Country Hill Limited, a wholly-owned subsidiary of China Investment Corporation, or CIC, whereby (i) the Company has conditionally agreed to allot and issue to CIC, and CIC has conditionally agreed to subscribe through Country Hill Limited for 360,589,053 convertible preferred shares at a subscription price of HK$5.39 per convertible preferred share (the “CIC Initial Preferred Shares”) and (ii) the Company will issue a warrant to CIC to subscribe, in aggregate, up to 72,117,810 convertible preferred shares (subject to adjustment) at an exercise price of HK$5.39 per preferred share (the “CIC Warrant”). The CIC Warrant is exercisable [please fill in under what conditions and/or when the CIC Warrant is exercisable]. The 360,589,053 convertible preferred shares and CIC Warrant were issued to CIC on June 3, 2011. CIC has not exercised any part of the CIC Warrant.
(2)Besides the CIC Initial Preferred Shares and CIC Warrant held by Country Hill Limited, CIC also beneficially owns in 13,637,000 ordinary shares which is not reflected in the table above.
     The terms related to the conversion of the convertible preferred shares (as set out in Appendix III to the shareholders’ circular of the Company dated May 11, 2011) are set out below:
     The holders of the convertible preferred shares will have the right at any time to convert (in whole or in part) their convertible preferred shares into fully paid ordinary shares at the conversion rate of ten ordinary shares per convertible preferred share (which shall be for a minimum amount of 70,000,000 convertible preferred shares or, if less than 70,000,000 convertible preferred shares are then held by CIC, all of such convertible preferred shares). The holders of the convertible preferred shares are not required to pay any amount for conversion of their convertible preferred shares into ordinary shares. The ordinary shares issued upon conversion will be credited as fully paid, and will rank pari passu in all respects with the other ordinary shares in issue as at the date of the conversion, and will be allotted and issued free from all liens, charges and encumbrances and together with all rights attaching thereto upon allotment and issue and at any time thereafter, including all rights to any dividend or other distribution declared, made or payable by reference to a record date falling on or after the date of the conversion notice.
     The convertible preferred shares will be mandatorily converted into ordinary shares at the then applicable conversion rate on the day immediately following the expiry of twelve months commencing from the closing date as if the holder of the convertible preferred shares has elected to convert its convertible preferred shares into ordinary shares on the mandatory conversion date.
     The initial conversion rate of ten ordinary shares per convertible preferred share is subject to adjustment upon the occurrence of certain prescribed events, among other things, capitalisation of profits or reserves, consolidations, sub-divisions and re-classifications of shares, capital distributions, issue of shares or other securities, and the issue of a new class of shares carrying voting rights.
     In the event of any issue of any ordinary share or any securities which by their terms are convertible into or exchangeable for, or carry right(s) of subscription for, any ordinary share, the conversion rate in force immediately before such issue will be adjusted to compensate the holders of convertible preferred shares by reference to the lowest of:
     (i) the reference price per ordinary share which initially is HK$0.5390 (subject to adjustment as described in this section);
     (ii) the amount which represents:
     a. in respect of any rights issue of ordinary shares by the Company, 90% of the relevant theoretical ex-rights price for an ordinary share under that rights issue;
     b. in respect of any issue of securities which by their terms are convertible into or exchangeable for, or carry right(s) of subscription for, ordinary share(s):
     (1) in the case of options, warrants or similar instruments, the aggregate of the subscription price or premium for such instrument and the initial exercise price at which the holder of such instrument may subscribe for ordinary shares;
     (2) in the case of convertible bonds or convertible shares or similar instruments, the initial conversion price at which such instrument may be converted into ordinary             shares; or
     (3) in any other case, the aggregate price paid and initially payable by the subscriber of such securities in order to receive ordinary shares; and
     c. in respect of any other issue of ordinary shares by the Company, the relevant issue price for an ordinary share under that issue;
     (iii) the amount which represents a discount of 10% to the arithmetic average of the daily volume weighted average price for an ordinary share as shown on the VAP page of Bloomberg for the:
     a. ten consecutive trading days immediately after the date on which the relevant issue is announced;
     b. in the case of a rights issue, ten consecutive trading days immediately after the ex-rights date; or
     c. if the reference price to determine the issue price is based on share prices for a period after the relevant issue is announced, all the trading days during that period.
     The adjustment will become effective immediately following the date of the issuance of the new securities.
     No adjustment to the conversion rate will be made which has the effect or result of: (i) reducing the initial conversion rate upon the issue of the convertible preferred shares, except upon any consolidation of ordinary shares or any corporate exercise with the effect of increasing the nominal value of the ordinary shares; or (ii) any ordinary share, upon conversion, falling to be issued at a price below the nominal value of the ordinary share.
     Please see “Item 10. Additional Information — Material Contracts” for further description of the subscription agreement with Country Hill Limited dated April 18, 2011.
     On May 5, 2011, the Company entered into a subscription agreement with Datang Holdings (Hongkong) Investment Company Limited, a wholly-owned subsidiary of Datang Telecom Technology & Industry Holdings Co., Ltd., or Datang, in respect of the pre-emptive subscription of convertible preferred shares and warrants. Please refer to the section entitled “Datang Further Subscription Agreement” under this Item 7 for a description of the subscription agreement entered into by us and Datang and the warrant agreement to be entered into between us and Datang. Each of the convertible preferred shares issued to Country Hill Limited and to be issued to Datang Holdings (Hongkong) Investment Company Limited (subject to required government and regulatory approvals) pursuant to the abovementioned subscription agreements is entitled to one vote on all matters upon which the ordinary shares are entitled to vote, including the election of directors, as if the convertible preferred shares were converted into ordinary shares. No shareholder has voting rights that are different from those of other shareholders.


As of December 31, 2008, 22,327,784,8272010, 27,334,063,747 ordinary shares (inclusive of 63,087,19144,597,759 ADS shares) of our company were outstanding. Of these ordinary shares, 3,154,359,5502,229,887,950 shares were registered in the name of HSBC Nominees (Hong Kong) Limited,DBS Ltd. Hong Kong Branch, on behalf of J.P. Morgan Chase Bank, the depositary under the deposit agreement. J.P. Morgan has advised us that, as of December 31, 2008,2010, these 63,087,19144,597,759 ADSs, representing 3,154,3595502,229,887,950 ordinary shares, were held of record by eighteleven U.S. persons.registered holders. We have no further information as to shares held or beneficially owned by U.S. persons. Each ADS represents 50 ordinary shares.
We do not believe that we are directly or indirectly owned or controlled by another corporation, by any foreign government or by any other natural or legal person severally or jointly.
Related Party Transactions
The following disclosure is for the purpose of fulfilling disclosure requirements pursuant to the Rules Governing the Listing of Securities on the HKSE (the “HK Listing Rules”) and the rules and regulations promulgated pursuant to the U.S. Securities and Exchange Act of 1934, as amended, only, and may contain disclosure of related party transactions not required to be disclosed in our financial statements under U.S. GAAP. This section is not applicable under U.S. GAAP since it is not related to financial data.
Indemnification Agreements and Service Contracts
Indemnification Agreements. Article 156 of our Articles of Association provides (amongst others) that we may indemnify any person who is made a party to any action, suit or proceeding by reason of the fact that the person is or was our director, officer, employee or agent, or is or was serving at our request as our director, officer, employee or agent at another entity, subject to certain limitations and applicable conditions.
We recognize the substantial increase in corporate litigation in general, subjecting directors, officers, employees, agents and fiduciaries to expensive litigation risks. We desire to attract and retain the services of highly qualified individuals to serve the company and, in part, in order to induce such individuals to continue to provide services to the company, we wish to provide for the indemnification and advancing of expenses of its directors as permitted by law and applicable regulations.
Original Indemnification Agreements. On or around March 18, 2004, upon completion of the Global Offering, we entered into identical indemnification agreements with each director whose appointment as director took effect immediately upon the Global Offering, whom we refer to as the Global Offering Directors, whereby we agreed to,inter alia, indemnify our Global Offering Directors in respect of liability arising from their capacity as our directors. We refer to these indemnification agreements as, collectively, the ‘Original Indemnification Agreements. Pursuant to the Original Indemnification Agreements, we were obliged to indemnify each Global Offering Director, to the fullest extent permitted by law, against all costs, charges, expenses, liabilities, losses and obligations incurred in connection with any threatened, pending or completed action, suit, proceeding or alternative dispute resolution mechanism, or any hearing, inquiry or investigation which might lead to any of the foregoing (an ''Applicable Claim’’) by reason of or arising out of any event or occurrence relating to the fact that he is or was a director of SMIC, or any of our subsidiaries, or is or was serving at our request at another corporation or enterprise, or by reason of any activity or inactivity while serving in such capacity(an ''Indemnifiable Event’’). Our obligation to indemnify our Global Offering Directors pursuant to the Original Indemnification Agreements was subject to certain exceptions and limitations set out therein.
a.Original Indemnification Agreements.

 

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New Indemnification Agreements; Service Contracts. At the annual general meeting of our shareholders on May 6, 2005, our shareholders, other than our directors, chief executive officer and their respective Associates (as defined in the HK Listing Rules) approved an amendment to the form of the Original Indemnification Agreements. As amended, we refer to the new form of Indemnification Agreements as the “New Indemnification Agreements. The New Indemnification Agreements executed by each of the directors superseded the Original Indemnification Agreements which we had previously entered into with any existing directors. The New Indemnification Agreement reflected the then new requirements under Rules 14A.35 of the HK Listing Rules to set a term of no longer than three years and a maximum aggregate annual value for each connected transaction (as defined under the HK Listing Rules). The terms of the New Indemnification Agreements were the same as the Original Indemnification Agreements, except that the New Indemnification Agreements were subject to a term of three years and an annual cap. The annual cap in relation to the New Indemnification Agreements was not to exceed a maximum aggregate annual value as disclosed in our previous announcement. For the year ended December 31, 2008, no payment was made to any director under the New Indemnification Agreements.
On or around March 18, 2004, upon completion of the Global Offering, we entered into identical indemnification agreements with each director whose appointment as director took effect immediately upon the Global Offering, whom we refer to as the Global Offering Directors, whereby we agreed to, inter alia, indemnify our Global Offering Directors in respect of liability arising from their capacity as our directors. We refer to these indemnification agreements as, collectively, the Original Indemnification Agreements. Pursuant to the Original Indemnification Agreements, we were obliged to indemnify each Global Offering Director, to the fullest extent permitted by law, against all costs, charges, expenses, liabilities, losses and obligations incurred in connection with any threatened, pending or completed action, suit, proceeding or alternative dispute resolution mechanism, or any hearing, inquiry or investigation which might lead to any of the foregoing (an “Applicable Claim”) by reason of or arising out of any event or occurrence relating to the fact that he is or was a director of SMIC, or any of our subsidiaries, or is or was serving at our request at another corporation or enterprise, or by reason of any activity or inactivity while serving in such capacity (an “Indemnifiable Event”). Our obligation to indemnify our Global Offering Directors pursuant to the Original Indemnification Agreements was subject to certain exceptions and limitations set out therein.
b.New Indemnification Agreements; Service Contracts. At the annual general meeting of our shareholders on May 6, 2005, our shareholders, other than our directors, chief executive officer and their respective Associates (as defined in the HK Listing Rules) approved an amendment to the form of the Original Indemnification Agreements. As amended, we refer to the new form of Indemnification Agreements as the “New Indemnification Agreements. The New Indemnification Agreements executed by each of the directors superseded the Original Indemnification Agreements which we had previously entered into with any existing directors. The New Indemnification Agreement reflected the then new requirements under Rules 14A.35 of the HK Listing Rules to set a term of no longer than three years and a maximum aggregate annual value for each connected transaction (as defined under the HK Listing Rules). The terms of the New Indemnification Agreements were the same as the Original Indemnification Agreements, except that the New Indemnification Agreements were subject to a term of three years and an annual cap. The annual cap in relation to the New Indemnification Agreements was not to exceed a maximum aggregate annual value as disclosed in our previous announcement. For the year ended December 31, 2009, no payment was made to any director under the New Indemnification Agreements.
Service Contracts. The New Indemnification Agreements remained in effect until the entering into between us and our directors of amended service contracts between October 7, 2008 and November 25, 2009 which include indemnity provisions. Each of our executive officers also signed service contracts between October 7, 2008 and April 13, 2009 which include indemnity provisions. Five of our directors signed the amended service contracts in 2008, and the remaining directors signed the amended service contracts in 2009. Each of our executive officers also signed service contracts which include indemnity provisions in 2008 and 2009. We refer to the service contracts we have entered into with each of our directors and executive officers collectively as the Service Contracts. The indemnification provisions contained in the Service Contracts are substantially the same as the terms of the New Indemnification Agreements, except that the Service Contracts are not subject to a maximum term or to an annual cap. The indemnification provisions set forth in the Services Contracts will continue in effect with respect to Applicable Claims relating to Indemnifiable Events regardless of whether the relevant director or executive officer continues to serve as our director or executive officer or to serve at any other enterprise at our request. Except for these indemnification provisions, the Service Contracts do not provide for benefits upon termination of service or employment.
Strategic Cooperation Agreement
On December 24, 2008, upon completion of thea Share Purchase Agreement pursuant to which Datang conditionally agreed to subscribe through Datang Holdings (Hongkong) Investment Company Limited, or Datang Hongkong, a Hong Kong incorporated wholly owned subsidiary, and the Company conditionally agreed to allot and issue, shares representing 19.9% of the issued share capital of the Company prior to such issuance and approximately 16.6% following such issuance at a total purchase price of US$171.8 million, the Company and Datang entered into a strategic cooperation agreement (the “Strategic Cooperation Agreement”).
Pursuant to the Strategic Cooperation Agreement, the Company intends to give priority to the production requirements of Datang, while Datang intends to give priority to engage or employ the fabrication services of the Group. In addition, the Company and Datang would share their technological research and development resources, co-operate in the development of international markets and globalization of their businesses, and make joint efforts to apply for PRC national and local projects in connection with scientific research and industrialization relating to the integrated circuit sector.
The pricing for the transactions contemplated under the Strategic Cooperation Agreement will be determined based on market value. The Proposed Cap for the period commencing December 24, 2008 and ending on the day on which the Company’s next annual general meeting will be held is US$100 million, which representsCaps, being the maximum revenue expected to be generated by the Company from these transactions during such period.
For the year ended December 31, 2008, noaggregate values of transactions under the Strategic Cooperation Agreement, are US$50,000,000 for the period commencing on June 23, 2009 and ending on December 31, 2009, and US$100,000,000 for the period commencing on January 1, 2010 and ending on December 23, 2010, respectively, were approved by the shareholders of the Company at its annual general meeting held on June 23, 2009.
Datang Subscription Agreement (2010)
     On July 15, 2010, the completion of the placing of 1,500,000,000 new ordinary shares at the placing price of HK$0.52 per share to not fewer than six independent placees through J.P. Morgan Securities (Asia Pacific) Limited and The Royal Bank of Scotland N.V., Hong Kong Branch as the placing agents (the “Placing”) took place. Pursuant to the share purchase agreement entered into between the Company and Datang dated 6 November 2008 relating to the sale and purchase of an aggregate of 3,699,094,300 ordinary shares of the Company (the “Datang Share Purchase Agreement”), Datang has a right of pre-emption to subscribe for a pro rata portion of shares which is equivalent to such number of shares as will result in its percentage shareholding in the Company not being diluted by the Placing.
     On August 16, 2010, the Company entered into a subscription agreement with Datang (“Datang Subscription Agreement”) pursuant to which the Company conditionally agreed to issue, and Datang conditionally agreed to subscribe (through Datang Hongkong) for, a total of 1,528,038,461 ordinary shares (being equivalent to the sum of (i) the amount of shares issued to Datang pursuant to the exercise of its pre-emptive right under the Datang Share Purchase Agreement in connection with the Placing as will result in Datang’s percentage shareholding in the Company not being diluted by the Placing (the “Datang Pre-emptive Shares”) and (ii) the number of new shares, which, together with the Datang Pre-emptive Shares, will fetch an aggregate purchase price of US$102 million) at the subscription price of HK$0.52 per share (being equivalent to the subscription price in the Placing). The completion took place on November 16, 2010, when 1,528,038,461 ordinary shares were issued to Datang under the special mandate approved by the Company’s independent shareholders at its extraordinary general meeting held on September 21, 2010.
     Please see the section entitled “Material Contract” under Item 10 below for further details of the Datang Subscription Agreement.
Datang Further Subscription Agreement (2011)
     On April 18, 2011, the Company entered into a subscription agreement with Country Hill Limited, a wholly owned subsidiary of China Investment Corporation, in connection with the subscription of (i) 360,589,053 Convertible Preferred Shares and (ii) warrants to subscribe for up to 72,117,810 Convertible Preferred Shares (subject to adjustment). The terms of the Convertible Preferred Shares (as set out in Appendix III to the shareholders’ circular of the Company dated May 11, 2011) are set out in “Item 7. Major Shareholders and Related Party Transactions — B. Preferred Shares”.
     Please see “Item 10. Additional Information — Material Contracts” for further details about the subscription agreement with Country Hill Limited.
     On May 5, 2011, the Company entered into a subscription agreement with Datang Hongkong (the “Datang Further Subscription Agreement”) whereby the Company has conditionally agreed to allot and issue to Datang Hongkong, and Datang Hongkong has conditionally agreed to subscribe for (i) 84,956,858 Convertible Preferred Sharesat a subscription price of HK$5.39 per share (“Datang Pre-emptive Preferred Shares”) and (ii) warrants to subscribe for up to 16,991,371 Convertible Preferred Shares (subject to adjustment) at an exercise price of HK$5.39 per warrant (“Datang Pre-emptive Warrants”) pursuant to Datang’s exercise of its pre-emptive right under the Datang Share Purchase Agreement in connection with the subscription by Country Hill Limited, on the same terms and conditions as reasonably practicable as the subscription of Convertible Preferred Shares by Country Hill Limited, taking into account the fact that Datang is already an existing shareholder of the Company. The issue of Datang Pre-emptive Preferred Shares and Datang Pre-emptive Warrants is conditional on the obtaining of the approval of independent shareholders of the Company and necessary governmental approvals. The Company has obtained independent shareholders’ approval at its extraordinary general meeting held on May 27, 2011. As of the latest practicable date, the Datang Pre-emptive Preferred Shares and Datang Pre-emptive Warrants have not been issued.
     Please see the section entitled “Material Contract” under Item 10 below for further details of the Datang Further Subscription Agreement.
     Pursuant to the share and warrant issuance agreement dated 9 November 2009 between Datangthe Company and Taiwan Semiconductor Manufacturing Company, Ltd. (“TSMC”) (the “TSMC Share and Warrant Issuance Agreement”), in case of any issue of new shares or warrants, subject to certain exceptions, TSMC has a pre-emptive right to purchase a pro rata portion of the new shares and warrants being issued equivalent to the percentage of the issued share capital of the Company then owned by TSMC prior to the issue of the new shares and warrants. The Company has notified TSMC in accordance with the terms of the TSMC Share and Warrant Issuance Agreement in connection with the subscription by Convertible Preferred Shares and warrants by Country Hill Limited. TSMC has notified the Company that it will not exercise its pre-emption rights in respect of the subscription by Convertible Preferred Shares and warrants by Country Hill Limited and the Company (or any of its subsidiaries).proposed subscription Datang.


Item 8. Financial Information

Consolidated Statements and Other Financial Information
Please see “Item 18. Financial Statements.”
See “Item 4—4 — Information on the Company-Business Overview-CustomersCompany — Business Overview — Customers and Markets” regarding the percentage of our sales which are exported from China.
Litigation
As is the case with many companies in the semiconductor industry, we have received from time to time communications from third parties asserting that our technologies, fabrication processes, design of the semiconductors made by us or use by our customers of semiconductors made by us may infringe upon patents or other intellectual property rights of others. Irrespective of the validity of such claims, we could incur significant costs in the defense thereof or could suffer adverse effects on our operations.
Beginning in December 2003, through August 2004, the Company became subject to several lawsuits brought by Taiwan Semiconductor Manufacturing Company, Limited (“TSMC”) relating to allegedalleging infringement of certain patents and misappropriation of alleged trade secrets relating to methods for conducting semiconductor fab operations and manufacturing integrated circuits.
On January 30, 2005, the Company and TSMC exchanged signature pages later attached toentered into a settlement agreement. Terms were added to the document subsequent to the exchange of signatures. The identification of the exact terms of the agreement, were determined at a preliminary trial in 2009, as described below under “Recent TSMC Legal Developments.” As found by the California Superior Court, SMIC and TSMC agreed, without admission of liability, to dismisswhich provided for the dismissal of all pending legal actions without prejudice between the two companies (the “Settlement“2005 Settlement Agreement”). The terms of the Settlement Agreement also were determined to include the following:
1) The Company and TSMC agreed to cross-license each other’s patent portfolio for all semiconductor device products, effective from January 2005 through December 2010.

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2) TSMC covenanted not to sue the Company for trade secret misappropriation as alleged in TSMC’s legal actions as it related to .15μm and larger processes subject to certain conditions (“TSMC Covenant”). The TSMC Covenant did not cover .13μm and smaller technologies after 6 months following execution of the Settlement Agreement (July 31, 2005). Excluding the .13μm and smaller technologies, the TSMC Covenant remains in effect indefinitely, terminable upon a breach by the Company.
3) The Company is required to deposit certain Company materials relating to .13μm and smaller technologies into an escrow account until December 31, 2006 or under certain circumstances for a longer period of time.
4) The Company agreed to pay TSMC an aggregate of $175 million in installments over a period of $30 millionsix years.
In accounting for eachthe 2005 Settlement Agreement, the Company determined that there were several components — settlement of litigation, covenant not to sue, patents licensed by the first five yearsCompany to TSMC and $25 million in the sixth year.use of TSMC’s patent license portfolio both prior and subsequent to the settlement date. The Company hasdoes not believe that the settlement of litigation, covenant not to date made all scheduled paymentssue or patents licensed by the Company to TSMC qualify as set forth in the Settlement Agreement.”assets under US GAAP.
The Company believesdetermined that the Court’s ruling is erroneous.use of TSMC’s patent license portfolio prior and subsequent to the 2005 Settlement Agreement date qualify for assets under US GAAP. $16.7 million was allocated to the pre-2005 Settlement Agreement period, reflecting the amount that the Company would have paid for use of the patent license portfolio prior to the date of the 2005 Settlement Agreement. The ruling may be appealed by SMIC followingremaining $141.3 million, representing the filingrelative fair value of the licensed patent license portfolio, was recorded on the Company’s consolidated balance sheets as a final judgment bydeferred cost (“Deferred Cost”) and was amortized over a six-year period, which represents the Court in this matter.
Recent TSMC Legal Developments:life of the licensed patent license portfolio.
On August 25, 2006, TSMC filed a lawsuit against the Company and certain subsidiaries namely(SMIC Shanghai, SMIC (Shanghai), SMIC (Beijing)Beijing and SMIC (Americas)Americas) in the Superior Court of the State of California, County of Alameda for alleged breach of a settlement agreement,the 2005 Settlement Agreement, alleged breach of promissory notes related to the 2005 Settlement Agreement and alleged trade secret misappropriation by the Company. TSMC seeks, among other things, damages, injunctive relief, attorneys’ fees, and the acceleration of the remaining payments outstanding under that settlement agreement.
In the present litigation, TSMC alleges that the Company has incorporated TSMC trade secrets in the manufacture of the Company’s 0.13 micron or smaller process products. TSMC further alleges that as a result of this claimed breach, TSMC’s patent license is terminated and the covenant not to sue is no longer in effect with respect to the Company’s larger process products. The Company has vigorously denied all allegations of misappropriation. The Court has made no finding that TSMC’s claims are valid. The Court has set a trial date of September 8, 2009.
On September 13, 2006, the Company announced that in addition to filing a response strongly denying the allegations offiled counterclaims against TSMC in the United States lawsuit, itsame court in September 2006 and also filed on September 12, 2006, a cross-complaintsuit against TSMC seeking, among other things, damages for TSMC’s breach of contract and breach of implied covenant of good faith and fair dealing.
On November 16, 2006, the High Court in Beijing in November 2006.
The Company settled all pending litigation with TSMC on November 9, 2009, including the People’s Republic of China, accepted the filing oflegal action filed in California for which a complaintverdict was returned by the Companyjury against SMIC on November 4, 2009, with a Settlement Agreement (the “2009 Settlement Agreement”) which replaced the 2005 Settlement Agreement. The 2009 Settlement Agreement resolved all pending lawsuits between the parties and its wholly-owned subsidiaries, namely, SMIC (Shanghai) and SMIC (Beijing), regarding the unfair competition arising from the breach of bona fide (i.e. integrity, good faith) principle and commercial defamation by TSMC (“PRC Complaint”). In the PRC Complaint, the Company is seeking, among other things, an injunction to stop TSMC’s infringing acts, public apology from TSMC to the Company and compensation from TSMC to the Company, including profits gained by TSMC from their infringing acts.
On August 14, 2007, the Company filed an amended cross-complaint against TSMC seeking, among other things, damages for TSMC’s breach of contract and breach of patent license agreement. TSMC thereafter denied the allegationsparties have since dismissed all pending litigation between them. The terms of the Company’s amended cross-complaint2009 Settlement Agreement include the following:
1) Entry of judgment and subsequently filed additionalmutual release of all claims that the Company breached a settlement agreement by filing an actionwere or could have been brought in the Beijing High Court. The Company has denied these additional claims by TSMC.pending lawsuits;
On August 15-17, 2007,2) Termination of SMIC’s obligation to make remaining payments under the California Court held a preliminary injunction hearing on TSMC’s motion to enjoin use of certain process recipes in certain of2005 Settlement Agreement between the Company’s 0.13 micron logic process flows.
On September 7, 2007, the Court denied TSMC’s preliminary injunction motion, thereby leaving unaffected the Company’s development and sales. However, the court required the Company to provide 10 days’ advance notice to TSMC if the Company plans to disclose logic technology to non-SMIC entities under certain circumstances, to allow TSMC to object to the planned disclosure.parties (approximately US$40 million);

 

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In May 2008,3) Payment to TSMC filedof an aggregate of US$200 million (with US$15 million paid upon execution, funded from SMIC’s existing cash balances, and the remainder to be paid in installments over a motionperiod of four years);
4) Commitment to grant to TSMC of 1,789,493,218 shares of SMIC (representing approximately 8% of SMIC’s issued share capital as of October 31, 2009) and a warrant exercisable within three years of issuance to subscribe for 695,914,030 shares of SMIC, subject to adjustment at a purchase price of HK$1.30 per share, subject to adjustment. Both the shares and the warrant would allow TSMC to obtain total ownership of approximately 10% of SMIC’s issued share capital after giving effect to the share issuances and are subject to receipt of required government and regulatory approvals; and
5) Certain remedies in the California Courtevent of breach of this settlement.
Accounting Treatment for summary adjudication againstthe 2009 Settlement Agreement:
In accounting for the 2009 Settlement Agreement, the Company on severaldetermined that there were three components of the Company’s cross claims. The Company opposed the motion2009 Settlement Agreement:
1) Settlement of litigation via entry of judgment and on August 6, 2008, the Court grantedmutual release of all claims in part and denied in partconnection with pending litigation;
2) TSMC’s motion.
On June 23, 2008, the Company filed in the California court a cross-complaint against TSMC seeking, among other things, damages for TSMC’s unlawfulcovenant not-to-sue with respect to alleged misappropriation of trade secrets from SMIC to improve its competitive position against SMIC.secrets; and
On July 10, 2008, the California Court held a preliminary injunction hearing on TSMC’s motion to enjoin disclosure3) Termination of information on certain process recipes in the Company’s 0.30 micron logic process flows to 3rd parties. On August 8, 2008, the Court granted-in-part TSMC’s motion and preliminarily enjoined SMIC from disclosing fourteen 0.30 ìm process steps. On October 3, 2008, SMIC filed a notice of appealpayment obligation of the Court’s August 8, 2008 Order with the California Court of Appeal. This appeal is currently pending.
During the pre-trial proceedings in the matter, as noted aboveremaining payments to TSMC under “Overview of TSMC Litigation”, questions arose regarding the actual terms of the 2005 Settlement Agreement between SMIC and TSMC. Accordingly, the California Court held a preliminary trial on January 13 to 16, 2009, limited to a determinationof approximately $40 million.
The Company does not believe that any of the termsaforementioned qualify as assets under US GAAP. Accordingly, all such items were expensed as of the settlement date, and previously recorded deferred cost associated with the 2005 Settlement Agreement were immediately impaired, resulting in an expense of $269.6 million which was recorded as litigation settlement in the consolidated statements of operations. The commitment to grant shares and an interpretationwarrants was initially measured at fair value and is being accounted for as a derivative with all subsequent changes in fair value being reflected in the consolidated statements of any requirements to “meet and confer” prior to institution of litigation. On March 10, 2009, the Court issued a Statement of Decision finding, in part, that an agreement between the parties was executed on January 30, 2005, and thereafter amended on February 2, 2005, as urged by TSMC.operations. The Company believesrecorded a loss of $30.1 million and $29.8 million as the Court’s ruling is erroneous.change in fair value of commitments to issue shares and warrants in 2009 and 2010 through the date of issuance of the shares and warrants on July 5, 2010, respectively.
Contingent Liability
     In 2007, the Company entered into equipment purchase and cooperative manufacturing arrangements (the “Arrangements”) with an unrelated semiconductor manufacturer (the “Counterparty”). The ruling may be appealedequipment was relocated by SMIC following the filing of a final judgment by the Court in this matter.
On May 1,2008 as scheduled. In 2009, the Company filed motionsreceived notifications from the Counterparty that the Company was responsible for summary adjudication against TSMC’s claims for breach of promissory notesadditional equipment relocation expenses and violationa portion of the California Uniform Trade Secrets Act.losses incurred during the term of the cooperative manufacturing arrangement. The motions will be heard byCompany has contested the Court on July 17, 2009.
The California Court has further scheduled a trial upon all liability issues related to a selected list of TSMC trade secret claims and SMIC trade secretrequested further information supporting the Counterparty’s claims. The Counterparty filed a demand for dispute arbitration in late 2009 for the equipment relocation expenses. The Company recorded its best estimate of the probable amount of its liability on the claims to commence on September 8,in the consolidated financial statement as of and during the year ended December 31, 2009.
In the Company’s action inend of 2010, the Beijing High People’s Court, following an unsuccessful challenge to that Court’s jurisdiction by TSMC,Counterparty has filed further claims under the Court has held evidentiary hearings on October 15, October 29, and November 25, 2008.cooperative manufacturing arrangement. The Court rendered its first-instance judgment on June 10, 2009. ClaimsCompany settled all of SMIC against TSMC were not supported by the Court in the first-instance judgment. The first-instance judgment is not final and either TSMC or SMIC may further appealdisputes related to the PRC Supreme People’s Court according to equipment relocation claims and is continuing its investigations and negotiations with


the law.
UnderCounterparty under the provisionscooperative manufacturing arrangement. The contingent liability recorded as of SFAS 144,December 31, 2010 represented the Company is required to make a determination as to whether or not this pending litigation represents an event that requires a further analysisCompany’s best estimate of whether the patent license portfolio has been impaired. We believe that the lawsuit is at a discovery stage and we are still evaluating whether or not the litigation represents such an event. The Company expects further information to become available to us, which will aid us in making a determination. The outcome of any impairment analysis performed under SFAS 144 might result in a material impact to our financial position and results of operations. Because the case is in its discovery stage, the Company is unable to evaluate the likelihood of an unfavorable outcome or to estimate the amount or range of potentialprobable loss.
Dividends and Dividend Policy
At the end of 2008,2010, the Company’s accumulated deficit increaseddecreased to US$748.51,698.9 million from an accumulated deficit of US$308.21,712.0 million at the end of 2007.2009. The Company has not declared or paid any cash dividends on the ordinary shares. We intend to retain any earnings for use in the Company’s business and do not currently intend to pay cash dividends on the ordinary shares. Dividends, if any, on the outstanding shares will be declared by and subject to the discretion of the Board and must be approved at the annual general meeting of shareholders. The timing, amount and form of future dividends, if any, will also depend, among other things, on:
the Company’s results of operations and cash flow;
the Company’s future prospects;
the Company’s capital requirements and surplus;
the Company’s financial condition;
general business conditions;
contractual restrictions on the payment of dividends by the Company to its shareholders or by the Company’s subsidiaries to the Company; and
other factors deemed relevant by the Board.

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the Company’s future prospects;


the Company’s capital requirements and surplus;
the Company’s financial condition;
general business conditions;
contractual restrictions on the payment of dividends by the Company to its shareholders or by the Company’s subsidiaries to the Company; and
other factors deemed relevant by the Board.
The Company’s ability to pay cash dividends will also depend upon the amount of distributions, if any, received by the Company from its wholly-owned Chinese operating subsidiaries. Under the applicable requirements of Chinese Company Law, the Company’s subsidiaries in China may only distribute dividends after they have made allowances for:
recovery of losses, if any;
allocation to the statutory common reserve funds;
allocation to staff and workers’ bonus and welfare funds; and
allocation to a discretionary common reserve fund if approved by the Company’s shareholders.
More specifically, these operating subsidiaries may only pay dividends after 10% of their net profit has been set aside as statutory common reserves and a discretionary percentage of their net profit has been set aside for the staff and workers’ bonus and welfare funds. These operating subsidiaries are not required to set aside any of their net profit as statutory common reserves if such reserves are at least 50% of their respective registered capital. Furthermore, if they record no net income for a year, they generally may not distribute dividends for that year.


Significant Changes
Please see the section entitled “Litigation” above.

 

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Item 9. The Offer and Listing
Our ordinary shares are principally traded on the Stock Exchange of Hong Kong under the stock code “981” Our ordinary shares began trading on the Stock Exchange of Hong Kong on March 18, 2004. Our American Depositary Shares, which began trading on the New York Stock Exchange on March 17, 2004, are traded under the symbol “SMI.”
The table below sets forth the high and low closing prices on the Stock Exchange of Hong Kong and the New York Stock Exchange for the ordinary shares represented by theand ADSs representing such ordinary shares, respectively, since the completion of the global offering and for the most recent six months.
                 
  Stock Exchange of Hong Kong  New York Stock Exchange(1) 
  Closing price per ordinary share  Closing price per ADS 
  High Price  Low Price  High Price  Low Price 
2005                
First Quarter HK$1.75* HK$1.48  US$11.14  US$9.35 
Second Quarter HK$1.71  HK$1.48  US$10.93  US$9.52 
Third Quarter HK$1.75* HK$1.21  US$11.33* US$7.83 
Fourth Quarter HK$1.33  HK$1.00* US$8.46  US$6.68*
 
2006                
First Quarter HK$1.29* HK$1.02  US$8.38* US$6.73 
Second Quarter HK$1.21  HK$1.00  US$7.82  US$6.36 
Third Quarter HK$1.07  HK$0.97  US$6.88  US$6.30 
Fourth Quarter HK$1.03  HK$0.87* US$6.46  US$5.48*
 
2007                
First Quarter HK$1.24* HK$0.87  US$8.30* US$5.87 
Second Quarter HK$1.24  HK$1.04  US$7.68  US$6.69 
Third Quarter HK$1.18  HK$0.81  US$7.50  US$5.30 
Fourth Quarter HK$1.11  HK$0.71* US$6.72  US$4.57*
 
2008                
First Quarter HK$0.82* HK$0.41  US$4.98* US$2.76 
Second Quarter HK$0.78  HK$0.44  US$4.32  US$2.88 
Third Quarter HK$0.48  HK$0.20  US$2.99  US$1.32 
Fourth Quarter HK$0.35  HK$0.11* US$2.41  US$0.89*
December HK$0.35  HK$0.15  US$2.22  US$0.96 
 
2009                
January HK$0.39  HK$0.24  US$2.29  US$1.54 
February HK$0.32  HK$0.23  US$1.86  US$1.53 
March HK$0.32  HK$0.25  US$2.02  US$1.57 
April HK$0.35  HK$0.27  US$2.18  US$1.82 
May HK$0.42  HK$0.29  US$2.70  US$2.01 
June (through June 15) HK$0.47  HK$0.41  US$2.96  US$2.61 
   
Stock Exchange of Hong KongNew York Stock Exchange(1)
Closing price per ordinary shareClosing price per ADS
High PriceLow PriceHigh PriceLow Price
2005
First QuarterHK $1.75 *HK $1.48US $11.14US $9.35
Second QuarterHK $1.71HK $1.48US $10.93US $9.52
Third QuarterHK $1.75 *HK $1.21US $11.33 *US $7.83
Fourth QuarterHK $1.33HK $1.00 *US $8.46US $6.68 *
2006
First QuarterHK $1.29 *HK $1.02US $8.38 *US $6.73
Second QuarterHK $1.21HK $1.00US $7.82US $6.36
Third QuarterHK $1.07HK $0.97US $6.88US $6.30
Fourth QuarterHK $1.03HK $0.87 *US $6.46US $5.48 *
2007
First QuarterHK $1.24 *HK $0.87US $8.30 *US $5.87
Second QuarterHK $1.24HK $1.04US $7.68US $6.69
Third QuarterHK $1.18HK $0.81US $7.50US $5.30
Fourth QuarterHK $1.11HK $0.71 *US $6.72US $4.57 *
2008
First QuarterHK $0.82 *HK $0.41US $4.98 *US $2.76
Second QuarterHK $0.78HK $0.44US $4.32US $2.88
Third QuarterHK $0.48HK $0.20US $2.99US $1.32
Fourth QuarterHK $0.35HK $0.11 *US $2.41US $0.89 *
2009
First QuarterHK $0.39HK $0.23*US $2.29US $1.53*
Second QuarterHK $0.47HK $0.27US $2.96US $1.82
Third QuarterHK $0.44HK $0.37US $2.86US $2.40
Fourth QuarterHK $0.66*HK $0.35US $3.88*US $2.30
2010
First QuarterHK $1.05HK $0.54US $6.67*US $3.57
Second QuarterHK $1.06*HK $0.53US $6.74US $3.36
Third QuarterHK $0.63HK $0.48US $4.01US $3.08*
Fourth QuarterHK $0.69HK $0.54US $4.36US $3.41
2011
JanuaryHK $0.65HK $0.56US $4.14US $3.70
FebruaryHK $0.75HK $0.57US $4.72US $3.77
MarchHK $0.64HK $0.57US $3.98US $3.59
AprilHK $0.71HK $0.59US $4.39US $3.72
MayHK $0.94HK $0.62US $5.78US $4.05
June (through June 15)HK $0.67HK $0.61US $4.19US $3.90
(1) Each ADS represents 50 ordinary shares.
 
* Indicates high and low prices for the fiscal year.


At our request, trading in our shares on the Stock Exchange of Hong Kong was suspended with effect from November 6, 2008, 10:03 a.m., Hong Kong time, pending the release of our announcement regarding our entering into the Share Purchase Agreement with Datang Telecom Technology & Industry Holdings Co., Ltd. Pursuant to our application to the Hong Kong Stock Exchange, trading in our shares resumed on the Stock Exchange of Hong Kong with effect from 9:30 a.m., November 11, 2008, Hong Kong time Also at our request, trading in our ADSs on the NYSE was suspended for a like period.
On April 18, 2011, trading in our shares on the NYSE was suspended from 9:30 a.m., New York time, pending the release of our announcement regarding our entering into an investment agreement with China Investment Corporation. Trading in our shares resumed at 1:57 p.m., New York time on the same day. No trading suspension was imposed by the Stock Exchange of Hong Kong.

 

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Item 10. Additional Information
Memorandum and Articles of Association
The section entitled “Description of Share Capital” in our IPO registration statement is incorporated by reference into this annual report.
The sections entitled “Item 10-Additional Information-Memorandum and Articles of Association” in our annual report on Form 20-F for the fiscal year ended December 31, 2004, filed with the SEC on June 26, 2005 and in our annual report on Form 20-F for the fiscal year ended December 31, 2005, filed with the SEC on June 26, 2006 are incorporated by reference into this annual report. In addition, at the annual general meeting of our shareholders held on June 2, 2008, our shareholders approved an amendment to our Articles of Association to provide that a member of our board of directors may be removed by Ordinary Resolution.
Material Contracts
Share Purchase Agreement with Datang Telecom Technology & Industry Holdings Co., Ltd.
We entered into a Share Purchase Agreement dated November 6, 2008 with Datang Telecom Technology & Industry Holdings Co., Ltd, or Datang, pursuant to which Datang subscribed through a Hong Kong incorporated subsidiary, also referred to below as the HKCo,Datang Hongkong, and we allotted and issued, 3,699,094,300 ordinary shares for a purchase price of HK$0.36 per ordinary shares for a total purchase price of US$171.8 million on December 24, 2008, also referred to below as the closing date.
The principal terms of the Share Purchase Agreement are as follows:
 Right to Nominate Investor NomineesDirectors. Datang has the right to nominate two nominees to our board of directors, provided that the decision of our board to appoint, or propose to our shareholders for appointment, any individual nominated by Datang as a director will be made in the best interests our companyof us and our shareholders as a whole, and we are not obliged to simply appoint any individual nominated by Datang as a director without taking into account such considerations, provided further that.factor. In addition (a) subject to clause (b) below, the number of Datang nominees shall decrease to one if Datang, the HKCoDatang Hongkong and thetheir permitted transferee,transferees, collectively, hold less than 1,849,547,150 shares (as appropriately adjusted for stock splits, stock consolidation, stock dividends, recapitalizations and the like) of the our total issued nominal share capital, or Datang, together with the HKCo,Datang Hongkong, holds less than 924,773,575 shares (as appropriately adjusted for stock splits, stock consolidation, stock dividends, recapitalizations and the like) of our total issued nominal share capital; and (b) the right to nominate any Datang nominee shall cease to exist if Datang, the HKCODatang Hongkong and thetheir permitted transferee,transferees, collectively, hold less than 924,773,575 shares (as appropriately adjusted for stock splits, stock consolidation, stock dividends, recapitalizations and the like) of our total issued nominal share capital, or if Datang, together with HKCo,Datang Hongkong, holds less than 462,386,788 shares (as appropriately adjusted for stock splits, stock consolidation, stock dividends, recapitalizations and the like) of our total nominal share capital.;
  Right to Nominate Vice-President in Charge of TD-SCDMA. Datang has the right to nominate a Vice-President in charge of our TD-SCDMA business, provided that Datang, HKCoDatang Hongkong and thetheir permitted transferee,transferees, collectively, hold at least 924,773,575 shares (as appropriately adjusted for stock splits, stock consolidation, stock dividends, recapitalizations and the like) of our total nominal share capital from time to time, provide that Datang, together with the HKCO,Datang Hongkong, holds at least 462,386,788 shares (as appropriately adjusted for stock splits, stock consolidation, stock dividends, recapitalizations and the like) of our total issued share capital from time to time, subject to the approval of our board (excluding the Datang nominees).


  Pre-emptive Right.Datang has the following right to purchase any new ordinary shares, any securities convertible into or exchangeable into ordinary shares or any warrants or other rights to subscribe for ordinary shares, referred to as the “Relevant Securities” (subject to the approval of our independent shareholders in order to comply with the Rules Governing the Listing of Securities on the Hong Kong Stock Exchange prior to each such purchase), in the event that we propose to issue the Relevant Securities, to enable Datang to hold after such issue (i) in the case of an offer to investors that would otherwise result in a prospective largest shareholder (other than an underwriter that is placing on our behalf the Relevant Securities in abonafide capital markets transaction), beneficially owning more ordinary shares than Datang and Datang Hong Kong in the aggregate, one ordinary share more than the number of ordinary shares proposed to be beneficially owned by the prospective largest shareholder, unless (a) Datang and the HKCoDatang Hongkong hold less than 2,774,320,725 shares (as appropriately adjusted for stock splits, stock consolidation, stock dividends, recapitalizations and the like) of our total nominal share capital, or (b) at least two-thirds of our board of directors (excluding Datang nominees) in good faith resolves in writing that such exercise is not in the best interests of our company and our shareholders as a whole, and (ii) in the case of thean issue of Relevant Securities other than (i) above, a pro rata portion of the Relevant Securities equal to the percentage of our issued share capital then beneficially owned by Datang (together with HKCo)Datang Hongkong) prior to the issuance of the Relevant Securities, provided that Datang (together with HKCo)Datang Hongkong) maintains an ownership interest equal to at least 1,849,547,150 shares (as appropriately adjusted for stock splits, stock consolidation, stock consolidation, stock dividends, recapitalizations and the like) of our total nominal share capital.

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  Lock-Up. Datang and Datang Hong Kong shall not transfer any of the shares purchased under the Share Purchase Agreement without our prior written consent for a period of two years from the closing date, provided that such lock-up shall not apply to transfer of less than 1,849,547,150 of such shares (as appropriately adjusted for stock splits, stock consolidation, stock dividends, recapitalizations and the like) to a permitted transferee as defined in the Share Purchase Agreement, provided that any such permitted transferee shall be a non-PRC incorporated entity, unless Datang shall have provided to us in writing justifying the need to transfer to a PRC incorporated entity, and our board of directors (excluding the Datang nominees) shall have determined that such transfer to a PRC incorporated entity is not expected to be prejudicial to the interests of, or have an adverse effect, on our group.
 
  Standstill. Datang shall not, except with our prior written consent, directly or indirectly, acquire any of our ordinary shares, any other security carrying voting rights and any outstanding convertible securities, options, warrants or other rights which are convertible into or exchangeable or exercisable or carrying rights of subscription for securities carrying voting rights in us (together our “voting securitiesVoting Securities” exceeding the lesser of thirty percent of our issued voting securities,Voting Securities, or such other threshold that may trigger a mandatory offer obligation as set out in the Hong Kong Code on Takeovers and Mergers, at any time following the date of the Share Purchase Agreement and until the second anniversary of the closing date.
Strategic Cooperation Agreement with Datang Telecom Technology & Industry Holdings Co., Ltd.
We entered into a Strategic Cooperation Agreement, dated December 24, 2008, with Datang Telecom Technology & Industry Holdings Co., Ltd. The principal terms of the Strategic Cooperation Agreement are as follows:
  Effective Period:Two years effective from the closing date, being December 24, 2008, subject to all the cooperation pursuant to the Strategic Cooperation Agreement, complying with, among other things, the Rules Governing the Listing of Securities on the Hong Kong Stock Exchange.
 
  Material Terms:Cooperation in the areas of technology, industry, global markets and cooperative undertaking.


  Cooperation of technological research and development, or Technological Cooperation. As part of our core business of providing IP design services, we intend to provide our existing research and development facilities and manpower in developing advanced logic processing technology and intellectual property bank for Datang, while Datang will provide pilot authentication products in relation to such development. The funding required for such research and development will be in accordance with the market practice and to be agreed by us and Datang. We expect this to be provided by reference to the extent of each party’s responsibilities and rights in the cooperation. We also intend to recommend the technology of Datang to third party customers.
 
  Provision of fabrication services, or Production Cooperation.Cooperation.As part of our core business of semiconductors fabrication, we intend to give priority to the production requiements of Datang while Datang intends to give priority to engage or employ our fabrication services provided that our price, technology and service standards are comparable to competitors and at the prevailing market value. The price for the provision of fabrication services under the Production Cooperation will be determined by reference to market price.
 
  Global markets, or Market Development Cooperation. We also intend to cooperate with Datang in the development of international markets and globalization of its business.
 
  Cooperative Undertaking in relation to PRC National Scientific Research Projects, or Cooperative Undertaking. We and Datang intend to make joint efforts to apply for PRC national and local projects in connection with scientific research and industrialization relating to the integrated circuit sector.

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Long-Term Loan Facilities
SMIC Shanghai and SMIC Tianjin entered into long-term loan facilities in 2006 See Item 5 - Liquidity and Capital Resources on page 65 for a description of these long-term loan facilities.
2009 Settlement Agreement
Please also see the section entitled “Litigation” above regarding the settlement agreement into which we entered with TSMC.
Placing Agreement
     On 8 July 2010, the Company entered into a placing agreement with J.P. Morgan Securities (Asia Pacific) Limited and The Royal Bank of Scotland N.V., Hong Kong Branch as the placing agents whereby the Company conditionally agreed to place, through the placing agents, up to 1,500 million ordinary shares to not less than six independent placees at a price of HK$0.52 per share (the “Placing”).
     Completion of the Placing took place on 15 July 2010, pursuant to which the Company issued and allotted 1,500 million ordinary shares to not fewer than six independent placees, who are third parties independent of and not connected with the Company and its connected persons, at the placing price of HK$0.52 per share.
Datang Subscription Agreement (2010)
     On August 16, 2010, the Company entered into a subscription agreement with Datang Telecom Technology & Industry Holdings Co., Ltd, or Datang, (“Datang Subscription Agreement”) pursuant to which the Company conditionally agreed to issue, and Datang conditionally agreed to subscribe (through Datang Holdings (Hongkong) Investment Company Limited, or Datang Hongkong) for, a total of 1,528,038,461 ordinary shares (being equivalent to the sum of (i) the amount of shares issued to Datang pursuant to the exercise of its pre-emptive right under the Datang Share Purchase Agreement in connection with the Placing as will result in Datang’s percentage shareholding in the Company not being diluted by the Placing (the “Datang Pre-emptive Shares”) and (ii) such number of new shares, which, together with the Datang Pre-emptive Shares, will fetch an aggregate purchase price of US$102 million) at the subscription price of HK$0.52 per share (being equivalent to the subscription price in the Placing). Completion was conditional upon, among other things, the obtaining of PRC governmental and regulatory approvals and consents by Datang.
     The completion of this subscription took place on November 16, 2010, when 1,528,038,461 ordinary shares were issued to Datang under the special mandate approved by the Company’s independent shareholders at its extraordinary general meeting held on September 21, 2010.
Subscription Agreement with Country Hill Limited
     The subscription agreement dated as of April 18, 2011 and entered into by us and Country Hill Limited, a wholly-owned subsidiary of China Investment Corporation, or CIC, in respect of the subscription of 360,589,053 Convertible Preferred Shares (the “CIC Initial Preferred Shares”) and warrants to subscribe for 72,117,810 Convertible Preferred Shares (the “CIC Warrants”, together with the CIC Initial Preferred Shares, the “CIC Securities”) includes, among others, the following terms:


Consideration of the CIC Securities.The subscription price of HK$5.39 per CIC Initial Preferred Share is reflective of an effective conversion price of HK$0.539 per ordinary share (based on the initial conversion rate of ten ordinary shares per Convertible Preferred Share) and the total cash consideration payable by CIC is US$250 million.
Terms of the Convertible Preferred Shares.The terms of the Convertible Preferred Shares (as set out in Appendix III to the shareholders circular of the Company dated May 11, 2011) are set out in “Item 7. Major Shareholders and Related Party Transactions — B. Preferred Shares”. Below are the principal terms:
Dividend entitlements: The Convertible Preferred Shares will rank pari passu in respect of entitlement to dividends and other income distribution as ordinary shares as if the Convertible Preferred Shares had been converted into ordinary shares for the relevant accounting period.
Capital: Upon a liquidation, dissolution, winding up (whether voluntary or involuntary) or return or reduction of capital of the Company (but not on conversion of the Convertible Preferred Shares or any repurchases by the Company of any Convertible Preferred Shares or ordinary shares) the assets of the Company available for distribution among the shareholders will be applied first in paying to the holders of the Convertible Preferred Shares and holders of other preference shares of the Company an amount in repayment of capital equal to the amount paid up or credited as paid up on such shares in priority to:
(i)any payment to the holders of ordinary shares; and
(ii)any other obligations ranking pari passu with the claims of the holders of ordinary shares.
Ranking: The CIC Initial Preferred Shares will, upon issue, rank (a) pari passu with the claims of holders of (i) any class of preferred share capital of the Company and (ii) other obligations of the Company which rank pari passu with the Convertible Preferred Shares or such preferred shares, and (b) in priority (including with respect to distribution of proceeds upon any liquidation event up to the amount paid up) to the any payment to the holders of ordinary shares of the Company and other obligations of the Company, incurred directly or indirectly by it, which rank, or are expressed to rank, pari passu the claims of the ordinary shares.
Conversion right: The holders of the Convertible Preferred Shares will have the right at any time to convert (in whole or in part) their Convertible Preferred Shares into fully paid ordinary shares at the conversion rate of ten ordinary shares per Convertible Preferred


Share (which shall be for a minimum amount of 70,000,000 Convertible Preferred Shares or, if less than 70,000,000 Convertible Preferred Shares are then held by CIC, all of such Convertible Preferred Shares). The holders of the Convertible Preferred Shares are not required to pay any amount for conversion of their Convertible Preferred Shares into ordinary shares. The ordinary shares issued upon conversion will be credited as fully paid, and will rank pari passu in all respects with the other ordinary shares in issue as at the date of the conversion, and will be allotted and issued free from all liens, charges and encumbrances and together with all rights attaching thereto upon allotment and issue and at any time thereafter, including all rights to any dividend or other distribution declared, made or payable by reference to a record date falling on or after the date of the conversion notice.
Mandatory Conversion Date: The Convertible Preferred Shares will be mandatorily converted into ordinary shares at the then applicable conversion rate on the day immediately following the expiry of twelve months commencing from the closing date as if the holder of the Convertible Preferred Shares has elected to convert its Convertible Preferred Shares into ordinary shares on the mandatory conversion date.
Adjustment to Conversion Rate: The initial conversion rate of ten ordinary shares per Convertible Preferred Share is subject to adjustment upon the occurrence of certain prescribed events, among other things, capitalisation of profits or reserves, consolidations, sub-divisions and re-classifications of shares, capital distributions, issue of shares or other securities, and the issue of a new class of shares carrying voting rights.
In the event of any issue of any ordinary share or any securities which by their terms are convertible into or exchangeable for, or carry right(s) of subscription for, any ordinary share, the conversion rate in force immediately before such issue will be adjusted to compensate the holders of Convertible Preferred Share by reference to the lowest of:
(i)the reference price per ordinary share which initially is HK$0.5390 (subject to adjustment as described in this section);
(ii)the amount which represents:
a.in respect of any rights issue of ordinary shares by the Company, 90% of the relevant theoretical ex-rights price for an ordinary share under that rights issue;
b.in respect of any issue of securities which by their terms are convertible into or exchangeable for, or carry right(s) of subscription for, ordinary share(s):
(1)in the case of options, warrants or similar instruments, the aggregate of the subscription price or premium for such instrument and the initial exercise price at which the holder of such instrument


may subscribe for ordinary shares;
(2)in the case of convertible bonds or convertible shares or similar instruments, the initial conversion price at which such instrument may be converted into ordinary shares; or
(3)in any other case, the aggregate price paid and initially payable by the subscriber of such securities in order to receive ordinary shares; and
c.in respect of any other issue of ordinary shares by the Company, the relevant issue price for an ordinary share under that issue;
(iii)the amount which represents a discount of 10% to the arithmetic average of the daily volume weighted average price for an ordinary share as shown on the VAP page of Bloomberg for the:
a.ten consecutive trading days immediately after the date on which the relevant issue is announced;
b.in the case of a rights issue, ten consecutive trading days immediately after the ex-rights date; or
c.if the reference price to determine the issue price is based on share prices for a period after the relevant issue is announced, all the trading days during that period.
     The adjustment will become effective immediately following the date of the issuance of the new securities.
No adjustment to the conversion rate will be made which has the effect or result of: (i) reducing the initial conversion rate upon the issue of the Convertible Preferred Shares, except upon any consolidation of ordinary shares or any corporate exercise with the effect of increasing the nominal value of the ordinary shares; or (ii) any ordinary share, upon conversion, falling to be issued at a price below the nominal value of the ordinary share.
Voting: The Convertible Preferred Shares will entitle the holders thereof to receive notice of, attend and vote at any meeting of members of the Company. Each Convertible Preferred Share will confer on its holder such number of voting rights as if the Convertible Preferred Share had been converted into ordinary shares.
Consent: Except with the consent or sanction of at least 75 per cent of the vote of the holders of the Convertible Preferred Shares given at a separate class meeting, no resolution may be made by the Company to amend the terms of the Convertible Preferred Shares.


Transferability: The Convertible Preferred Shares will be freely transferrable save as provided for under the terms of the CIC Subscription Agreement.
Redemption: The Convertible Preferred Shares are non-redeemable.
Protection: The Company has undertaken to each holder of Convertible Preferred Shares (including but not limited to) (i) that all the ordinary shares issued upon conversion will be duly and validly allotted and issued as fully paid or credited as fully paid and free from all liens, charges and encumbrances; (ii) that it will not in any way vary the rights attached to any class or series of shares, or attach any restriction to any class or series of shares, to the extent that such variation would have the effect of varying the rights attaching to the Convertible Preferred Shares, without prior written approval of 75 per cent. of the holders of Convertible Preferred Shares; (iii) that there will not be shares of different nominal values in issue at any time; (iv) it will not, without prior written approval of 75 per cent. of the holders of Convertible Preferred Shares, take any steps to or so as to liquidate, dissolve or windup the Company or any of its subsidiaries unless such liquidation, dissolution or winding-up will not have a material adverse effect; (v) it will not make any reduction or redemption of capital, share premium account or capital redemption reserve involving repayment of money to its shareholders or reduce any uncalled liability in respect of any issued share except in certain situations; and (vi) it will not enter into any agreement, instrument or other document whatsoever binding on it which may result in any breach of the memorandum and articles of association of the Company.
Pre-emptive rights.Country Hill Limited will have the following right to subscribe for (subject to any authorisation, consent, approval, licence or notification required for the purposes of or as a consequence of the CIC Subscription either from governmental, regulatory or other public bodies):
(i)whilst any Convertible Preferred Shares issued to and beneficially owned by Country Hill Limited (and/or its permitted transferee) remain unconverted and to the extent that the original percentage of issued share capital of the Company held by Country Hill Limited (and/or its permitted transferee) on a fully-diluted basis through such Convertible Preferred Shares immediately prior to the issue is reduced as a result of the issue of any new ordinary shares or preferred shares, any securities convertible into or exchangeable into ordinary shares or preferred shares or any warrants or other rights to subscribe for ordinary shares or preferred shares (which preferred shares carry voting rights in general meetings of the Company) (“Relevant Securities”) (after having taken into account any


adjustment to the conversion rate), such number of additional Convertible Preferred Shares (bearing the same conversion rate as the existing issued Convertible Preferred Shares having reflected the adjustment) so as to enable the Investor to hold, after the issue of the Relevant Securities, a pro rata portion of the issued share capital of the Company (on a fully diluted basis) equal to the original percentage; and
(ii)to the extent that any of the Convertible Preferred Shares held by Country Hill Limited have been converted and Country Hill Limited is holding ordinary shares of the Company issued as a result of the conversion, such number of additional Relevant Securities so as to enable Country Hill Limited to hold, after the issue of the Relevant Securities, a pro rata portion of the Relevant Securities equal to the percentage of the issued share capital of the Company represented by the converted ordinary shares then beneficially owned by Country Hill Limited immediately prior to the issuance of the Relevant Securities.
Right to Nominate one member of the Board.Country Hill Limited will have the right to nominate one member of our board of directors, or CIC Nominee, provided that: (i) the nomination and appointment of the CIC Nominee is considered by the board (excluding the Investor Nominee) to be in the best interest of the Company and its shareholders as a whole; and (ii) the CIC Nominee has passed the Company’s conflict and background check in accordance with common and usual standards and policies generally applicable to the appointment and nomination of a director of the Company. The Company will use all reasonable efforts to give effect to the appointment of the CIC Nominee to the board as soon as practicable after the completion of the subscription by Country Hill Limited which took place on June 3, 2011, and no later than 31 August 2011.
Lock-up Undertaking. Country Hill Limited will be restricted from selling, or transferring the CIC Initial Preferred Shares, any Convertible Preferred Shares issued upon the exercise of the CIC Warrants and any additional Convertible Preferred Shares or warrants subscribed for a period of 2 years from the Investor Closing Date, except that Country Hill Limited may transfer any Convertible Preference Shares or ordinary shares to any wholly-owned subsidiaries of CIC. The lock-up undertaking will cease to apply where any of the following members of the senior management of the Company, being Mr. David N.K. Wang, Mr. Gary Tseng, Mr. Simon Yang, Mr. Chris Keh-Fei Chi and Mr. Barry Quan, cease their employment with the Company within a period of (2) years commencing from the Investor Closing Date, except where they ceased their employment as a result of misconduct, or as a result of health conditions.
Restriction on transfers to a Competitor. Country Hill Limited has agreed to refrain


from transferring to any entity that provides or that has the capability to provide, directly or indirectly through any subsidiary or affiliate, semiconductor wafer fabrication or foundry services to third parties (“Competitor”), directly or indirectly, the Convertible Preferred Shares, the CIC Warrants, or any ordinary shares issued upon conversion of the Convertible Preferred Shares except where there is a genuine open market sale, with the written consent of the Company’s board of directors, or for accepting a general offer which has become unconditional or where the offeror has become entitled to exercise compulsory acquisition rights.
Warrant Agreement.On June 3, 2011, or the completion date, the Company and Country Hill Limited entered into a warrant agreement (the “CIC Warrant Agreement”) pursuant to the CIC Subscription Agreement whereby the Company issued the CIC Warrants to Country Hill Limited. Major terms of the warrant agreement are as below:
Consideration.The CIC Warrants are issued as part of the Investor Subscription.
Exercise of the CIC Warrants. Country Hill Limited may exercise, in whole or in part, the CIC Warrants on any business day on or prior to 11: 59 p.m., Hong Kong time, on the date that is 12 months from the date of the CIC Warrant Agreement. Upon exercise, the CIC Warrants will be converted into Convertible Preferred Shares (the “Warrant Preferred Shares”). Each partial exercise shall be for a minimum subscription of 15,000,000 Warrant Preferred Shares, or, if less than 15,000,000 Warrant Preferred Shares are issuable under the CIC Warrants then held by Country Hill Limited, for all of such number of Warrant Preferred Shares issuable under the CIC Warrants then held by Country Hill Limited. Any unexercised CIC Warrants will lapse after the date that is 12 months from the date of the CIC Warrant Agreement.
Exercise Price.HK$5.39 per CIC Warrant is equivalent to the subscription price for the CIC Initial Preferred Shares and is reflective of an effective conversion price of HK$0.539 per ordinary share (based on the initial conversion rate of ten ordinary shares per Convertible Preferred Share).
Adjustment of Exercise Price. No adjustment will be made to the exercise price of the CIC Warrants nor the number of Warrant Preferred Shares issuable upon exercise of each CIC Warrant.
Warrant Preferred Shares. The Warrant Preferred Shares will not be adjusted but will bear a conversion rate for conversion into ordinary shares that may be adjusted as described in the paragraph ‘‘Terms of the Convertible Preferred Shares — Adjustment to Conversion Rate’’ above. The Warrant Preferred Shares will entitle the holders thereof to receive notice of, attend and vote at any meeting of members of the Company. Each Warrant Preferred Share will confer on its holder such


number of voting rights as if the Warrant Preferred Share had been converted into ordinary shares.
Transferability. Save as to transfers to any wholly-owned subsidiary of China Investment Corporation, the CIC Warrants are not transferable without the prior written approval of the Company.
No Listing of the Investor Warrants. No application will be made for a listing of the CIC Warrants on The Stock Exchange of Hong Kong Limited or any other stock exchange.


Datang Further Subscription Agreement (2011)
     On May 5, 2011, the Company entered into a subscription agreement (the “Datang Further Subscription Agreement”) with Datang Holdings (Hongkong) Investment Company Limited, or Datang , a wholly owned subsidiary of Datang Telecom Technology & Industry Holdings Co., Ltd., whereby the Company has conditionally agreed to allot and issue to Datang, and Datang has conditionally agreed to subscribe for (i) 84,956,858 Convertible Preferred Shares at a subscription price of HK$5.39 per share (“Datang Pre-emptive Preferred Shares”) and (ii) warrants to subscribe for up to 16,991,371 Convertible Preferred Shares (subject to adjustment) at an exercise price of HK$5.39 per warrant (“Datang Pre-emptive Warrants”, together with the Datang Pre-emptive Preferred Shares, the “Datang Pre-emptive Securities”) pursuant to Datang’s exercise of its pre-emptive right under the Datang Share Purchase Agreement in connection with the subscription of Convertible Preferred Shares and warrants by Country Hill Limited (the “CIC Subscription”), on the same terms and conditions as reasonably practicable as the CIC Subscription, taking into account the fact that Datang is already an existing shareholder of the Company. The issue of Datang Pre-emptive Securities is conditional on, among other things, the obtaining of the approval of independent shareholders of the Company and necessary governmental approvals. The Company has obtained independent shareholders’ approval at its extraordinary general meeting held on May 27, 2011. As of the latest practicable date, the Datang Pre-emptive Securities have not been issued.
Principal terms of the Datang Further Subscription Agreement are as below:
Consideration of the Datang Pre-emptive Securities. The subscription price of HK$5.39 per Datang Pre-emptive Preferred Share is reflective of an effective conversion price of HK$0.539 per ordinary share (based on the initial conversion rate of ten ordinary shares per Convertible Preferred Share) and the total cash consideration payable by Datang is US$58.9 million.
Terms of the Convertible Preferred Shares.The terms of the Convertible Preferred Shares (as set out in Appendix III to the shareholders circular of the Company dated May 11, 2011) are set out in “Item 7. Major Shareholders and Related Party Transactions — B. Preferred Shares”. Below are their principal terms:
Dividend entitlements. The Convertible Preferred Shares will rank pari passu in respect of entitlement to dividends and other income distribution as ordinary shares as if the Convertible Preferred Shares had been converted into ordinary shares for the relevant accounting period.
Capital. Upon a liquidation, dissolution, winding up (whether voluntary or


involuntary) or return or reduction of capital of the Company (but not on conversion of the Convertible Preferred Shares or any repurchases by the Company of any Convertible Preferred Shares or ordinary shares) the assets of the Company available for distribution among the shareholders will be applied first in paying to the holders of the Convertible Preferred Shares and holders of other preference shares of the Company an amount in repayment of capital equal to the amount paid up or credited as paid up on such shares in priority to:
(A)any payment to the holders of ordinary shares; and
(B)any other obligations ranking pari passu with the claims of the holders of ordinary shares.
Ranking. The Datang Pre-emptive Preferred Shares will, upon issue, rank (a) pari passu with the claims of holders of (i) any class of preferred share capital of the Company and (ii) other obligations of the Company which rank pari passu with the Convertible Preferred Shares or such preferred shares, and (b) in priority (including with respect to distribution of proceeds upon any liquidation event up to the amount paid up) to any payment to the holders of ordinary shares of the Company and other obligations of the Company, incurred directly or indirectly by it, which rank, or are expressed to rank, pari passu the claims of the ordinary shares.
Conversion right. The holders of the Convertible Preferred Shares will have the right at any time to convert (in whole or in part) their Convertible Preferred Shares into fully paid ordinary shares at the conversion rate which is initially ten ordinary shares per Convertible Preferred Share and subject to adjustment(s) (which shall be for a minimum amount of 70,000,000 Convertible Preferred Shares or, if less than 70,000,000 Convertible Preferred Shares are then held by Datang, all of such Convertible Preferred Shares). The holders of the Convertible Preferred Shares are not required to pay any amount for conversion of their Convertible Preferred Shares into ordinary shares. The ordinary shares issued upon conversion will be credited as fully paid, and will rank pari passu in all respects with the other ordinary shares in issue as at the date of the conversion, and will be allotted and issued free from all liens, charges and encumbrances and together with all rights attaching thereto upon allotment and issue and at any time thereafter, including all rights to any dividend or other distribution declared, made or payable by reference to a record date falling on or after the date of the conversion notice.
Mandatory Conversion Date. The Convertible Preferred Shares will be


mandatorily converted into ordinary shares at the then applicable conversion rate on the day immediately following the expiry of twelve months commencing from the completion date of the subscription of Datang Pre-emptive Securities as if the holder of the Convertible Preferred Shares has elected to convert its Convertible Preferred Shares into ordinary shares on the mandatory conversion date.
Adjustment to Conversion Rate. The initial conversion rate of ten ordinary shares per Convertible Preferred Share is subject to adjustment upon the occurrence of certain prescribed events, among other things, capitalisation of profits or reserves, consolidations, sub-divisions and re-classifications of shares, capital distributions, issue of shares or other securities, and the issue of a new class of shares carrying voting rights.
In the event of any issue of any ordinary share or any securities which by their terms are convertible into or exchangeable for, or carry right(s) of subscription for, any ordinary share, theconversion rate in force immediately before such issue will be adjusted to compensate the holders of Convertible Preference Shares by reference to the lowest of:
(i)the reference price per ordinary share which initially is HK$0.5390 (subject to adjustment as described in this section);
(ii)the amount which represents:
a.in respect of any rights issue of ordinary shares by the Company, 90% of the relevant theoretical ex-rights price for an ordinary share under that rights issue;
b.in respect of any issue of securities which by their terms are convertible into or exchangeable for, or carry right(s) of subscription for, ordinary share(s):
(1)in the case of options, warrants or similar instruments, the aggregate of the subscription price or premium for such instrument and the initial exercise price at which the holder of such instrument may subscribe for ordinary shares;
(2)in the case of convertible bonds or convertible shares or similar instruments, the initial conversion price at which such instrument may be converted into ordinary shares; or
(3)in any other case, the aggregate price paid and initially payable by the subscriber of such securities in order to receive ordinary shares; and
c.in respect of any other issue of ordinary shares by the Company, the


relevant issue price for an ordinary share under that issue;
(iii)the amount which represents a discount of 10% to the arithmetic average of the daily volume weighted average price for an ordinary share as shown on the VAP page of Bloomberg for the:
a.ten consecutive trading days immediately after the date on which the relevant issue is announced; or
b.in the case of a rights issue, ten consecutive trading days immediately after the ex-rights date; or
c.if the reference price to determine the issue price is based on share prices for a period after the relevant issue is announced, all the trading days during that period.
The adjustment will become effective immediately following the date of the issuance of the new securities. No adjustment to the conversion rate will be made which has the effect or result of: (i) reducing the initial conversion rate upon the issue of the Convertible Preferred Shares, except upon any consolidation of ordinary shares or any corporate exercise with the effect of increasing the nominal value of the ordinary shares; or (ii) any Ordinary Share, upon conversion, falling to be issued at a price below the nominal value of the ordinary share.
Voting. The Convertible Preferred Shares will entitle the holders thereof to receive notice of, attend and vote at any meeting of members of the Company. Each Convertible Preferred Share will confer on its holder such number of voting rights as if the Convertible Preferred Share had been converted into ordinary shares.
Consent. Except with the consent or sanction of at least 75 per cent. of the vote of the holders of the Convertible Preferred Shares given at a separate class meeting, no resolution may be made by the Company to amend the terms of the Convertible Preferred Shares.
Transferability. The Convertible Preferred Shares will be freely transferrable save as provided for under the terms of the Datang Further Subscription Agreement.
Redemption. The Convertible Preferred Shares are non-redeemable.
Protection.The Company has undertaken to each holder of Convertible Preferred Shares (including but not limited to) (i) that all the ordinary shares upon conversion will be duly and validly allotted and issued as fully paid or


credited as fully paid and free from all liens, charges and encumbrances; (ii) that it will not in any way vary the rights attached to any class or series of shares, or attach any restriction to any class or series of shares, to the extent that such variation would have the effect of varying the rights attaching to the Convertible Preferred Shares, without prior written approval of 75 per cent. of the holders of Convertible Preferred Shares; (iii) that there will not be shares of different nominal values in issue at any time; (iv) it will not without prior written approval of 75 per cent. of the holders of Convertible Preferred Shares, take any steps to or so as to liquidate, dissolve or windup the Company or any of its subsidiaries unless such liquidation, dissolution or winding-up will not have a material adverse effect; (v) it will not make any reduction or redemption of capital, share premium account or capital redemption reserve involving repayment of money to its shareholders or reduce any uncalled liability in respect of any issued share except in certain situations; and (vi) it will not enter into any agreement, instrument or other document whatsoever binding on it which may result in any breach of the memorandum and articles of association of the Company.
Pre-emptive Rights.Datang will have the following right to subscribe for (subject to any authorisation, consent, approval, licence or notification required for the purposes of or as a consequence of the Datang Further Subscription either from governmental, regulatory or other public bodies):
(i)whilst any Convertible Preferred Shares issued to and beneficially held by Datang (and/or its permitted transferee) remain unconverted, and to the extent that the percentage (the ‘‘Original Percentage’’) of the issued share capital of the Company held by Datang on a fully-diluted basis through such Convertible Preferred Shares immediately prior to the issue is reduced as a result of the issue of any new ordinary shares or preferred shares, any securities convertible into or exchangeable into ordinary shares or preferred shares or any warrants or other rights to subscribe for ordinary shares or preferred shares (which preferred shares carry voting rights in general meetings of the Company) (the “Relevant Securities”) (after having taken into account any adjustment to the conversion rate), such number of additional Convertible Preferred Shares (bearing the same conversion rate as the existing issued Convertible Preferred Shares having reflected the adjustment) so as to


enable Datang to hold, after the issue of the Relevant Securities, a pro rata portion of the issued share capital of the Company (on a fully-diluted basis) equal to the Original Percentage; and
(ii)to the extent that any of the Convertible Preferred Shares held by Datang have been converted and Datang is holding ordinary shares issued as a result of the said conversion, such number of additional Relevant Securities so as to enable Datang to hold, after the issue of the Relevant Securities, a pro rata portion of the Relevant Securities equal to the percentage of the issued share capital of the Company represented by the converted ordinary shares then beneficially owned by Datang immediately prior to the issuance of the Relevant Securities,
provided that Datang’s shareholding in the issued share capital of the Company represented by the Convertible Preferred Shares or converted ordinary shares shall be excluded and ignored for the purpose of determining the number of securities that Datang is able to acquire pursuant to its pre-emptive rights under the Datang Share Purchase Agreement.
Lock-up Undertaking.Datang will be restricted from selling, or transferring the Datang Pre-emptive Preferred Shares, any Convertible Preferred Shares issued upon the exercise of the Datang Pre-emptive Warrants and any additional Convertible Preferred Shares or Datang Pre-emptive Warrants subscribed for a period of 2 years from the completion date for the subscription of Datang Pre-emptive Securities (“Datang Closing”), except that Datang may transfer any Convertible Preference Shares or ordinary shares to a permitted transferee. The lock-up undertaking will cease to apply where any of the following members of the senior management of the Company, being Mr. David N.K. Wang, Mr. Gary Tseng, Mr. Simon Yang, Mr. Chris Keh-Fei Chi and Mr. Barry Quan, cease their employment with the Company within a period of two (2) years commencing from the Datang Closing date, except where they ceased their employment as a result of misconduct, or as a result of health conditions.
Restriction on transfers to a Competitor. Datang has agreed to refrain from transferring to any entity that provides or that has the capability to provide, directly or indirectly through any subsidiary or affiliate, semiconductor wafer fabrication or foundry services to third parties (“Competitor”), directly or indirectly, the Convertible Preferred Shares, the Datang Pre-emptive Warrants, or any ordinary shares issued upon conversion of the Convertible Preferred Shares except where there is a genuine open market sale, with the written consent of the Board of Directors, or for accepting a general offer which has


become unconditional or where the offeror has become entitled to exercise compulsory acquisition rights.
Completion of the Datang Further Subscription. The first business day after the satisfaction or waiver of the conditions to the Datang Closing, or at such other time, date and location as is mutually agreed in writing by the Company and Datang.
Datang Warrant Agreement. To be entered into between the Company as the issuer and Datang as the subscriber of Warrants to subscribe for 16,991,371 Convertible Preferred Shares on the Datang Closing date, pursuant to the Datang Further Subscription Agreement. Major terms of this warrant agreement are as below:
Consideration.The Datang Pre-emptive Warrants are issued as part of the subscription of the Datang Pre-emptive Securities.
Exercise of the Datang Pre-emptive Warrants. Datang may exercise, in whole or in part, the Datang Pre-emptive Warrants on any business day on or prior to 11: 59 p.m., Hong Kong time, on the date that is 12 months from the date of the CIC Warrant Agreement. Upon exercise, the warrants will be converted into Convertible Preferred Shares. Each partial exercise will be for a minimum subscription of 15,000,000 Convertible Preferred Shares, or, if less than 15,000,000 Convertible Preferred Shares are issuable under the warrants then held by Datang, for all of such number of Convertible Preferred Shares issuable under the warrants then held by Datang. Any unexercised Datang Pre-emptive Warrants will lapse after the date that is 12 months from the date of completion of the CIC Subscription.
Exercise Price.HK$5.39 per Datang Pre-emptive Warrant is equivalent to the subscription price for the Datang Pre-emptive Preferred Shares and is reflective of an effective conversion price of HK$0.539 per ordinary share (based on the initial conversion rate of ten ordinary shares per Convertible Preferred Share).
Adjustment of Exercise Price. No adjustment will be made to the exercise price of the Datang Pre-emptive Warrants nor the number of Convertible Preferred Shares issuable upon exercise of each warrant.
Datang Warrant Preferred Shares. The Convertible Preferred Shares issuable upon exercise of Datang Pre-emptive Warrants (“Warrant Preferred Shares”) will not be adjusted but will bear a conversion rate for conversion into ordinary shares that may be adjusted as described in the paragraph ‘‘Terms of the Convertible Preferred Shares — Adjustment to Conversion Rate’’ above. The Warrant Preferred Shares will entitle the holders thereof to receive notice of, attend and vote at any meeting of members of the Company. Each Warrant Preferred Share will confer on its holder such number of voting rights as if the Warrant


Preferred Share had been converted into ordinary shares.
Transferability. Save as to transfers to any wholly-owned subsidiary of Datang, the Datang Pre-emptive Warrants are not transferable without the prior written approval of the Company.
No Listing of the Datang Pre-emptive Warrants. No application will be made for a listing of the Datang Pre-emptive Warrants on The Stock Exchange of Hong Kong Limited or any other stock exchange.


Joint Venture Agreement and JV Memorandum with Hubei Science & Technology Investment Group Co., Ltd.
On May 12, 2011, the Company entered into a joint venture agreement (the “Joint Venture Agreement”) and a memorandum (the “JV Memorandum”) with Hubei Science & Technology Investment Group Co., Ltd., or Hubei Science & Technology, a company incorporated in the PRC and wholly-owned by The Wuhan East Lake Hi-Tech Development Zone Administrative Committee, to invest in and manage Wuhan Xinxin Semiconductor Manufacturing Corporation, or Wuhan Xinxin’s 12-inch wafer production line.
(i)Joint Venture Agreement
Pursuant to the Joint Venture Agreement, the parties shall establish Semiconductor Manufacturing International (Wuhan) Corp., a joint venture company to be established in Wuhan, Hubei Province, the PRC (the “JV Company”), for the purpose of the joint venture to be formed to further develop 12-inch wafer production facilities and implement advanced technologies for the manufacturing of integrated circuits.
Hubei Science & Technology shall contribute 33.34% of the registered capital of the JV Company in an aggregate amount of US$500,000,000 over a period of time as described below through the injection of all of the capital of Wuhan Xinxin into the JV Company plus a cash injection of US$226,168,955. The Company shall contribute 66.66% of the registered capital of the JV Company in an aggregate amount of US$1,000,000,000 over a period of time as described below.
The capital contribution shall be made in two stages:
(a)not less than 20% of the registered capital of the JV Company upon the application of the business licence of the JV Company, made up of:
a.US$45,233,791 contribution in cash plus all the capital of Wuhan Xinxin in the amount of US$273,831,045 (based on the value of the paid-up registered capital of Wuhan Xinxin) by Hubei Science & Technology; and
b.US$200,000,000 contribution in cash by the Company; and
(b)the balance of the outstanding capital contributions from both parties within two years after the establishment of the JV Company.
Hubei Science & Technology shall be entitled to appoint three of the directors of the JV


Company, including the managing director, and the Company shall be entitled to appoint two of the directors of the JV Company.
Pursuant to the Joint Venture Agreement, the Company authorises the JV Company to use the patents and other technologies necessary for the 12-inch wafer production facilities to be operated by the JV Company that the Company could lawfully employ. The JV Company is also authorised to use the relevant trademarks of the Company in the areas of manufacturing, operations and sales.
The obligations of the parties under the Joint Venture Agreement are subject to compliance with applicable laws (including the rules of regulatory authorities such as The Stock Exchange of Hong Kong Limited)). The establishment of the joint venture is subject to obtaining the necessary PRC approvals and shareholders’ approval. The implementation of the joint venture may also be dependent on market conditions.
(ii)JV Memorandum
Pursuant to the JV Memorandum:
(a)the Company will have the right to purchase the equity interests of Hubei Science & Technology in the JV Company; and
(b)the Company will have the right to appoint three directors of the JV Company and Hubei Science & Technology will have the right to appoint two directors after the Company’s capital contribution in the JV Company exceeds 50% of the total capital contribution.
(iii)The JV Company
Upon Completion, all of the capital of Wuhan Xinxin will be injected into the JV Company as part of the capital contribution of Hubei Science & Technology. The paid-up registered capital of Wuhan Xinxin is equivalent to US$273,831,045 using the exchange rate at the time such registered capital was paid up. Wuhan Xinxin is a wholly-owned subsidiary of Hubei Xinxin and is engaged in the operation of a 300mm wafer fab in Wuhan.


Other Contracts
Management Service Contracts with Cension Semiconductor Manufacturing Corporation and Wuhan Xinxin Semiconductor Manufacturing Corporation
We provideThe Company provided management services to Cension Semiconductor Manufacturing Corporation (“Cension”), a foundry owned by a municipal government. Prior to the termination of the management service in October 2010, management service revenues for 2010, 2009 and 2008 were $4,500,000, $6,000,000 and $12,000,000, respectively.
The Company also provided management services to Wuhan Xinxin Semiconductor Manufacturing Corporation (“Xinxin”), which areis a government-owned foundries pursuantfoundry. In 2009, the Company ceased its recognition of management service revenue due to issues of collectability and no revenue was recorded in 2010.
Furthermore, the Company recorded a $115.8 million bad debt provision in the second half of 2009, of which $93.5 million and $21.1 million were due to long outstanding overdue receivables relating primarily to the Operatingrevenue for management services rendered and Managementrelated equipment sold, respectively. The Company further negotiated with Cension and reached an agreement to settle the balances between the two parties. Cension agreed to make cash payment of $47.2 million to the Company. The remaining balances were relinquished. The Company collected $28.5 million of payments from Cension during 2010 and recorded as a deduction of general and admistrative expense in the consolidated statements of operations.
TSMC Share and Warrant Issuance Agreement
The share and warrant issuance agreement dated October 15, 2005 betweenas of November 9, 2009 and entered into by us and CensionTSMC in connection with the 2009 Settlement Agreement (the “TSMC Share and Warrant Issuance Agreement”) includes, among others, the following terms:
1) Commitment to grant to TSMC 1,789,493,218 shares of SMIC and one or more warrants exercisable within three years of issuance to subscribe for an aggregate of 695,914,030 shares of SMIC, subject to adjustment, at a purchase price of HK$1.30 per share, subject to adjustment (referred to collectively as the “TSMC Warrant”). Issuance of the shares and the OperatingTSMC Warrant are subject to receipt of required government and Managementregulatory approvals;
2) TSMC’s agreement that, subject to certain exceptions, it will not, except with the prior written consent of our Board of Directors, acquire any of our ordinary shares or other voting securities or securities convertible into or exchangeable for any such securities or take certain specified actions such as making a tender offer or commencing a proxy solicitation with respect to our shares, for so long as TSMC holds any of the securities to be issued to it under the 2009 Settlement Agreement dated Marchand we have not become the subject of certain specified transactions related to a change of control of SMIC;
3) Pre-emptive rights in favor of TSMC which permit TSMC to purchase its pro rata portion (based on the percentage of the issued share capital of SMIC beneficially owned by TSMC) of new equity issuances by SMIC, subject to certain specified exceptions and conditions, including compliance with the rules of the Stock Exchange of Hong Kong;
4) Agreement by TSMC to vote all of the ordinary shares of SMIC held by it as recommended by our Board of Directors other than with respect to certain change of control transactions involving SMIC; and
5) An obligation of SMIC, if the conditions to the issuance of our shares and the TSMC Warrant to be issued under the 2009 Settlement Agreement have not been satisfied prior to June 30, 2006 between us2010, and Xinxin. Management service revenuesif requested by TSMC, to sell the shares which would otherwise have been issued to TSMC (including the shares issuable under these agreementsthe TSMC Warrant if the trading price for 2008, 2007SMIC’s shares exceeds the applicable exercise price for specified periods) in underwritten public offerings or share placements and 2006 were $33,000,000, $42,000,000to deliver the proceeds of any such offerings or placements (net of underwriters’ discounts or commissions to the placement agent, as applicable) to TSMC.
TSMCWarrant Agreement
The Warrant Agreement entered into (subject to receipt of required government and $4,151,238, respectively.regulatory approvals) by SMIC and TSMC on July 5, 2010 in connection with the 2009 Settlement Agreement (the “TSMC Warrant Agreement”) provides for adjustments to the number of shares issuable under the TSMC Warrant, the per share exercise price of the TSMC Warrant and/or the nature of the property issuable upon exercise of the TSMC Warrant including the following:
1) In 2008, 2007the event of stock dividends, stock splits and 2006, we sold equipment with carryingsimilar transactions, the number of shares issuable under the TSMC Warrant and the per share exercise price of the TSMC Warrant will be adjusted so as to make such dividend, split or similar transaction not affect the economic value of $7,688, $19,530,909 and $19,411,553 to Cension for $175,300, $42,300,258 and $61,182,653, which resulted in gains on salethe TSMC Warrant;
2) In the event of $167,612, $22,769,349 and $41,771,099, respectively.
In 2008,certain specified change of control transactions involving SMIC, the Company sold equipment with carrying value of $3,629,605 to Xinxin for $3,944,204, which resulted in a gain on sale of $314,599.
Transactions with Cension Semiconductor Manufacturing Corporation (“Cension”) and Elpida Memory, Inc.
On April 10, 2007, Cension entered into an Asset Purchase Agreement with Elpida Memory, Inc., or Elpida, a Japan based memory chip manufacturer,TSMC Warrant will become exercisable for the purchasesame consideration as would have been payable with respect to the shares of Elpida’s 200mm wafer processing equipment currently locatedstock issuable under the TSMC Warrant in Hiroshima, Japanconnection with that change of control transaction if such shares of stock had been issued prior to the change of control transaction; and
3) In the event of the issuance by SMIC following November 9, 2009, of any new shares or securities exercisable for, convertible into or exchangeable for common shares of SMIC or similar rights, for a consideration per share (as determined in accordance with certain guidelines in the Warrant Agreement) less than the then-applicable per share exercise price for the total priceTSMC Warrant then the number of approximately $320 million.
As part of this Asset Purchase Agreement, we provided a corporate guarantee for a maximum guarantee liability of $163.2 million on behalf of Cension in favour of Elpida. Our guarantee liability will terminate upon full payment of the purchase price by Cension to Elpida. In return for providing the above corporate guarantee, we received a guarantee fee from Cension based on 1.5% of the guarantee amount, or $2.4 million. Approximately $160 million in 200mm wafer processing equipment purchased under this Asset Purchase Agreement was held as collateralshares issuable under the guarantee.
We are entitledTSMC Warrant will be increased by multiplying such number by a fraction (A) the numerator of which is the then applicable per share exercise price under the TSMC Warrant and (B) the denominator of which is determined by dividing (i) the sum of (x) the then-applicable per share exercise price under the TSMC Warrant multiplied by the number of shares of SMIC outstanding prior to the net profit (loss) associatednew issuance plus (y) the total consideration received by SMIC in the new issuance (as determined in accordance with certain guidelines in the ongoing operationsWarrant Agreement) by (ii) the number of this equipment, netshares of a guaranteed fixed share of revenue for Elpida, duringSMIC outstanding following the transitional period prior to when the equipment was relocated from Hiroshima to Chengdu. Such relocation was completed in 2008.new issuance.


On August 30, 2007, Cension negotiated with Elpida and subsequently reduced the purchase price to US$309.5 million.
In April 2008, SMIC entered into an agreement with Cension to purchase approximately half of the equipment from Cension for approximately $152 million. The equipment acquired by the Company will be used for the Company’s future expansion. The corporate guarantee was released after this purchase.
Exchange Controls
We receive a portion of our sales in Renminbi, which is currently not a freely convertible currency. Approximately 2.3% of our sales for the year ended December 31, 2006, approximately 0.9% of our sales for the year ended December 31, 2007, and approximately 5.4% of our sales for the year ended December 31, 2008, approximately 0.16% of our sales for the year ended December 31, 2009, and approximately 10.2% of our sales for the year ended December, 31, 2010 were denominated in Renminbi. While we have used these proceeds for the payment of our Renminbi expenses, we may in the future need to convert these sales into foreign currencies to allow us to purchase imported materials and equipment, particularly as we expect the proportion of our sales to China-based companies to increase in the future. Under China’s existing foreign exchange regulations, payments of current account items, including profit distributions, interest payments and expenditures from trade may be made in foreign currencies without government approval, except for certain procedural requirements. The Chinese government may, however, at its discretion, restrict access in the future to foreign currencies for current account transactions and prohibit us from converting our Renminbi sales into foreign currencies.

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Taxation
The following discussion of the material U.S. federal income and Cayman Islands tax consequences of an investment in our ADSs or ordinary shares is based upon laws and relevant interpretations thereof in effect as of the date of this prospectus, all of which are subject to change, possibly with retroactive effect. This discussion does not deal with all possible tax consequences relating to an investment in our ADSs or ordinary shares, such as the tax consequences under U.S. state, local and non-U.S. tax laws.
United States Federal Income Taxation


Except where noted, this summary deals only with the ownership and disposition of the ADSs and ordinary shares that are held as capital assets by U.S. Holders. This summary does not represent a detailed description of the U.S. federal income tax consequences applicable to U.S. Holders that are subject to special treatment under the U.S. federal income tax laws, including:
  banks;
 
  dealers in securities or currencies;
 
  financial institutions;
 
  real estate investment trusts;
 
  insurance companies;
 
  tax-exempt organizations;
 
  persons holding ADSs or ordinary shares as part of a hedging, integrated or conversion transaction, constructive sale or straddle;
 
  traders in securities that have elected the mark-to-market method of accounting;
 
  persons liable for the alternative minimum tax;
 
  persons who have ceased to be U.S. citizens or to be taxed as resident aliens;
 
  persons who own or are deemed to own more than 10% of our voting shares; or
 
  U.S. persons whose “functional currency” is not the U.S. dollar.
This summary is based in part on representations by the depositary and assumes that each obligation under the deposit agreement and any related agreement will be performed in accordance with its terms. Furthermore, the discussion below is based upon the provisions of the Internal Revenue Code of 1986, as amended, or the Code, and U.S. Treasury regulations, rulings and judicial decisions thereunder as of the date hereof, and such authorities may be replaced, revoked or modified, possibly on a retroactive basis, so as to result in U.S. federal income tax consequences different from those discussed below.
A U.S. Holder that holds ADSs or ordinary shares is urged to consult its own tax advisor concerning the U.S. federal income tax consequences as well as any consequences arising under the laws of any other taxing jurisdiction (including any U.S. state or locality) or any aspect of U.S. federal gift or estate law in light of the particular circumstances of the U.S. Holder.

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A U.S. Holder is a beneficial owner of ADSs or ordinary shares that is a U.S. person. A U.S. person is:
  a citizen or resident of the United States;
 
  a corporation or other entity taxable as a corporation created or organized in or under the laws of the United States, any state thereof, or the District of Columbia;


  an estate the income of which is subject to U.S. federal income taxation, regardless of its source; or
 
  a trust if it is subject to the primary supervision of a court within the United States and one or more U.S. persons have the authority to control all substantial decisions of the trust or has a valid election in effect under applicable U.S. Treasury regulations to be treated as a U.S. person.
If a partnership holds ADSs or ordinary shares, the tax treatment of a partner will generally depend on the status of the partner and the activities of the partnership. A U.S. Holder that is a partner of a partnership holding ADSs or ordinary shares is urged to consult its own tax advisors.
ADSs or Ordinary Shares.In general, for U.S. federal income tax purposes, a U.S. Holder of ADSs will be treated as the owner of the underlying ordinary shares that are represented by such ADSs. Deposits and withdrawals of ordinary shares in exchange for ADSs will not be subject to U.S. federal income taxation.
Distributions on ADSs or Ordinary Shares.Subject to the discussion under “—Passive“-Passive Foreign Investment Company Rules” below, the gross amount of the cash distributions on the ADSs or ordinary shares will be taxable to a U.S. Holder as dividends to the extent of our current and accumulated earnings and profits, as determined under U.S. federal income tax principles. Subject to certain limitations, dividends paid to noncorporate U.S. Holders, including individuals, may be eligible for a reduced rate of taxation if we are deemed to be a “qualified foreign corporation” for U.S. federal income tax purposes. A qualified foreign corporation includes:
  a foreign corporation that is eligible for the benefits of a comprehensive income tax treaty with the United States that includes an exchange of information program; and
 
  a foreign corporation if its stock with respect to which a dividend is paid or its ADSs backed by such stock are readily tradable on an established securities market within the United States,
but does not include an otherwise qualified corporation that is a passive foreign investment company. We believe that we will be a qualified foreign corporation for so long as we are not a passive foreign investment company and the ordinary shares or ADSs are considered to be readily tradable on an established securities market within the United States. A U.S. Holder that exchanges its ADSs for ordinary shares may not be eligible for the reduced rate of taxation on dividends if the ordinary shares are not readily tradable on an established securities market within the United States. Our status as a qualified foreign corporation, however, may change.
Dividends will be includable in a U.S. Holder’s gross income on the date actually or constructively received by such U.S. Holder, in the case of ordinary shares, or by the depositary, in the case of ADSs. These dividends will not be eligible for the dividends-received deduction generally allowed to U.S. corporations in respect of dividends received from other U.S. corporations.
To the extent that the amount of any cash distribution exceeds our current and accumulated earnings and profits, the distribution will first be treated as a tax-free return of capital, causing a reduction in the adjusted basis of the ADSs or ordinary shares (thereby increasing the amount of gain, or decreasing the amount of loss, a U.S. Holder would recognize on a subsequent disposition of the ADSs or ordinary shares), and the balance in excess of adjusted basis will be subject to tax as capital gain.
To the extent we pay dividends on the ADSs or the ordinary shares in Hong Kong dollars, the U.S. dollar value of such dividends should be calculated by reference to the exchange rate prevailing on the date of actual or constructive receipt of the


dividend, regardless of whether the Hong Kong dollars are converted into U.S. dollars at that time. If Hong Kong dollars are converted into U.S. dollars on the date of actual or constructive receipt of such dividends, the tax basis of the U.S. holder in such Hong Kong dollars will be equal to their U.S. dollar value on that date and, as a result, the U.S. Holder generally should not be required to recognize any foreign currency exchange gain or loss. Any gain or loss recognized on a subsequent conversion or other disposition of the Hong Kong dollars generally will be treated as U.S. source ordinary income or loss.
It is possible that distributions of ADSs or ordinary shares that are received as part of a pro rata distribution to all of our ordinary shareholders may not be subject to U.S. federal income tax. The basis of the new ADSs or ordinary shares so received will be determined by allocating a U.S. Holder’s basis in the old ADSs or ordinary shares between the old ADSs or ordinary shares and the new ADSs or ordinary shares received, based on their relative fair market values on the date of distribution.

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Dividends paid on the ADSs or ordinary shares will be income from sources outside of the United States and for tax years beginning before January 1, 2007, generally will constitute “passive income” or, in the case of certain U.S. Holders, “financial services income” and for tax years beginning after December 31, 2006, generally will constitute “passive category income” or, in the case of certain U.S. Holders, “general category income” for U.S. foreign tax credit limitation purposes.
Sale, Exchange or Other Disposition of ADSs or Ordinary Shares.Subject to the discussion under “—Passive“-Passive Foreign Investment Company Rules” below, upon the sale, exchange or other disposition of ADSs or ordinary shares, a U.S. Holder generally will recognize capital gain or loss equal to the difference between the amount realized upon the sale, exchange or other disposition and the adjusted tax basis of the U.S. Holder in the ADSs or ordinary shares. A U.S. Holder’s tax basis in an ADS or an ordinary share will be, in general, the price it paid for that ADS or ordinary share. The capital gain or loss generally will be long-term capital gain or loss if, at the time of sale, exchange or other disposition, the U.S. Holder has held the ADS or ordinary share for more than one year. Net long-term capital gains of noncorporate U.S. Holders, including individuals, are eligible for reduced rates of taxation. The deductibility of capital loss is subject to limitations. Any gain or loss that a U.S. Holder recognizes generally will be treated as gain or loss from sources within the United States for U.S. foreign tax credit limitation purposes.
Passive Foreign Investment Company Rules.We believe that we were not a passive foreign investment company for 2007. Based on the projected composition of our income, the timing of our anticipated capital expenditures and valuation of our assets, we do not expect to be a passive foreign investment company for 2008 and do not expect to become one in the future, although this may change.
In general, we will be deemed to be a passive foreign investment company for any taxable year in which either (i) at least 75% of our gross income is passive income or (ii) at least 50% of the value (determined on the basis of a quarterly average) of our assets is attributable to assets that produce or are held for the production of passive income. For this purpose, passive income generally includes dividends, interest, royalties, rents (other than rents and royalties derived in the active conduct of a trade or business and not derived from a related person), annuities and gains from assets that produce passive income.
If we are a PFIC in any taxable year, unless a mark-to-market election described below is made, U.S. Holders will generally be subject to additional taxes and interest charges on certain “excess” distribution we make and on any gain realized on the disposition or deemed disposition of ADSs or ordinary shares regardless of whether we continue to be a PFIC in the year of the “excess” distribution or disposition. Distributions in respect of a U.S. Holder’s ADSs or ordinary shares during the taxable year will generally constitute “excess” distributions if, in the aggregate, they exceed 125% of the average amount of distributions in respect of the U.S. Holder’s ADSs or ordinary shares over the three preceding taxable years or, if shorter, the portion of the U.S. Holder’s holding period before such taxable year.


To compute the tax on “excess” distributions or any gain, (i) the “excess” distribution or the gain will be allocated ratably to each day in the holding period; (ii) the amount allocated to the current year and any tax year before we became a PFIC will be taxed as ordinary income in the current year; (iii) the amount allocated to other taxable years will be taxable at the highest applicable marginal rate in effect for that year; and (iv) an interest charge at the rate for underpayment of taxes will be imposed with respect to any portion of the “excess” distribution or gain described under (iii) above that is allocated to such other taxable years. In addition, if we are PFIC, no distribution will qualify for taxation at the preferential rate for non-corporate holders discussed in “—Distributions“-Distributions on ADSs or Ordinary Shares” above.
If we are a PFIC in any year in which our ADSs or ordinary shares are “marketable”, a U.S. Holder will be able to avoid the “excess” distribution rules described above if such U.S. Holder makes a timely “mark-to-market” election with respect to its ADSs or ordinary shares. The ADSs or ordinary shares will be “marketable” as long as they remain regularly traded on a national securities exchange, such as the New York Stock Exchange or the Hong Kong Stock Exchange. If this election is made in a timely fashion, the U.S. Holder will generally recognize as ordinary income or ordinary loss the difference between the fair market value of the ADSs or ordinary shares on the last day of any taxable year and the U.S. Holder’s adjusted tax basis in the ADSs or ordinary shares. Any ordinary income resulting from this election will generally be taxed at ordinary income rates. Any ordinary losses will be deductible only to the extent of the net amount of previously included income as a result of the mark-to-market election, if any. The U.S. Holder’s adjusted tax basis in the ADSs or ordinary shares will be adjusted to reflect any such income or loss.
Alternatively, the “excess distribution” rules described above may generally be avoided by electing to treat us as a “Qualified Electing Fund,” or QEF, under Section 1295 of the Internal Revenue Code of 1986, as amended. A QEF election is available only if the U.S. Holder receives an annual information statement from the PFIC setting forth its ordinary earnings and net capital gains, as calculated for U.S. federal income tax purposes. We will not provide our U.S. Holders with the information statement necessary to make a QEF election. Accordingly, U.S. Holders will not be able to make or maintain such an election.

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A U.S. Holder is urged to consult its own tax advisors concerning the availability of making a mark-to-market election or a qualified electing fund election and the U.S. federal income tax consequences of holding the ADSs or ordinary shares if we are deemed to be a passive foreign investment company in any taxable year.
Information Reporting and Backup Withholding.In general, unless a U.S. Holder belongs to a category of certain exempt recipients (such as corporations), information reporting requirements will apply to distributions on ADSs or ordinary shares made within the United States and to the proceeds of sales of ADSs or ordinary shares that are effected through the U.S. office of a broker or the non-U.S. office of a broker that has certain connections with the United States. Backup withholding currently imposed at a rate of 28% may apply to these payments if a U.S. Holder fails to provide a correct taxpayer identification number or certification of exempt status, fails to report in full dividend and interest income or, in certain circumstances, fails to comply with applicable certification requirements.
Any amounts withheld under the backup withholding rules may generally be allowed as a refund or a credit against a U.S. Holder’s U.S. federal income tax, provided the U.S. Holder furnishes the required information to the Internal Revenue Service in a timely manner.
Cayman Islands Taxation
The following summary constitutes the opinion of Conyers Dill & Pearman to the material Cayman Islands tax consequences of acquiring, owning, and transferring our ADSs and ordinary shares.


The Cayman Islands currently levy no taxes on individuals or corporations based upon profits, income, gains or appreciation and there is no taxation in the nature of inheritance tax or estate duty. You will not be subject to Cayman Islands taxation on payments of dividends or upon the repurchase by us of your ADSs or ordinary shares. In addition, you will not be subject to withholding tax on payments of dividends or distributions, including upon a return of capital, nor will gains derived from the disposal of ADSs or ordinary shares be subject to Cayman Islands income or corporation tax.
No Cayman Islands stamp duty will be payable by you in respect of the issue or transfer of ADSs or ordinary shares. However, an instrument transferring title to an ADS, if brought to or executed in the Cayman Islands, would be subject to Cayman Islands stamp duty. The Cayman Islands are not party to any double taxation treaties. There are no exchange control regulations or currency restrictions in the Cayman Islands.
We were incorporated under the laws of the Cayman Islands as an exempted company and, as such, obtained an undertaking in April 2000 from the Governor in Council of the Cayman Islands substantially that, for a period of twenty years from the date of such undertaking, no law which is enacted in the Cayman Islands imposing any tax to be levied on profit or income or gains or appreciation shall apply to us and no such tax and no tax in the nature of estate duty or inheritance tax will be payable, either directly or by way of withholding, on our ADSs or ordinary shares.
Documents on Display
We are subject to the information requirements of the Securities Exchange Act of 1934, as amended. In accordance with these requirements, we file reports and other information with the Securities and Exchange Commission. These materials, including this annual report and the exhibits thereto, may be inspected and copied at the Commission’s Public Reference Room at 450 Fifth100 F Street, N.W.N.E., Washington, D.C. 20549. The public may obtain information on the operation of the Commission’s Public Reference Room by calling the Commission in the United States at 1-800-SEC-0330. The Commission also maintains a website athttp://www.sec.gov that contains reports, proxy statements and other information regarding registrants that file electronically with the Commission. In addition, material filed by us can be inspected at the offices of the New York Stock Exchange at 20 Broad Street, New York, New York 10005.

 

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Item 11. Quantitative and Qualitative Disclosures About Market Risk
Market risk is the risk of loss related to adverse changes in market prices, including foreign currency exchange rates and interest rates of financial instruments. We are exposed to these risks in the ordinary course of our business. Our exposure to these risks derives primarily from changes in interest rates and foreign currency exchange rates. To mitigate some of these risks, we utilize spot, forward, and derivative financial instruments.
Foreign Exchange Rate Fluctuation Risk
Our revenue, expense, and capital purchasing activities are primarily transacted in U.S. dollars. However, since we have operations consisting of manufacturing, sales activities and capital purchasing outside of the U.S., we enter into transactions in other currencies. We are primarily exposed to changes in exchange rate for the Euro, Japanese Yen, and Rmb.
To minimize these risks, we purchase foreign-currency forward exchange contracts with contract terms normally lasting less than sixtwelve months to protect against the adverse effect that exchange rate fluctuations may have on foreign-currency denominated activities. These forward exchange contracts are principally denominated in Rmb, Japanese Yen or Euros, and do not qualify for hedge accounting in accordance with SFAS No. 133.accounting. As of December 31, 2008,2010, we had outstanding foreign currency forward exchange contracts with notional amounts of US$220.792.8 million. As of December 31, 2008,2010, the fair value of foreign currency forward exchange contracts was approximately a lossgain of US$3.50.2 million, which is recorded in other expenseincome and other currentliabilities. We had US$220.7 million of foreign currency exchange contracts outstanding as of December 31, 2008.current assets.
We do not enter into foreign currency exchange contracts for speculative purposes. See “Risk Factors—RisksFactors-Risks Related to Our Financial Condition and Business—ExchangeBusiness-Exchange rate fluctuations could increase our costs, which could adversely affect our operating results and the value of our ADSs” and “—Risks“-Risks Related to Conducting Operations in China—DevaluationChina-Devaluation or appreciation in the value of the Renminbi or restrictions on convertibility of the Renminbi could adversely affect our business and operating results.”
                
 As of December 31, 2008  As of December 31, 2010
 Expected maturity date  (in US$ thousands)
 (in US$ thousands)  Notional  
 Unrealized  Amount  
 2008 Fair Value  2010 Fair Value
Forward Exchange Agreement
  
(Receive RMB/Pay US$)  
Contract Amount 189,543  (3,069) 82,685 305 
(Receive EUR/Pay US$)  
Contract Amount 31,144  (441) 10,175  (90)
         
Total Contract Amount 220,687  (3,510) 92,860 215 
         
Cross Currency Swap Fluctuation Risk
On December 15, 2005, the Company entered into a long-term loan facility agreement in the aggregate principal amount of EUR 85 million. The company is primarily exposed to changes in the exchange rate for the Euro.
To minimize the risk, the company entered into cross currency swap contracts with a contract term fully matching the repayment schedule of the long-term loan to protect against the adverse effect of exchange rate fluctuations arising from foreign-currency denominated loans. The cross currency swap contract does not qualify for hedge accounting in accordance with SFAS No. 133.ASC 815.
For the portion of the Euro long-term loan that is not covered by cross currency swap contracts, we have separately entered into foreign exchange forward contracts to minimize the currency risk. These foreign exchange forward contracts do not qualify for hedge accounting in accordance with SFAS No.133.ASC 815.
As of December 31, 2008,2010, the Company had outstanding cross currency swap contracts with notional amounts of US$36.711.3 million. Notional amounts are stated in the U.S. dollar equivalents at spot exchange rates as of the respective dates. As of December 31, 2008,2010, the fair value of cross currency swap contracts was approximately a loss of US$0.36 million, which is recorded in other income and other current assets. We had US$36.7 million of cross currency swap contracts outstanding as of December 31, 2008, all of which will mature in 2012.1.3 million.

 

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Interest Rate Risk
Our exposure to interest rate risks relates primarily to our long-term debt obligations, which we generally assume to fund capital expenditures and working capital requirements. The table below presents annual principal amounts due and related weighted average implied forward interest rates by year of maturity for our debt obligations outstanding as of December 31, 2008.2010. Our long-term debt obligations are all subject to variable interest rates. The interest rates on our U.S. dollar-denominated loans are linked to the LIBOR rate, while our EUR-denominated loans have interest rates linked to the EURIBOR rates. As a result, the interest rates on our loans are subject to fluctuations in the underlying interest rates to which they are linked.
                            
 As of December 31,  As of December 31,
 2009 2010 2011 2012 2013  2011 2012
 (Forecast)  (Forecast)
 (in US$ thousands, except percentages)  (in US$ thousands, except percentages)
US$ denominated
  
Average balance 754,059 361,029 133,435 37,225   310,181 103,738 
Average interest rate  1.83%  1.81%  2.03%  2.22%    2.04%  2.26%
EUR denominated
  
Average balance 46,551 29,789 16,201 3,245   15,388 3,245 
Average interest rate  1.99%  2.01%  2.10%  2.48%    1.61%  1.96%
Weighted average forward interest rate
  1.89%  1.89%  2.13%  2.32%    2.01%  2.25%


Item 12. Description of Securities Other Than Equity Securities
Not applicable.American Depository Shares
Fees and Charges That An ADR Holder May Have To Pay
Category
(as defined by SEC)Depositary ActionsAssociated Fee
(a) Depositing or substituting
the underlying shares
Each person to whom ADSs are issued against deposits of Shares, including deposits in respect of Share Distributions, Rights and Other Distributions (as such terms are defined in paragraph (10) of the Deposit Agreement as filed with the SEC on March 10, 2004 which we are referred to herein as the “Depositary Agreement”)$5.00 for each 100 ADSs (or portion thereof) evidenced by the new ADRs delivered
(b) Receiving or distributing dividendsDistribution of dividends$0.02 or less per ADS (or portion thereof)
(c) Selling or exercising rightsDistribution or sale of securitiesSuch fee being in an amount equal to the fee for the execution and delivery of ADSs referred to above which would have been charged as a result of the deposit of such securities
(d) Withdrawing an underlying securityEach person surrendering ADSs for withdrawal of Deposited Securities$5.00 for each 100 ADSs (or portion thereof) surrendered.
(e) Transferring, splitting or grouping receipts;Transfers, combining or grouping of depositary receipts$1.50 per ADR
(f) General depositary services, particularly those charged on an annual basis.Not applicableNot applicable
(g) Expenses of the depositaryFees and expenses incurred by the Depositary (including without limitation expenses incurred on behalf of Holders in connection with compliance with foreign exchange control regulations or any law or regulation relating to foreign investment) in delivery of Deposited Securities or otherwise in connection with the Depositary’s or its Custodian’s compliance with applicable law, rule or regulation.The Company will pay all other charges and expenses of the Depositary and any agent of the Depositary (except the Custodian) pursuant to agreements from time to time between the Company and the Depositary, except (i) stock transfer or other taxes and other governmental charges (which are payable by Holders or persons depositing Shares), (ii) cable, telex and facsimile transmission and delivery charges incurred at the request of persons depositing, or Holders delivering Shares, ADRs or Deposited Securities (which are payable by such persons or Holders), (iii) transfer or registration fees for the registration of transfer of Deposited Securities on any applicable register in connection with the deposit or withdrawal of Deposited Securities (which are payable by persons depositing Shares or Holders withdrawing Deposited Securities; there are no such fees in respect of the Shares as of the date of the Deposit Agreement), and


Category
(as defined by SEC)Depositary ActionsAssociated Fee
(iv) expenses of the Depositary in connection with the conversion of foreign currency into U.S. dollars (which are paid out of such foreign currency). These charges may be changed in the manner indicated in paragraph (16) of the Depositary Agreement
Fees and Payments Made By The Depositary To The Company
DIRECT
PAYMENTS
J.P. Morgan, as depositary, has agreed to reimburse certain reasonable Company expenses related to the Company’s ADR Program and incurred by the Company in connection with the Program. In the year ended 2010, the total reimbursed amount was $18,730 among which $10,000 was for investor relations, and $8,730 was for broker reimbursement. The amounts the depositary reimbursed are not perforce related to the fees collected by the depositary from ADR holders.
INDIRECT
PAYMENTS
As part of its service to the Company, J.P. Morgan has agreed to waive $120,000 annually for on-going ADR Program maintenance. The table below sets forth the fees that J.P. Morgan has agreed to waive and/or expenses that J.P. Morgan has agreed to pay in the year ended December 31, 2010.
     
  Amount Waived or Paid for Fiscal
  Year Ended December
Category of Expenses 31, 2010
Third-party expenses paid directly $ 
Fees waived $120,000 
PART II
Item 13. Defaults, Dividend Arrearages, and Delinquencies
None.

101


Item 14. Material Modifications to the Rights of Security Holders and Use of Proceeds
Not applicable.


Item 15. Controls and Procedures
Disclosure Controls and Procedures
Our Chief Executive Officer and our Acting Chief Financial and Accounting Officer have evaluated the effectiveness of our disclosure controls and procedures (as defined in Rules 13a-15(e) and 15d-15(e) of the Securities Exchange Act of 1934). They have concluded that as of December 31, 2008,2010, our disclosure controls and procedures were adequate and effective to ensure that material information relating to us and our consolidated subsidiaries was made known to them by others within our company and our consolidated subsidiaries.effective.
Report By Management On Internal Control Over Financial Reporting
OurThe management of Semiconductor Manufacturing International Corporation (“SMIC”) is responsible for establishing and maintaining adequate internal control over financial reporting, as such term is defined in Rule 13a-15(f) under the Securities Exchange Act of 1934, as amended, for our company. Internalreporting. SMIC’s internal control over financial reporting is a processsystem was designed to provide reasonable assurance to our management and board of directors regarding the reliability of financial reporting and the preparation and fair presentation of consolidated financial statements issued for external purposes in accordance with generally accepted accounting principles and includes those policies and procedures that (1) pertain to the maintenance of records that, in reasonable detail, accurately and fairly reflect the transactions and dispositions of a company’s assets, (2) provide reasonable assurance that transactions are recorded as necessary to permit preparation of consolidated financial statements in accordance with generally accepted accounting principles, and that a company’s receipts and expenditures are being made only in accordance with authorizations of a company’s management and directors, and (3) provide reasonable assurance regarding prevention or timely detection of unauthorized acquisition, use, or disposition of a company’s assets that could have a material effect on the consolidated financial statements.principles.
Because of its inherent limitations, a system ofAll internal control over financial reporting can provide only reasonable assurance with respect to consolidated financial statement preparation and presentationsystems, no matter how well designed, have inherent limitations and may not prevent or detect misstatements. Also, projections of any evaluation of effectivenessTherefore, even those systems determined to future periods are subjectbe effective can only provide reasonable assurance with respect to the risk that controls may become inadequate because of changes in conditions, or that the degree of compliance with the policies or procedures may deteriorate.financial reporting reliability and financial statement preparation and presentation.
As required by Section 404 of the Sarbanes-Oxley Act of 2002 and related rules as promulgated by the Securities and Exchange Commission,SMIC management assessed the effectiveness of the internal control over financial reporting as of December 31, 2008 using2010. In making this assessment, we used the criteria established in “Internal Control-Integrated Framework” issuedset forth by the Committee of Sponsoring Organizations of the Treadway Commission.
Commission (the COSO criteria) in Internal Control — Integrated Framework. Based on thisour assessment management concludedwe believe that, theas of December 31, 2010, our internal control over financial reporting wasis effective as of December 31, 2008 based on the criteria established in “Internal Control-Integrated Framework” issued by the Committee of Sponsoring Organizations of the Treadway Commission.COSO criteria.
Attestation Report of the Registered Public Accounting Firm
The effectiveness of internal control over financial reporting as of December 31, 20082010 has been audited by our independent registered public accounting firm, Deloitte Touche Tohmatsu as stated in its report (See F-2).
Changes In Internal Control Over Financial Reporting
In 20082009, Management identified material weaknesses related to the following:
the control procedures to ensure adequate communication occurs among internal functions so that proper accounting analysis is conducted by those charged with financial reporting and accounting prior to closing the financial accounts and that all relevant information relating to non-routine transactions and significant accounting estimates known to senior management and other internal functions is communicated timely to those charged with the responsibility of financial reporting and maintaining the Company’s books and records did not operate effectively.
     During 2010, Management has taken the following steps to remedy the identified material weaknesses:
added additional internal control procedures to ensure regular and timely communications among the financial accounting and reporting functions and other departments, including operational functions as well as legal and administrative personnels;
increased our in-house expertise and reporting capabilities through regular training for our accounting and operational personnel; and
designated managers and staff to timely research and analyze non-routine transactions and significant accounting estimates and added internal control procedures for the documentation of such research and analysis.
     Except for the changes mentioned above, there were no other changes in the design in our internal controlcontrols over financial reporting that occurred during the period covered by this annual report that have materially affected, or are reasonably likely to materially affect, our internal controlcontrols over financial reporting.


Item 16A. Audit Committee Financial Expert
Our board has determined that Mr. Lip-Bu Tan is an audit committee financial expert as defined under the applicable rules of the SEC issued pursuant to Section 407 of the Sarbanes-Oxley Act of 2002. Mr. Tan is independent as such term is defined under Section 303A.02 of the New York Stock Exchange Listed Company Manual.

102


Item 16B. Code of Ethics
Item 16B. Code of Ethics
We have adopted a Code of Business Conduct and Ethics which is applicable to all of our employees, including our Chief Executive Officer, Acting Chief Financial and Accounting Officer, and any other persons performing similar functions.
Our Code of Business Conduct and Ethics is available, free of charge, to any person who sends a request for a paper copy to us at Semiconductor Manufacturing International Corporation, 18 Zhangjiang Road, Pudong New Area, Shanghai, China 201203, Attention: Investor Relations.
Item 16C. Principal Accountant Fees and Services
The following table sets forth the aggregate audit fees, audit-related fees, tax fees and all other fees we paid or incurred for audit services, audit-related services, tax services and other services rendered by our principal accountants during the fiscal years ended December 31, 20072009 and December 31, 2008.2010.
                
 2007 2008  2009 2010
Audit Fees US$1,533,000 US$1,584,925  US $1,291,969 US $1,250,000
Audit-Related Fees US$152,358   US $— US $—
Tax Fees US$12,935   US $— US $—
 
Total US$1,698,293 US$1,584,925  US $1,291,969 US $1,250,000
Audit fees consist of the standard work associated with U.S. GAAP and statutory audits of our annual financial statements including the review of our quarterly financial results and filings with the Securities and Exchange Commission, Hong Kong Stock Exchange and other regulators.
Audit-related fees include services relating to our compliance with the requirements of the Sarbanes-Oxley Act and services relating to our resolution of SEC related comments.
Tax services include tax compliance, tax advice, tax planning and transfer pricing with respect to the various regulations to which we are subject.
The audit committee has approved all audit-related services performed by Deloitte Touche Tohmatsu, 35/F, One Pacific Place, 88, Queensway, Hong Kong. The audit committee has also approved and will continue to consider, on a case-by-case basis, all non-audit services. According to the charter of our audit committee, before our principal accountants are engaged by us to render audit or non-audit services, the engagement, including the nature and scope of the work to be performed and the associated fees, must be approved by our audit committee. Our audit committee has not established any pre-approval policies and procedures.


Item 16D. Exemptions from the Listing Standards of Audit Committees
Not applicable.
Item 16E. Purchases of Equity Securities by the Issuer and Affiliated Purchasers
Pursuant to the terms of our 2001 Stock Plan, 2001 Preference Shares Stock Plan, 2001 Regulation S Stock Plan and 2001 Regulation S Preference Shares Stock Plan recipients of stock options to purchase our ordinary shares are entitled to early exercise their options, subject to our right of repurchase. When employees, directors, or service providers who have early exercised their options terminate their employment with us, we may repurchase the unvested shares subject to the option, at a price which is the lower of the exercise price of the option and the fair market value of our ordinary shares as of the date of repurchase. Other than repurchases of unvested shares upon termination of employment pursuant to these employee stock option plans, we have not repurchased any of our outstanding capital stock during 2008.2010.

103


Item 16G. Corporate Governance
We are incorporated under the laws of the Cayman Islands. The principal trading market for our shares is the Hong Kong Stock Exchange. We have adopted a set of corporate governance guidelines in accordance with the applicable laws, rule and regulations, including our Corporate Governance Policy and our Code of Business Conduct and Ethics, each of which are posted on our website.
Because our American Depositary Shares are registered with the United States Securities and Exchange Commission and are listed on the New York Stock Exchange, or the NYSE, we are also subject to certain U.S. corporate governance requirements, including many of the provisions of the Sarbanes-Oxley Act of 2002. However, because we are a “foreign private issuer”, many of the corporate governance rules in the NYSE Listed Company Manual, or the NYSE Standards, do not apply to us. We are permitted to follow corporate governance practices in accordance with Cayman Islands law and the Hong Kong Stock Exchange Listing Rules in lieu of most of the corporate governance standards contained in the NYSE Standards.
Set forth below is a brief summary of the significant differences between our corporate governance practices and the corporate governance standards applicable to U.S. domestic companies listed on the NYSE, or U.S. domestic issuers:
  The NYSE Standards require U.S. domestic issuers to have a nominating/corporate governance committee composed entirely of independent directors. We are not subject to this requirement, and we have not established a nominating/corporate governance committee.
 
  The NYSE Standards provide detailed tests that U.S. domestic issuers must use for determining independence of directors. While we may not specifically apply the NYSE tests, our board assesses independence in accordance with Hong Kong Stock Exchange Listing Rules, and in the case of audit committee members in accordance with Rule 10A-3 under the U.S. Securities and Exchange Act of 1934, as amended, and considers whether there are any relationships or circumstances which are likely to affect such director’s independence from management.
 
  We believe that the composition of our board and its committees and their respective duties and responsibilities are otherwise generally responsive to the relevant NYSE Standards applicable to U.S. domestic issuers. However, the charters for our audit and compensation committees may not address all aspects of the NYSE Standards. For example, NYSE Standards require compensation committees of U.S. domestic issuers to produce a compensation committee report


annually and include such report in their annual proxy statements or annual reports on Form 10-K. We are not subject to this requirement, and we have not addressed this in our compensation committee charter. We disclose the amounts of compensation of our directors on a named basis and the five highest individuals on an aggregate basis in our annual report in accordance with the requirements of the Hong Kong Stock Exchange Listing Rules.
 
  The NYSE Standards require that shareholders must be given the opportunity to vote on all equity compensation plans and material revisions to those plans. We comply with the requirements of Cayman Islands law and the Hong Kong Stock Exchange Listing Rules in determining whether shareholder approval is required, and we do not take into consideration the NYSE’s detailed definition of what are considered “material revisions.”
The above summary is not a detailed, item-by-item analysis of the differences between our corporate governance practices and the corporate governance standards applicable to U.S. domestic issuers, but rather is intended to provide our U.S. shareholders with a brief, general summary of the significant ways that our corporate governance practices differ from those of a U.S. domestic issuer.

 

104


PART III
Item 17. Financial Statements
We have elected to provide the financial statements and related information specified in Item 18 in lieu of Item 17.
Item 18. Financial Statements
See pages F-1 to F-80.F-50.


Item 19. Exhibits
   
Exhibit 1.1 Eleventh Amended and Restated Articles of Association, as adopted at the Registrant’s annual general meeting of shareholders on June 2, 2008(1)
   
Exhibit 4.1 Settlement Agreement dated January 31, 2005 by and between Semiconductor Manufacturing International Corporation and Taiwan Semiconductor Manufacturing Corporation, Ltd., including Patent License Agreement(2)
   
Exhibit 4.2 English language summary of Chinese language Syndicate Loan Agreement dated May 26, 2005, between Semiconductor Manufacturing International (Beijing) Corporation, Semiconductor Manufacturing International Corporation, as guarantor, and China Development Bank, China Construction Bank, Bank of China, Agricultural Bank of China, China Merchants Bank, HuaXia Bank, China Mingsheng Bank, Bank of Communications, Bank of Beijing, Industrial and Commercial Bank of China (Asia) and CITIC Ka Wah Bank(2)
   
Exhibit 4.3 Form of Indemnification Agreement, as adopted at the Registrant’s annual general meeting of shareholders on May 6, 2005(2)
   
Exhibit 4.4 Form of Service Contract between the Company and each of its executive officers(3)
   
Exhibit 4.5 Form of Service Contract between the Company and each of its directors(3)
   
Exhibit 4.6 English language summary of Chinese language Syndicate Loan Agreement dated May 31, 2006, between Semiconductor Manufacturing International (Tianjin) Corporation, Semiconductor Manufacturing International Corporation, as guarantor, and China Construction Bank, China Minsheng Bank, China Development Bank, Industrial and Commercial Bank of China, Agricultural Bank of China, Bank of China, China Merchants Bank, China Bo Hai Bank, Bank of Communications and Bangkok Bank(3)(4)
   
Exhibit 4.7 English language summary of Chinese language Syndicate Loan Agreement dated June 8, 2006, between Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International Corporation, as guarantor, and ABN AMRO Bank N.V., Bank of China (Hong Kong) Limited, Bank of Communications, The Bank of Tokyo-Mitsubishi UFJ, Ltd., China Construction Bank, DBS Bank Ltd., Fubon Bank (Hong Kong) Limited, Industrial and Commercial Bank of China and Shanghai Pudong Development Bank(3)(4)
   
Exhibit 4.8 Share Purchase Agreement, dated November 6, 2008, by and between the Company and Datang Telecom Technology & Industry Holdings Limited Co., Ltd.(4)(5)
   
Exhibit 4.9 English language translation of Strategic Cooperation Agreement, dated December 24, 2008 by and between the Company and Datang Telecom Technology & Industry Holdings Co., Ltd.(5)(6)
Exhibit 4.10Settlement Agreement dated November 9, 2009 by and between the Company and Taiwan Semiconductor Manufacturing Corporation, Ltd., including Share and Warrant Agreements(7)
Exhibit 4.11Placing Agreement dated July 8, 2010 by and between the Company as the Issuer and J.P. Morgan (Asia Pacific) Limited and The Royal Bank of Scotland N.V., Hong Kong Branch as placing agents.
Exhibit 4.12Subscription Agreement with Datang Telecom Technology & Industry Holdings Co., Ltd. dated August 16, 2010
Exhibit 4.13Subscription Agreement with Country Hill Limited, a wholly-owned subsidiary of China Investment Corporation dated April 18, 2011
Exhibit 4.14Further Subscription Agreement with Datang Holdings (Hongkong) Investment Company Limited, a wholly-owned subsidiary of Datang Telecom Technology & Industry Holdings Co., Ltd., dated May 5, 2011
Exhibit 4.15English language translation of Chinese language Joint Venture Agreement and Joint Venture Memorandum dated May 12, 2011, between Semiconductor Manufacturing International Corporation and Hubei Science & Technology Investment Group Co., Ltd.
   
Exhibit 8.1 List of Subsidiaries
   
Exhibit 12.1 Certification of CEO under Section 302 of the U.S. Sarbanes-Oxley Act of 2002
   
Exhibit 12.2 Certification of Acting CFO under Section 302 of the U.S. Sarbanes-Oxley Act of 2002
   
Exhibit 13.1 Certification of CEO and Acting CFO under Section 906 of the U.S. Sarbanes-Oxley Act of 2002
   
Exhibit 99.1 Consent of Deloitte Touche Tohmatsu

105


   
Exhibit 101.INSXBRL Instance Document
Exhibit 101.SCHXBRL Taxonomy Extension Schema Document
Exhibit 101.CALXBRL Taxonomy Extension Calculation Linkbase Document
Exhibit 101.DEFXBRL Taxonomy Extension Definition Linkbase Document
Exhibit 101.LABXBRL Taxonomy Extension Label Linkbase Document
Exhibit 101.PREXBRL Taxonomy Extension Presentation Linkbase Document
(1) Previously filed as an exhibit to the Registrant’s Annual Report on Form 20F for the fiscal year ended December 31, 2007, filed June 27, 2008 and amended November 28, 2008.
 
(2) Previously filed as an exhibit to the Registrant’s Annual Report on Form 20F for the fiscal year ended December 31, 2004, filed June 28, 2005. With respect to Exhibit 4.1, please refer to Item 8 “Litigation” in the Registrant’s Annual Report on Form 20F for the fiscal year ended December 31, 2008.
 
(3)Previously filed as an exhibit to the Registrant’s Annual Report on Form 20F for the fiscal year ended December 31, 2008, filed June 22, 2009.
(4) Previously filed as an exhibit to the Registrant’s Annual Report on Form 20F for the fiscal year ended December 31, 2005, filed June 28, 2006.
 
(5)Previously filed as an exhibit to the Registrant’s Form 6-K dated January 5, 2009. Portions of this exhibit were omitted and filed separately with the Commission pursuant to Rule 24b-2 of the Securities Exchange Act of 1934, as amended, concerning confidential treatment.
(6)Previously filed as an exhibit to the Registrant’s Form 6-K dated January 5, 2009. Portions of this exhibit were omitted and filed separately with the Commission pursuant to Rule 24b-2 of the Securities Exchange Act of 1934, as amended, concerning confidential treatment.
(7)Previously filed as an exhibit to the Registrant’s Annual Report on Form 20F for the fiscal year ended December 31, 2009, filed June 29, 2010.


(4) Previously filed as an exhibit to the Registrant’s Form 6-K dated November 17, 2008. Portions of this exhibit were omitted and filed separately with the Commission pursuant to Rule 24b-2 of the Securities Exchange Act of 1934, as amended, concerning confidential treatment.
 
(5) Previously filed as an exhibit to the Registrant’s Form 6-K dated January 5, 2009. Portions of this exhibit were omitted and filed separately with the Commission pursuant to Rule 24b-2 of the Securities Exchange Act of 1934, as amended, concerning confidential treatment.

 

106


SIGNATURES
The registrant hereby certifies that it meets all of the requirements for filing on Form 20-F and that it has duly caused and authorized the undersigned to sign this annual report on its behalf.
SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
Date: June 28, 2011By:/s/ David NK Wang
     
 SEMICONDUCTOR MANUFACTURING
INTERNATIONAL CORPORATION
 
 
Date: June 22, 2009 By:  /s/ Richard Ru Gin Chang  Name: David NK Wang
  Name:  Richard Ru Gin Chang 
  Title: President and Chief Executive Officer

 

107


INDEX TO FINANCIAL STATEMENTS
     
Contents Page(s) 
 
  F-2 
 
  F-3
 
  F-4F-5 
F-6
 
  F-5F-8 
 
  F-6F-9 
 
  F-8F-11 
 
  F-75F-47 

F-1


REPORT OF INDEPENDENT REGISTERED PUBLIC ACCOUNTING FIRM
To the Board of Directors and Stockholders of Semiconductor Manufacturing International Corporation:TO THE BOARD OFDIRECTORS AND STOCKHOLDERS OF
SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
We have audited the accompanying consolidated balance sheets of Semiconductor Manufacturing International Corporation and subsidiaries (the “Company”) as of December 31, 2008, 20072010, 2009 and 2006,2008, and the related consolidated statements of operations, stockholders’ equity and comprehensive income (loss), and cash flows for each of the three years in the period ended December 31, 2008. Our audit also included2010, and the related financial statement schedule. These financial statements and financial statement schedule included in Schedule I. We also have auditedare the responsibility of the Company’s internal control over financial reporting as of December 31, 2008, based on criteria established in Internal Control — Integrated Framework issued by the Committee of Sponsoring Organizations of the Treadway Commission. The Company’s management is responsible for these financial statements, for maintaining effective internal control over financial reporting, and for its assessment of the effectiveness of internal control over financial reporting, included in the accompanying Report by Management on Internal Control over Financial Reporting.management. Our responsibility is to express an opinion on these financial statements and an opinion on the Company’s internal control over financial reportingstatement schedule based on our audits.
We conducted our audits in accordance with the standards of the Public Company Accounting Oversight Board (United States). Those standards require that we plan and perform the audit to obtain reasonable assurance about whether the financial statements are free of material misstatementmisstatement. An audit includes examining, on a test basis, evidence supporting the amounts and disclosures in the financial statements. An audit also includes assessing the accounting principles used and significant estimates made by management, as well as evaluating the overall financial statement presentation. We believe that our audits provide a reasonable basis for our opinion.
In our opinion, such consolidated financial statements present fairly, in all material respects, the financial position of Semiconductor Manufacturing International Corporation and subsidiaries as of December 31, 2010, 2009 and 2008, and the results of their operations and their cash flows for each of the three years in the period ended December 31, 2010, in conformity with accounting principles generally accepted in the United States of America. Also, in our opinion, such financial statement schedule, when considered in relation to the basic consolidated financial statements taken as whole, present fairly, in all material respects, the information set forth therein.
We have also audited, in accordance with the standards of the Public Company Accounting Oversight Board (United States), the Company’s internal control over financial reporting as of December 31, 2010, based on the criteria established inInternal Control — Integrated Frameworkissued by the Committee of Sponsoring Organizations of the Treadway Commission and our report dated March 30, 2011 expressed an unqualified opinion on the Company’s internal control over financial reporting.
Deloitte Touche Tohmatsu
Certified Public Accountants
Hong Kong
March 30, 2011, except for Note 30, as to which the date is June 28, 2011.

F-2


REPORT OF INDEPENDENT REGISTERED PUBLIC ACCOUNTING FIRM
TO THE BOARD OFDIRECTORS AND STOCKHOLDERS OF
SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
We have audited the internal control over financial reporting of Semiconductor Manufacturing International Corporation and subsidiaries (the “Company”) as of December 31, 2010, based on the criteria established inInternal Control — Integrated Frameworkissued by the Committee of Sponsoring Organizations of the Treadway Commission. The Company’s management is responsible for maintaining effective internal control over financial reporting and for its assessment of the effectiveness of internal control over financial reporting, included in the accompanying Report by Management on Internal Control over Financial Reporting. Our responsibility is to express an opinion on the Company’s internal control over financial reporting based on our audit.
We conducted our audit in accordance with the standards of the Public Company Accounting Oversight Board (United States). Those standards require that we plan and perform the audit to obtain reasonable assurance about whether effective internal control over financial reporting was maintained in all material respects. Our audits of the financial statements included examining, on a test basis, evidence supporting the amounts and disclosures in the financial statements, assessing the accounting principles used and significant estimates made by management, and evaluating the overall financial statement presentation. Our audit of internal control over financial reporting included obtaining an understanding of internal control over financial reporting, assessing the risk that a material weakness exists, and testing and evaluating the design and operating effectiveness of internal control based on the assessed risk. Our audits also includedrisk, and performing such other procedures as we considered necessary in the circumstances. We believe that our audits provideaudit provides a reasonable basis for our opinions.opinion.
A company’s internal control over financial reporting is a process designed by, or under the supervision of, the company’s principal executive and principal financial officers, or persons performing similar functions, and effected by the company’s board of directors, management, and other personnel to provide reasonable assurance regarding the reliability of financial reporting and the preparation of financial statements for external purposes in accordance with generally accepted accounting principles. A company’s internal control over financial reporting includes those policies and procedures that (1) pertain to the maintenance of records that, in reasonable detail, accurately and fairly reflect the transactions and dispositions of the assets of the company; (2) provide reasonable assurance that transactions are recorded as necessary to permit preparation of financial statements in accordance with generally accepted accounting principles, and that receipts and expenditures of the company are being made only in accordance with authorizations of management and directors of the company; and (3) provide reasonable assurance regarding prevention or timely detection of unauthorized acquisition, use, or disposition of the company’s assets that could have a material effect on the financial statements.
Because of the inherent limitations of internal control over financial reporting, including the possibility of collusion or improper management override of controls, material misstatements due to error or fraud may not be prevented or detected on a timely basis. Also, projections of any evaluation of the effectiveness of the internal control over financial reporting to future periods are subject to the risk that the controls may become inadequate because of changes in conditions, or that the degree of compliance with the policies or procedures may deteriorate.

F-3


In our opinion, the consolidated financial statements referred to above present fairly, in all material respects, the financial position of Semiconductor Manufacturing International Corporation and subsidiaries as of December 31, 2008, 2007 and 2006 and the results of their operations and their cash flows for each of the three years in the period ended December 31, 2008, in conformity with accounting principles generally accepted in the United States of America. Also, in our opinion, such financial statement schedule, when considered in relation to the basic consolidated financial statements taken as whole, present fairly, in all material respects, the information set forth therein. Also, in our opinion, the Company maintained, in all material respects, effective internal control over financial reporting as of December 31, 2008,2010, based on the criteria established inInternal Control — Integrated Frameworkissued by the Committee of Sponsoring Organizations of the Treadway Commission.
As discussed We have also audited, in Note 2(s)accordance with the standards of the Public Company Accounting Oversight Board (United States), effective January 1, 2007,the consolidated financial statements as of and for the year ended December 31, 2010, of the Company adopted FASB Interpretation No. 48, “Accounting for Uncertainty in Income Taxes — an Interpretation of FASB Statement No. 109”.
Deloitte Touche Tohmatsu
Certified Public Accountants
Hong Kong
April 17, 2009,and our report dated March 30, 2011, except for Note 28 and Schedule I,30, as to which the date is June 22, 200928, 2011, which expressed an unqualified opinion on those financial statements.

Deloitte Touche Tohmatsu
Certified Public Accountants
Hong Kong
March 30, 2011

F-2F-4


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATIONConsolidated Statements of Operations
CONSOLIDATED BALANCE SHEETS
(In US dollars, except share data)
                 
      December 31, 
  NOTES  2008  2007  2006 
ASSETS
                
 
Current assets:                
Cash and cash equivalents     $450,229,569  $469,284,013  $363,619,731 
Restricted Cash      6,254,813       
Short-term investments  5   19,928,289   7,637,870   57,950,603 
Accounts receivable, net of allowances of $5,680,658, $4,492,090 and $4,048,845 at December 31, 2008, 2007 and 2006, respectively  7   199,371,694   298,387,652   252,184,975 
Inventories  8   171,636,868   248,309,765   275,178,952 
Prepaid expense and other current assets      56,299,086   31,237,755   20,766,945 
Receivable for sale of manufacturing equipment      23,137,764   17,321,000   70,544,560 
Assets held for sale  9      3,123,567   9,420,729 
              
Total current assets      926,858,083   1,075,301,622   1,049,666,495 
 
Land use rights, net  10   74,293,284   57,551,991   38,323,333 
 
Plant and equipment, net  11   2,963,385,840   3,202,957,665   3,244,400,822 
Acquired intangible assets, net  13   200,059,106   232,195,132   71,692,498 
Deferred cost, net  28   47,091,516   70,637,275   94,183,034 
Equity investment  14   11,352,186   9,896,398   13,619,643 
Other long-term prepayments      1,895,337   2,988,404   4,119,433 
Deferred tax assets  19   45,686,470   56,915,172   25,286,900 
              
TOTAL ASSETS     $4,270,621,822  $4,708,443,659  $4,541,292,158 
              
LIABILITIES AND STOCKHOLDERS’ EQUITY
                
Current liabilities:                
Accounts payable  15  $185,918,539  $301,992,739  $309,129,199 
Accrued expenses and other current liabilities      122,173,803   150,109,963   97,121,231 
Short-term borrowings  17   201,257,773   107,000,000   71,000,000 
Current portion of promissory note  16   29,242,001   29,242,000   29,242,001 
Current portion of long-term debt  17   360,628,789   340,692,788   170,796,968 
Income tax payable      552,006   1,152,630   72,417 
              
Total current liabilities      899,772,911   930,190,120   677,361,816 
              
Long-term liabilities:                
Promissory notes  16   23,589,958   51,057,163   77,601,657 
Long-term debt  17   536,518,281   616,294,743   719,570,905 
Long-term payables relating to license agreements  18   18,169,006   62,833,433   16,992,950 
Other long term liabilities            3,333,333 
Deferred tax liabilities  19   411,877   604,770   210,913 
              
Total long-term liabilities      578,689,122   730,790,109   817,709,758 
              
Total liabilities      1,478,462,033   1,660,980,229   1,495,071,574 
              
Commitments  25             
Minority interest  20   42,795,288   34,944,408   38,800,666 
Stockholders’ equity:                
Ordinary shares, $0.0004 par value, 50,000,000,000 shares authorized, 22,327,784,827, 18,558,919,712 and 18,432,756,463 shares issued and outstanding at December 31, 2008, 2007 and 2006, respectively  21   8,931,114   7,423,568   7,373,103 
Additional paid-in capital      3,489,382,267   3,313,375,972   3,288,765,465 
Accumulated other comprehensive (loss) income      (439,123)  (1,881)  91,840 
Accumulated deficit      (748,509,757)  (308,278,637)  (288,810,490)
              
Total stockholders’ equity      2,749,364,501   3,012,519,022   3,007,419,918 
              
TOTAL LIABILITIES AND STOCKHOLDERS’ EQUITY     $4,270,621,822  $4,708,443,659  $4,541,292,158 
              
                 
  Year ended December 31, 
     2010  2009  2008 
 
Sales    $1,554,788,587  $1,070,387,103  $1,353,711,299 
Cost of sales      1,244,714,305   1,184,589,553   1,412,851,079 
 
Gross profit (loss)      310,074,282   (114,202,450)  (59,139,780)
 
Operating expenses (income):                
Research and development      174,900,381   160,753,629   102,239,779 
General and administrative     43,762,351   218,688,042   67,036,672 
Selling and marketing      29,498,495   26,565,692   20,661,254 
Amortization of acquired intangible assets      27,167,870   35,064,589   32,191,440 
Impairment loss of long-lived assets     8,442,050   138,294,783   106,740,667 
Loss (gain) from sale of plant and equipment and other fixed assets     (658,535)  3,832,310   (2,877,175)
Litigation settlement        269,637,431    
Other operating income    (16,493,049)      
 
Total operating expenses, net      266,619,563   852,836,476   325,992,637 
 
Income (loss) from operations     43,454,719   (967,038,926)  (385,132,417)
 
Other income (expense):                
Interest income      4,127,252   2,591,284   11,542,339 
Interest expense      (22,655,830)  (24,699,336)  (50,766,958)
Change in the fair value of commitment to issue shares and warrants     (29,815,453)  (30,100,793)   
Foreign currency exchange gain      5,024,930   7,302,121   11,425,279 
Others, net      8,771,701   4,626,008   7,428,721 
 
Total other expense, net      (34,547,400)  (40,280,716)  (20,370,619)
 
Income (loss) before income tax      8,907,319   (1,007,319,642)  (405,503,036)
Income tax benefit (expense)     4,818,497   46,624,242   (26,432,993)
Gain (loss) from equity investment     284,830   (1,782,142)  (444,211)
 
Net income (loss)      14,010,646   (962,477,542)  (432,380,240)
Accretion of interest to noncontrolling interest      (1,050,000)  (1,059,663)  (7,850,880)
Loss attributable to noncontrolling interest      139,751       
Income (loss) attributable to Semiconductor Manufacturing                
International Corporation      13,100,397   (963,537,205)  (440,231,120)
 
Earnings (loss) per share, basic    $0.00  $(0.04) $(0.02)
Earnings (loss) per share, diluted    $0.00  $(0.04) $(0.02)
 
Shares used in calculating basic earnings (loss) per share     24,258,437,559   22,359,237,084   18,682,544,866 
 
Shares used in calculating diluted earnings (loss) per share     25,416,597,405   22,359,237,084   18,682,544,866 
 
The accompanying notes are an integral part of these consolidated financial statements.

F-3F-5


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATIONConsolidated Balance Sheets
CONSOLIDATED STATEMENTS OF OPERATIONS
(In US dollars, except share data)
                 
      Year ended December 31, 
  NOTES  2008  2007  2006 
Sales  26  $1,353,711,299  $1,549,765,288  $1,465,322,867 
Cost of sales      1,412,851,079   1,397,037,881   1,338,155,004 
              
Gross (loss) profit      (59,139,780)  152,727,407   127,167,863 
              
Operating expenses (income):                
Research and development      102,239,779   97,034,208   94,170,750 
General and administrative      58,841,103   74,489,877   47,364,533 
Selling and marketing      20,661,254   18,715,961   18,231,048 
Amortization of acquired intangible assets      32,191,440   27,070,617   24,393,561 
Impairment loss of long-lived assets  12,13   106,740,667       
Income from sale of equipment and other fixed assets  9,11   (2,877,175)  (28,651,446)  (43,121,929)
              
Total operating expenses, net      317,797,068   188,659,217   141,037,963 
              
Loss from operations  31   (376,936,848)  (35,931,810)  (13,870,100)
              
Other income (expense):                
Interest income      11,542,339   12,348,630   14,916,323 
Interest expense      (50,766,958)  (37,936,126)  (50,926,084)
Foreign currency exchange gain (loss)      3,229,710   11,249,889   (21,912,234)
Others, net      7,428,721   2,237,902   1,821,337 
              
Total other expense, net      (28,566,188)  (12,099,705)  (56,100,658)
              
Loss before income tax      (405,503,036)  (48,031,515)  (69,970,758)
Income tax benefit (expense)  19   (26,432,993)  29,719,775   24,927,744 
Minority interest      (7,850,880)  2,856,258   (18,803)
Loss from equity investment  14   (444,211)  (4,012,665)  (4,201,247)
              
Net loss before cumulative effect of a change in accounting principle      (440,231,120)  (19,468,147)  (49,263,064)
Cumulative effect of a change in accounting principle            5,153,986 
              
Net loss     $(440,231,120) $(19,468,147) $(44,109,078)
              
On the basis of net loss before accounting change per share, basic and diluted  23  $(0.02) $(0.00) $(0.00)
              
Cumulative effect of an accounting change per share, basic and diluted  23  $  $  $0.00 
              
Loss per share, basic and diluted  23  $(0.02) $(0.00) $(0.00)
              
Shares used in calculating basic and diluted loss per share  23   18,682,544,866   18,501,940,489   18,334,498,923 
              
                 
  December 31, 
     2010  2009  2008 
 
ASSETS
                
Current assets:                
Cash and cash equivalents     $515,808,332  $443,462,514  $450,229,569 
Restricted cash     161,350,257   20,360,185   6,254,813 
Short-term investments     2,453,951      19,928,289 
Accounts receivable, net of allowances of $49,373,296, $96,144,543 and $5,680,658 at December 31, 2010, 2009 and 2008, respectively     206,622,841   204,290,545   199,371,694 
Inventories     213,404,499   193,705,195   171,636,868 
Prepaid expense and other current assets      75,824,180   28,881,866   56,299,086 
Receivable for sale of equipment and other fixed assets            23,137,764 
Assets held for sale        8,184,462    
Current portion of deferred tax assets     3,638,427   8,173,216    
 
Total current assets      1,179,102,487   907,057,983   926,858,083 
                 
Prepaid land use rights      78,798,287   78,111,788   74,293,284 
Plant and equipment, net     2,351,862,787   2,251,614,217   2,963,385,840 
Acquired intangible assets, net     173,820,851   182,694,105   200,059,106 
Deferred cost, net           47,091,516 
Equity investment     9,843,558   9,848,148   11,352,186 
Other long-term assets      215,178   391,741   1,895,337 
Deferred tax assets     109,050,066   94,358,635   45,686,470 
 
TOTAL ASSETS
     $3,902,693,214  $3,524,076,617  $4,270,621,822 
 
LIABILITIES AND EQUITY
                
Current liabilities:                
Accounts payable    $515,577,285  $228,882,804  $185,918,539 
Short-term borrowings     372,055,279   286,864,063   201,257,773 
Current portion of long-term debt     333,458,941   205,784,080   360,628,789 
Accrued expenses and other current liabilities      146,986,675   111,086,990   122,173,803 
Current portion of promissory notes     29,374,461   78,608,288   29,242,001 
Commitment to issue shares and warrants relating to litigation settlement        120,237,773    
Income tax payable      1,892,691   58,573   552,006 
 
Total current liabilities      1,399,345,332   1,031,522,571   899,772,911 
 

F-6


Consolidated Balance Sheets
                 
  December 31, 
     2010  2009  2008 
 
Long-term liabilities:                
Non-current portion of promissory notes     56,327,268   83,324,641   23,589,958 
Long-term debt     178,596,008   550,653,099   536,518,281 
Long-term payables relating to license agreements        4,779,562   18,169,006 
Other long-term liabilities     58,788,806   21,679,690    
Deferred tax liabilities     1,094,257   1,035,164   411,877 
 
Total long-term liabilities      294,806,339   661,472,156   578,689,122 
 
Total liabilities      1,694,151,671   1,692,994,727   1,478,462,033 
 
Non-controlling interest     39,004,168   34,841,507   42,795,288 
 
Commitments               
Equity:                
Ordinary shares, $0.0004 par value, 50,000,000,000 shares authorized, 27,334,063,747, 22,375,886,604, and 22,327,784,827 shares issued and outstanding at December 31, 2010, 2009 and 2008, respectively      10,933,625   8,950,355   8,931,114 
Additional paid-in capital      3,858,642,606   3,499,723,153   3,489,382,267 
Accumulated other comprehensive loss      (1,092,291)  (386,163)  (439,123)
Accumulated deficit      (1,698,946,565)  (1,712,046,962)  (748,509,757)
 
Total equity      2,169,537,375   1,796,240,383   2,749,364,501 
 
TOTAL LIABILITIES, NONCONTROLLING INTEREST AND EQUITY
     $3,902,693,214  $3,524,076,617  $4,270,621,822 
 
The accompanying notes are an integral part of these consolidated financial statements.

F-4F-7


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
CONSOLIDATED STATEMENTS OF STOCKHOLDERS’ EQUITY AND COMPREHENSIVE INCOME (LOSS)
Consolidated Statements of Equity and Comprehensive Income (Loss)
(In US dollars, except share data)
                                                            
 Accumulated        Accumulated   
 Additional other Deferred Total    other Total 
 Ordinary paid-in comprehensive stock Accumulated stockholders Comprehensive  Ordinary Additional paid-in comprehensive Accumulated Total comprehensive 
 Share Amount capital income (loss) compensation, net deficit equity loss  Share Amount capital loss deficit equity loss 
Balance at January 1, 2006 18,301,680,867 $7,320,673 $3,291,439,835 $138,978 $(24,881,919) $(244,701,412) $3,029,316,155 
 
Balance at January 1, 2008 18,558,919,712 $7,423,568 $3,313,375,972 $(1,881) $(308,278,637) $3,012,519,022   
Exercise of stock options 132,744,596 53,098 3,912,210    3,965,308  69,770,815 27,908 768,361   796,269  
Repurchase of restricted ordinary shares  (1,669,000)  (668)  (57,522)     (58,190) 
Deferred stock compensation adjustment    (24,881,919)  24,881,919   
Share-based compensation   23,506,847    23,506,847 
Cumulative effect of a change in accounting principle    (5,153,986)     (5,153,986) 
Net loss       (44,109,078)  (44,109,078) $(44,109,078)
Foreign currency translation adjustments     (16,885)    (16,885)  (16,885)
Realized gain on investments     (30,253)    (30,253)  (30,253)
                 
Balance at December 31, 2006 18,432,756,463 $7,373,103 $3,288,765,465 $91,840 $ $(288,810,490) $3,007,419,918 $(44,156,216)
   
Exercise of stock options 126,455,749 50,582 3,988,549    4,039,131 
Repurchase of restricted ordinary shares  (292,500)  (117)  (21,383)     (21,500) 
Issuance of ordinary shares 3,699,094,300 1,479,638 163,620,362   165,100,000  
Share-based compensation   20,643,341    20,643,341    11,617,572   11,617,572  
Net loss       (19,468,147)  (19,468,147) $(19,468,147)      (440,231,120)  (440,231,120)  (440,231,120)
Foreign currency translation adjustments     (93,721)    (93,721)  (93,721)     (437,242)   (437,242)  (437,242)
                 
Balance at December 31, 2007 18,558,919,712 $7,423,568 $3,313,375,972 $(1,881) $ $(308,278,637) $3,012,519,022 $(19,561,868)
   
Balance at December 31, 2008 22,327,784,827 $8,931,114 $3,489,382,267 $(439,123) $(748,509,757) $2,749,364,501 $(440,668,362)
Exercise of stock options 69,770,815 27,908 768,361    796,269  48,101,777 19,241 195,785   215,026  
Issuance of ordinary shares to a stockholder 3,699,094,300 1,479,638 163,620,362    165,100,000 
Share-based compensation   11,617,572    11,617,572    10,145,101   10,145,101  
Net loss       (440,231,120)  (440,231,120) $(440,231,120)      (963,537,205)  (963,537,205)  (963,537,205)
Foreign currency translation adjustments     (437,242)    (437,242)  (437,242)    52,960  52,960 52,960 
                 
Balance at December 31, 2009 22,375,886,604 $8,950,355 $3,499,723,153 $(386,163) $(1,712,046,962) $1,796,240,383 $(963,484,245)
Exercise of stock options 140,645,464 56,258 2,161,420   2,217,678  
Issuance of ordinary shares relating to litigation settlement 1,789,493,218 715,797 137,050,128   137,765,925  
Issuance of warrant relating to litigation settlement   13,002,275   13,002,275  
Issuance of ordinary shares 3,028,038,461 1,211,215 197,910,997   199,122,212  
Share-based compensation   8,794,633   8,794,633  
Net income     13,100,397 13,100,397 13,100,397 
Foreign currency translation adjustments     (706,128)   (706,128)  (706,128)
Balance at December 31, 2008 22,327,784,827 $8,931,114 $3,489,382,267 $(439,123) $ $(748,509,757) $2,749,364,501 $(440,668,362)
Balance at December 31, 2010 27,334,063,747 $10,933,625 $3,858,642,606 $(1,092,291) $(1,698,946,565) $2,169,537,375 $12,394,269 
                 
The accompanying notes are an integral part of these consolidated financial statements.statements

F-5


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
CONSOLIDATED STATEMENTS OF CASH FLOWS
(In US dollars)
             
  Year ended December 31, 
  2008  2007  2006 
Operating activities:            
Net Loss $(440,231,120) $(19,468,147) $(44,109,078)
Less: Cumulative effect of a change in accounting principle        (5,153,986)
          
Net loss before cumulative effect of a change in accounting principle  (440,231,120)  (19,468,147)  (49,263,064)
Adjustments to reconcile net loss to net cash provided by operating activities:            
Minority interest  7,850,880   (2,856,258)  18,803 
Deferred taxes  11,035,809   (31,234,415)  (25,075,987)
Income from sale of equipment and other fixed assets  (2,877,175)  (28,651,446)  (43,121,929)
Depreciation and amortization  761,808,822   706,277,464   919,616,493 
Non-cash interest expense on promissory note and long-term payable relating to license agreements  6,915,567   4,762,343   5,702,607 
Amortization of acquired intangible assets  32,191,440   27,070,616   24,393,561 
Share-based compensation  11,617,572   20,643,341   23,506,847 
Loss from equity investment  444,211   4,012,665   4,201,247 
Impairment loss of long-lived assets  106,740,667       
Changes in operating assets and liabilities:            
Accounts receivable, net  99,015,958   (46,202,677)  (10,851,061)
Inventories  76,672,897   26,869,187   (83,941,316)
Prepaid expense and other current assets  (23,968,264)  (9,339,779)  (8,926,442)
Accounts payable  (76,827,049)  19,852,824   24,705,615 
Accrued expenses and other current liabilities  (7,487)  2,982,369   (14,722,249)
Income tax payable  (600,624)  1,080,213   72,417 
Other long term liabilities     (3,333,333)  3,333,333 
          
Net cash provided by operating activities  569,782,104   672,464,967   769,648,875 
          
Investing activities:            
Purchase of plant and equipment  (669,054,599)  (717,170,957)  (882,580,833)
Proceeds from government grant to purchase plant and equipment  4,181,922      2,208,758 
Proceeds from sale of equipment  2,319,597   98,128,041   4,044,702 
Proceeds received from sale of assets held for sale  563,008   16,476,045   12,716,742 
Purchase of acquired intangible assets  (79,277,586)  (90,090,114)  (9,573,524)
Acquisition of minority interest     (1,000,000)   
Purchase of short-term investments  (291,007,766)  (135,241,799)  (135,058,817)
Sale of short-term investments  278,717,347   185,554,532   90,873,820 
Change in restricted cash  (6,254,813)      
Purchase of equity investment  (1,900,000)      
          
Net cash used in investing activities  (761,712,890)  (643,344,252)  (917,369,152)
          

F-6


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
CONSOLIDATED STATEMENTS OF CASH FLOWS
(In US dollars)
             
  Year ended December 31, 
  2008  2007  2006 
Financing activities:            
Proceeds from short-term borrowings  422,575,386   201,658,000   255,003,999 
Repayment of short-term borrowings  (328,317,613)  (165,658,000)  (449,485,081)
Proceeds from long-term debt  285,929,954   262,247,672   785,344,546 
Repayment of long-term debt  (345,770,415)  (195,628,015)  (635,613,638)
Repayment of promissory note  (30,000,000)  (30,000,000)  (30,000,000)
Payment of loan initiation fee        (3,596,938)
Proceeds from exercise of employee stock options  796,269   4,039,131   3,965,308 
Proceeds from issuance of ordinary shares  168,100,000       
Repurchase of restricted ordinary shares     (21,500)  (58,190)
          
Net cash provided by (used in) financing activities  173,313,581   76,637,288   (74,439,994)
          
Effect of exchange rate changes  (437,239)  (93,721)  (16,885)
          
NET (DECREASE) INCREASE IN CASH AND CASH EQUIVALENTS  (19,054,444)  105,664,282   (222,177,156)
CASH AND CASH EQUIVALENTS, beginning of year  469,284,013   363,619,731   585,796,887 
          
CASH AND CASH EQUIVALENTS, end of year $450,229,569  $469,284,013  $363,619,731 
          
SUPPLEMENTAL DISCLOSURE OF CASH FLOW INFORMATION:            
Income taxes paid $15,997,808  $435,109  $164,409 
          
Interest paid $54,423,059  $45,322,891  $46,808,533 
          
SUPPLEMENTAL DISCLOSURES OF INVESTING AND FINANCING ACTIVITIES            
             
Accounts payable for plant and equipment $(99,592,362) $(138,839,513) $(165,828,795)
          
Long-term payable for acquired intangible assets $(18,169,006) $(62,833,433) $(16,992,950)
          
Receivables for sales of manufacturing equipment $23,137,764  $17,321,000  $70,544,560 
          
The accompanying notes are an integral part of these consolidated financial statements.

F-7


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
1. ORGANIZATION AND PRINCIPAL ACTIVITIES
Semiconductor Manufacturing International Corporation was incorporated under the laws of the Cayman Islands on April 3, 2000. As of December 31, 2008, the Company operates primarily through the following subsidiaries:
Place and dateAttributable
of incorporation/equity
Name of companyestablishmentinterest heldPrincipal activity
Better Way Enterprises LimitedSamoa100%Trading of semiconductor products
(“Better Way”)April 5, 2000
Semiconductor ManufacturingPRC100%Manufacturing and trading of semiconductor products
International (Shanghai)December 21, 2000
Corporation (“SMIS”)*#
SMIC, AmericasUnited States of America100%Marketing related activities
June 22, 2001
Semiconductor ManufacturingPRC100%Manufacturing and trading of semiconductor products
International (Beijing)Corporation (“SMIB”)*#
July 25, 2002
SMIC Japan Corporation*Japan100%Marketing related activities
October 8, 2002
SMIC Europe S.R.LItaly100%Marketing related activities
July 3, 2003
SMIC Commercial (Shanghai)PRC100%Operation of a convenience store
Limited Company (formerly SMICSeptember 30, 2003
Consulting Corporation)*#
Semiconductor ManufacturingPRC100%Manufacturing and trading of semiconductor products
International (Tianjin) CorporationNovember 3, 2003
(“SMIT”)*#
Semiconductor ManufacturingCayman Islands57.3%Investment holding
International (AT) Corporation (“AT”)*July 26, 2004
Semiconductor ManufacturingPRC57.3%Manufacturing and trading of semiconductor products
International (Chengdu)December 28, 2004
Corporation (“SMICD”)*#
SMIC Energy TechnologyPRC100%Manufacturing and trading of solar cells and modules
(Shanghai) CorporationSeptember 9, 2005
(“Energy Science”)*#

F-8


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
Consolidated Statements of Cash Flows
(In US dollars, except where otherwise stated)dollars)
Place and dateAttributable
of incorporation/equity
Name of companyestablishmentinterest heldPrincipal activity
SMIC Development (Chengdu)PRC100%Construction, operation, and management of SMICD’s living quarter, schools, and supermarket
Corporation*#December 29, 2005
Magnificent Tower LimitedBritish Virgin Islands100%Investment holding
January 5, 2006
Semiconductor Manufacturing InternationalBritish Virgin Islands100%Trading of semiconductor products
(BVI) CorporationApril 26, 2007
Admiral Investment Holdings LimitedBritish Virgin Islands100%Investment holding
October 10, 2007
SMIC Shenzhen (HK) Company LimitedHong Kong100%Investment holding
January 29, 2008
Semiconductor ManufacturingPRC100%Manufacturing and trading of semiconductor products
International (Shenzhen) Corporation*#March 20, 2008
             
  Year ended December 31, 
  2010  2009  2008 
 
Operating activities:            
Net income (loss) $14,010,646  $(962,477,542) $(432,380,240)
Adjustments to reconcile net income (loss) to net cash provided by operating activities:            
Deferred taxes  (10,097,549)  (56,222,094)  11,035,809 
(Gain) loss from sale of plant and equipment and other fixed assets  (658,535)  3,832,310   (2,877,175)
Depreciation  584,241,805   748,185,169   761,808,822 
Non-cash interest expense on promissory notes and long-term payables relating to license agreements  4,038,189   3,844,324   6,915,567 
Amortization of acquired intangible assets  27,167,870   35,064,589   32,191,440 
Share-based compensation  8,794,633   10,145,101   11,617,572 
(Gain) loss from equity investment  (284,830)  1,782,142   444,211 
Impairment loss of long-lived assets  8,442,050   138,294,783   106,740,667 
Litigation settlement (non-cash portion)     239,637,431    
Change in the fair value of commitment to issue shares and warrants  29,815,453   30,100,793    
Allowance for doubtful accounts  1,076,767   111,584,756   1,188,568 
Other non-cash expense  711,469       
Changes in operating assets and liabilities:            
Accounts receivable  (2,402,228)  (95,382,736)  97,827,390 
Inventories  (19,699,304)  (22,068,328)  76,672,897 
Prepaid expense and other current assets  (46,335,851)  28,920,815   (23,968,264)
Prepaid land use right  (686,498)      
Accounts payable  34,205,945   35,788,601   (76,827,049)
Accrued expenses and other current liabilities  53,406,989   11,349,772   (7,487)
Other long-term liabilities  37,109,116   21,679,690    
Income tax payable  1,834,118   (493,433)  (600,624)
Changes in restricted cash relating to operating activities  (30,077,566)      
 
Net cash provided by operating activities  694,612,689   283,566,143   569,782,104 
 
Investing activities:            
Purchase of plant and equipment  (491,538,600)  (217,269,234)  (669,054,599)
Proceeds from government subsidy to purchase plant and equipment  26,876,268   54,125,325   4,181,922 
Proceeds received from sale of Assets held for sale  7,810,382   1,482,716   563,008 
Proceeds from sale of plant and equipment  6,375,042   3,715,641   2,319,597 
Purchase of intangible assets  (21,681,441)  (59,096,987)  (79,277,586)
Purchase of short-term investments  (25,812,871)  (49,974,860)  (291,007,766)
Sale of short-term investments  23,400,000   69,903,150   278,717,347 
Change in restricted cash relating to investing activities  (110,912,506)  (14,105,371)  (6,254,813)
Purchase of equity investment     (278,103)  (1,900,000)
Net cash received upon purchase of a subsidiary  1,770,603       
 
Net cash used in investing activities  (583,713,123)  (211,497,723)  (761,712,890)
 
#Companies registered as wholly foreign-owned enterprises in the People’s Republic of China (“PRC”), excluding for the purpose of this annual report, Hong Kong, Macau and Taiwan.
*For identification purposes only
In addition to the above, the Company has a number of wholly-owned subsidiaries in the PRC, Hong Kong, Samoa, the British Virgin Islands and Cayman Islands.
Semiconductor Manufacturing International Corporation and its subsidiaries (hereinafter collectively referred to as the “Company” or “SMIC”) are mainly engaged in the computer-aided design, manufacturing, packaging, testing and trading of integrated circuits and other semiconductor services, as well as manufacturing and designing semiconductor masks.

F-9


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATIONConsolidated Statements of Cash Flows
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For
             
  Year ended December 31, 
  2010  2009  2008 
 
Financing activities:            
Proceeds from short-term borrowings  716,676,446   726,897,421   422,575,386 
Repayment of short-term borrowings  (631,485,230)  (641,291,131)  (328,317,613)
Repayment of promissory notes  (80,000,000)  (15,000,000)  (30,000,000)
Proceeds from long-term debt  10,000,000   100,945,569   285,929,954 
Repayment of long-term debt  (254,382,231)  (241,655,460)  (345,770,415)
Proceeds from exercise of employee stock options  2,217,678   215,026   796,269 
Proceeds from issuance of ordinary shares  199,122,212      168,100,000 
Redemption of noncontrolling interest     (9,013,444)   
 
Net cash (used in) provided by financing activities  (37,851,125)  (78,902,019)  173,313,581 
 
Effect of exchange rate changes  (702,623)  66,544   (437,239)
 
NET INCREASE (DECREASE) IN CASH AND CASH EQUIVALENTS
  72,345,818   (6,767,055)  (19,054,444)
CASH AND CASH EQUIVALENTS, beginning of year
  443,462,514   450,229,569   469,284,013 
 
CASH AND CASH EQUIVALENTS,end of year
 $515,808,332   443,462,514  $450,229,569 
 
SUPPLEMENTAL DISCLOSURE OF CASH FLOW INFORMATION:
            
Income taxes paid $3,444,934   9,636,901  $15,997,808 
 
Interest paid $33,686,823   37,934,992  $54,423,059 
 
SUPPLEMENTAL DISCLOSURES OF NON-CASH, INVESTING AND FINANCING ACTIVITIES
            
Accounts payable for plant and equipment $(342,373,019)  (105,618,026) $(99,592,362)
 
Long-term payable for acquired intangible assets $(5,015,672) $(28,966,666) $(70,100,000)
 
Receivable for sales of manufacturing equipment $  $23,137,764  $17,231,000 
 

F-10


Notes to the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)Consolidated Financial Statements
1.General
Semiconductor Manufacturing International Corporation was incorporated under the laws of the Cayman Islands on April 3, 2000. The addresses of the registered office and principal place of business of the Company are disclosed in the introduction to the annual report. The Company is an investment holding company. Semiconductor Manufacturing International Corporation and its subsidiaries (hereinafter collectively referred to as the “Company” or “SMIC”) are mainly engaged in the computer-aided design, manufacturing, packaging, testing and trading of integrated circuits and other semiconductor services, as well as manufacturing and designing semiconductor masks. The principal subsidiaries and their activities are set out in Appendix 1.
2. SUMMARY OF SIGNIFICANT ACCOUNTING POLICIESSummary of Significant Accounting Policies
(a) Basis of presentation
 
  The consolidated financial statements of the Company are prepared in accordance with accounting principles generally accepted in the United States of America (“US GAAP”).
 
(b) Principles of consolidation
 
  The consolidated financial statements include the accounts of the Company, and its majority owned subsidiaries.subsidiaries and its consolidated affiliate. All inter-company transactions and balances have been eliminated upon consolidation.
 
(c) Use of estimates
 
  The preparation of financial statements in conformity with US GAAP requires management to make estimates and assumptions that affect the reported amounts of assets and liabilities and revenue and expenses in the financial statements and accompanying notes.statements. Significant accounting estimates reflected in the Company’s financial statements include contingent liabilities, valuation allowance for deferred tax assets, allowance for doubtful accounts, inventory valuation, non- marketablenon-marketable equity investment valuation, useful lives and commencement of productive use for plant and equipment and acquired intangible assets, impairment of long-lived assets, accruals for sales adjustments, accrued expenses, contingencies and assumptions related to the valuation of share-based compensation and related forfeiture rates. The Company believes that the accounting estimates employed are appropriate and the resulting balances are reasonable; however, due to the inherent uncertainties in making estimates, actual results could differ from the original estimates, requiring adjustments to these balances in future periods.
 
(d) Cash and cash equivalents
 
  Cash and cash equivalents consist of cash on hand and highly liquid investments which are unrestricted as to withdrawal or use, and which have maturities of three months or less when purchased.
 
(e) Restricted Cash
 
  Restricted cash consists of bank deposits pledged against short-term credit facilities and unused government grantssubsidies for fab construction.construction and certain research and development projects.

F-11


Notes to the Consolidated Financial Statements (continued)
2.Summary of Significant Accounting Policies(continued)
 
(f) Investments
 
  Short-term investments primarily consist primarily of debt instruments and mutual funds are classified either as held-tomaturity, available-for-sale or trading securities.
Held-to-maturity securities, are recorded at amortized cost.
Available-for-sale securities are recorded at fair market value. Unrealized gains and losses are recorded as part of accumulated other comprehensive income (loss). The unrealized gains and losses are reclassified to earnings once the available-for-sale investments are settled. Unrealized losses, which are deemed other than temporary, are recorded in the statement of operations as other expenses.

F-10


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
Trading securities are recorded at fair value with unrealized gains and losses classifiedincluded in earnings.
 
  Equity investments are recorded in long-term assets and accounted for under the equity method when the Company has the ability to exercise significant influence, but not control, over the investee or under the cost method when the investment does not qualify for the equity method. Equity method investments only include non-marketable investments.
 
 Available-for-sale and non-marketable equity investments are evaluated for impairment when the Company identifies indicator of impairment. Investments are considered to be impaired when a decline in fair value is judged to be other than temporary, when events or circumstances are identified that would significantly harm the fair value of the investment and the fair value is significantly below cost basis and /or the significant decline has lasted for an extended period of time. If the investment is other than temporarily impaired, the investment would be written down to its fair value.
(g) Concentration of credit risk
 
  Financial instruments that potentially expose the Company to concentrations of credit risk consist primarily of cash and cash equivalents, short-term investments, accounts receivable other current assets and receivable for sale of manufacturing equipment. The Company places its cash and cash equivalents with reputable financial institutions.
 
  The Company conducts credit evaluations of customers and generally does not require collateral or other security from its customers. The Company establishes an allowance for doubtful accounts based upon estimates, factors surrounding the credit risk of specific customers and other information.
 
The change in the allowances for doubtful accounts is as follows:
             
Allowances for accounts receivable 2010  2009  2008 
 
Balance, beginning of year $96,144,543  $5,680,658  $4,492,090 
Provision recorded during the year  1,076,767   94,704,790   1,301,556 
Write-offs in the year  (19,348,014)  (4,240,905)  (112,988)
Recovered in the year  (28,500,000)      
 
Balance, end of year $49,373,296  $96,144,543  $5,680,658 
 
As more fully described in Note 22, the Company collected $28,500,000 from a managed government-owned foundry during the year ended December 31, 2010 for which a specific allowance had been previously provided.
             
Allowances for receivable for sale of         
Equipment and other fixed assets 2010  2009  2008 
 
Balance, beginning of year $21,120,871  $  $ 
Provision recorded during the year     21,120,871    
Write-offs in the year  (17,176,667)      
Recovered in the year         
 
Balance, end of year $3,944,204  $21,120,871  $ 
 

F-12


Notes to the Consolidated Financial Statements (continued)
2.Summary of Significant Accounting Policies(continued)
(h) Inventories
 
  Inventories are stated at the lower of cost (weighted average) or market. Cost comprises direct materials, direct labor costs and those overheads costs that were incurred in bringing the inventories to their present location and condition.
 
 Adjustments are recorded to write down the cost of obsolete and excess inventory to the estimated market value based on historical and forecasted demand. In 2008, 2007 and 2006, inventory was written down by $40,818,979, $22,676,608 and $16,106,471, respectively, and recorded in cost of sales to reflect the lower of cost or market adjustments.
(i) LandPrepaid land use rights net
 
  LandPrepaid land use rights, which are all located in the PRC, are recorded at cost less accumulated amortization. Amortization is providedand are charged to income ratably over the term of the land use right agreement on a straight-line basis over the terms of the agreements which range from 50 to 70 years.

F-11


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
(j) Plant and equipment, net
 
  Plant and equipment are carried at cost less accumulated depreciation and are depreciated on a straight-line basis over the following estimated useful lives:
   
Buildings 25 years
Facility machinery and equipment 10 years
Manufacturing machinery and equipment 5-75–7 years
Furniture and office equipment 3-53–5 years
Transportation equipment 5 years
  The Company constructs certain of its plant and equipment. In addition to costs under the construction contracts, external costs directly related to the construction of such facilities, including duties and tariffs, equipment installation and shipping costs, are capitalized. Interest incurred on funds used to construct plant and equipment during the active construction period is capitalized, net of government subsidies received. See Note 2(n). Depreciation is recorded at the time assets are ready for their intended use.
 
(k) Acquired intangible assets
 
  Acquired intangible assets, which consist primarily of technology, licenses and patents, are carried at cost less accumulated amortization. Amortization is computed using the straight-line method over the expected useful lives of the assets of 3three to 10ten years.
 
(l) Impairment of long-lived assets
 
  The Company assesses the impairment of long-lived assets when events or changes in circumstances indicate that the carrying value of the assets or the asset group may not be recoverable. Factors that we considerthe Company considers in deciding when to perform an impairment review include, but are not limited to significant under-performance of a business or product line in relation to expectations, significant negative industry or economic trends, and significant changes or planned changes in our use of the assets. An impairment analysis is performed at the lowest level of identifiable independent cash flows for an asset or asset group. We makeThe Company makes subjective judgments in determining the independent cash flows that can be related to a specific asset group based on our asset usage model and manufacturing capabilities. We measureThe Company measures the recoverability of assets that will continue to be used in our operations by comparing the carrying value of the asset group to our estimate of the related total future undiscounted cash flows. If an asset group’s carrying value is not recoverable through the related undiscounted cash flows, the impairment loss is measured by comparing the difference between the asset group’s carrying value and its fair value, based on the best information available, including market prices or discounted cash flow analysis.

F-12F-13


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
ForNotes to the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)Consolidated Financial Statements (continued)
2.Summary of Significant Accounting Policies(continued)
(m) Revenue recognition
 
  The Company manufactures semiconductor wafers for its customers based on the customers’ designs and specifications pursuant to manufacturing agreements and/or purchase orders. The Company also sells certain semiconductor standard products to customers. Revenue is recognized when persuasive evidence of an arrangement exists, service has been performed, the fee is fixed or determinable and collectability is reasonably assured. Sales to customers are recognized upon shipment and title transfer, if all other criteria have been met. The Company also provides certain services, such as mask making, testing and probing. Revenue is recognized when the services are completed or upon shipment of semiconductor products, if all other criteria have been met.
 
Revenue is measured at the fair value of the consideration received or receivable and represents amounts receivable for goods sold and services provided in the normal courses of business, net of discounts and sales-related taxes.
  Customers have the right of return within one year pursuant to warranty and sales return provisions. The Company typically performs tests of its products prior to shipment to identify yield rate per wafer. Occasionally, product tests performed after shipment identify yields below the level agreed with the customer. In those circumstances, the customer arrangement may provide for a reduction to the price paid by the customer or for the costs to return products and to ship replacement products to the customer. The Company estimates the amount of sales returns and the cost of replacement products based on the historical trend of returns and warranty replacements relative to sales as well as a consideration of any current information regarding specific known product defects at customers that may exceed historical trends.
 
  The Company provides management services to certain government-owned foundries. Service revenue is recognized when persuasive evidence of an arrangement exists, service has been performed, the fee is fixed or determinable, and collectability is reasonably assured.

F-14


Notes to the Consolidated Financial Statements (continued)
2.Summary of Significant Accounting Policies(continued)
 
(n) Capitalization of interest
 
  Interest incurred on funds used to construct plant and equipment during the active construction period is capitalized, net of government subsidies received. The interest capitalized is determined by applying the borrowing interest rate to the average amount of accumulated capital expenditures for the assets under construction during the period. Capitalized interest is added to the cost of the underlying assets and is amortized over the useful life of the assets. Government subsidies, capitalized interest and net interest expense are as follows:
             
  For the year ended December 31, 
  2008  2007  2006 
Total actual interest expense $70,735,520  $72,686,950  $78,120,699 
Less: Government subsidy  9,308,764   27,083,604   22,396,613 
Less: Capitalized interest  10,659,798   7,667,220   4,798,002 
          
Net interest expense $50,766,958  $37,936,126  $50,926,084 
          
             
 For the year ended December 31 
  2010  2009  2008 
 
Total actual interest expense (non-litigation) $34,016,123  $41,421,385  $70,735,520 
Recorded in the consolidated statements of operations  (22,655,830)  (24,699,336)  (50,766,958)
 
Gross capitalized interest  11,360,293   16,722,049   19,968,562 
Government subsidies  (4,190,735)  (11,617,950)  (9,308,764)
 
Net capitalized interest $7,169,558  $5,104,099  $10,659,798 
 
(o) Government subsidies
The Company received the following types of government subsidies:
(1)Reimbursement of certain interest costs incurred on borrowings
 
   Government subsidy is recognized when it is earned. The Company received government subsidies of $109,079,381, $97,598,972 and $73,600,743 in cash of $9,308,764, $27,083,6042010, 2009 and $22,396,613 in 2008, 2007 and 2006, respectively, which were based on the interest expense on the Company’s budgeted borrowings.respectively. The Company records government subsidiesrecorded $4,190,735, $11,617,950 and $9,308,764 as a reduction of interest expense, on an accrual basis.

F-13


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
(2)Government awards$32,830,375, $31,855,697 and $56,967,187 as a reduction of operating expenses and $26,685,296, $57,257,456 and $4,181,922 as a reduction of the cost of fixed assets or construction in progress in 2010,2009 and 2008, respectively. The Company recorded $16,493,049, $nil and $nil as other operating income in 2010, 2009 and 2008, respectively, as such amounts were unrestricted as to use and given the Company’s historical and expected future receipt of further subsidies. The Company records amounts received in advance of conditions being met in order to earn the subsidy as deferred liabilities.
 
 The Company received government awards of $56,967,187, $5,058,722 and $11,886,551 in the form of reimbursement of certain expenses in 2008, 2007 and 2006, respectively. These awards were recorded as reductions of related expenses, primarily research and development.
(3)Government subsidy for fab construction
Certain local governments provided subsidies to encourage the Company to participate and manage new plants relating to the integrated circuit industry.
As of December 31, 2008, the Company received $7,324,792, of which $4,181,922 has been used to offset the cost of construction in progress. The unused balance of $3,142,870 is recorded in restricted cash.
In 2006, the Company received a government subsidy of $2,208,758 as a reimbursement of land use right payment, which has been used to offset the cost of the land use rights.
(p) Research and development costs
 
  Research and development costs are expensed as incurred and reported net of related government subsidies.

F-15


Notes to the Consolidated Financial Statements (continued)
2.Summary of Significant Accounting Policies(continued)
 
(q) Start-up costs
 
  In accordance with Statement of Position No. 98-5, “Reporting on the costs of start-up activities,” theThe Company expenses all costs incurred in connection with start-up activities, including preproduction costs associated with new manufacturing facilities and costs incurred with the formation of these facilitiesthe Company such as organization costs. Preproduction costs including the design, formulation and testing of new products or process alternatives are included in research and development expenses. Preproduction costs including facility and employee costs incurred in connection with constructing new manufacturing plants are included in general and administrative expenses.
 
(r) Foreign currency translation
 
  The United States dollar (“US dollar”), the currency in which a substantial portion of the Company’s transactions are denominated, is used as the functional and reporting currency of the Company. Monetary assets and liabilities denominated in currencies other than the US dollar are translated into US dollar at the rates of exchange ruling at the balance sheet date. Transactions in currencies other than the US dollar during the year are converted into the US dollar at the applicable rates of exchange prevailing on the transaction dates. Transaction gains and losses are recognized in the statements of operations.

F-14


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
  The financial records of certain of the Company’s subsidiaries are maintained in local currencies other than the US dollar, such as Japanese Yen, which are their functional currencies. Assets and liabilities are translated at the exchange rates at the balance sheet date. Equity accounts are translated at historical exchange rates, and revenues, expenses, gains and losses are translated using the monthly weighted average exchange rates. Translation adjustments are reported as cumulative translation adjustments and are shown as a separate component of other comprehensive income (loss) in the statements of stockholders’ equity and comprehensive income (loss).
 
(s) Income taxes
 
  Current income taxes are provided for in accordance with the laws of the relevant taxing authorities.

As part of the process of preparing financial statements, the Company is required to estimate its income taxes in each of the jurisdictions in which it operates. The Company accounts for income taxes using the asset and liability method. Under this method, deferred income taxes are recognized for tax consequences in future years of differences between the tax bases of assets and liabilities and their financial reporting amounts at each year-end, based on enacted laws and statutory tax rates applicable for the difference that are expected to affect taxable income. Valuation allowances are provided if based onupon the weight of available evidence, it is more likely than not that some or all of the deferred tax assets will not be realized.
 
  On January 1, 2007,The Company recognizes the Company adopted FASB Interpretation No. 48, “Accounting for Uncertainty in Income Taxes –tax benefit from an Interpretation of FASB Statement No. 109” (“FIN 48”), which prescribes a more-likely-than-not threshold for financial statement recognition and measurement of auncertain tax position taken or expected toonly if it is more likely than not that the tax position will be taken in a tax return. This interpretation also provides guidancesustained on de-recognitionexamination by the taxing authorities based on the technical merits of income tax assets and liabilities, classificationthe position.

F-16


Notes to the Consolidated Financial Statements (continued)
2.Summary of current and deferred income tax assets and liabilities, accounting for interest and penalties associated with tax positions, accounting for income taxes in interim periods and income tax disclosures.Significant Accounting Policies(continued)
 
(t) Comprehensive income (loss)
 
  Comprehensive income (loss) includes such items as net loss, foreign currency translation adjustments and unrealized income (loss) on available-for-sales securities. Comprehensive income (loss) is reported in the statements of stockholders’ equity and comprehensive income (loss).
 
(u) Fair value of financial instruments
 
  On January 1, 2008,The Company defines fair value as the Company adoptedprice that would be received from selling an asset or paid to transfer a liability in an orderly transaction between market participants at the provisions of Financial Accounting Standards Board (FASB) Statement of Financial Accounting Standards (SFAS) No. 157 “Fair Value Measurements” (SFAS 157)measurement date. When determining the fair value measurements for all financial assets and financial liabilities recognizedrequired or disclosedpermitted to be recorded at fair value, we consider the principal or most advantageous market in which we would transact and we consider assumptions that market participants would use when pricing the financial statements on a recurring basis (at least annually). The Company has deferred its implementationasset or liability, such as inherent risk, transfer restrictions, and risk of the provisions of SFAS No. 157 for all non-financial assets and liabilities in accordance with FASB Staff Position (FSP) FAS 157-2, “Effective Date of FASB Statement No. 157” (FSP 157-2), SFAS No. 157 defines fair value, establishes a framework for measuring fair value, and enhances fair value measurement disclosure. The adoption of SFAS No. 157 did not have a significant impact on our consolidated financial statements, and the resulting fair values calculated under SFAS No. 157 after adoption were not significantly different than the fair values that would have been calculated under previous guidance.non-performance.

F-15


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
  In October 2008, the FASB issued FSP FAS 157-3, “Determining the Fair Value ofThe Company utilizes a Financial Asset When the Market for That Asset Is Not Active”(FSP 157-3). FSP 157-3 clarifies the application of SFAS No. 157 in a marketfair value hierarchy that is not active, and addresses application issues such as the use of internal assumptions when relevant observable data does not exist,requires an entity to maximize the use of observable market information when the market is not active,inputs and minimize the use of market quotesunobservable inputs when assessing the relevance of observablemeasuring fair value. Observable inputs are obtained from independent sources and can be validated by a third party, whereas unobservable data. FSP 157-3 is effective for all periods presentedinputs reflect assumptions regarding what a third party would use in accordance with SFAS No. 157. The adoption of FSP 157-3 did not have a significant impact on our consolidatedpricing an asset or liability. A financial statements orinstrument’s categorization within the fair valuesvalue hierarchy is based upon the lowest level of our financialinput that is significant to the fair value measurement. The Company establishes three levels of inputs that may be used to measure fair value that gives the highest priority to observable inputs and the lowest priority to unobservable inputs as follows:
Level 1 — Quoted prices in active markets for identical assets andor liabilities.
 
  When available,Level 2 — Inputs other than quoted market prices in active markets that are observable, either directly or indirectly.
Level 3 — Unobservable inputs to the valuation methodology that are significant to the measurement of fair value of assets or liabilities.
The Company uses valuation techniques that maximize the use of observable inputs and minimize the use of unobservable inputs. The Company performs a through analysis of the assets and liabilities that are subject to fair value measurements and disclosures to determine the appropriate level based on the observability of the inputs used in the valuation techniques. Assets and liabilities carried at fair value are classified in the categories described above based on the lowest level input that is significant to the fair value measurement in its entirety.

F-17


Notes to the Consolidated Financial Statements (continued)
2.Summary of Significant Accounting Policies(continued)
(u)Fair value(continued)
The Company measures the fair value of financial instruments based on quoted market prices in active markets, valuation techniques that use observable market-based inputs or unobservable inputs that are corroborated by market data. Pricing information the Company obtains from third parties is internally validated for reasonableness prior to use in the consolidated financial statements. When observable market prices are not readily available, the Company generally estimates the fair value using valuation techniques that rely on alternate market data or inputs that are generally less readily observable from objective sources and are estimated based on pertinent information available at the time of the applicable reporting periods. In certain cases, fair values are not subject to precise quantification or verification and may fluctuate as economic and market factors vary and the Company’s evaluation of those factors changes. Although the Company uses its best judgment in estimating the fair value of these financial instruments, there are inherent limitations in any estimation technique. In these cases, a minor change in an assumption could result in a significant change in its estimate of fair value, thereby increasing or decreasing the amounts of the Company’s consolidated assets, liabilities, stockholders’ equity (deficit) and net income or loss. See Note 4, “Fair Value”, for further details.
 
  On January 1, 2008,Financial instruments include cash and cash equivalents, restricted cash, short-term investments, short-term borrowings, long-term promissory notes, long-term payables relating to license agreements, long-term debt, accounts payables, accounts receivables and receivables for sale of equipments. The carrying values of cash and cash equivalents, restricted cash, short-term investments and short-term borrowings approximate their fair values based on quoted market values or due to their short-term maturities. The carrying values of long-term promissory notes approximate their fair values as the Company adopted SFAS No. 159, “Fair Value of Option for Financial Assetsinterest rates used to discount the promissory notes did not fluctuate significantly between the date the notes were recorded and Financial Liabilities – including an amendment of FASB Statement No.115” (“SFAS 159”). SFAS 159 permits companies to choose to measure certainDecember 31, 2010. The Company’s other financial instruments and other itemsthat are not recorded at fair value using an instrument-by-instrument election. The Company doesare not elect to use the fair value option and therefore, the adoption of SFAS 159 did not have a material impact on the Company’s consolidated financial position or result of operations.significant.
 
(v) Share-based compensation
 
  The Company grants stock options to its employees and certain non-employees. Under the provisions of SFAS 123(R), share-basedShare-based compensation cost is measured at the grant date, based on the fair value of the award, and is recognized, net of expected forfeitures, as an expense over the employee’s requisite service period (generally the vesting period of the equity grant).

F-16


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
 The Company’s total actual share-based compensation expense for the years ended December 31, 2008, 2007 and 2006 was $11,617,572, $20,643,341 and $23,506,847, respectively.
 
(w) Derivative financial instruments
 
  The Company’s primary objective for holding derivative financial instruments is to manage currency and interest rate risks. The Company records derivative instruments as assets or liabilities, measured at fair value. The Company does not offset the carrying amounts of derivatives with the same counterparty in accordance with FASB Interpretation (“FIN”) No. 39, “Offsetting of Amounts Related to Certain Contracts — an interpretation of APB Opinion No. 10 and FASB Statement No. 105” (“FIN 39”) as amended.counterparty. The recognition of gains or losses resulting from changes in the values of those derivative instruments is based on the use of each derivative instrument. The Company does not have any derivative instruments that qualify for hedge accounting.

F-18


Notes to the Consolidated Financial Statements (continued)
2.Summary of Significant Accounting Policies(continued)
 
(x) Recently issued accounting standards
 
  In December 2007,April 2010, the FASB issued SFAS No. 141, “Business Combinations: (Revised 2007)ASU 2010-17, “Revenue Recognition — Milestone Method (Topic 605) (“SFAS 141R”). SFAS 141RThis guidance is relevant to provide on defining a milestone and determining when it may be appropriate to apply the milestone method of revenue recognition for research or development transactions. Research or development arrangements frequently include payment provisions whereby a portion or all transactionsof the consideration is contingent upon milestone events such as successful completion of phases in a study or eventsachieving a specific result from the research or development efforts. Specifically, this guidance amends the affect vendors that provide research or development deliverables in an arrangement in which one entity obtains control over one or more other businesses. SFAS 141R requires an acquirer topayments are contingent upon achieving uncertain future events or circumstances. A vendor can recognize any assets and noncontrolling interest acquired and liabilities assumedconsideration that is contingent upon achievement of a milestone in its entirety as revenue in the period in which the milestone is achieved only if the milestone meets all criteria to be measured at fair value asconsidered substantive should based on: (1) be commensurate with either of the acquisition date. Liabilitiesfollowing: (a) the vendor’s performance to achieve milestone, (b) the enhancement of the value of the item delivered as a result of a specific outcome resulting from the vendor’s performance to achieve the milestone; (2) relate solely to past performance; or (3) be reasonable relative to all deliverables and payment terms in the arrangement. In addition, a vendor that is affected by the amendments required to provide all of the following: (1) a description of the overall arrangement; (2) a description of each milestone and related to contingent considerationconsideration; (3) a determination of whether each milestone is considered substantive; (4) the factors that the entity considered in determining whether the milestone or milestones are recognized and measured at fair value on the date of acquisition rather than at a later date whensubstantive; or (5) the amount of consideration recognized during the consideration may be resolved beyond a reasonable doubt. This revised approach replaces SFAS 141’s cost allocation process in which the cost of an acquisition was allocated to the individual assets acquired and liabilities assumed based on their respective fair value. SFAS 141R requires any acquisition-related costs and restructuring costs to be expensed as incurred as opposed to allocating such costs to the assets acquired and liabilities assumed as previously required by SFAS 141. Under SFAS 141R, an acquirer recognizes liabilities for a restructuring plan in purchase accounting only if the requirements of SFAS 146, “Accounting for Costs Associated with Exit or Disposal Activities”, are met. SFAS 141R allowsperiod for the recognition of pre-acquisition contingencies at fair value only if these contingencies are likely to materialize. If this criterionmilestone or milestones. This guidance is not met at the acquisition date, then the acquirer accounts for the non-contractual contingency in accordance with recognition criteria set forth under SFAS 5, “Accounting for Contingencies”, in which case no amount should be recognized in purchase accounting. SFAS 141R is effective as of the beginning of an entity’s first fiscal year that begins after December 15, 2008. The adoption of SFAS 141R will change the Company’s accounting treatment for business combination on a prospective basis beginning on January 1, 2009.

F-17


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
In December 2007, the FASB issued SFAS No. 160, Noncontrolling Interestsfor milestones achieved in Consolidated Financial Statements — an Amendment of ARB No. 51” (“SFAS 160”). This Statement amends ARB 51, Consolidated Financial Statements, to establish accounting and reporting standards for the noncontrolling interest in a subsidiary and for the deconsolidation of a subsidiary. It clarifies that a noncontrolling interest in a subsidiary is an ownership interest in the consolidated entity and should be reported as equity on the financial statements. SFAS 160 requires consolidated net income to be reported at amounts that include the amounts attributable to both the parent and the noncontrolling interest. Furthermore, disclosure of the amounts of consolidated net income attributable to the parent and to the noncontrolling interest is required on the face of the financial statements. SFAS 160 is effective as of the beginning of an entity’s first fiscal year that begins after December 15, 2008. The Company will incorporate the presentation requirements outlined by SFAS No. 160 on January 1, 2009.
In March 2008, the FASB issued SFAS No. 161, “Disclosures about Derivative Instruments and Hedging Activities — an amendment of FASB Statement No. 133” (“SFAS 161”). SFAS 161 enhances the required disclosures under SFAS 133, “Accounting for Derivative Instruments and Hedging Activities”, in order to provide the investing community additional transparency in an entity’s financial statements and to more adequately disclose the impact investments in derivative instruments and use of hedging have on financial position, operating results and cash flows. SFAS 161 is effective for fiscal years, and interim periods beginning after November 15, 2008, with early application allowed. SFAS 161 does not change the accounting treatment for derivative instruments and will change the Company’s disclosure for derivative instruments and hedging activities on January 1, 2009.
In April, 2008, the FASB issued FSP. FAS 142-3, “Determination of the Useful Life of Intangible Assets” (“FSP 142- 3”). In determining the useful life of acquired intangible assets, FSP 142-3 removes the requirement to consider whether an intangible asset can be renewed without substantial cost of material modifications to the existing terms and conditions and, instead, requires an entity to consider its own historical experience in renewing similar arrangements. FSP 142-3 also requires expanded disclosure related to the determination of intangible asset useful lives. FSP 142-3 is effective for fiscalwithin those years, beginning on or after DecemberJune 15, 2008. The guidance for determining the useful life of a recognized intangible asset must be applied prospectively to intangible assets acquired after the effective date. Early adoption is prohibited.2010. The adoption of FSP 142-3ASU 2010-17 will not have a material impact on the Company’s consolidated financial position or result of operations.
 
 In November 2008, the Emerging Issues Task Force issued EITF No. 08-6, “Equity Method Investment Accounting Considerations” (“EITF 08-6”) that addresses how the initial carrying value of an equity method investment should be determined, how an impairment assessment of an underlying indefinite-lived intangible asset of an equity method investment should be performed, how an equity method investee’s issuance of shares should be accounted for, and how to account for a change in an investment from the equity method to the cost method. EITF 08-6 shall be effective in fiscal years beginning on or after December 15, 2008, and interim periods within those fiscal years. EITF 08-6 shall be applied prospectively with early application prohibited. The impact of adopting EITF 08-6 will not have a material impact on our consolidated financial condition or results of operations.

F-18


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
(y) LossEarnings (loss) per share
 
  Basic lossearnings (loss) per share is computed by dividing lossincome (loss) attributable to holders of ordinary shares by the weighted average number of ordinary shares outstanding (excluding shares subject to repurchase) for the year. Diluted lossearnings (loss) per ordinary share reflects the potential dilution that could occur if securities or other contracts to issue ordinary shares were exercised or converted into ordinary shares. Ordinary share equivalents are excluded from the computation in lossincome (loss) periods as their effects would be anti-dilutive.

F-19


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
ForNotes to the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)Consolidated Financial Statements (continued)
3.Fair Value
Assets/Liabilities Measured at Fair Value on a Recurring Basis
Assets and liabilities measured on the Company’s balance sheet at fair value on a recurring basis subsequent to initial recognition consisted of the following:
3. CHANGE IN ACCOUNTING ESTIMATE IN 2007
                 
  Fair Value Measurements at December 31, 2010 Using 
  Quoted Prices          
  In Active  Significant       
  Markets for  Other  Significant    
  Identical  Observable  Unobservable    
  Instruments  Inputs  Inputs  Total Gains 
  (Level 1)  (Level 2)  (Level 3)  (Losses) 
   
Assets:                
Forward foreign exchange contracts $  $694,795  $  $2,204,383 
Cross-currency interest rate swap contracts           291,694 
   
Derivative assets measured at fair value $  $694,795  $  $2,496,077 
   
Liabilities:                
Forward foreign exchange contracts $  $(479,735) $  $(4,169,805)
Interest rate swap contracts     (1,380,454)     (957,678)
Cross-currency interest rate swap contracts     (1,292,475)     (949,068)
 
Derivative liabilities measured at fair value $  $(3,152,664) $  $(6,076,551)
 
Prior to January 2007, all manufacturing machinery and equipment were depreciated over estimated useful lives of 5 years. From January 1, 2007 onward, the Company re-evaluated the periods over which the equipment is available to use and extended the estimated useful lives of the manufacturing machinery and equipment based on historical usage experience and industry practices. The useful lives of the manufacturing machinery and equipment used in the wafer manufacturing processing were changed from 5 years to a 5 to 7 year range. The change in accounting estimate resulted in lower depreciation expense of $248,218,139 for the year ended December 31, 2007.

F-20


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
4. FAIR VALUE
SFAS No. 157 defines fair value as the price that would be received from selling an asset or paid to transfer a liability in an orderly transaction between market participants at the measurement date. When determining the fair value measurements for assets and liabilities required or permitted to be recorded at fair value, we consider the principal or most advantageous market in which we would transact and we consider assumptions that market participants would use when pricing the asset or liability, such as inherent risk, transfer restrictions, and risk of non-performance.
Fair Value Hierarchy
SFAS No. 157 establishes a fair value hierarchy that requires an entity to maximize the use of observable inputs and minimize the use of unobservable inputs when measuring fair value. Observable inputs are obtained from independent sources and can be validated by a third party, whereas unobservable inputs reflect assumptions regarding what a third party would use in pricing an asset or liability. A financial instrument’s categorization within the fair value hierarchy is based upon the lowest level of input that is significantNotes to the fair value measurement. SFAS No. 157 establishes three levels of inputs that may be used to measure fair value that gives the highest priority to observable inputs and the lowest priority to unobservable inputs as follows:Consolidated Financial Statements (continued)
Level 1 — Quoted prices in active markets for identical assets or liabilities.
3.Fair Value(continued)
Level 2 — Inputs other than quoted market prices in active markets that are observable, either directly or indirectly.
Assets/Liabilities Measured at Fair Value on a Recurring Basis(continued)
Level 3 — Unobservable inputs to the valuation methodology that are significant to the measurement of fair value of assets or liabilities.
                 
  Fair Value Measurements at December 31, 2009 Using 
  Quoted Prices          
  in Active          
  Markets for  Significant Other  Significant    
  Identical  Observable  Unobservable    
  Instruments  Inputs  Inputs  Total Gains 
  (Level 1)  (Level 2)  (Level 3)  (Losses) 
 
Assets:                
Forward foreign exchange contracts $  $54,442  $  $3,961,279 
Interest rate swap contracts           104,000 
Cross-currency interest swap contracts     503,551      1,086,822 
 
Derivative assets measured at fair value $  $557,993  $  $5,152,101 
 
Liabilities:                
Forward foreign exchange contracts $  $483,421  $  $(3,835,234)
Interest rate swap contracts     529,712      (127,336)
Cross-currency interest rate swap contracts     388,913      (519,099)
Commitment to issue shares and warrants relating to litigation settlement      120,237,773       (30,100,793)
 
Derivative liabilities measured at fair value $  $121,639,819  $  $(34,582,462)
 
The Company uses valuation techniques that maximize the use of observable inputs and minimize the use of unobservable inputs. The Company performs a thorough analysis of the assets and liabilities within the scope of SFAS 157 to determine the appropriate level based on the observability of the inputs used in the valuation techniques. Assets and liabilities carried at fair value as of December 31, 2008 are classified in the categories described above based on the lowest level input that is significant to the fair value measurement in its entirety.

F-21


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
ForNotes to the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
Consolidated Financial Instruments Measured at Fair Value on a Recurring BasisStatements (continued)
Financial instruments measured on the Company’s balance sheet at fair value on a recurring basis subsequent to initial recognition consisted of the following:
3.Fair Value(continued)
                 
  Fair Value Measurements at Reporting Date Using 
  Quoted Prices          
  in Active  Significant       
  Markets for  Other  Significant    
  Identical  Observable  Unobservable    
  Instruments  Inputs  Inputs    
  (Level 1)  (Level 2)  (Level 3)  Total Balance 
Liabilities:                
Forward foreign exchange contracts $  $3,510,305  $  $3,510,305 
Cross-currency interest swap contracts     360,089      360,089 
             
Derivative liabilities measured at fair value $  $3,870,394  $  $3,870,394 
             
Assets/Liabilities Measured at Fair Value on a Recurring Basis(continued)
The derivatives were priced by models that use readily observable market inputs, such as time value, forward interest rates, volatility factors, and current and forward market prices for foreign currency.
                 
  Fair Value Measurements at December 31, 2008 Using 
  Quoted Prices          
  in Active          
  Markets for  Significant Other  Significant    
  Identical  Observable  Unobservable    
  Instruments  Inputs  Inputs  Total Gains 
  (Level 1)  (Level 2)  (Level 3)  (Losses) 
 
Assets:                
Forward foreign exchange contracts $  $665,584  $  $4,350,382 
Cross-currency interest rate swap contracts     873,040      2,324,228 
 
Derivative assets measured at fair value $  $1,538,624  $  $6,674,610 
 
Liabilities:                
Forward foreign exchange contracts $  $4,175,889  $  $(10,809,932)
Cross-currency interest rate swap contracts     1,233,129      (1,670,195)
 
Derivative liabilities measured at fair value $  $5,409,018  $  $(12,480,127)
 
Financial Instruments not Recorded at Fair Value
We price our derivative financial instruments, consisting of forward foreign exchange contracts and interest rate swap contracts using level 2 inputs such as exchange rates and interest rates for instruments of comparable durations and profiles.
The Company discloses the fair value of financial instruments that are not carried at fair value in accordance with SFAS 107, “Disclosure of Fair Value of Financial Instruments”. Financial instruments include cash and cash equivalents, restricted cash, held-to-maturity investments, equity and cost method investments, short-term borrowings, promissory note, longterm payables relating to license agreements, long-term debt, accounts payables, accounts receivables, other current assets and receivables for sale of manufacturing equipment. The fair values of cash and cash equivalents, restricted cash and short-term borrowings approximate their carrying values due to their short-term maturities. The fair value of long-term promissory notes and payables relating to license agreements was approximately $42,253,031 which was calculated based on current interest rates over the remaining payment terms. The fair value of long-term debt approximates its carrying value due to variable interest rates that approximate market rates. The fair value of cost method investment could not be practically estimated due to its non-marketability.
Assets Measured at Fair Value on a Nonrecurring Basis

Fair value of long-lived assets held and used was determined by discounted cash flow technique, which includes the future cash flows that are directly associated with and that are expected to arise as a direct result of the use and eventual disposition of the asset. Estimates of future cash flows used to test the recoverability of a long-lived asset incorporated the Company’s own assumptions about its use of the asset and considered all available evidence. Fair value of long-lived assets held for sale was determined by the price that would be received to sell the asset in an orderly transaction between market participants.
The Company did not have any asset measured at fair value on a nonrecurring basis as of December 31, 2010.
                 
  Fair Value Measurements at December 31, 2009 Using 
  Quoted Prices          
  in Active          
  Markets for  Significant Other  Significant    
  Identical  Observable  Unobservable    
  Instruments  Inputs  Inputs    
Description (Level 1)  (Level 2)  (Level 3)  Total Losses 
 
Long-lived assets held and used $  $  $28,424,849  $(5,269,281)
Long-lived assets held for sale        8,184,462   (22,718,729)
 
  $  $  $36,609,311  $(27,988,010)
 

F-22


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
ForNotes to the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
5. SHORT-TERM INVESTMENTSConsolidated Financial Statements (continued)
As of December 31, 2008 and 2007, the Company has the following held-to-maturity security, respectively:
3.Fair Value(continued)
                 
  Debt instruments maturing in one year 
      Gross  Gross    
  Amortized  unrealized  unrealized    
  Cost  gains  losses  Fair value 
December 31, 2008 $19,928,289  $  $  $19,928,289 
             
December 31, 2007 $7,637,870  $  $  $7,637,870 
             
Assets Measured at Fair Value on a Nonrecurring Basis(continued)
As of December 31, 2006, the Company has available-for-sale security as follows:
In 2009, long-lived assets held and used with a carrying amount of $33.7 million were written down to their fair value of $28.4 million, resulting in an impairment charge of $5.3 million. In addition, long- lived assets held for sale with a carrying amount of $30.9 million were written down to their fair value less cost to sell of $8.2 million, resulting in a loss of $22.7 million. All such amounts were included in impairment loss of long-lived assets in the consolidated statements of operations for the year ended December 31, 2009.
                 
  December 31, 2006 
      Gross  Gross    
      unrealized  unrealized    
  Cost  gains  losses  Fair value 
Mutual fund $52,866,825  $  $  $52,866,825 
             
                 
  Fair Value Measurements at December 31, 2008 Using 
  Quoted Prices          
  in Active          
  Markets for  Significant Other  Significant    
  Identical  Observable  Unobservable    
  Instruments  Inputs  Inputs    
Description (Level 1)  (Level 2)  (Level 3)  Total Losses 
 
Long-lived assets held and used $  $  $916,958,304  $(105,774,000)
 
  $  $  $916,958,304  $(105,774,000)
 
As of December 31, 2006, the Company held certain trading securities with cost of $5,000,000 and fair value of $5,083,778.
In 2008, long-lived assets held and used with a carrying amount of approximately $1.0 billion were written down to their fair value of approximately $917.0 million, resulting in an impairment charge of $105.8 million, which was included in impairment loss of long-lived assets in the consolidated statements of operations for the year ended December 31, 2008.

4.Short-term Investments
As of December 31, 2010, 2009 and 2008, the Company has the following short-term investments, respectively:
                 
  Debt instruments maturing in one year 
      Gross  Gross    
      unrealized  unrealized    
  Cost  gains  losses  Fair value 
 
December 31, 2010
 $2,453,235  $716  $  $2,453,951 
 
December 31, 2009 $  $  $  $ 
 
December 31, 2008 $19,928,289  $  $  $19,928,289 
 

F-23


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
ForNotes to the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
6. DERIVATIVE FINANCIAL INSTRUMENTSConsolidated Financial Statements (continued)
The Company has the following notional amount of derivative instruments:
5.Restricted Cash
             
  December 31 
  2008  2007  2006 
Forward foreign exchange contracts $220,687,295  $404,103  $35,660,177 
Interest rate swap contracts        250,000,000 
Cross-currency interest rate swap contracts  36,731,630   51,057,531   15,947,874 
          
  $257,418,925  $51,461,634  $301,608,051 
          
As of December 31, 2010, restricted cash consisted of $128,818,265 of bank time deposits pledged against letters of credit and short-term borrowings, and $32,531,992 government subsidies for the reimbursement of research and development expenses to be incurred in certain government sponsored projects. As of December 31, 2009 and 2008, the Company held $20,360,185 and $6,254,813 of bank time deposits pledged against letters of credit and short-term borrowings, respectively.
The Company purchases foreign-currency forward exchange contracts with contract terms expiring within one year to protect against the adverse effect that exchange rate fluctuations may have on foreign-currency denominated purchase activities, principally the Renminbi, the Japanese Yen and the European Euro. The foreign-currency forward exchange contracts do not qualify for hedge accounting. Notional amounts are stated in the US dollar equivalents at spot exchange rates at the respective dates.
6.Derivative Financial Instruments
         
  Notional  US dollar 
Settlement currency amount  equivalents 
As of December 31, 2008        
European Euro  21,979,034  $31,144,291 
Renminbi  1,294,294,400   189,543,004 
        
      $220,687,295 
        
As of December 31, 2007        
Renminbi  2,950,400  $404,103 
       
As of December 31, 2006        
Japanese Yen  4,235,537,500  $35,660,177 
       
The Company has the following notional amount of derivative instruments:
In 2007 and 2006, the Company entered into various cross-currency interest rate swap agreements to protect against volatility of future cash flows caused by the changes in both interest rates and exchange rates associated with outstanding long-term debt that are denominated in a currency other than the US dollar. The cross-currency interest rate swap agreements did not qualify for hedge accounting. Notional amounts are stated in the US dollar equivalents at spot exchange rates at the respective dates.
             
  December 31 
  2010  2009  2008 
 
Forward foreign exchange contracts $92,859,692   9,028,995  $220,687,295 
Interest rate swap contracts  76,000,000   54,000,000    
Cross-currency interest rate swap contracts  11,279,915   24,699,730   36,731,630 
 
  $180,139,607  $87,728,725  $257,418,925 
 
         
  Notional  US dollar 
Settlement currency amount  equivalents 
As of December 31, 2008        
Euro  25,922,110  $36,731,630 
       
 
As of December 31, 2007        
Euro  34,624,665  $51,057,531 
       
 
As of December 31, 2006        
Euro  12,098,220  $15,947,874 
       
The Company purchases foreign-currency forward exchange contracts with contract terms expiring within one year to protect against the adverse effect that exchange rate fluctuations may have on foreign- currency denominated purchase activities, principally the Renminbi, the Japanese Yen and the European Euro. The foreign-currency forward exchange contracts do not qualify for hedge accounting. In 2010, 2009 and 2008, the change in fair value of forward contracts was presented in foreign currency exchange gain in the consolidated statements of operations. Notional amounts are stated in the US dollar equivalents at spot exchange rates at the respective dates.

         
  Notional  US dollar 
Settlement currency amount  equivalents 
 
As of December 31, 2010
        
Euro
  7,682,707  $10,174,977 
Renminbi
  546,297,909   82,684,715 
 
      $92,859,692 
 
As of December 31, 2009        
Euro  14,825,188  $21,265,249 
Renminbi  (83,496,523)  (12,236,254)
 
      $9,028,995 
 
As of December 31, 2008        
Euro  21,979,034  $31,144,291 
Renminbi  1,294,294,400   189,543,004 
 
      $220,687,295 
 

F-24


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATIONNotes to the Consolidated Financial Statements (continued)
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
6.Derivative Financial Instruments(continued)
In 2006, the Company entered into various interest rates swap contracts to protect against volatility of future cash flows caused by the changes in interest rates associated with outstanding debt. The interest rate swap contracts did not qualify for hedge accounting. In 2006, gains or losses on the interest rate swap contracts of $(5,641,467) were recognized in interest expense, respectively. As of December 31, 2006, the Company had outstanding interest rate swap contracts with notional amounts of $250,000,000.
In 2010, 2009 and 2008, the Company entered into cross-currency interest rate swap agreements to protect against volatility of future cash flows caused by the changes in both interest rates and exchange rates associated with outstanding long-term debt denominated in a currency other than the US dollar. In 2010, 2009 and 2008, gains or losses on the interest rate swap contracts were recognized as interest expense in the consolidated statements of operations. As of December 31, 2010, 2009 and 2008, the Company had outstanding cross-currency interest rate swap contracts as follows:
The fair values of each derivative instrument are as follows:
         
  Notional  US dollar 
Settlement currency amount  equivalents 
 
As of December 31, 2010
        
Euro
  8,517,000  $11,279,915 
 
As of December 31, 2009        
Euro  17,219,555  $24,699,730 
 
As of December 31, 2008        
Euro  25,922,110  $36,731,630 
 
             
  December 31 
  2008  2007  2006 
Forward foreign exchange contracts $(3,510,305) $530,354  $(2,694,415)
Interest rate swap contracts        (5,641,467)
Cross-currency interest rate swap contracts  (360,089)  1,003,275   323,630 
          
  $(3,870,394) $1,533,629  $(8,012,252)
          
In 2010 and 2009, the Company entered into various interest rates swap agreements to protect against volatility of future cash flows caused by the changes in interest rates associated with outstanding debt. The fair values of each derivative instrument is follows:
As of December 31, 2008, 2007 and 2006, the fair value of the derivative instruments was recorded in accrued expenses and other current liabilities, prepaid expense and other current assets, and accrued expenses and other current liabilities, respectively, with the change in fair value of forward foreign exchange contracts recorded in other income (expense) and the change in fair value of interest rate swap contract and cross currency interest rate swap contracts recorded in interest expense.
             
  December 31 
  2010  2009  2008 
 
Forward foreign exchange contracts $215,060  $(428,979) $(3,510,305)
Interest rate swap contracts  (1,380,454)  (529,712)   
Cross-currency interest rate swap contracts  (1,292,475)  114,638   (360,089)
 
  $(2,457,869) $(844,053) $(3,870,394)
 

As of December 31, 2010, 2009 and 2008, the fair value of the derivative instruments was recorded in accrued expenses and other current liabilities.

F-25


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
ForNotes to the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
7. ACCOUNTS RECEIVABLE, NET OF ALLOWANCESConsolidated Financial Statements (continued)
The Company determines credit terms for each customer on a case-by-case basis, based on its assessment of such customer’s financial standing and business potential with the Company.
7.Accounts Receivable, Net of Allowances
An aging analysis of accounts receivable, net of allowance for doubtful accounts, is as follows:
The Company determines credit terms ranging from 30 to 60 days for each customer on a case-by-case basis, based on its assessment of such customer’s financial standing and business potential with the Company.
             
  2008  2007  2006 
Current $108,109,977  $249,489,644  $213,539,198 
Overdue:            
Within 30 days  18,211,498   39,131,577   31,611,729 
Between 31 to 60 days  6,073,500   6,107,866   5,879,705 
Over 60 days  66,976,719   3,658,565   1,154,343 
          
  $199,371,694  $298,387,652  $252,184,975 
          
Allowance for doubtful accounts $(5,680,658) $(4,492,090) $(4,048,845)
          
An aging analysis of accounts receivable, net of allowances for doubtful accounts, is as follows:
The change in the allowance for doubtful accounts is as follows:
             
  2010  2009  2008 
 
Current $174,378,643  $160,802,634  $108,109,977 
Overdue:            
Within 30 days  25,395,378   30,882,525   18,211,498 
Between 31 to 60 days  3,033,340   1,641,710   6,073,500 
Over 60 days  3,815,480   10,963,676   66,976,719 
 
  $206,622,841  $204,290,545  $199,371,694 
 
             
  2008  2007  2006 
Balance, beginning of year $4,492,090  $4,048,845  $1,091,340 
Provision recorded during the year  1,301,556   486,920   2,957,505 
Write-offs in the year  (112,988)  (43,675)   
          
Balance, end of year $5,680,658  $4,492,090  $4,048,845 
          
8.Inventories

             
  2010  2009  2008 
 
Raw materials $79,037,913  $57,279,287  $76,299,347 
Work in progress  86,234,857   102,538,543   53,674,794 
Finished goods  48,131,729   33,887,365   41,662,727 
 
  $213,404,499  $193,705,195  $171,636,868 
 
In 2010, 2009 and 2008, inventory write downs of $19,893,861, $26,296,168, and $40,818,979 respectively, were recorded in cost of sales to reflect the lower of cost or market adjustments.
9.Assets Held for Sale
In 2009, the Company committed to a plan to complete its exit from the DRAM business and to sell certain fixed assets having a carrying value of $30,903,192, at the time of the decision to fully exit from the DRAM market was made. The Company began actively soliciting for potential buyers for these assets prior to December 31, 2009 and expects to sell them within the following twelve months. At December 31, 2009, the assets were classified as held for sale and were written down to $8,184,462 representing the Company’s estimate of fair value less costs to sell. Fair value of long-lived assets held for sale was determined by the price that would be received to sell the asset in an orderly transaction between market participants. The impairment of $22,718,730 was recorded as a component of impairment loss in the consolidated statements of operation.
In 2010, the Company sold a portion of such assets for $7,611,775, resulting in a gain of $1,455,721. As of December 31, 2010, the Company concluded that the remaining assets of $4,756,260 would not been sold within the following 12 months and, accordingly, reclassified such assets to assets held and used.

F-26


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
ForNotes to the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
8. INVENTORIESConsolidated Financial Statements (continued)
             
  2008  2007  2006 
Raw materials $76,299,347  $83,645,656  $89,431,781 
Work in progress  53,674,794   139,959,481   150,506,509 
Finished goods  41,662,727   24,704,628   35,240,662 
          
  $171,636,868  $248,309,765  $275,178,952 
          
10.Plant and Equipment, Net

             
  2010  2009  2008 
 
Buildings $311,717,261  $293,225,129  $292,572,075 
Facility machinery and equipment  565,829,867   552,373,720   534,251,063 
Manufacturing machinery and equipment  5,584,906,496   5,398,887,677   5,367,843,256 
Furniture and office equipment  78,075,574   74,206,691   76,210,542 
Transportation equipment  2,109,425   1,890,082   1,768,949 
 
   6,542,638,623   6,320,583,299   6,277,645,885 
Less: accumulated depreciation  (4,902,754,755)  (4,299,836,387)  (3,657,309,884)
 
   1,639,883,868   2,020,746,912   2,615,336,001 
Construction in progress  711,978,919   230,867,305   348,049,839 
 
  $2,351,862,787  $2,251,614,217  $2,963,385,840 
 
The Company recorded depreciation expense of $584,241,805, $746,684,986 and $760,881,076 for the years ended December 31, 2010, 2009 and 2008, respectively.
11.Impairment of plant and equipment
In 2010, the Company recorded an impairment loss of $8,442,050 associated with the disposal of fixed assets with outdated technologies.
In 2009, the effect of adverse market conditions and significant changes in the Company’s operation strategy lead to the Company’s identification and commitment to abandon a group of long-lived assets. This group of long-lived assets is equipped with outdated technologies and no longer receives vendor support. As of December 31, 2009, this group of assets ceased to be used. As a result, the Company recorded an impairment loss of $104,676,535 after writing down the carrying value to zero.
In 2008, the Company reached an agreement with certain customers to discontinue production of DRAM products and subsequently the Company decided to exit the commodity DRAM business as a whole. The Company considered these actions to be an indicator of impairment in regard to certain plant and equipment of the Company’s Beijing facilities. The Company recorded an impairment loss of $105,774,000, equal to the excess of the carrying value over the fair value of the associated assets. The Company computed the fair value of the plant and equipment utilizing a discounted cash flow approach. For the purpose of the analysis, the Company applied a discount rate of 9% to the expected cash flows to be generated over the remaining useful lives of primary manufacturing machinery and equipment of approximately five years.
12.Acquired Intangible Assets, Net
             
  2010  2009  2008 
 
Technology, Licenses and Patents Cost: $236,690,448  $346,792,269  $323,457,444 
Accumulated Amortization and Impairment  (62,869,597)  (164,098,164)  (123,398,338)
 
Acquired intangible assets, net $173,820,851  $182,694,105  $200,059,106 
 
The Company entered into several technology, patent and license agreements with third parties whereby the Company purchased intangible assets for $18,294,616, $23,334,825 and $1,022,081 in 2010, 2009 and 2008, respectively.

F-27


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
ForNotes to the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
9. ASSETS HELD FOR SALEConsolidated Financial Statements (continued)
Assets held for sale represent residential real estate that the Company has constructed for its employees.
12.Acquired Intangible Assets, Net(continued)
In 2008, the Company sold residential real estate units with a carrying value of $1,594,508 for $2,283,375, which resulted in a gain on sale of $688,867. The Company reclassified the remaining unsold real estate units of $1,529,057 to land use rights and plant and equipment.
The Company recorded amortization expense of $27,167,870, $35,064,589 and $32,191,440 in 2010, 2009 and 2008 respectively. The Company expected to record amortization expenses related to the acquired intangible assets as follows:
In 2007, the Company sold residential real estate units with a carrying value of $8,402,962 for $12,599,790, which resulted in a gain on sale of $4,196,828. Meanwhile, the Company reclassified the remaining unsold real estate units of $1,017,767 of 2007 to land use rights and plant and equipment. In addition, the Company decided to offer employees another 42 residential real estate units, and classified the $3,123,567 carrying value as assets held for sale, among which, none have been sold out up to December 31, 2007.
     
Year Amount 
 
2011 $31,155,230 
2012 $26,722,052 
2013 $25,666,381 
2014 $23,786,151 
2015 $21,813,780 
In 2006, the Company offered to sell employees 381 residential real estate units, and classified the $17,097,675 carrying value as assets held for sale. The Company sold residential real estate units with a carrying value of $7,676,946 for $8,934,560, which resulted in a gain on sale of $1,257,614. The remaining balances of assets held for sale as of December 31, 2006 was $9,420,729, representing 213 residential real estate units.
In 2010, 2009 and 2008, the Company recorded impairment losses of $nil, $5,630,236 and $966,667, respectively, for licenses related DRAM products that are no longer in use.

13.Equity Investment
         
  December 31, 2010 
  Carrying  % of 
  Amount  Ownership 
 
Equity method investment (unlisted)        
Toppan SMIC Electronics (Shanghai) Co., Ltd. $7,665,455   30.0 
Cost method investments (unlisted) $2,178,103  Less than 20.0 
 
  $9,843,558     
 
The Company assesses the status of its equity investments for impairment on a periodic basis. As of December 31, 2010, the Company has concluded that no impairment exists related to its equity investments. The fair value of the Company’s cost-method investments were not estimated as there were no identified events or changes in circumstances that may have a significant adverse effect on the fair value of the investment.
14.Accounts Payable
An aging analysis of the accounts payable is as follows:
             
  2010  2009  2008 
 
Current $429,831,103  $174,834,213  $126,149,360 
Overdue:            
Within 30 days  42,087,271   25,335,474   26,524,678 
Between 31 to 60 days  8,540,898   8,269,941   9,510,883 
Over 60 days  35,118,013   20,443,176   23,733,618 
 
  $515,577,285  $228,882,804  $185,918,539 
 

F-28


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
ForNotes to the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
10. LAND USE RIGHTS, NETConsolidated Financial Statements (continued)
             
  2008  2007  2006 
Land use rights (50-70 years) $80,079,885  $62,410,846  $42,485,856 
Less: accumulated amortization  (5,786,601)  (4,858,855)  (4,162,523)
          
  $74,293,284  $57,551,991  $38,323,333 
          

F-29


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
15.Promissory Note
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
In 2009, the Company reached a new settlement with TSMC as detailed in Note 27. Under this agreement, the remaining promissory note of $40,000,000 under the prior 2005 Settlement Agreement was cancelled. The Company issued twelve non-interest bearing promissory notes with an aggregate amount of $200,000,000 as the settlement consideration. The Company has recorded a discount of $8,067,071 for the imputed interest on the notes using an effective interest rate of 2.85% (which represents the Company’s average rate of borrowing for 2009) and was recorded as a reduction of the face amount of the promissory notes. In total, the Company paid TSMC $80,000,000 in 2010 and $45,000,000 in 2009, of which $15,000,000 was associated with the 2005 Settlement Agreement. The outstanding promissory notes are as follows:
11. PLANT AND EQUIPMENT, NET
             
  2008  2007  2006 
Buildings $292,572,075  $283,153,927  $269,721,109 
Facility, machinery and equipment  540,021,636   470,434,074   435,112,058 
Manufacturing machinery and equipment  5,467,846,683   5,035,366,468   4,539,566,491 
Furniture and office equipment  76,210,542   67,835,774   61,979,029 
Transportation equipment  1,768,949   1,750,734   1,666,185 
          
   6,378,419,885   5,858,540,977   5,308,044,872 
Less: accumulated depreciation and impairment  (3,763,083,884)  (2,930,088,762)  (2,314,667,455)
Construction in progress  348,049,839   274,505,450   251,023,405 
          
  $2,963,385,840  $3,202,957,665  $3,244,400,822 
          
The Company recorded depreciation expense of $760,881,076, $705,391,171 and $919,038,915 for the years ended December 31, 2008, 2007 and 2006, respectively. In 2008, the Company sold equipment with a carrying value of $5,948,053 for $8,136,361, which resulted in a gain on sale of $2,188,308. In 2007, the Company sold equipment with a carrying value of $26,920,427 for $51,375,045, which resulted in a gain on sale of $24,454,618. In 2006, the Company sold equipment with a carrying value of $26,554,170 for $68,418,485, which resulted in a gain on sale of $41,864,315.

F-30


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
12. IMPAIRMENT OF PLANT AND EQUIPMENT
         
  December 31, 2010 
      Discounted 
Maturity Face Value  value 
 
2011 $30,000,000  $29,374,461 
2012  30,000,000   28,559,710 
2013  30,000,000   27,767,558 
 
Total  90,000,000   85,701,729 
 
Less: Current portion of promissory notes  30,000,000   29,374,461 
 
Non-current portion of promissory notes $60,000,000  $56,327,268 
 
In 2008, the Company reached an agreement with certain customers to discontinue production of DRAM products2010, 2009 and subsequently the Company decided to exit the commodity DRAM business as a whole. The Company considered these actions to be an indicator of impairment in regard to certain plant and equipment of the Company’s Beijing facilities. The Company recorded an impairment loss of $105,774,000, equal to the excess of the carrying value over the fair value of the associated assets. The Company computed the fair value of the plant and equipment utilizing a discounted cash flow approach. For the purpose of the analysis, the Company applied a discount rate of 9% to the expected cash flows to be generated over the remaining useful lives of primary manufacturing machinery and equipment of approximately 5 years.

F-31


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
13. ACQUIRED INTANGIBLE ASSETS, NET
             
  2008  2007  2006 
Technology, Licenses and Patents            
Cost: $323,457,444  $322,435,363  $134,862,112 
Accumulated Amortization and Impairment  (123,398,338)  (90,240,231)  (63,169,614)
          
Acquired intangible assets, net $200,059,106  $232,195,132  $71,692,498 
          
The Company entered into several technology, patent and license agreements with third parties whereby the Company purchased intangible assets for $1,022,081, $187,573,251 and $15,418,322 in 2008, 2007 and 2006, respectively.
In 2008, the Company recorded an impairment loss of $966,667 for licenses related to DRAM products that are no longer in use.
The Company recorded amortization expense of $32,191,440, $27,070,617 and $24,393,561 in 2008, 2007 and 2006 respectively. The Company will record amortization expenses related to the acquired intangible assets of $37,634,121, $28,557,689, $24,479,980, $18,858,581 and $17,130,688 for 2009, 2010, 2011, 2012 and 2013, respectively.

F-32


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
14. EQUITY INVESTMENT
         
  December 31, 2008 
  Carrying Amount  % of Ownership 
Equity Method Investment        
Toppan SMIC Electronics (Shanghai) Co., Ltd. $9,162,766   30.0 
Cost method investments $2,189,420  Less than 20.0
       
Acquired intangible assets, net $11,352,186     
       
On July 6, 2004, the Company and Toppan Printing Co., Ltd (“Toppan”) entered into an agreement to form Toppan SMIC Electronics (Shanghai) Co., Ltd. (“Toppan SMIC”) in Shanghai, to manufacture on-chip color filters and micro lenses for CMOS image sensors.
In 2005, the Company injected cash of $19,200,000 into Toppan SM IC, representing 30% equity ownership. In 2008, 2007 and 2006, the Company recorded $444,211, $4,012,665 and $4,201,247, respectively, as its share of the net loss of the equity investment.

F-33


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
15. ACCOUNTS PAYABLE
An aging analysis of the accounts payable is as follows:
             
  2008  2007  2006 
Current $126,149,360  $223,527,856  $238,864,239 
Overdue:            
Within 30 days  26,524,678   46,571,502   43,364,820 
Between 31 to 60 days  9,510,883   10,226,533   9,594,873 
Over 60 days  23,733,618   21,666,848   17,305,267 
          
  $185,918,539  $301,992,739  $309,129,199 
          

F-34


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
16. PROMISSORY NOTE
As set out in Note 28, the Company has been performing obligations under a settlement and license agreement with TSMC. Under this agreement, the Company issued thirteen non-interest bearing promissory notes with an aggregate amount of $175,000,000 as the settlement consideration. The Company has recorded a discount of $17,030,709 for the imputed interest on the notes, which was calculated using an effective interest rate of 3.45% and was recorded as a reduction of the face amounts of the promissory notes. The Company repaid $30,000,000, $30,000,000 and $30,000,000 in 2008, 2007 and 2006, respectively. The outstanding promissory notes are as follows:
         
  December 31, 2008 
Maturity Face value  Discounted value 
2009 $30,000,000  $29,242,001 
2010  25,000,000   23,589,958 
       
Less: Current portion of promissory notes  30,000,000   29,242,001 
       
Long-term portion of promissory notes $25,000,000  $23,589,958 
       
In 2008, 2007 and 2006, the Company recorded interest expense of $2,532,795, $3,455,506$3,768,799, $2,070,569 and $4,347,221,$2,532,795, respectively, relating to the amortization of the discount.
16.Indebtedness
Short-term and long-term debts are as follows:
             
  2010  2009  2008 
 
Short-term borrowings from commercial banks (a) $372,055,279  $286,864,063  $201,257,773 
 
Long-term debt by contracts (b):            
Shanghai USD syndicate loan $  $127,840,000  $266,050,000 
Shanghai USD & RMB loan  110,270,925   99,309,612    
Beijing USD syndicate loan  290,062,000   300,060,000   300,060,000 
EUR loan  25,422,023   50,227,567   72,037,070 
Tianjin USD syndicate loan  86,300,000   179,000,000   259,000,000 
 
  $512,054,948  $756,437,179  $897,147,070 
 
Long-term debt by repayment schedule:            
Within one year $333,458,940  $205,784,080  $360,628,789 
More than one year, but not exceeding two years  178,596,008   334,995,270   305,568,789 
More than two years, but not exceeding five years     215,657,829   230,949,492 
Total $512,054,948   756,437,179  $897,147,070 
 
Less: current maturities of long-term debt  333,458,941   205,784,080   360,628,789 
 
Non-current maturities of long-term debt $178,596,008  $550,653,099  $536,518,281 
 

F-35F-29


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
ForNotes to the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
17. INDEBTEDNESSConsolidated Financial Statements (continued)
Short-term and long-term debts are as follows:
             
  2008  2007  2006 
Short-term borrowings from commercial banks (a) $201,257,773  $107,000,000  $71,000,000 
          
Long-term debt by contracts (b):            
Shanghai USD syndicate loan $266,050,000  $393,910,000  $274,420,000 
Beijing USD syndicate loan  300,060,000   500,020,000   600,000,000 
EUR loan  72,037,070   51,057,531   15,947,873 
Tianjin USD syndicate loan  259,000,000   12,000,000    
          
  $897,147,070  $956,987,531  $890,367,873 
          
             
Long-term debt by repayment schedule:            
2009 $360,628,789         
2010  305,568,789         
2011  135,482,995         
2012  95,466,497         
            
   897,147,070         
Less: current maturities of long-term debt  360,628,789         
            
Non-current maturities of long-term debt $536,518,281         
            
16.Indebtedness(continued)
(a) Short-term borrowings from commercial banks
As of December 31, 2008, the Company had ten short-term credit agreements that provided total credit facilities of up to $268 million on a revolving credit basis. As of December 31, 2008, the Company had drawn down $201 million under these credit agreements and $67 million is available for future borrowings. The outstanding borrowings under the credit agreements are unsecured. The interest expense incurred in 2008 was $9,411,024, of which $1,103,335 was capitalized as additions to assets under construction. The interest rate on the loan ranged from 1.88% to 8.75% in 2008.
As of December 31, 2007, the Company had fifteen short-term credit agreements that provided total credit facilities of up to $484 million on a revolving credit basis. As of December 31, 2007, the Company had drawn down $107 million under these credit agreements and $377 million was available for future borrowings. The outstanding borrowings under the credit agreements were unsecured. The interest expense incurred in 2007 was $4,537,200, of which $1,909,602 was capitalized as additions to assets under construction. The interest rate on the loan ranged from 5.37% to 6.44% in 2007.
As of December 31, 2006, the Company had fifteen short-term credit agreements that provided total credit facilities of up to $474 million on a revolving credit basis. As of December 31, 2006, the Company had drawn down $71 million under these credit agreements and $403 million was available for future borrowings. The outstanding borrowings under the credit agreements were unsecured. The interest expense incurred in 2006 was $8,471,823, of which $1,019,903 was capitalized as additions to assets under construction. The interest rate on the loans ranged from 3.62% to 6.52% in 2006.

F-36


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
As of December 31, 2010, the Company had 20 short-term credit agreements that provided total credit facilities of up to $583 million on a revolving credit basis. As of December 31, 2010, the Company had drawn down $372 million under these credit agreements and $211 million was available for future borrowings. The outstanding borrowings under the credit agreements are unsecured, except for $13 million, which is secured by term deposits. The interest expense incurred in 2010 was $12,037,913 of which $3,182,351 was capitalized as additions to assets under construction. The interest rate was calculated as LIBOR+0.9% to 4.50%, which ranged from 1.11% to 5.84% in 2010.
As of December 31, 2009, the Company had 19 short-term credit agreements that provided total credit facilities of up to $337 million on a revolving credit basis. As of December 31, 2009, the Company had drawn down $287 million under these credit agreements and $50 million was available for future borrowings. The outstanding borrowings under the credit agreements are unsecured, except for $20 million, which is secured by term deposits. The interest expense incurred in 2009 was $11,250,052, of which $2,752,239 was capitalized as additions to assets under construction. The interest rate was calculated as LIBOR+1.5% to 2.75%, which ranged from 1.11% to 8.75% in 2009.
As of December 31, 2008, the Company had 10 short-term credit agreements that provided total credit facilities of up to $268 million on a revolving credit basis. As of December 31, 2008, the Company had drawn down $201 million under these credit agreements and $67 million is available for future borrowings. The outstanding borrowings under the credit agreements are unsecured. The interest expense incurred in 2008 was $9,411,024, of which $1,103,335 was capitalized as additions to assets under construction. The interest rate is available and determined as LIBOR+0.5% to 1.75%, which ranged from 1.18% to 8.75% in 2008.
(b) Long-term debt
Shanghai USD syndicate loan
In June 2006, SMIS entered into the Shanghai USD syndicate loan with an aggregate principal amount of $600,000,000 with a consortium of international and PRC banks. The principal amount is repayable beginning December 2006 in ten semi-annual installments. The interest rate is variable and determined as LIBOR+1.00%. In August 2010, the facility was fully repaid.
Shanghai USD & RMB loan

In June 2009, SMIS entered into the Shanghai USD & RMB loan, a two-year loan facility in the principal amount of $80,000,000 and RMB200,000,000 (approximately $29,309,012) with The Export-Import Bank of China. The principal amount is repayable at June 30, 2011.
The facility is secured by the manufacturing equipment located in SMIS’s 12-inch fab. This two- year bank facility will be used to finance future expansion and general corporate needs for SMIS’s 12-inch fab. The interest rates from the US tranche and RMB tranche are variable at LIBOR+2.00% and fixed at 4.86%, respectively.
The total outstanding balance of the facilities is collateralized by equipment with an original cost of $366 million as of December 31, 2010.
Shanghai USD syndicate loan
In June, 2006, SMIS entered into the Shanghai USD syndicate loan with the aggregate principal amount of $600,000,000, with a consortium of international and PRC banks. Of this principal amount, $393,000,000 was used to repay the principal amount outstanding under SMIS’s previous USD syndicate loans. The remaining principal amount was available to be used to finance future expansion and general corporate requirements of SMIS. As of December 31, 2007 and 2006, SMIS had drawn down $600,000,000 and $393,000,000 from this facility. The principal amount is repayable starting from December 2006 in ten semi-annual installments. In 2008, 2007 and 2006, SMIS had repaid $127,860,000, $87,510,000 and $118,580,000, respectively, according to the repayment schedule. As of December 31, 2008 and 2007 and 2006, the outstanding balance of this borrowing was $266,050,000, $393,910,000 and $274,420,000, respectively. In 2008, the interest rate on the loan ranged from 2.47% to 5.76%. The interest expense incurred in 2008, 2007 and 2006 was $16,979,883, $17,260,814 and $13,522,886, respectively, of which $5,358,081, $3,308,444 and $1,624,224 was capitalized as additions to assets under construction in 2008, 2007 and 2006, respectively.
The total outstanding balance of the Shanghai USD syndicate loan is collateralized by certain plant and equipment with an original cost of $1,871 million as of December 31, 2008.
The Shanghai USD syndicate loan contains covenants relating to the minimum consolidated tangible net worth, limits total borrowings compared to tangible net worth and EBITDA for the prior four quarters, and requires minimum debt service coverage ratios. SMIS has complied with these covenants (unless otherwise waived by the lenders to such agreement) as of December 31, 2008.
Beijing USD syndicate loan
In May 2005, SMIB entered into the Beijing USD syndicate loan, a five-year loan facility in the aggregate principal amount of $600,000,000, with a syndicate of financial institutions based in the PRC. This five-year bank loan was used to expand the capacity of SMIB’s fabs. The withdrawal period of the facility was twelve months from date of signing the agreement. As of December 31, 2008, 2007 and 2006, the outstanding balance was $300,060,000, $500,020,000 and $600,000,000, respectively, on this loan facility. The principal amount is repayable starting from December 2007 in six equal semi-annual installments. In 2008 and 2007, SMIB had repaid $199,960,000 and $99,980,000, respectively, according to the repayment schedule. In 2008, the interest rate on the loan ranged from 3.46% to 6.38%. The interest expense incurred in 2008, 2007 and 2006 was $25,599,360, $42,183,106 and $28,525,628, of which $1,599,175, $2,342,794 and $450,516 was capitalized as additions to assets under construction in 2008, 2007 and 2006, respectively.
The total outstanding balance of the Beijing USD syndicate loan is collateralized by certain plant and equipment with an original cost of $1,047 million as of December 31, 2008.
The Beijing USD syndicate loan contains covenants to maintain minimum cash flows as a percentage of non-cash expenses and to limit total liabilities, excluding shareholder loans, as a percentage of total assets. SMIB has complied with these covenants (unless otherwise waived by the lenders to such agreement) as of December 31, 2008.

F-37F-30


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATIONNotes to the Consolidated Financial Statements (continued)
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
16.Indebtedness(continued)
EUR loan
(b)Long-term debt(continued)
On December 15, 2005, the Company entered into the EUR loan, a long-term loan facility agreement in the aggregate principal amount of EUR 85 million with ABN Amro Bank N.V. Commerz Bank N.V., Shanghai Branch. The proceeds from the facility were used to purchase lithography equipment to support the expansion of the Company’s manufacturing facilities. The drawdown period of the facility ends on the earlier of (i) the date on which the loans have been fully drawn down; or (ii) 36 months after the date of the agreement. Each drawdown made under the facility shall be repaid in full by the Company in ten equal semi-annual installments starting from May 6, 2006.
In 2008, 2007 and 2006, SMIS and SMIT had drawn down EUR 28,475,000 ($38,929,954), EUR 28,390,000 ($41,863,894) and EUR 15,122,775 ($19,934,841), respectively. SMIS and SMIT repaid an aggregated amount of EUR12,261,930 ($17,950,415), EUR 5,863,555 ($8,173,357) and EUR 3,024,555 ($3,986,968) in 2008, 2007 and 2006, respectively. As of December 31, 2008, 2007 and 2006, the outstanding balance is EUR 50,837,735 ($72,037,070), EUR 34,624,665 ($51,057,531) and EUR 12,098,220 ($15,947,873). In 2008, the interest rate on the loan ranged from 3.01% to 6.12%. The interest expense incurred in 2008, 2007 and 2006 was $2,682,195, $996,706 and $279,908, respectively, of which $810,495, $82,036 and $65,072 was capitalized as additions to assets under construction in 2008, 2007 and 2006, respectively.
The total outstanding balance of the facility is collateralized by certain plant and equipment with an original cost of $21.8 million for SMIT and $114.5 million for SMIS as of December 31, 2008.
Tianjin USD syndicate loan
On May 31, 2006, SMIT entered into the Tianjin USD syndicate loan, a five-year loan facility in the aggregate principal amount of $300,000,000, with a syndicate of financial institutions based in the PRC. This five-year bank loan was used to expand the capacity of SMIT’s fab. In 2008 and 2007, SMIT drew down $247,000,000 and $12,000,000 of the facility amount, respectively. The principal amount is repayable starting from 2010 in six semi-annual installments. In 2008, the interest rate on the loan ranged from 3.11% to 6.03%. The interest expense incurred in 2008 and 2007 was $9,147,490 and $285,253, respectively, of which $1,788,712 and $24,344 was capitalized as additions to assets under construction in 2008 and 2007, respectively.
The total outstanding balance of the Tianjin USD syndicate loan is collateralized by certain plant and equipment with an original cost of $627.4 million as of December 31, 2008.
The Tianjin USD syndicate loan contains covenants to maintain minimum cash flows as a percentage of non-cash expenses and to limit total liabilities as a percentage of total assets. SMIT has complied with these covenants (unless otherwise waived by the lenders to such agreement) as of December 31, 2008.
Beijing USD syndicate loan
In May 2005, SMIB entered into the Beijing USD syndicate loan, a five-year loan facility in the aggregate principal amount of $600,000,000, with a syndicate of financial institutions based in the PRC. The principal amount is repayable starting from December 2007 in six equal semi-annual installments. On June 26, 2009, SMIB amended the syndicated loan agreement to defer the commencement of the three remaining semi-annual payments to December 28, 2011. The amendment includes a provision for mandatory early repayment of a portion of the outstanding balance if SMIB’s financial performance exceeds certain pre-determined benchmarks. The amendment was accounted for as a modification as the terms of the amended instrument were not substantially different from the original terms. The interest rates before and after the amendment, calculated as LIBOR+1.60% and LIBOR+2.20%, respectively.
The total outstanding balance of the Beijing USD syndicate loan is collateralized by its plant and equipment with an original cost of $1,314 million as of December 31, 2010.
The Beijing USD syndicate loan contains covenants to maintain minimum cash flows as a percentage of non-cash expenses and to limit total liabilities, excluding shareholder loans, as a percentage of total assets. SMIB has complied with these covenants as of December 31, 2010.
EUR loan
On December 15, 2005, the Company entered into the EUR syndicate loan, a long-term loan facility agreement in the aggregate principal amount of EUR 85 million with a syndicate of banks with ABN Amro Bank N.V. Commerz Bank (Nederland) N.V. as the leading bank. The proceeds from the facility were used to purchase lithography equipment to support the expansion of the Company’s manufacturing facilities. The drawdown period of the facility ends on the earlier of (i) the date on which the loans have been fully drawn down; or (ii) 36 months after the date of the agreement. Each drawdown made under the facility shall be repaid in full by the Company in ten equal semi-annual installments starting from May 6, 2006. The interest rate is variable and determined as EURIBOR+0.25%.
The total outstanding balance of the facility is collateralized by certain plant and equipment with an original cost of $115 million for SMIS as of December 31, 2010.
Tianjin USD syndicate loan
In May 2006, SMIT entered into the Tianjin USD syndicate loan, a five-year loan facility in the aggregate principal amount of $300,000,000, with a syndicate of financial institutions based in the PRC. This five-year bank loan was used to expand the capacity of SMIT’s fab. The Company has guaranteed SMIT’s obligations under this facility. The principal amount is repayable starting from 2010 in six semi-annual installments and interest rate is variable and determined at LIBOR+1.25%.
The total outstanding balance of the facility is collateralized by its plant and equipment with an original cost of $627 million as of December 31, 2010.

F-38F-31


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
18. LONG-TERM PAYABLES RELATING TO LICENSE AGREEMENTS
The Company entered into several license agreements for acquired intangible assets to be settled by installment payments. Installments payable under the agreements as of December 31, 2008 are as follows:
         
  December 31, 2008 
Maturity Face value  Discounted value 
2009 $50,133,334  $49,203,521 
2010  14,766,666   13,614,440 
2011  5,200,000   4,554,566 
       
   70,100,000   67,372,527 
Less: Current portion of long-term payables  50,133,334   49,203,521 
       
Long-term portion of long-term payables $19,966,666  $18,169,006 
       
These long-term payables were interest free, and the present value was discounted using the Company’s weighted- average borrowing rates ranging from 3.45% to 4.94%.
The current portion of other long-term payables is recorded in accrued expenses and other current liabilities.
In 2008, 2007 and 2006, the Company recorded interest expense of $4,382,772, $1,511,880 and $1,355,386 relatingNotes to the Consolidated Financial Statements (continued)
16.Indebtedness(continued)
(b)Long-term debt(continued)
Tianjin USD syndicate loan(continued)
The Tianjin USD syndicate loan contains covenants to maintain minimum cash flows as a percentage of non-cash expenses and to limit total liabilities as a percentage of total assets. SMIT has complied with these covenants as of December 31, 2010.
Details of the drawn down, repayment and outstanding balance of the abovementioned long-term debts are summarized as follows:
                     
  Shanghai              
  USD  Shanghai  Beijing USD      Tianjin USD 
  Syndicate  USD & RMB  Syndicate      Syndicate 
  Loan  Loan  Loan  EUR Loan  Loan 
 
Balance at January 1, 2008 $393,910,000     $500,020,000  $51,057,531  $12,000,000 
Drawn down          $38,929,954  $247,000,000 
Repayment $127,860,000     $199,960,000  $17,950,415    
 
Balance at December 31, 2008 $266,050,000     $300,060,000  $72,037,070  $259,000,000 
Drawn down    $99,309,612          
Repayment $138,210,000        $21,809,503  $80,000,000 
 
Balance at December 31, 2009
 $127,840,000  $99,309,612  $300,060,000  $50,227,567  $179,000,000 
Drawn down
    $10,961,313          
Repayment
 $127,840,000     $9,998,000  $24,805,544  $92,700,000 
 
Balance at December 31, 2010
    $110,270,925  $290,062,000  $25,422,023  $86,300,000 
 
17.Long-term Payables Relating to License Agreements
The Company entered into several license agreements for acquired intangible assets to be settled by installment payments. The remaining payments under the agreements as of December 31, 2010 are $5,200,000 having a discounted value of $5,015,672 which will be mature in 2011.
These long-term payables were interest free, and the present value was discounted using the Company’s weighted-average borrowing rates 4.94%.
The current portion of other long-term payables is recorded as part of accrued expenses and other current liabilities.
In 2010, 2009 and 2008, the Company recorded interest expense of $269,390, $1,773,755 and $4,382,772, respectively, relating to the amortization of the discount.

F-39F-32


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
19. INCOME TAXES
The Company is a taxexempted company incorporated in the Cayman Islands.
In 2008, the Company recorded withholding income tax expense of $15,400,000 for license income generated from its PRC subsidiaries.
Subsidiaries in PRC
Prior to January 1, 2008, the subsidiaries incorporated in the PRC were governed by the Income Tax Law of the PRC Concerning Foreign Investment and Foreign Enterprises and various relevant income tax laws, regulations and policies (the “FEIT Laws”).
On March 16, 2007, the National People’s Congress of China enacted a new Enterprise Income Tax Law (“New EIT Law”) which became effective January 1, 2008. Under the New EIT Law, domestically-owned enterprises and foreign invested enterprises (“FIEs”) are subject to a uniform tax rate of 25%. The New EIT Law also provides a transition period starting from its effective date for those enterprises which were established before the promulgation date of the New EIT Law and which are entitled to a preferential lower tax rate and/or tax holiday under the FEIT Law or other related regulations. Based on the New EIT Law, the tax rate of such enterprises will transitionNotes to the uniform tax rate throughout a five-year period. Tax holidays that were enjoyed under the FEIT Laws may continue to be enjoyed until the end of the holiday. Tax holidays that have not started because the enterprise is not profitable will take effect regardless whether the FIEs are profitable in 2008.Consolidated Financial Statements (continued)
18.Income Taxes
Semiconductor Manufacturing International Corporation is a tax-exempted company incorporated in the Cayman Islands.
Prior to January 1, 2008, the subsidiaries incorporated in the PRC were governed by the Income Tax Law of the PRC Concerning Foreign Investment and Foreign Enterprises and various local income tax laws (the “FEIT Laws”).
On March 16, 2007, the National People’s Congress of China enacted a new Enterprise Income Tax Law (“New EIT Law”), which became effective January 1, 2008. Under the New EIT Law, domestically- owned enterprises and foreign invested enterprises (“FIEs”) are subject to a uniform tax rate of 25%. The New EIT Law also provides a transition period starting from its effective date for those enterprises which were established before the promulgation date of the New EIT Law and which are entitled to a preferential lower tax rate and/or tax holiday under the FEIT Law or other related regulations. Based on the New EIT Law, the tax rate of such enterprises will transition to the uniform tax rate throughout a five-year period. Tax holidays that were enjoyed under the FEIT Laws may to be enjoyed until the end of the holiday. FEIT Law tax holidays that have not started because the enterprise is not profitable will take effect regardless whether the FIEs are profitable in 2008.
According to Guofa [2007] No. 39 — the Notice of the State Council Concerning Implementation of Transitional Rules for Enterprise Income Tax Incentives effective from January 1, 2008, enterprises that enjoyed preferential tax rates shall gradually transit to the statutory tax rate over 5 years after the new EIT Law is effective. Enterprises that enjoyed a tax rate of 15% under the FEIT Law shall be levied rates of 18% in 2008, 20% in 2009, 22% in 2010, 24% in 2011 and 25% in 2012 and thereafter.
On February 22, 2008, the PRC government promulgated Caishui Circular [2008] No.1, the Notice of the Ministry of Finance and State Administration of Tax concerning Certain Enterprise Income Tax Preferential Policies (“Circular No.1”). Pursuant to Guofa (2007) No. 39 — the Notice of the State Council Concerning Implementation of Transitional Rules for Enterprise Income Tax Incentives (“Circular 39”) issued on December 26, 2007, enterprises that enjoyed preferential tax rates shall gradually transit to the statutory tax rate over 5 years after the new EIT Law is effective. Enterprises that enjoyed a tax rate of 15% under the FEIT Law shall be levied of rates of 18% in 2008, 20% in 2009, 22% in 2010, 24% in 2011 and 25% in 2012.
On February 22, 2008, the PRC government promulgated Caishui (2008) No.1, the Notice of the Ministry of Finance and State Administration of Tax concerning Certain Enterprise Income Tax Preferential Policies (“Caishui No.1”). Pursuant to Caishui No.1, integrated circuit production enterprises whose total investment exceeds RMB8,000 million (approximately $1,095 million) or whose integrated circuits have a line width of less than 0.25 micron are entitled to preferential tax rate of 15%. If the operation period is more than 15 years, those enterprises are entitled to a full exemption from income tax for five years starting from the first profitable year after utilizing all prior years’ tax losses and 50% reduction for the following five years. SMIS, SMIB and SMIT have met such accreditation requirements.
On February 9, 2011, the State Council of China issued Guo Fa [2011] No.4, the Notice on Certain Policies to Further Encourage the Development of the Software and Integrated Circuit Industries(“Circular No.4”), to provide various incentives from tax, investment and financing, and R&D perspectives for the software and integrated circuit industries. In particular, Circular No.4 reinstates certain EIT incentives stipulated by Circular No.1 for the software and integrated circular enterprises.

F-40F-33


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
ForNotes to the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
The detailed tax status of SMIC’s PRC entities is elaborated as follows:Consolidated Financial Statements (continued)
18.Income Taxes(continued)
The detailed tax status of SMIC’s PRC entities is elaborated as follows:
1) SMIS
 
  Pursuant to the preferential tax policy available under the FEIT law as well as other related tax regulation, SMIS was subject to a preferential income tax rate of 15%. According to Circular Guofa (2000) No. 18 — New Policy Implemented for Software and Semiconductor Industries (“Circular 18”) issued by the State Council of China, SMIS is entitled to a 10-year tax holiday (5-year(five year full exemption followed by 5-yearfive year half reduction) for FEIT rate starting from the first profit- making year after utilizing all prior years’ tax losses. The tax holiday enjoyed by SMIS took effect in 2004 when the SMIS completed its first profit-making year.utilized all accumulated tax losses.
 
  In accordance with the New EIT Law and Caishui No.1,Guofa [2007] No. 39, SMIS iswas eligible to continue enjoying 15%11% income tax rate in 2010 and its12%, 12.5% and 12.5% in the tax holiday through its expiry in 2013.
 
2) SMIB and SMIT
 
  In accordance with the Circular 18, Circular No.1 and Caishui No.1,Circular No.4, SMIB and SMIT are currently entitled to the preferential tax rate of 15% and will be entitled to a 10-year tax holiday (5-year(five year full exemption followed by 5-yearfive year half reduction) subsequent to their first profit-making years after utilizing all prior tax losses.losses but no later than December 31, 2017. Both entities were in accumulative loss positions as of December 31, 20082010 and as a result the tax holiday has not yet takenbegun to take effect.
 
3) SMICD
 
  Under the FEIT Laws, SMICD was qualified forto enjoy a 5-year tax holiday (2-year(two year full exemption followed by 3-yearthree year half reduction) subsequent to its first profit-making year after utilizing all prior tax losses. As of December 31, 2008, SMICD was still in a loss position. Pursuant to the New EIT Law, the tax holiday began in 2008 at the statutory tax rate of 25% despite the fact that SMICD had yet to be profitable. The applicable income tax rates for the years ended December 31, 2008, 2009, 2010, 2011, 2012 and thereafter are 0%, 0%, 12.5% 12.5%, 12.5% and 25%, respectively.
4)Energy Science
Energy Science is a manufacturing enterprise located in the Shanghai Pudong New Area. Pursuant to the preferential tax policy granted to the Pudong New Area under the FEIT Law, Energy Science was subject to a preferential tax rate of 15% and qualified for a 5-year tax holiday (2-year full exemption followed by 3-year half reduction in FEIT rate) subsequent to its first profit-making year after utilizing all prior years’ tax losses or 2008 in accordance with the New EIT Law. TheSMICD was in a loss position and the tax holiday commenced in 2007 and would continue until 2011. Thebegan as at December 31, 2008 at the statutory tax rate is gradually transiting toof 25% within a 5-year transition period starting from 2008.. The applicable income tax ratesrate for 2010, 2011, and 2012 is 12.5%, and thereafter is 25% respectively.
In 2010, the Company recorded withholding income tax expense of $1,836,851 for license income generated from its PRC subsidiaries.
The Company’s other subsidiaries are subject to respective local country’s income tax laws, including those of Japan, the United States of America and European countries, whose income tax expenses for the years of 2010, 2009 and 2008 are as follows:
             
  2010  2009  2008 
 
Japan subsidiary $  $  $405,000 
US subsidiary  210,000   252,000   223,812 
European subsidiary  152,105   141,431   128,010 
In 2010, 2009 and 2008, the Company had minimal taxable income in Hong Kong.

F-34


Notes to the Consolidated Financial Statements (continued)
18.Income Taxes(continued)
The provision for income taxes by tax jurisdiction is as follows:
             
  December 31 
  2010  2009  2008 
 
PRC            
Current $4,916,947  $40,949  $15,106 
Adjustments on deferred tax assets and liabilities for enacted changes in tax rate     (32,403,299)  20,542,716 
Deferred  (10,097,549)  (23,818,794)  (9,506,907)
Other jurisdiction, current  362,105   9,556,902   15,382,078 
 
Income tax (benefit) expense $(4,818,497) $(46,624,242) $26,432,993 
 
The income (loss) before income taxes by tax jurisdiction is as follows:
             
  December 31 
  2010  2009  2008 
 
PRC $55,542,596  $(793,668,370) $(291,664,135)
Other jurisdictions  (46,635,277)  (213,651,272)  (113,838,901)
 
  $8,907,319  $(1,007,319,642) $(405,503,036)
 
Deferred tax liabilities $(1,094,256) $(1,035,164) $(411,877)
 
Total deferred tax liabilities $(1,094,256) $(1,035,164) $(411,877)
 

F-35


Notes to the Consolidated Financial Statements (continued)
18.Income Taxes(continued)
Details of deferred tax assets and liabilities are as follows:
             
  2010  2009  2008 
 
Deferred tax assets:            
Allowances and reserves $3,102,688  $13,019,352  $4,732,017 
Start-up costs  23,309,859   159,707   929,991 
Net operating loss carry forwards  185,443,770   109,384,792   55,476,943 
Unrealized exchange loss     6,006   33,228 
Depreciation and impairment of fixed assets  62,068,769   79,104,144   59,224,163 
Subsidy on long lived assets  148,473   479,818   479,817 
Accrued expenses  2,382,856   1,936,337   603,274 
 
Total deferred tax assets  276,456,415   204,090,156   121,479,433 
Valuation allowance  (163,767,922)  (101,558,305)  (75,792,963)
 
Net deferred tax assets $112,688,493  $102,531,851  $45,686,470 
Current portion of deferred tax assets $3,638,427  $8,173,236    
Non-current portion of deferred tax assets  109,050,066   94,358,635   45,686,470 
 
Net deferred tax assets $112,688,493  $102,531,851  $45,686,470 
Deferred tax liability:            
Capitalized interest  (1,049,162)  (1,035,164)  (411,877)
Unrealized exchange gain  (45,094)      
Total deferred tax liabilities  (1,094,256)  (1,035,164)  (411,877)
 
Non-current portion of deferred tax liabilities  (1,094,256)  (1,035,164)  (411,877)
Total deferred tax liabilities $(1,094,256) $(1,035,164) $(411,877)
 
The Company has no material uncertain tax positions as of December 31, 2010 or unrecognized tax benefit which would favorably affect the effective income tax rate in future periods. The Company classifies interest and/or penalties related to income tax matters in income tax expense. As of December 31, 2010, the amount of interest and penalties related to uncertain tax positions is immaterial. The Company does not anticipate any significant increases or decreases to its liability for unrecognized tax benefits within the next 12 months.
As of December 31, 2010, the Company’s PRC subsidiaries had net operating loss carry forward of $1,202.5 million, of which $70.6 million, $265.6 million, $322.1 million, $458.0 million and $86.2 million will expire in 2012, 2013, 2014, 2015 and 2016, respectively.
Under the New EIT Law, the profits of a foreign invested enterprise arising in year 2008 and beyond that will be distributed to its immediate holding company outside China will be subject to a withholding tax rate of 10%. A lower withholding tax rate may be applied if there is a favorable tax treaty between mainland China and the jurisdiction of the foreign holding company. For example, holding companies in Hong Kong that are also tax residents in Hong Kong are eligible for a 5% withholding tax on dividends under the Tax Memorandum between China and the Hong Kong Special Administrative Region. Since the Company intends to reinvest its earnings to expand its businesses in mainland China, its PRC subsidiaries do not intend to distribute profits to their immediate foreign holding companies for the foreseeable future. Accordingly, as of December 31, 2010, the Company has not recorded any withholding tax on the retained earnings of its PRC subsidiaries.

F-36


Notes to the Consolidated Financial Statements (continued)
18.Income Taxes(continued)
Income tax expense computed by applying the applicable EIT tax rate of 15% is reconciled to income before income taxes and noncontrolling interest as follows:
             
  2010  2009  2008 
 
Applicable enterprise income tax rate  15.0%  15.0%  15.0%
Expenses not deductible for tax purpose  46.4%  (2.2%)  (1.8%)
Effect of tax holiday and tax concession  33.8%  (0.8%)  0.0%
Expense (credit) to be recognized in future periods  35.6%  (6.3%)  8.2%
Changes in valuation allowances  30.0%  (0.7%)  (15.6%)
Effect of different tax rate of subsidiaries operating in other jurisdictions  89.6%  (3.6%)  (7.2%)
Utilization of net operating loss carry forwards  (304.5%)      
Changes of tax rate     3.2%  (5.1%)
 
Effective tax rate  (54.1%)  4.6%  (6.5%)
 
The aggregate amount and per share effect of the tax holiday are as follows:
             
  2010  2009  2008 
 
The aggregate dollar effect $3,009,966  $7,979,279  $10,572 
Per share effect — basic and diluted $0.00  $0.00  $0.00 

F-37


Notes to the Consolidated Financial Statements (continued)
19.Noncontrolling Interest
In 2005, AT issued Series A redeemable convertible preference shares (“Series A shares”) to certain third parties for cash consideration of $39 million, representing 43.3% equity interest of AT. In 2007, AT repurchased one million Series A shares for $1 million from a noncontrolling stockholder, and equity interest of the noncontrolling stockholders in AT decreased to 42.7% as of December 31, 2007. On January 1, 2009, the noncontrolling interest holders of AT redeemed eight million Series A shares with a total redemption amount of $9,013,444 and the equity interest of the noncontrolling stockholders in AT decreased to 33.7%.
At any time after January 1, 2009, if AT has not filed its initial registration statement relating its initial public offering as of such date, the holders of Series A shares (other than SMIC) shall have the right to require AT to redeem such holders’ shares upon redemption request by paying cash in an amount per share equal to the initial purchase price at $1.00 for such Series A shares plus the product of (i) purchase price relating to the Series A shares and (ii) 3.5% per annum calculated on a daily basis from May 23, 2005. As of December 31, 2010, 30 million preferred shares are outstanding and redeemable to noncontrolling interest holders. The Series A shares are not considered participating securities and have been recorded at their redemption amount as a noncontrolling interest in the consolidated balance sheets. Adjustments to the carrying value of the Series A shares have been recorded as an accretion of interest to noncontrolling interest in the consolidated statements of operations.
The carrying value of the various noncontrolling interest was recorded at the higher of the redemption value or the historical cost, increased or decreased for the noncontrolling interest’s share of the net income or loss and dividend.
     
Reconciliation of the Noncontrolling Interest    
 
Balance at January 1, 2008 $34,944,408 
Accretion of interest  7,850,880 
 
Balance at December 31, 2008 $42,795,288 
Redemption  (9,013,444)
Accretion of interest  1,059,663 
 
Balance at December 31, 2009 $34,841,507 
Additional of Noncontrolling Interest  3,252,412 
Loss attributed to noncontrolling interest  (139,751)
Accretion of interest  1,050,000 
 
Balance at December 31, 2010 $39,004,168 
 

F-38


Notes to the Consolidated Financial Statements (continued)
20.Share-based Compensation
The Company’s total share-based compensation expense for the years ended December 31, 2010, 2009 and 2008 was $8,794,633, $10,145,101, and $11,617,572, respectively.
Stock options
The Company’s employee stock option plans (the “Plans”) allow the Company to offer a variety of incentive awards to employees, consultants or external service advisors of the Company. In 2004, the Company adopted the 2004 Stock Option Plan (“2004 Option Plan”), under the terms of which the 2004 Option Plan options are granted at the fair market value of the Company’s ordinary shares and expire 10 years from the date of grant and vest over a requisite service period of four years. Any compensation expense is recognized on a straight-line basis over the employee service period. As of December 31, 2010, options to purchase 1,096,603,670 ordinary shares were outstanding, and options to purchase 204,962,557 ordinary shares were available for future grants.
As of December 31, 2010, the Company also has options to purchase 221,075,856 ordinary shares outstanding under the 2001 Stock Plan. The Company had not issued stock options under this plan after the IPO.
A summary of the stock option activity is as follows:
                 
  Ordinary shares  Weighted 
          Average    
      Weighted  Remaining  Aggregated 
  Number of  average  Contractual  Intrinsic 
  options  exercise price  Term  Value 
 
Options outstanding at January 1, 2010  1,410,142,830  $0.10         
Granted  604,275,518  $0.09         
Exercised  (58,106,806) $0.04         
Cancelled  (638,632,016) $0.09         
 
Options outstanding at December 31, 2010  1,317,679,526  $0.11  6.72 years $10,406,295 
 
Vested or expected to vest at December 31, 2010  1,233,390,872  $0.11  6.23 years $9,059,290 
 
Exercisable at December 31, 2010  492,642,959  $0.13  4.27 years $3,839,239 
 
The total intrinsic value of options exercised in the year ended December 31, 2010, 2009 and 2008 2009, 2010, 2011was $2,572,660, $167,625 and thereafter are 0%, 10%, 11%, 12% and 25%,$1,434,758, respectively.
Subsidiaries in other jurisdictions
The weighted-average grant-date fair value of options granted during the year 2010, 2009 and 2008 was $0.04, $0.02 and $0.05, respectively.
The Company’s other subsidiaries are subject
When estimating forfeiture rates, the Company uses historical data to estimate option exercise and employee termination within the pricing formula.

F-39


Notes to the respective local country’s income tax laws, including those of Japan,Consolidated Financial Statements (continued)
20.Share-based Compensation(continued)
The fair value of each option granted are estimated on the date of grant using the Black-Scholes option pricing model with the assumptions noted below. The risk-free rate for periods within the contractual life of the option is based on the yield of the US Treasury Bond. The expected term of options granted represents the period of time that options granted are expected to be outstanding. Expected volatilities are based on the average volatility of our stock prices with the time period commensurate with the expected term of the options. The dividend yield is based on the Company’s intended future dividend plan.
              
  2010 2009 2008 
  
Average risk-free rate of return 1.28%1.18%2.13%
Expected term 1–4 years 2–4 years 1–4 years 
Volatility rate 60.83%55.95%46.82%
Expected dividend yield    
Restricted share units
In January 2004, the Company adopted the 2004 Equity Incentive Plan (which was subsequently amended and restated on June 3, 2010.) (“2004 EIP”) whereby the Company provided additional incentives to the Company’s employees, directors and external consultants through the issuance of restricted shares, restricted share units and stock appreciation rights to the participants at the discretion of the Board of Directors. Under the amended and restated 2004 EIP, the Company was authorized to issue up 1,015,931,725 ordinary shares, being the increased plan limit approved by its shareholders at the 2010 AGM, which is equivalent to 2.5% of its issued and outstanding ordinary shares as of March 31, 2010. As of December 31, 2010, 144,382,562 restricted share units were outstanding and 228,778,913 ordinary shares were available for future grant through the issuance of restricted shares, restricted share units and stock appreciation rights. The RSUs vest over a requisite service period of 4 years and expire 10 years from the date of grant. Any compensation expense is recognized on a straight-line basis over the employee service period.
A summary of RSU activities is as follows:
                 
  Restricted share units  Weighted Average 
      Weighted  Remaining    
  Number of  Average Fair  Contractual  Aggregated 
  Share Units  Value  Term  Fair Value 
 
Outstanding at January 1, 2010  53,625,777  $0.11         
Granted  207,315,992  $0.10         
Exercised  (82,247,855) $0.10         
Cancelled  (34,311,352) $0.10         
 
Outstanding at December 31, 2010  144,382,562  $0.10  8.91 years $14,321,561 
 
Vested or expected to vest at December 31, 2010  124,028,443  $0.10  8.87 years $12,041,247 
 

F-40


Notes to the United States of America, Taiwan, Europe and Hong Kong. In 2008, 2007 and 2006, the Company’s US subsidiary had recorded current income tax expense of $223,812, $163,604 and $31,030, respectively. In 2008, 2007 and 2006, the Company’s European subsidiary had recorded current income tax expense of $128,010, $181,451 and $112,671, respectively. In 2008, 2007 and 2006, the Company recorded income tax expense of $405,000, $1,149,983 and $nil and income tax refund of $774,744, $nil, $nil for the service income generated in Japan. In 2008, 2007 and 2006, the Company had minimal taxable income in Hong Kong.Consolidated Financial Statements (continued)

20.Share-based Compensation(continued)
Pursuant to the 2004 EIP, the Company granted 207,315,992, 787,797 and 41,907,100 RSUs in 2010, 2009, and 2008, respectively, most of which vest over a period of four years. The fair value of the RSUs at the date of grant was $20,169,232, $32,213 and $3,313,114 in 2010, 2009, and 2008, respectively, which is expensed over the vesting period. As a result, the Company has recorded a compensation expense of $3,493,661, $3,370,893, and $5,644,789 in 2010, 2009, and 2008, respectively.
Unrecognized compensation cost related to non-vested share-based compensation.
As of December 31, 2010, there was $16,025,676 of total unrecognized compensation cost related to non-vested share-based compensation arrangements granted under the 2001 Stock Option Plan, 2004 Stock Option Plan and 2004 EIP. The cost is expected to be recognized over a weighted-average period of 1.50 years.
21.Reconciliation of Basic and Diluted Earnings (loss) per Share
The following table sets forth the computation of basic and diluted earnings (loss) per share for the years indicated:
             
  2010  2009  2008 
 
Income (loss) attributable to Semiconductor Manufacturing International Corporation ordinary shares holders $13,100,397  $(963,537,205) $(440,231,120)
Basic:            
Weighted average ordinary shares outstanding  24,258,437,559   22,359,237,084   18,682,585,932 
Less: Weighted average ordinary shares outstanding subject to repurchase        (41,066)
 
Weighted average shares used in computing basic earnings (loss) per share  24,258,437,559   22,359,237,084   18,682,544,866 
 
Basic earnings (loss) per share $0.00  $(0.04) $(0.02)
 
Diluted:            
Weighted average ordinary shares outstanding  24,258,437,559   22,359,237,084   18,682,585,932 
Dilutive effect of stock options and restricted share units  280,572,761       
Dilutive effect of contingently issuable shares  877,587,085       
 
Weighted average shares used in computing diluted earnings (loss) per share  25,416,597,405   22,359,237,084   18,682,544,866 
 
Diluted earnings (loss) per share $0.00  $(0.04) $(0.02)
 

F-41


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATIONNotes to the Consolidated Financial Statements (continued)
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
21.Reconciliation of Basic and Diluted Earnings (loss) per Share(continued)
The Company estimates its income taxes in each of the jurisdictions in which it operates. The Company accounts for income taxes by the liability method. Under this method, deferred income taxes are recognized for tax consequences in future years of differences between the tax basis of assets and liabilities and their financial reporting amounts at each yearend, based on enacted laws and statutory tax rates applicable for temporary differences that are expected to affect taxable income. Valuation allowances are provided if based on available evidence, it is more likely than not that some or all of the deferred tax assets will not be realized.
As of December 31, 2010, the Company has 1,747,346,656 ordinary share equivalents outstanding which were excluded from the computation of diluted earnings per share because the exercise price was greater than the average market price of the common shares. In 2009 and 2008, the Company had 113,454,250 and 189,478,507, respectively, ordinary share equivalents outstanding which were excluded from the computation of diluted loss per share, as their effect would have been anti-dilutive due to the net loss reported in such periods.
The provision for income taxes by tax jurisdiction is as follows:
The following table sets forth the securities comprising of these anti-dilutive ordinary share equivalents for the years indicated:
             
  December 31 
  2008  2007  2006 
PRC            
Current $15,106  $19,602  $4,542 
Adjustments on deferred tax assets and liabilities for enacted changes in tax rate  20,542,716   (20,542,716)   
Deferred  (9,506,907)  (10,691,699)  (25,075,987)
          
Other jurisdictions            
Current  15,382,078   1,495,038   143,701 
Deferred         
          
  $26,432,993  $(29,719,775) $(24,927,744)
          
             
  December 31, 
  2010  2009  2008 
 
Outstanding options to purchase ordinary shares  1,014,825,425   96,282,204   128,361,312 
Outstanding unvested restricted share units     17,172,046   61,117,195 
Warrant shares  759,521,231       
 
   1,774,346,656   113,454,250   189,478,507 
 
The income (loss) before income taxes by tax jurisdiction is as follows:
22.Transactions with Managed Government-Owned Foundries
             
  December 31 
  2008  2007  2006 
PRC $(291,664,135) $51,906,337  $46,806,662 
Other jurisdictions  (113,838,901)  (99,937,852)  (116,777,420)
          
  $(405,503,036) $(48,031,515) $(69,970,758)
          
The Company provided management services to Cension Semiconductor Manufacturing Corporation (“Cension”), a foundry owned by a municipal government. Prior to the termination of the management service in October 2010, management service revenues for 2010, 2009 and 2008 were $4,500,000, $6,000,000 and $12,000,000, respectively.
Details of deferred tax assets and liabilities are as follows:
The Company also provided management services to Wuhan Xinxin Semiconductor Manufacturing Corporation (“Xinxin”), which is a government-owned foundry. In 2009, the Company ceased its recognition of management service revenue due to issues of collectability and no revenue was recorded in 2010.
             
  2008  2007  2006 
Deferred tax assets:            
Allowances and reserves $4,732,017  $  $1,962,410 
Start-up costs  929,991   53,698   958,105 
Net operating loss carry forwards  55,476,943      5,201,545 
Unrealized exchange loss  33,228      47,860 
Depreciation of fixed assets  59,224,163   75,886,896   33,715,867 
Subsidy on long lived assets  479,817   479,817   295,654 
Accrued sales return  603,274      137,719 
          
Total deferred tax assets  121,479,433   76,420,411   42,319,160 
Valuation allowance  (75,792,963)  (19,505,239)  (17,032,260)
          
Net deferred tax assets — non-current $45,686,470  $56,915,172  $25,286,900 
          
Deferred tax liability:            
Capitalized interest $(411,877) $(604,770) $(210,913)
          
Furthermore, the Company recorded a $115.8 million bad debt provision in the second half of 2009, of which $93.5 million and $21.1 million were due to long outstanding overdue receivables relating primarily to the revenue for management services rendered and related equipment sold, respectively. The Company further negotiated with Cension and reached an agreement to settle the balances between the two parties. Cension agreed to make cash payment of $47.2 million to the Company. The remaining balances were relinquished. The Company collected $28.5 million of payments from Cension during 2010 and recorded as a deduction of general and administrative expense in the consolidated statements of operations.

F-42


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
As a result of strategic tax planning that became effective in 2006, a temporary difference between the tax and book basis of certain assets was created. Under SFAS 109 “Accounting for Income Taxes”, the Company recognized a valuation allowance of $20.3 million, $19.5 million and $8.4 million to reduce the deferred tax asset of $59.2 million, $75.9 million and $33.7 million to an amount that is more-likely-than-not to be realized as of December 31, 2008, 2007 and 2006, respectively. Accordingly, income tax expense of $17.5 million and income tax benefits of $31.1 million and $25.3 million were recorded in 2008, 2007 and 2006, respectively. The deferred tax asset recognized relates specially to one of the Company’s subsidiaries on the basis that this subsidiary has achieved profitability in prior years and is expected to continue to be profitable based on the current forecast.
As of December 31, 2008, the Company’s Beijing, Tianjin and Chengdu subsidiaries had net operating loss carry forward of $917.1 million, of which $117.8 million, $174.9 million, $271.8 million and $352.6 million will expire in 2011, 2012, 2013 and 2014, respectively.
Under the New EIT Law, profits earned subsequent to January 1, 2008 from a foreign invested enterprise that are distributed to a non-resident enterprise outside of China, will be subject to a withholding tax rate of 10%. A lower withholding tax rate may be applied if there is a favorable tax treaty between mainland China and the jurisdiction of the non-resident enterprise. For example, holding companies in Hong Kong that are also tax residents in Hong Kong are eligible for a 5% withholding tax (for the Hong Kong holding company which directly holds at least 25% of the capital of the foreign invested enterprise) on dividends under the Tax Memorandum between China and the Hong Kong Special Administrative Region. However, under Guoshuihan (2009) No. 81, a transaction or arrangement entered into for the primary purpose of being qualified for a preferential tax rate on dividends under a tax agreement would not be a valid reason for qualifying for such preferential treatment. Where a taxpayer inappropriately enjoyed the tax agreement treatment due to such a transaction or arrangement, the competent tax authorities are empowered to make appropriate adjustments that they deem appropriate.
Since the Company intends to reinvest its earnings to expand its businesses in mainland China, its PRC subsidiaries do not intend to distribute profits to their immediate foreign holding companies in the foreseeable future. Accordingly, as of December 31, 2008, the Company has not recorded any withholding tax on the retained earnings of its PRC subsidiaries.

F-43


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
Uncertainties exist with respect to how China’s current income tax law applies to our overall operations, and more specifically, with regard to tax residency status. New EIT Law includes a provision specifying that legal entities organized outside of China will be considered residents for Chinese income tax purposes if their place of effective management or control is within China. The Implementation RulesNotes to the EIT Law provide that non-resident legal entities will be considered China residents if substantial and overall management and control over the manufacturing and business operations, personnel, accounting, properties, etc. occurs within China. Additional guidance is expected to be released by the Chinese government in the near future that may clarify how to apply the rules to taxpayers. Despite the present uncertainties resulting from the limited PRC tax guidance on the issue, we do not believe that our legal entities organized outside of China should be treated as residents for EIT Law purposes. If one or more of our legal entities organized outside of China were characterized as China tax residents for the year ended December 31, 2008, the impact would adversely affect our results of operation.
Income tax expense computed by applying the applicable EIT tax rate of 15% is reconciled to income before income taxes and minority interest as follows:
             
  2008  2007  2006 
Applicable enterprise income tax rate  15.0%  15.0%  15.0%
Expenses (credit) not deductible for tax purpose  (1.8%)  (0.9%)  3.1%
Effect of tax holiday and tax concession  0.0%  48.7%  25.0%
Expense (credit) to be recognized in future periods  8.2%  (19.2%)  29.3%
Changes in valuation allowances  (15.6%)  9.3%  (11.9%)
Effect of different tax rate of subsidiaries operating in other jurisdictions  (7.2%)  (33.8%)  (24.9%)
Changes of tax rate  (5.1%)  42.8%   
          
Effective tax rate  (6.5%)  61.9%  35.6%
          
The aggregate amount and per share effect of the tax holiday are as follows:
             
  2008  2007  2006 
The aggregate dollar effect $10,572  $23,415,370  $17,472,283 
Per share effect- basic and diluted $0.00  $0.00  $0.00 
The Company adopted FIN 48 on January 1, 2007. The Company made its assessment of the level of tax authority for each tax position (including the potential application of interest and penalties) based on its technical merits. FIN 48 did not have any impact on the Company total liabilities or stockholders’ equity as of January 1, 2007. The Company has no material uncertain tax positions as of December 31, 2008 or unrecognized tax benefit which would favorably affect the effective income tax rate in future periods. The Company classifies interest and/or penalties related to income tax matters in income tax expense. As of December 31, 2008, the amount of interest and penalties related to uncertain tax positions is immaterial. The Company does not anticipate any significant increases or decreases to its liability for unrecognized tax benefits within the next 12 months.

F-44


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
20. MINORITY INTEREST
In 2004, the Company incorporated AT and SMICD, a wholly-owned subsidiary of AT.
In 2005, AT issued Series A redeemable convertible preference shares (“Series A shares”) to certain third parties for cash consideration of $39 million, representing 43.3% equity interest of AT. In 2007, AT repurchased 1 million preference shares with $1 million from a minority stockholder, and equity interest of the minority stockholders in AT decreased to 42.7% as of December 31, 2007. No share transaction occurred in 2008.
At any time after January 1, 2009, if AT has not filed its initial registration statement relating its initial public offering as of such date, the holders of Series A shares (other than SM IC) shall have the right to require AT to redeem such holders’ shares upon redemption request by paying cash in an amount per share equal to the initial purchase price at $1.00 for such Series A shares plus the product of (i) purchase price relating to the Series A shares and (ii) 3.5% per annum calculated on a daily basis from May 23, 2005. As of December 31, 2008, 38 million preferred shares are outstanding to minority interest holders and will be redeemable beginning January 1, 2009. The Series A shares are not considered participating securities and have been recorded at their redemption amount as a non-controlling interest in the consolidated balance sheets. Adjustments to the carrying value of the Series A shares have been recorded as a minority interest expense in the consolidated statements of operations.

F-45


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
21. CAPITAL STOCK
In November 2008, the Company issued 3,699,094,300 ordinary shares to a stockholder at HK$0.36 per share and received consideration of $165,100,000, net of issuance costs of approximately $3,000,000.

F-46


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
22. SHARE-BASED COMPENSATION
Stock options
The Company’s employee stock option plans (the “Plans”) allow the Company to offer a variety of incentive awards to employees, consultants or external service advisors of the Company. In 2004, the Company adopted the 2004 Stock Option Plan (“2004 Option Plan”) whereby the Company grants stock options to attract, retain and motivate employees, directors and service providers. Following the Company’s IPO in March 2004, the Company issued stock options solely through the 2004 Option Plan. Options to purchase 1,317,000,000 ordinary shares are authorized under the 2004 Option Plan. Under the terms of the 2004, Option Plan options are granted at the fair market value of the Company’s ordinary shares, and expire 10 years from the date of grant and vest over a requisite service period of four years. Any compensation expense is recognized on a straight-line basis over the employee service period. As of December 31, 2008, options to purchase 786,071,676 ordinary shares were outstanding, and options to purchase 530,428,324 ordinary shares were available for future grants.
In 2001, the Company adopted the 2001 Stock Option Plan (“2001 Option Plan”). Options to purchase 998,675,840 ordinary shares and 536,566,500 of Series A convertible preference shares are authorized under the 2001 Option Plan. Options to purchase Series A convertible preference shares were converted into options to purchase ordinary shares immediately prior to the completion of the IPO. Under the terms of the 2001 Option Plan, options are generally granted at prices equal to the fair market value, expire 10 years from the date of grant and vest over a requisite service period of four years. Following the IPO, the Company no longer issues stock options under the 2001 Option Plan. As of December 31, 2008, options to purchase 338,084,318 ordinary shares were outstanding.
A summary of the stock option activity is as follows:
                 
  Ordinary shares  Weighted 
         Average    
      Weighted  Remaining  Aggregated 
  Number  average  Contractual  Intrinsic 
  of options  exercise price  Term  Value 
Options outstanding at January 1, 2008  1,042,398,482  $0.14         
Granted  248,840,090  $0.05         
Exercised  (22,730,522) $0.03         
Forfeited or cancelled  (144,352,056) $0.13         
             
Options outstanding at December 31, 2008  1,124,155,994  $0.12  6.79 years $34,499,475 
             
Vested or expected to vest at December 31, 2008  1,080,819,321  $0.12  6.87 years $30,288,832 
             
Exercisable at December 31, 2008  491,098,679  $0.13  4.89 years $28,604,914 
             
The total intrinsic value of options exercised in the year ended December 31, 2008, 2007 and 2006 was $1,434,758, $5,679,680 and $5,240,221, respectively.

F-47


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
Certain options were granted to non-employees that resulted in a share-based compensation expense of $374,967, $665,787 and $584,283 in 2008, 2007 and 2006, respectively.
The weighted-average grant-date fair value of options granted during the year 2008, 2007 and 2006 was $0.05, $0.04 and $0.05, respectively.
The fair value of each option and share grant is estimated on the date of grant using the Black-Scholes option pricing model with the assumptions noted below. The Company uses historical data to estimate option exercise and employee termination within the pricing formula. The risk-free rate for periods within the contractual life of the option is based on the yield of the US Treasury Bond. The expected term of options granted represents the period of time that options granted are expected to be outstanding. Expected volatilities are based on the average volatility of the Company with the time period commensurate with the expected time of the options. The dividend yield is based on the Company’s intended future dividend plan.
             
  2008  2007  2006 
Average risk-free rate of return  2.13%  3.98%  4.72%
Expected term 1-4 years 1-4 years 2-4 years
Volatility rate  46.82%  35.28%  32.69%
Expected dividend yield         
Restricted share units (RSU)
In January 2004, the Company adopted the 2004 Equity Incentive Plan (“2004 EIP”) whereby the Company provided additional incentives to the Company’s employees, directors and external consultants through the issuance of restricted shares, restricted share units (“RSU”) and stock appreciation rights to the participants at the discretion of the Board of Directors. Under the 2004 EIP, the Company was authorized to issue up to 2.5% of the issued and outstanding ordinary shares immediately following the closing of its IPO, which were 455,409,330 ordinary shares. As of December 31, 2008, 95,620,762 RSU were outstanding and 200,948,509 ordinary shares were available for future grant. The RSU vest over a requisite service period of 4 years and expire 10 years from the date of grant. No stock appreciation rights have been issued. Any compensation expense is recognized on a straight-line basis over the vesting period.

F-48


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
A summary of RSU activity is as follows:
                 
  Restricted share units  Weighted Average 
      Weighted  Remaining  Aggregated 
  Number of  Average  Contractual  Fair 
  Share Units  Fair Value  Term  Value 
Outstanding at January 1, 2008  119,442,808  $0.14         
Granted  41,907,100  $0.08         
Exercised  (49,953,525) $0.13         
Forfeited or cancelled  (15,775,621) $0.13         
Outstanding at December 31, 2008  95,620,762  $0.12  8.19 years $11,970,507 
Vested or expected to vest at December 31, 2008  29,485,303  $0.12  8.29 years $4,047,455 
Pursuant to the 2004 EIP, the Company granted 41,907,100, 40,519,720 and 16,058,864 RSU in 2008, 2007, and 2006, respectively. The fair value of the RSU at the date of grant was $3,313,114, $5,631,263 and $2,055,597 in 2008, 2007, and 2006, respectively. The Company recorded compensation expense of $5,644,789, $7,216,799 and $5,452,148 in 2008, 2007, and 2006, respectively.
Unrecognized compensation cost related to non-vested share-based compensation
As of December 31, 2008, there was $13,996,655 of total unrecognized compensation cost related to non-vested share- based compensation arrangements granted under the 2001 Stock Option Plan, 2004 Stock Option Plan and 2004 EIP. The cost is expected to be recognized over a weighted-average period of 1.15 years.
As of December 31, 2008, 2007, and 2006 the Company had the following shares subject to repurchase:
             
  2008  2007  2006 
Ordinary Shares     90,000   16,498,871 

F-49


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
23. RECONCILIATION OF BASIC AND DILUTED LOSS PER SHARE
The following table sets forth the computation of basic and diluted loss per share for the years indicated:
             
  2008  2007  2006 
Net Loss $(440,231,120) $(19,468,147) $(44, 109,078)
Less: Cumulative effect of a change in accounting principle        (5,153,986)
          
Net loss before cumulative effect of a change in accounting principle  (440,231,120)  (19,468,147)  (49,263,064)
          
Basic and diluted:            
Weighted average ordinary shares outstanding  18,682,585,932   18,505,650,171   18,361,910,033 
Less: Weighted average ordinary shares outstanding subject to repurchase  (41,066)  (3,709,682)  (27,411,110)
          
Weighted average shares used in computing basic and diluted income per share  18,682,544,866   18,501,940,489   18,334,498,923 
          
On the basis of loss per share before cumulative effect of a change in accounting principle, basic and diluted $(0.02) $(0.00) $(0.00)
          
Cumulative effect of a change in accounting principle per share, basic and diluted $  $  $0.00 
          
Basic and diluted loss per share $(0.02) $(0.00) $(0.00)
          
Ordinary share equivalents of share options and restricted share units are calculated using the treasury stock method. Under the treasury stock method, the proceeds from the assumed conversion of share options and restricted share units are used to repurchase outstanding ordinary shares using the average fair value for the periods.
As of December 31, 2008, 2007 and 2006, the Company had 189,478,507, 147,988,221 and 223,818,877, respectively, ordinary share equivalents outstanding which were excluded in the computation of diluted loss per share, as their effect would have been anti-dilutive due to the net loss reported in such periods. They include:
             
  December 31 
  2008  2007  2006 
Outstanding options to purchase ordinary shares  128,361,312   72,685,282   62,339,207 
Outstanding unvested restricted share units to purchase ordinary shares  61,117,195   75,302,939   161,479,670 
          
   189,478,507   147,988,221   223,818,877 
          

F-50


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
24. TRANSACTIONS WITH MANAGED GOVERNMENT-OWNED FOUNDRIES
The Company provides management services to Cension Semiconductor Manufacturing Corporation (“Cension”) and Wuhan Xinxin Semiconductor Manufacturing Corporation (“Xinxin”), which are government-owned foundries. Management service revenues under these arrangements for 2008, 2007 and 2006 were $33,000,000, $42,000,000 and $4,151,238, respectively.
In 2008, 2007 and 2006, the Company sold equipment with carrying value of $7,688, $19,530,909 and $19,411,553 to Cension for $175,300, $42,300,258 and $61,182,653, which resulted in gains on sale of $167,612, $22,769,349 and $41,771,099, respectively.
In 2008, the Company sold equipment with carrying value of $3,629,605 to Xinxin for $3,944,204, which resulted in a gain on sale of $314,599.
On April 10, 2007, Cension entered into an Asset Purchase Agreement (the “Agreement”) with Elpida Memory, Inc. (“Elpida”), a Japan based memory chip manufacturer, for the purchase of Elpida’s 200mm wafer processing equipment currently located in Hiroshima, Japan for the total price of approximately $320 million.
As part of the Agreement, the Company provided a corporate guarantee for a maximum guarantee liability of $163.2 million on behalf of Cension in favour of Elpida. The Company’s guarantee liability will terminate upon full payment of the purchase price by Cension to Elpida. In return for providing the above corporate guarantee, the Company received a guarantee fee from Cension based on 1.5% of the guarantee amount, or $2.4 million. Approximately $160 million in 200mm wafer processing equipment purchased under the Agreement was held as collateral under the guarantee.
The Company is entitled to the net profit (loss) associated with the ongoing operations of this equipment, net of a guaranteed fixed share of revenue for Elpida, during the transitional period prior to when the equipment was relocated from Hiroshima to Chengdu. Such relocation was completed in 2008.
On August 30, 2007, Cension negotiated with Elpida and subsequently reduced the purchase price to US$309.5 million.
In April 2008, SMIC entered into an agreement with Cension to purchase approximately half of the Equipment from Cension for approximately $152 million. The equipment acquired by the Company will be used for the Company’s future expansion. The corporate guarantee was released after this purchase.

F-51


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
25. COMMITMENTSConsolidated Financial Statements (continued)
23.Commitments
(a) Purchase commitments
 
  As of December 31, 20082010, the Company had the following commitments to purchase machinery, equipment and construction obligations. The machinery and equipment is scheduled to be delivered atto the Company’s facility by December 31, 2009.2011.
    
    
Facility construction $7,359,374  $82,989,853 
Machinery and equipment $52,235,105  558,085,743 
   
 $59,594,479  $641,075,596 
   
(b) Royalties
 
  The Company has entered into several license and technology agreements with third parties. The terms of the contracts range from 3three to 10ten years. The Company is subject tomakes royalty payments based on a certain percentage of product sales usingof products, which use the third parties’ technology or license. In 2008, 20072010, 2009 and 2006,2008, the Company incurred royalty expense of $18,867,409, $13,118,570$29,498,094, $20,836,511 and $7,724,704,$18,867,409, respectively, which was included in cost of sales.
24. Segment and Geographic Information
  The Company is engaged principally in the computer-aided design, manufacturing and trading of integrated circuits. The Company’s chief operating decision maker has entered into several license agreements with third parties wherebeen identified as the Company provides access to certain licensed technology.Chief Executive Officer, who reviews consolidated results of manufacturing operations when making decisions about allocating resources and assessing performance of the Company. The Company will receive royalty payments based on a certain percentage of product sales usingbelieves it operates in one segment. The following table summarizes the Company’s licensed technology. In 2008, 2007 and 2006, the Company earned royalty income of $1,192,537, $1,428,603 and $1,384,137, respectively, which was included in sales. Royalty income is recognized one quarter in arrears when reports are received.net revenues generated from different geographic locations:
             
  2010  2009  2008 
 
Total sales:            
United States $851,914,130  $632,047,071  $767,966,660 
Europe  39,178,321   20,806,685   92,572,683 
Asia Pacific*  58,773,919   35,625,352   40,849,450 
Taiwan  173,108,545   157,624,333   185,848,747 
Japan  3,187,517   9,685,012   37,706,875 
Mainland China  428,626,155   214,598,650   228,766,884 
 
  $1,554,788,587  $1,070,387,103  $1,353,711,299 
 
(c)* Operating lease as lessorNot including Taiwan, Japan, Mainland China
  The Company owns apartment facilities that are leased to the Company’s employees at negotiated prices. The apartment rental agreement is renewed on an annual basis. The Company also leases office space to non-related third parties. Office lease agreements are renewed on an annual basis as well. The total amount of rental income recorded in 2008, 2007 and 2006 was $5,818,655, $6,937,107 and $6,142,692, respectively, and is recorded in other income in the statement of operations.
(d)Operating lease as lessee
The Company has various operating leases including land use rights, under non-cancellable leases expiring at various times through 2053. Future minimum lease payments under these leases as of December 31, 2008 are as follows:
     
Year ending    
2009 $6,055,605 
2010  269,868 
2011  202,580 
2012  168,153 
Thereafter  3,024,384 
    
  $9,720,590 
    
The total operating lease expense recorded in 2008, 2007 and 2006 was $1,084,894, $643,621 and $410,193, respectively.

F-52


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
26. SEGMENT AND GEOGRAPHIC INFORMATION
The Company is engaged principally in the computer-aided design, manufacturing and trading of integrated circuits. In accordance with SFAS No. 131, “Disclosures about Segments of an Enterprise and Related Information,” the Company’s chief operating decision maker has been identified as the Chief Executive Officer, who reviews consolidated results of manufacturing operations when making decisions about allocating resources and assessing performance of the Company. The Company believes it operates in one segment, and all financial segment information required by SFAS No. 131 can be found in the consolidated financial statements. The following table summarizes the Company’s net revenues generated from different geographic locations:
             
  2008  2007  2006 
Total sales:            
United States $767,966,660  $657,603,189  $602,506,213 
Europe  92,572,683   328,710,235   440,327,872 
Asia Pacific (Excluding Japan and Taiwan)  269,616,334   227,973,648   168,607,598 
Taiwan  185,848,747   183,113,880   153,057,616 
Japan  37,706,875   152,364,336   100,823,568 
          
  $1,353,711,299  $1,549,765,288  $1,465,322,867 
          
Revenue is attributed to countries based on headquarter of customer operations and is not related to the shipment destination.

Substantially all of the Company’s long-lived assets are located in the PRC.

F-53


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
27. SIGNIFICANT CUSTOMERS
The following table summarizes net revenue and receivable from customers which accounted for 10% or more of our net revenue, accounts receivable, other current assets or receivable for sale of manufacturing equipment:
                         
  Net revenue  Accounts receivable 
  Year ended December 31,  December 31, 
  2008  2007  2006  2008  2007  2006 
A  22%  16%  17%  23%  14%  14%
B  14%  *   *   *   *   * 
C  13%  *   *   *   *   * 
D  *   18%  28%  *   15%  29%
E  *   *   *   *   13%  * 
F  *   *   *   16%  *   * 
G  *   *   *   18%  *   * 
                         
     Receivable for sale of 
  Other current assets  manufacturing equipment 
  December 31,  December 31, 
  2008  2007  2006  2008  2007  2006 
F  50%  29%  *   83%  100%  100%
G  *   *   *   17%  *   * 
*Less than 10%

F-54


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
28. LITIGATION
Overview of TSMC Litigation:
Beginning in December 2003 through August 2004, the Company became subject to several lawsuits brought by Taiwan Semiconductor Manufacturing Company, Limited (“TSMC”) relating to alleged infringement of certain patents and misappropriation of alleged trade secrets relating to methods for conducting semiconductor fab operations and manufacturing integrated circuits.
On January 30, 2005, the Company and TSMC exchanged signature pages later attached to a settlement agreement. Terms were added to the document subsequent to the exchange of signatures. The identification of the exact terms of the agreement were determined at a preliminary trial in 2009, as described below under “Recent TSMC Legal Developments.” As found by the California Superior Court, SMIC and TSMC agreed, without admission of liability, to dismiss all pending legal actions without prejudice between the two companies (the “Settlement Agreement”). The terms of the Settlement Agreement also were determined to include the following:
1)The Company and TSMC agreed to cross-license each other’s patent portfolio for all semiconductor device products, effective from January 2005 through December 2010.
2)TSMC covenanted not to sue the Company for trade secret misappropriation as alleged in TSMC’s legal actions as it related to .15ìm and larger processes subject to certain conditions (“TSMC Covenant”). The TSMC Covenant did not cover .13ìm and smaller technologies after 6 months following execution of the Settlement Agreement (July 31, 2005). Excluding the .13ìm and smaller technologies, the TSMC Covenant remains in effect indefinitely, terminable upon a breach by the Company.
3)The Company is required to deposit certain Company materials relating to .13ìm and smaller technologies into an escrow account until December 31, 2006 or under certain circumstances for a longer period of time.
4)The Company agreed to pay TSMC an aggregate of $175 million in installments of $30 million for each of the first five years and $25 million in the sixth year.
The Company believes the Court’s ruling is erroneous. The ruling may be appealed by SMIC following the filing of a final judgment by the Court in this matter.
Accounting under the Settlement Agreement:
In accounting for the Settlement Agreement, the Company determined that there were several components of the Settlement Agreement—settlement of litigation, covenant not to sue, patents licensed by us to TSMC and the use of TSMC’s patent license portfolio both prior and subsequent to the settlement date.

F-55


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
The Company does not believe that the settlement of litigation, covenant not to sue or patents licensed by us to TSMC qualify as accounting elements. In regard to the settlement of litigation, the Company cites the following:
1)The Settlement Agreement reached between TSMC and SMIC clearly stated that there was no admission of liability by either party;
2)The Settlement Agreement required all parties to bear their own legal costs;
3)There were no other damages associated with the Settlement Agreement;
4)There was a provision in the Settlement Agreement for a grace period to resolve any misappropriation issues had they existed;
5)Albeit a complaint had been filed by TSMC on trade secret infringement, TSMC has never identified to the Company which trade secrets it claimed were being infringed upon by the Company;
6)The Settlement Agreement was concluded when the litigation process was still at a relatively early stage and the outcome of the litigation was therefore highly uncertain.
The TSMC covenant not to sue for alleged trade secrets misappropriation does not qualify as a separable asset in accordance with either SFAS 141 or SFAS 142 as TSMC had never specified the exact trade secrets that it claimed were misappropriated, the Company’s belief that TSMC’s trade secrets may be obtained within the marketplace by other legal means and the Company never obtained the legal right to use TSMC’s trade secrets.
In addition, the Company did not attribute any value to the patents licensed to TSMC under the Settlement Agreement due to the limited number of patents held by the Company at the time of the Settlement Agreement.
As a result, the Company determined that only the use of TSMC’s patent license portfolio prior and subsequent to the settlement date were considered elements of an arrangement for accounting purposes. In attributing value to these two elements, the Company first discounted the payment terms of the $175 million settlement amount using an annual 3.4464% interest rate to arrive at a net present value of $158 million. This amount was then allocated to the pre- and post- settlement periods based on relative fair value, as further described below.
Based on this approach, $16.7 million was allocated to the pre-settlement period, reflecting the amount that the Company would have paid for use of the patent license portfolio prior to the date of the Settlement Agreement. The remaining $141.3 million, representing the relative fair value of the licensed patent license portfolio, was recorded on the Company’s consolidated balance sheets as a deferred cost and is being amortized over a six-year period, which represents the life of the licensed patent license portfolio. The amortization of the deferred cost is included as a component of cost of sales in the consolidated statements of operations.
Valuation of Deferred Cost:
The fair value of the patent license portfolio was calculated by applying the estimated royalty rate to the specific revenue generated and expected to be generated from the specific products associated with the patent license portfolio.

F-56


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
The selected royalty rate was based on the review of median and mean royalty rates for the following categories of licensing arrangements:
a)existing third-party license agreements with SMIC;
b)the analysis of comparable industry royalty rates related to semiconductor chip/integrated circuit (“IC”) related technology; and
c)the analysis of comparable industry royalty rates related to semiconductor fabrication.
On an annualized basis, the amounts allocated to past periods was lower than that allocated to future periods as the Company assumed increases in revenues relating to the specific products associated with the patent license portfolio.
As the total estimated fair value of the patent license portfolio exceeded the present value of the settlement amount, the Company allocated the present value of the settlement amount based on the relative fair value of the amounts calculated prior and subsequent to the settlement date.
Recent TSMC Legal Developments:
On August 25, 2006, TSMC filed a lawsuit against the Company and certain subsidiaries, namely SMIC (Shanghai), SMIC (Beijing) and SM IC (Americas) in the Superior Court of the State of California, County of Alameda for alleged breach of a settlement agreement, alleged breach of promissory notes and alleged trade secret misappropriation by the Company. TSMC seeks, among other things, damages, injunctive relief, attorneys’ fees, and the acceleration of the remaining payments outstanding under that settlement agreement.
In the present litigation, TSMC alleges that the Company has incorporated TSMC trade secrets in the manufacture of the Company’s 0.13 micron or smaller process products. TSMC further alleges that as a result of this claimed breach, TSMC’s patent license is terminated and the covenant not to sue is no longer in effect with respect to the Company’s larger process products. The Company has vigorously denied all allegations of misappropriation. The Court has made no finding that TSMC’s claims are valid. The Court has set a trial date of September 8, 2009.
On September 13, 2006, the Company announced that in addition to filing a response strongly denying the allegations of TSMC in the United States lawsuit, it filed on September 12, 2006, a cross-complaint against TSMC seeking, among other things, damages for TSMC’s breach of contract and breach of implied covenant of good faith and fair dealing.
On November 16, 2006, the High Court in Beijing, the People’s Republic of China, accepted the filing of a complaint by the Company and its wholly-owned subsidiaries, namely, SMIC (Shanghai) and SMIC (Beijing), regarding the unfair competition arising from the breach of bona fide (i.e. integrity, good faith) principle and commercial defamation by TSMC (“PRC Complaint”). In the PRC Complaint, the Company is seeking, among other things, an injunction to stop TSMC’s infringing acts, public apology from TSMC to the Company and compensation from TSMC to the Company, including profits gained by TSMC from their infringing acts.

F-57


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
On August 14, 2007, the Company filed an amended cross-complaint against TSMC seeking, among other things, damages for TSMC’s breach of contract and breach of patent license agreement. TSMC thereafter denied the allegations of the Company’s amended cross-complaint and subsequently filed additional claims that the Company breached a settlement agreement by filing an action in the Beijing High Court. The Company has denied these additional claims by TSMC.
On August 15-17, 2007, the California Court held a preliminary injunction hearing on TSMC’s motion to enjoin use of certain process recipes in certain of the Company’s 0.13 micron logic process flows.
On September 7, 2007, the Court denied TSMC’s preliminary injunction motion, thereby leaving unaffected the Company’s development and sales. However, the court required the Company to provide 10 days’ advance notice to TSMC if the Company plans to disclose logic technology to non-SMIC entities under certain circumstances, to allow TSMC to object to the planned disclosure.
In May 2008, TSMC filed a motion in the California Court for summary adjudication against the Company on several of the Company’s cross claims. The Company opposed the motion and on August 6, 2008, the Court granted in part and denied in part TSMC’s motion.
On June 23, 2008, the Company filed in the California court a cross-complaint against TSMC seeking, among other things, damages for TSMC’s unlawful misappropriation of trade secrets from SMIC to improve its competitive position against SM IC.
On July 10, 2008, the California Court held a preliminary injunction hearing on TSMC’s motion to enjoin disclosure of information on certain process recipes in the Company’s 0.30 micron logic process flows to 3rd parties. On August 8, 2008, the Court granted-in-part TSMC’s motion and preliminarily enjoined SMIC from disclosing fourteen 0.30 ìm process steps. On October 3, 2008, SMIC filed a notice of appeal of the Court’s August 8, 2008 Order with the California Court of Appeal. This appeal is currently pending.
During the pre-trial proceedings in the matter, questions arose regarding the actual terms of the 2005 Settlement Agreement between SMIC and TSMC. Accordingly, the California Court held a preliminary trial on January 13 to 16, 2009, limited to a determination of the terms of the Settlement Agreement and an interpretation of any requirements to “meet and confer” prior to institution of litigation. On March 10, 2009, the Court issued a Statement of Decision finding, in part, that an agreement between the parties was executed on January 30, 2005, and thereafter amended on February 2, 2005, as urged by TSMC. The Company believes the Court’s ruling is erroneous. The ruling may be appealed by SMIC following the filing of a final judgment by the Court in this matter.
On May 1, 2009, the Company filed motions for summary adjudication against TSMC’s claims for breach of promissory notes and violation of the California Uniform Trade Secrets Act. The motions will be heard by the Court on July 17, 2009.
The California Court has further scheduled a trial upon all liability issues related to a selected list of TSMC trade secret claims and SMIC trade secret claims to commence on September 8, 2009.

F-58


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
In the Company’s action in the Beijing High People’s Court, following an unsuccessful challenge to that Court’s jurisdiction by TSMC, the Court has held evidentiary hearings on October 15, October 29, and November 25, 2008. The Court rendered its first-instance judgment on June 10, 2009. Claims of SMIC against TSMC were not supported by the Court in the first-instance judgment. The first-instance judgment is not final and either TSMC or SMIC may further appeal to the PRC Supreme People’s Court according to the law.
Under the provisions of SFAS 144, the Company is required to make a determination as to whether or not this pending litigation represents an event that requires a further analysis of whether the patent license portfolio has been impaired. We believe that the lawsuit is at a discovery stage and we are still evaluating whether or not the litigation represents such an event. The Company expects further information to become available to us, which will aid us in making a determination. The outcome of any impairment analysis performed under SFAS 144 might result in a material impact to our financial position and results of operations. Because the case is in its discovery stage, the Company is unable to evaluate the likelihood of an unfavorable outcome or to estimate the amount or range of potential loss.

F-59


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
29. RETIREMENT BENEFIT
The Company’s local Chinese employees are entitled to a retirement benefit based on their basic salary upon retirement and their length of service in accordance with a state-managed pension plan. The PRC government is responsible for the pension liability to these retired staff. The Company is required to make contributions to the state-managed retirement plan equivalent to 20% — 22.5% of the monthly basic salary of current employees. Employees are required to make contributions equivalent to 6% — 8% of their basic salary. The contribution of such an arrangement was approximately $11,039,680, $7,223,644 and $5,452,660 for the years ended December 31, 2008, 2007 and 2006, respectively. The retirement benefits do not apply to non-PRC citizens. The Company’s retirement benefit obligations outside the PRC are not significant.

F-60


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
30. DISTRIBUTION OF PROFITS
As stipulated by the relevant laws and regulations applicable to China’s foreign investment enterprise, the Company’s PRC subsidiaries are required to make appropriations from net income as determined under accounting principles generally accepted in the PRC (“PRC GAAP”) to non-distributable reserves which include a general reserve, an enterprise expansion reserve and a staff welfare and bonus reserve. Wholly-owned PRC subsidiaries are not required to make appropriations to the enterprise expansion reserve but appropriations to the general reserve are required to be made at not less than 10% of the profit after tax as determined under PRC GAAP. The staff welfare and bonus reserve is determined by the Board of Directors.
The general reserve is used to offset future extraordinary losses. The subsidiaries may, upon a resolution passed by the stockholders, convert the general reserve into capital. The staff welfare and bonus reserve is used for the collective welfare of the employee of the subsidiaries. The enterprise expansion reserve is for the expansion of the subsidiaries’ operations and can be converted to capital subject to approval by the relevant authorities. These reserves represent appropriations of the retained earnings determined in accordance with Chinese law. Appropriations to general reserve by the Company’s PRC subsidiaries were nil, $15,640,153 and $11,956,185 in 2008, 2007 and 2006, respectively.

F-61


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
31. COMPONENTS OF LOSS (INCOME) FROM OPERATIONS
             
  2008  2007  2006 
Loss (income) from operations is arrived at after charging (crediting):            
Auditors’ remuneration $1,584,925  $1,698,293  $1,577,928 
Amortization of land use rights  927,746   886,293   577,578 
Foreign currency exchange loss (gain)  (8,195,569)  3,117,962   3,939,745 
Bad debt expense  1,301,556   486,920   2,957,505 
Inventory write-down  17,766,628   6,570,137   2,297,773 
Staff costs inclusive of directors’ remuneration $190,942,366  $151,447,470  $108,742,094 

F-62


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
32. DIRECTORS’ REMUNERATION AND FIVE HIGHEST PAID INDIVIDUALS
Directors
Details of emoluments paid by the Company to the directors of the Company in 2008, 2007 and 2006 are as follows:
                                         
                          Zheng      Jiang    
  Richard  Kawanishi  Wang  Hsu  Lip-Bu  Henry  Gang  Albert  Shang    
  Chang  Tsuyoshi  Yang Yuan  Ta-Lin  Tan  Shaw  Wang  Y.C.  Zhou  Total 
2008
                                        
Salaries and other benefits
 $218,398  $  $  $  $  $  $  $  $  $218,398 
Stock option benefits
  144,300   4,285   4,285   4,285   4,285   4,285      12,489      178,214 
                               
Total emoluments
 $362,698  $4,285  $4,285  $4,285  $4,285  $4,285  $  $12,489  $  $396,612 
                               
2007                                        
Salaries and other benefits $195,395  $  $  $  $  $  $  $  $  $195,395 
Stock option benefits  172,203   17,189   17,189   17,189   17,189   17,189      50,094      308,242 
                               
Total emoluments $367,598  $17,189  $17,189  $17,189  $17,189  $17,189  $  $50,094  $  $503,637 
                               
2006                                        
Salaries and other benefits $192,727  $  $  $  $  $  $  $  $  $192,727 
Stock option benefits  156,241   12,951   12,951   12,951   12,951   12,951      37,742      258,738 
                               
Total emoluments $348,968  $12,951  $12,951  $12,951  $12,951  $12,951  $  $37,742  $  $451,465 
                               
The emoluments of the directors were within the following bands:
             
  2008  2007  2006 
  Number of  Number of  Number of 
  directors  directors  directors 
HK$nil to HK$1,000,000 ($128,620)  8   9   10 
HK$1,000,001 ($128,620) to HK$1,500,000 ($192,930)         
HK$1,500,001 ($192,930) to HK$2,000,000 ($257,240)         
HK$2,000,001 ($257,240) to HK$2,500,000 ($321,550)         
HK$2,500,001 ($321,550) to HK$3,000,000 ($385,860)  1   1   1 
The Company granted nil, nil and 3,500,000 options to purchase ordinary shares of the Company to the directors in 2008, 2007 and 2006, respectively. During the year ended December 31, 2008, no stock options were exercised and 500,000 stock options were cancelled by the directors. The cancellation was due to the resignation of a director.
The Company granted nil, nil and 500,000 restricted share units to purchase ordinary shares of the Company to the directors in 2008, 2007 and 2006, respectively. During the year ended December 31, 2008, 500,000 restricted share units automatically vested and no restricted share units were cancelled.

F-63


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
In 2008, 2007 and 2006, no emoluments were paid by the Company to any of the directors as an inducement to join or upon joining the Company or as compensation for loss of office. In September 2006, two directors were each offered options to purchase 500,000 ordinary shares. Both directors declined the options.
Five highest paid employees’ emoluments
Of the five individuals with the highest emoluments in the Group, one is a director of the Company whose emoluments are included in the disclosure above. The emoluments of the remaining four in 2008, 2007 and 2006 are as follows:
             
  2008  2007  2006 
Salaries and other benefits $941,001  $586,065  $518,198 
Bonus     237,969   233,662 
Stock option benefits  232,296   283,125   268,528 
          
Total emoluments $1,173,297  $1,107,159  $1,020,388 
          
The bonus is determined on the basis of the basic salary and the performance of the Company and the individual. Their emoluments were within the following bands:
             
  2008  2007  2006 
  Number of  Number of  Number of 
  individuals  individuals  individuals 
HK$nil to HK$1,000,000 ($128,620)         
HK$1,000,001 ($128,620) to HK$1,500,000 ($192,930)  1       
HK$1,500,001 ($192,930) to HK$2,000,000 ($257,240)  3      3 
HK$2,000,001 ($257,240) to HK$2,500,000 ($321,550)  1   4   1 
HK$2,500,001 ($321,550) to HK$4,500,000($578,790)     1   1 
HK$4,500,001 ($578,790) to HK$5,000,000 (643,100)         

F-64


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
33. DIVIDEND
No dividend has been paid or declared by the Company in 2008, 2007 and 2006.

F-65


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
34. SUBSEQUENT EVENTS
On January 1, 2009, the minority interest holders of AT redeemed 8,000,000 Series A shares with a total redemption amount of $9,013,444.

F-66


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
35. DIFFERENCE BETWEEN US GAAP AND INTERNATIONAL FINANCIAL REPORTING STANDARDS
The consolidated financial statements are prepared in accordance with US GAAP, which differ in certain significant respects from International Financial Reporting Standards (“IFRS”). The significant differences relate principally to share-based payments to employees and non-employees, presentation of minority interest, convertible financial instruments and assets held for sale.
(i)In regard to accounting treatment for share-based payments, IFRS 2, “Share Based Payment”, was issued to specify recognition, measurement and disclosure for equity compensation. IFRS 2 requires all share-based payment to be recognized in the financial statements using a fair value measurement basis. An expense should be recognized when goods or services received are consumed. IFRS 2 was effective for periods beginning on or after January 1, 2005.
Had the Company prepared the financial statements under IFRS, the Company would have adopted IFRS 2 retrospectively for the fiscal year beginning on January 1, 2005 and compensation expenses on share-based payments to employees would have been calculated using fair value method for the years prior to January 1, 2006.
Under US GAAP, prior to the adoption of the SFAS 123(R) from January 1, 2006, the Company was able to account for stock-based compensation issued to employees using either intrinsic value method or fair value method and the Company adopted the intrinsic value method of accounting for its stock options to employees.
Under the intrinsic value method, compensation expense is the excess, if any, of the fair value of the stock at the grant date or other measurement date over the amount an employee must pay to acquire the stock. Compensation expense, if any, is recognized over the applicable service period, which is the vesting period.
Effective January 1, 2006, the Company adopted the provisions of SFAS 123(R), “Share-Based Payment”. Under the provisions of SFAS 123(R), share-based compensation is measured at the grant date, based on the fair value of the award similar to IFRS 2. In addition, under SFAS 123(R) the Company was no longer required to record deferred sharebased compensation related to unvested share options in stockholder’s equity, consistent with IFRS 2. Upon the adoption of this accounting principle, the Company has recorded a cumulative effect of $5,153,986 in the year 2006 under US GAAP, which is not required under IFRS2.
(ii)Under US GAAP, the Series A shares of AT are accounted as minority interest and presented as temporary equity. The Series A shares are accreted to their redemption value at each reporting date. The accretion of interest is presented as minority interest expense in the consolidated statements of operations.
 
  Under IFRS,Substantially all of the Series A shares of AT contains both liability and conversion option components. A conversion option that will be settled byCompany’s long-lived assets are located in the exchange of a fixed amount of cash or another financial asset for a fixed number of AT’s ordinary shares is classified as an equity instrument.PRC.

F-67F-43


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATIONNotes to the Consolidated Financial Statements (continued)
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
25.Significant Customers
  On initial recognition,The following table summarizes net revenue and accounts receivable for customers which accounted for 10% or more of our accounts receivable and net sales:
                         
  Net revenue  Accounts receivable 
  Year ended December 31,  December 31, 
  2010  2009  2008  2010  2009  2008 
 
A  21%  22%  22%  27%  21%  23%
B  13%  14%  14%  *   *   * 
C  10%  13%  13%  *   11%  * 
D  *   *   *   *   *   16%
E  *   *   *   *   *   18%
F  *   *   *   *   10%  * 
                         
              Receivables from sale of 
  Other current assets  Manufacturing equipment 
  December 31,  December 31, 
  2010  2009  2008  2010  2009  2008 
 
D  *   *   50%  *   *   83%
E  *   *   *   *   *   17%
*Less than 10%.
26.Contingent Liability
In 2007, the fair valueCompany entered into equipment purchase and cooperative manufacturing arrangements (the “Arrangements”) with an unrelated semiconductor manufacturer (the “Counterparty”). The equipment was relocated by 2008 as scheduled. In 2009, the Company received notifications from the Counterparty that the Company was responsible for additional equipment relocation expenses and a portion of the losses incurred during the term of the cooperative manufacturing arrangement. The Company has contested the claims and requested further information supporting the Counterparty’s claims. The Counterparty filed a demand for dispute arbitration in late 2009 for the equipment relocation expenses. The Company recorded its best estimate of the probable amount of its liability componenton the claims in the consolidated financial statement as of and during the year ended December 31, 2009.
In the end of 2010, the Counterparty has filed further claims under the cooperative manufacturing arrangement. The Company settled all of the disputes related to the equipment relocation claims and is determined usingcontinuing its investigations and negotiations with the prevailing market interestCounterparty under the cooperative manufacturing arrangement. The contingent liability recorded as of similar non-convertible debt. December 31, 2010 represented the Company’s best estimate of the probable loss.
27.Litigation
The differentCompany settled all pending litigation with TSMC on November 9, 2009, including the legal action filed in California for which a verdict was returned by the jury against SMIC on November 4, 2009, with a Settlement Agreement (the “2009 Settlement Agreement”) which replaced the previous settlement agreement with TSMC (“2005 Settlement Agreement”). The 2009 Settlement Agreement resolved all pending lawsuits between the gross proceeds fromparties and the issuanceparties have since dismissed all pending litigation between them. The terms of the Series A2009 Settlement Agreement include the following:
1)Entry of judgment and mutual release of all claims that were or could have been brought in the pending lawsuits;

F-44


Notes to the Consolidated Financial Statements (continued)
27.Litigation(continued)
2)Termination of SMIC’s obligation to make remaining payments under the 2005 Settlement Agreement between the parties (approximately US$40 million);
3)Payment to TSMC of an aggregate of US$200 million (with US$15 million paid upon execution, funded from SMIC’s existing cash balances, and the remainder to be paid in installments over a period of four years);
4)Commitment to grant TSMC 1,789,493,218 shares of SMIC and a warrant exercisable within three years of issuance to subscribe for an additional 695,914,030 shares, subject to adjustment, at a purchase price of HK$1.30 per share (which would allow TSMC to obtain, by means of exercise of the warrant, ownership of approximately 2.78% of SMIC’s issued share capital as at December 31, 2010 (assuming a full exercise of the warrant)), subject to receipt of required government and regulatory approvals. The 1,789,493,218 ordinary shares and the fair value assigned towarrant were issued on July 5, 2010; and
5)Certain remedies in the liability components, presenting the conversion optionevent of breach of this settlement.
Accounting Treatment for the holder to convert the loan notes into equity, is included in equity. In subsequent periods, the liability component is carried at amortized cost using the effective interest method. The equity component, representing the option to convert the liability component into ordinary shares of AT, will remain in equity until the embedded option is exercised. No gain or loss is recognized in profit or loss upon conversion or expiration of the conversion option.2009 Settlement Agreement:
 
  The value assigned toIn accounting for the conversion option2009 Settlement Agreement, the Company determined that there were three components of the Series A shares is considered to be insignificant at initial recognition. The accretion of interest to record the Series A shares at redemption value is recognized as interest expense.2009 Settlement Agreement:
 
(iii)1) Under US GAAP, a beneficial conversion feature refers to the preferential priceSettlement of certain convertible equity instruments an investor receives when the effective conversion pricelitigation via entry of the equity instrumentsjudgment and mutual release of all claims in lower than the fair market value of the common stock to which the convertible equity instrument is convertible into at the date of issuance. US GAAP requires the recognition of the difference between the effective conversion price of the convertible equity instrument and the fair market value of the common stock as a deemed dividend.connection with pending litigation;
 
 Under IFRS, this deemed dividend is not required to be recorded.
(iv)2) Under IFRS, leasesTSMC’s covenant not-to-sue with respect to alleged misappropriation of landtrade secrets; and buildings are classified as operating or finance leases in the same way as leases of other assets. However, a characteristic of land is that it normally has an indefinite economic life and, if title is not expected to pass to the lessee by the end of the lease term, the lessee normally does not receive substantially all of the risks and rewards incidental to ownership, in which case the lease of land will be an operating lease. A payment made on entering into or acquiring a leasehold that is accounted for as an operating lease represents lease prepayments that are amortized over the lease term in accordance with the pattern of benefits provided. For balance sheet presentation, the prepayment of land use rights should be disclosed as current and non-current.
 
 Under US GAAP, land use rights are also accounted as operating leases and represent lease pre-payments that are amortized over the lease term in accordance with the pattern of benefits provided. Current and non-current asset classification is not required under US GAAP.
(v)3) IFRS requires an enterprise to evaluate at each balance sheet date whether there is any indication that a long- lived asset may be impaired. If any such indication exists, an enterprise should estimate the recoverable amountTermination of payment obligation of the long-lived asset. Recoverable amount isremaining payments to TSMC under the higher2005 Settlement Agreement of a long-lived asset’s net selling price and its value in use. Value in use is measured on a discounted present value basis. An impairment loss is recognized for the excess of the carrying amount of such assets over their recoverable amounts. A reversal of previous provision of impairment is allowed to the extent of the loss previously recognised as expense in the income statement.approximately $40 million.

F-68


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
Under US GAAP, long-lived assets and certain identifiable intangibles (excluding goodwill) held and used by an entity are reviewed for impairment whenever events or changes in circumstances indicate that the carrying value of a long-lived asset and certain identifiable intangibles (excluding goodwill) may not be recoverable. An impairment loss is recognized if the expected future cash flows (undiscounted) are less than the carrying amount of the assets. The impairment loss is measured based on the fair value of the long-lived assets and certain identifiable intangibles (excluding goodwill). Subsequent reversal of the loss is prohibited. Long-lived assets and certain identifiable intangibles (excluding goodwill) to be disposed of are reported at the lower of carrying amount or fair value less cost to sell.
The Company considered the operating loss in SMIB to be an impairment indicator for its long-lived assets in SMIB and evaluated whether or not such assets have been impaired at December 31, 2007. The undiscounted expected future cash flows were in excels of the carrying amount of the relevant long-lived assets and no impairment loss was required to be recognized under US GAAP in 2007. However, under IFRS, the estimated recoverable value derived from a discounted expected cash flow was less than the carrying value of those long-lived assts. As such, the Company has recognized an impairment loss of US$105,774,000 for the year ended December 31, 2007 under IFRS.
The Company reached an agreement with certain customers to discontinue production of DRAM products and subsequently the Company’s Board of Directors decided to exit the commodity DRAM business as a whole. The Company considered these actions to be an indicator of impairment in regard to the plant and equipment in the Company’s Beijing facility. Based on a detailed analysis, the Company recorded an impairment loss of $105,774,000, equal to the excess of the carrying value over the fair value of the associated assets under US GAAP in 2008.
The difference in timing of recognition of impairment loss under US GAAP and IFRS give rise to the difference in depreciation charges on long-lived assets after impairment allocation, which would be gradually reversed in future periods when the long-lived assets are fully depreciating.
(vi)Under US GAAP, income (loss) from equity investment is presented as a separate item before net income (loss) on net of tax basis.
Under IFRS, the income (loss) from equity investment is presented as a component of income (loss) before income tax benefit (expense).

F-69


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
  The adjustments necessaryCompany does not believe that any of the aforementioned qualify as assets under US GAAP. Accordingly, all such items were expensed as of the settlement date, and previously recorded deferred cost associated with the 2005 Settlement Agreement were immediately impaired, resulting in an expense of $269.6 million which was recorded as litigation settlement in the consolidated statements of operations. The commitment to restate loss attributable to holders of ordinarygrant shares and stockholders’ equitywarrants was initially measured at fair value and was accounted for as a derivative with all subsequent changes in accordance with IFRS are shownfair value reflected in the tables set out below.
             
  2008  2007  2006 
Net loss under US GAAP $(440,231,120) $(19,468,147) $(44,109,078)
IFRS adjustments:            
i) Reverse of cumulative effect of a change in accounting principle for share-based payment        (5,153,986)
ii) Accretion of interest on Series A Share  3,055,592   (2,856,258)  18,803 
v) Impairment of long-lived assets  105,774,000   (105,774,000)   
v) Depreciation of long-lived assets  4,633,535       
          
Net loss under IFRS $(326,767,993) $(128,098,405) $(49,244,261)
          
Net loss per share under IFRS $(0.02) $(0.01) $(0.00)
          
 
Stockholders’ equity as reported under US GAAP $2,749,364,501  $3,012,519,022  $3,007,419,918 
ii) Presentation of minority interest     34,944,408   38,800,666 
v) Impairment of long-lived assets     (105,774,000)   
v) Depreciation of long-lived assets  4,633,535       
          
Stockholders’ equity under IFRS $2,753,998,036  $2,941,689,430  $3,046,220,584 
          
 
Current liabilities as reported under US GAAP $899,772,911  $930,190,120  $677,361,816 
ii) Presentation of Series A shares  42,795,288       
          
Under IFRS $942,568,199  $930,190,120  $677,361,816 
          
 
Land use rights, net – current portion as reported under US GAAP $  $  $ 
IFRS adjustment            
iv) Current portion adjustment for land use right  1,442,730   1,054,777   712,521 
          
Under IFRS $1,442,730  $1,054,777  $712,521 
          
 
Land use rights, net            
As reported under US GAAP $74,293,284  $57,551,991  $38,323,333 
IFRS adjustments            
iv) Current portion adjustment for land use right  (1,442,730)  (1,054,777)  (712,521)
          
Under IFRS $72,850,554  $56,497,214  $37,610,812 
          
 
Plant and equipment            
As reported $2,963,385,840  $3,202,957,665  $3,244,400,822 
IFRS adjustments            
v) Impairment of long lived assets     (105,774,000)   
v) Depreciation of long lived assets  4,633,535       
          
Under IFRS $2,968,019,375  $3,097,183,665  $3,244,400,822 
          
 
Additional paid-in capital as reported under US GAAP $3,489,382,267  $3,313,375,972  $3,288,765,465 
IFRS adjustments            
i) Retrospective adjustment on adoption of IFRS 2  30,388,316   30,388,316   30,388,316 
i) Reverse of cumulative effect of a change in accounting principle  5,153,986   5,153,986   5,153,986 
iii) Carry forward prior year’s adjustment on deemed dividend  (55,956,051)  (55,956,051)  (55,956,051)
          
Under IFRS $3,468,968,518  $3,292,962,223  $3,268,351,716 
          
 
Accumulated deficit as reported under US GAAP $(748,509,757) $(308,278,637) $(288,810,490)
IFRS adjustments            
i) Carried over impact under IFRS 2  (30,388,316)  (30,388,316)  (30,388,316)
i) Reverse of cumulative effect of a change in accounting principle  (5,153,986)  (5,153,986)  (5,153,986)
iv) Carry forward prior year’s adjustment on deemed dividend  55,956,051   55,956,051   55,956,051 
v) Impairment of long-lived assets     (105,774,000)   
v) Depreciation of long-lived assets  4,633,535       
          
Under IFRS $(723,462,473) $(393,638,888) $(268,396,741)
          

F-70


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
             
  2008  2007  2006 
Cost of sales as reported under US GAAP $1,412,851,079  $1,397,037,881  $1,338,155,004 
IFRS adjustments            
v) Depreciation of long-lived assets  (4,633,535)      
          
Under IFRS $1,408,217,544  $1,397,037,881  $1,338,155,004 
          
 
Operating expenses as reported under US GAAP $317,797,068  $188,659,217  $141,037,963 
IFRS adjustments            
v) Impairment of long-lived assets  (105,774,000)  105,774,000    
          
Under IFRS $212,023,068  $294,433,217  $141,037,963 
          
 
Interest expense as reported under US GAAP $50,766,958  $37,936,126  $50,926,084 
IFRS adjustments            
ii) Accretion of interest on Series A shares  4,795,288       
          
Under IFRS $55,562,246  $37,936,126  $50,926,084 
          
 
Loss before income tax as reported under US GAAP $(405,503,036) $(48,031,515) $(69,970,758)
IFRS adjustments            
v) Impairment of long-lived assets  105,774,000   (105,774,000)   
v) Depreciation of long-lived assets  4,633,535       
vi) Presentation of income (loss) from equity investment  (444,211)  (4,012,665)  (4,201,247)
ii) Accretion of interest on Series A shares  (4,795,288)      
          
Under IFRS $(300,335,000) $(157,818,180) $(74,172,005)
          
In addition to the above, there are also other differences between US GAAP and IFRS relevant to the accounting policies of the Company. These differences have not led to any material differences in 2008, 2007 and 2006, and details of which are set out as below:
(a)Inventory valuation
Inventories are carried at cost under both US GAAP and IFRS. However, if there is evidence that the net realisable valueconsolidated statements of goods, in their disposal in the ordinary course of business, will be less than cost, whether due to physical obsolescence, changes in price levels, or other causes, the difference should be recognized asoperations. The Company recorded a loss of $30.1 million and $29.8 million as the current period. This is generally accomplished by stating such goods at a lower level commonly known as “market”.
Under US GAAP, a write-downchange in the fair value of inventoriescommitment to issue shares and warrants in 2009 and 2010 through the lowerdate of cost or market at the close of a fiscal period creates a new cost basis that subsequently cannot be reversed based on changes in underlying facts and circumstances. Market under US GAAP is the lowerissuance of the replacement costshares and net realizable value minus normal profit margin.
Under IFRS, a write-down of inventories to the lower of cost or market at the close of a fiscal period is a valuation allowance that can be subsequently reversed if the underlying facts and circumstances changes. Market under IFRS is net realizable value.

F-71


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
(b)Deferred income taxes
Deferred tax liabilities and assets are recognized for the estimated future tax effects of all temporary differences between the financial statement carrying amount of assets and liabilities and their respective tax bases under both US GAAP and IFRS.
Under IFRS, a deferred tax asset is recognized to the extent that it is probable that future profits will be available to offset the deductible temporary differences or carry forward of unused tax losses and unused tax credits. Under US GAAP, all deferred tax assets are recognized, subject to a valuation allowance, to the extent that it is ‘’more likely than not” that some portion or all of the deferred tax assets will be realized. “More likely than not” is defined as a likelihood of more than 50%.
With regard to the measurement of the deferred tax, IFRS requires recognition of the effects of a change in tax laws or rates when the change is “substantively enacted”. US GAAP requires measurement using tax laws and rates enacted at the balance sheet date.
Under US GAAP, deferred tax liabilities and assets are classified as current or non-current basedwarrants on the classification of the related asset or liability for financial reporting. Under IFRS, deferred tax assets and liabilities are always classified as non-current.
(c)Segment reporting
Under IFRS, a listed enterprise is required to determine its primary and secondary segments on the basis of lines of business and geographical areas, and to disclose results, assets and liabilities and certain other prescribed information for each segment. The determination of primary and secondary segment is based on the dominant source of the enterprise’s business risks and returns. Accounting policies adopted for preparing and presenting the financial statements of the Company should also be adopted in reporting the segmental results and assets. The business segment is considered as the primary segment for the Company. Meanwhile, the Management believes the risk and return shall be similar among its different geographical segments.
Under US GAAP, a public business enterprise is required to report financial and descriptive information about its reportable operating segments. Operating segments are components of an enterprise about which separate financial information is available that is evaluated regularly by the chief operating decision maker in deciding how to allocate resources and in assessing performance. US GAAP also permits the use of the accounting polices used for internal reporting purposes that are not necessarily consistent with the accounting policies used in consolidated financial statements.

F-72


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
(d)Borrowing costs
IFRS and US GAAP require capitalization of borrowing costs for those borrowings that are directly attributable to acquisition, construction or production of assets that necessarily take a substantial period of time to get ready for their intended use or sale. The amount to be capitalized is the borrowing cost which could theoretically have been avoided if the expenditure on the qualifying asset was not made. Under IFRS, borrowing costs are defined as interest and any other costs incurred by an enterprise in connection with the borrowing of funds, while under the US GAAP, borrowing costs are defined as interest only.
Under IFRS, to the extent that funds are borrowed specifically for the purpose of obtaining a qualified asset, the amount of borrowing costs eligible for capitalization is determined as the actual borrowing costs incurred on the borrowing during the period less any investment income on the temporary investment of those borrowing. The amount of borrowing costs to be capitalized under US GAAP is based solely on actual interest incurred related to the actual expenditure incurred.
(e)Research and development costs
IFRS requires the classification of the costs associated with the creation of intangible assets by research phase and development phase. Costs in the research phase must always be expensed. Costs in the development phase are expensed unless the entity can demonstrate all of the following:July 5, 2010, respectively.
28. the technical feasibility of completing the intangible asset so that it will be available for use or sale;
its intention to complete the intangible asset and use or sell it;
its ability to use or sell the intangible asset;
how the intangible asset will generate probable future economic benefits. Among other things, the enterprise should demonstrate the existence of a market for the output of the intangible asset or the intangible asset itself or, if it is to be used internally, the usefulness of the intangible asset;
the availability of adequate technical, financial and other resources to complete the development and to use or sell the intangible asset; and
its ability to measure the expenditure attributable to the intangible asset during the development phase.Retirement Benefit
Under US GAAP, research and development costs are expensed as incurred except for:
those incurred on behalf of other parties under contractual arrangements;
those that are unique for enterprises in the extractive industries;
certain costs incurred internally in creating a computer software product to be sold, leased or otherwise marketed, whose technological feasibility is established, i.e. upon completion of a detailed program design or, in its absence, upon completion of a working model; and
certain costs related to the computer software developed or obtained for internal use.

F-73


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
NOTES TO THE CONSOLIDATED FINANCIAL STATEMENTS
For the years ended December 31, 2008, 2007 and 2006
(In US dollars, except where otherwise stated)
  The general requirementCompany’s local Chinese employees are entitled to write off expenditurea retirement benefit based on researchtheir basic salary upon retirement and development as incurredtheir length of service in accordance with a state-managed pension plan. The PRC government is extendedresponsible for the pension liability to researchthese retired staff. The Company is required to make contributions to the state-managed retirement plan equivalent to 20% to 22.5% of the monthly basic salary of current employees. Employees are required to make contributions equivalent to 6% to 8% of their basic salary. The contribution of such an arrangement was approximately $12,845,223, $12,532,810 and development acquired in a business combination.$11,039,680 for the years ended December 31, 2010, 2009 and 2008, respectively. The retirement benefits do not apply to non-PRC citizens. The Company’s retirement benefit obligations outside the PRC are not significant.

F-45


Notes to the Consolidated Financial Statements (continued)
(f)29. StatementsDistribution of cash flowsProfits
  ThereAs stipulated by the relevant laws and regulations applicable to China’s foreign investment enterprise, the Company’s PRC subsidiaries are required to make appropriations to non-distributable reserves. The general reserve fund requires annual appropriation of 10% of after tax profit (as determined under accounting principles generally accepted in the PRC at each year-end), after offsetting accumulated losses from prior years, until the accumulative amount of such reserve fund reaches 50% of their registered capital. The general reserve fund can only be used to increase the registered capital and eliminate future losses of the respective companies under PRC regulations. The staff welfare and bonus reserve is determined by the Board of Directors and used for the collective welfare of the employee of the subsidiaries. The enterprise expansion reserve is for the expansion of the subsidiaries’ operations and can be converted to capital subject to approval by the relevant authorities. These reserves represent appropriations of the retained earnings determined in accordance with Chinese law. In 2010, 2009 and 2008, the Company did not make any appropriation to non-distributable reserves.
In addition, due to restrictions on the distribution of share capital from the Company’s PRC subsidiaries, the PRC subsidiaries share capital of $3,328 million at December 31, 2010 is considered restricted. As a result of these PRC laws and regulations, as of December 31, 2010, approximately $3,354 million is not available for distribution to the Company by its PRC subsidiaries in the form of dividends, loans or advances.
In 2010, 2009 and 2008, the Company has not declared or paid any cash dividends on the ordinary shares.
30.Subsequent Events
On March 1, 2011, the Company deconsolidated AT as its majority ownership interest was reduced to 10%. As a result, all previously issued preferred securities issued by AT were cancelled. The Company retained a 10% interest in AT and will account for such investment under the cost method in future periods as it no material differenceslonger has controlling financial interest nor significant influence in AT. No cash or other consideration was received by the Company in conjunction with the disposition. As of December 31, 2010, AT had a net asset of approximately $24.5 million with a noncontrolling interest in the form of preferred securities of $36.0 million. The Company subsequently recorded a gain of $17.1 million on statementsthe deconsolidation of cash flowsthis subsidiary equal to the difference between US GAAP(i) the sum of (a) the fair value of the retained noncontrolling investments in AT, which has not yet been determined, and IFRS.(b) the carrying amount of the aforementioned noncontrolling interest in AT, and (ii) the carrying amount of AT’s assets and liabilities.
On April 19, the Company entered in to a definitive investment agreement with Chin Investment Corporation (“CIC”). Under US GAAP, interest receivedthe terms of the agreement, CIC will invest $250 million in SMIC, acquiring 360,589,053 convertible preferred shares at HK$5.39 per convertible preferred share. After the issuance and paid must be classified asconversion of the new shares, CIC will own approximately 11.6% of SMIC’s outstanding share capital. The agreement also provides CIC with warrant for investing an operating activity. Under IFRS, interest receivedadditional $50 million in SMIC on the same terms, and paid may be classified as an operating, investing, or financing activity.entitles CIC to nominate one member of SMIC’s board of directors.

F-74F-46


SCHEDULE I
FINANCIAL STATEMENTS
ADDITIONAL INFORMATION — FINANCIAL STATEMENTS SCHEDULE I

SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
FINANCIAL INFORMATION OF PARENT COMPANY
BALANCE SHEETS
(In US dollars, except share data)
            
 December 31,             
 2008 2007 2006  December 31,
  2010 2009 2008
ASSETS
  
Current assets:  
Cash and cash equivalents $164,107,042 $6,042,030 $33,450,295 
Cash and cash equivalent 110,180,720 33,384,536 164,107,042 
Restricted cash 7,500,000 12,502,008  
Short-term investments 2,453,951   
Accounts receivable, net 260,331 10,970,690   440,471 291,073 260,331 
Amount due from subsidiaries 203,326,525 21,586,283 138,701,627  233,334,694 367,524,590 203,326,525 
Prepaid expense and other current assets 30,767,721 12,278,199 8,490,138  1,291,686 2,528,056 30,767,721 
         
 
Total current assets 398,461,619 50,877,202 180,642,060  355,201,522 416,230,263 398,461,619 
 
Plant and equipment, net 5,210,772 6,723,900 5,321,319  6,638,222 8,164,963 5,210,772 
Acquired intangible assets, net 187,061,939 216,281,235 71,115,222  139,510,804 160,939,520 187,061,939 
Deferred cost, net 47,091,516 70,637,275 94,183,034    47,091,516 
Investment in subsidiaries 2,553,682,338 2,995,391,546 2,962,930,960  2,099,436,556 1,826,666,595 2,553,682,338 
Investment in equity affiliate 9,452,186 9,896,398 13,619,643  7,665,454 7,670,044 9,452,186 
         
 
TOTAL ASSETS $3,200,960,370 $3,349,807,556 $3,327,812,238  2,608,452,558 2,419,671,385 3,200,960,370 
         
  
LIABILITIES AND STOCKHOLDERS’ EQUITY
 
Current liabilities: 
LIABILITIES AND EQUITY
 
Current Liabilities: 
Accounts payable $20,231,796 $4,811,093 $  8,215,543 4,838,515 20,231,796 
Accrued expenses and other current liabilities 81,367,429 34,021,253 46,191,765  27,314,886 72,893,883 81,367,429 
Amount due to subsidiaries 61,512,045 76,762,892 84,080,142  187,698,654 77,516,511 61,512,045 
Short-term borrowings 181,257,773 20,000,000 31,000,000  109,470,000 146,418,700 181,257,773 
Current portion of promissory note 29,242,001 29,242,000 29,242,001  29,374,461 78,608,288 29,242,001 
Current portion of long-term payables relating to license agreements 44,711,003 69,189,413 12,690,472 
Current portion of long-term payables relating to license agreement 9,000,000 18,622,691 44,711,003 
Commitment to issue shares and warrants Relating to litigation settlement  120,237,773  
Income tax payable 474,983 1,149,983   1,868,371  474,983 
         
Total current liabilities 372,941,915 519,136,361 418,797,030 
Long-term liabilities: 
Promissory notes 56,327,268 83,324,641 23,589,958 
Long-term payables relating to license agreements   9,208,881 
Other long term liabilities 9,646,000 20,970,000  
   
Total current liabilities 418,797,030 235,176,634 203,204,380 
Total long-term liabilities 65,973,268 104,294,641 32,798,839 
         
Total liabilities
 438,915,183 623,431,002 451,595,869 
  
Equity: 
Ordinary shares, $0.0004 par value, 50,000,000,000 shares authorized, 27,334,063,747, 22,375,886,604, and 22,327,784,827 shares issued and outstanding at December 31, 2010, 2009 and 2008, respectively 10,933,707 8,950,355 8,931,114 
Additional paid-in capital 3,858,642,524 3,499,723,153 3,489,382,267 
Accumulated other comprehensive (loss) income  (1,092,291)  (386,163)  (439,123)
Accumulated deficit  (1,698,946,565)  (1,712,046,962)  (748,509,757)
  
Total equity 2,169,537,375 1,796,240,383 2,749,364,501 
  
TOTAL LIABILITIES AND EQUITY
 2,608,452,558 2,419,671,385 3,200,960,370 
  

F-75


             
  December 31, 
  2008  2007  2006 
Long-term liabilities:            
Promissory notes  23,589,958   51,057,163   96,861,657 
Long-term payables relating to license agreements  9,208,881   51,054,737   16,992,950 
Other long term liabilities        3,333,333 
          
             
Total long-term liabilities  32,798,839   102,111,900   117,187,940 
          
             
Total liabilities $451,595,869  $337,288,534  $320,392,320 
          
             
Stockholders’ equity:            
             
Ordinary shares, $0.0004 par value, 50,000,000,000 shares authorized, shares issued and outstanding 22,327,784,827, 18,558,919,712, and 18,432,756,463, respectively  8,931,114   7,423,568   7,373,103 
Additional paid-in capital  3,489,382,267   3,313,375,972   3,288,765,465 
Accumulated other comprehensive (loss) income  (439,123)  (1,881)  91,840 
Accumulated deficit  (748,509,757)  (308,278,637)  (288,810,490)
          
             
Total stockholders’ equity  2,749,364,501   3,012,519,022   3,007,419,918 
          
             
TOTAL LIABILITIES AND STOCKHOLDERS’ EQUITY $3,200,960,370  $3,349,807,556  $3,327,812,238 
          

F-76F-47


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
FINANCIAL INFORMATION OF PARENT COMPANY
STATEMENTS OF OPERATIONS
(In US dollars)
            
 Year ended December 31,             
 2008 2007 2006  Year ended December 31,
  2010 2009 2008
Revenue $208,459,285 $12,363,023 $81,000  14,508,954 20,943,735 208,459,285 
 
Operating expenses:  
General and administrative expenses 48,818,885 61,970,384 42,208,145  29,811,340 111,308,433 48,818,885 
Amortization of deferred cost and acquired intangible assets 51,728,389 48,049,863 47,073,403 
Amortization of deferred cost and acquired intangibles assets 21,428,716 32,965,281 51,728,389 
Impairment loss of long-lived assets 966,667   5,630,237 966,667 
       
Litigation settlement  55,182,838  
   
Total operating expenses 101,513,941 110,020,247 89,281,548  51,240,056 205,086,789 101,513,941 
   
Loss from operations 106,945,344  (97,657,224)  (89,200,548)
Income (loss) from operations
  (36,731,102)  (184,143,054) 106,945,344 
  
Other income (expense):  
Interest income 571,870 1,267,478 1,290,279  358,830 399,655 571,870 
Interest expense  (11,637,266)  (6,029,720)  (12,880,250)  (4,714,813)  (7,314,896)  (11,637,266)
Other expense, net  (3,889,327)  (2,610,379)  (20,125,363)
       
Change in the fair value of commitment to issue shares and warrants  (29,815,452)  (30,100,793)  
Other income (expense), net  (5,493,222) 7,563,790  (3,889,327)
   
Total other expense, net  (14,954,723)  (7,372,621)  (31,715,334)  (39,664,657)  (29,452,244)  (14,954,723)
         
  
Net income (loss) before income tax 91,990,621  (105,029,845)  (120,915,882)  (76,395,759)  (213,595,298) 91,990,621 
   
Income tax expense  (15,030,257)  (1,149,983)    (4,631,225)  (9,163,471)  (15,030,257)
Loss from equity investment  (444,211)  (4,012,665)  (4,201,247) 284,830  (1,782,142)  (444,211)
Profit (loss) from investment in subsidiaries  (516,747,273) 90,724,346 75,854,065  93,842,551  (738,996,294)  (516,747,273)
         
 
Net loss before cumulative effect of a change in accounting principle  (440,231,120)  (19,468,147)  (49,263,064)
 
Cumulative effect of a change in accounting principle   5,153,986 
       
 
Net loss $(440,231,120) $(19,468,147) $(44,109,078)
       
Net income (loss)
 13,100,397  (963,537,205)  (440,231,120)

F-77F-48


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
FINANCIAL INFORMATION OF PARENT COMPANY
STATEMENTS OF CASH FLOWS
(In US dollars)
            
 Year ended December 31,             
 2008 2007 2006  Year ended December 31,
  2010 2009 2008
Operating activities
  
Loss attributable to holders of ordinary shares $(440,231,120) $(19,468,147) $(44,109,078)
Less: Cumulative effect of a change in accounting principle    (5,153,986)
       
 
Net loss  (440,231,120)  (19,468,147)  (49,263,064)
 
Net income (loss) 13,100,397  (963,537,205)  (440,231,120)
Adjustments to reconcile net loss to net cash provided by (used in) operating activities:
  
Loss (profit) from investment in subsidiaries 516,747,273  (90,724,346)  (75,854,065)  (93,842,551) 738,996,294 516,747,273 
Loss from equity investment 444,211 4,012,665 4,201,247   (284,830) 1,782,142 444,211 
Depreciation and amortization 51,733,790 48,381,796 47,322,544  23,474,623 34,357,584 51,733,790 
Impairment loss of long-lived assets 966,667     5,630,237 966,667 
Share-based compensation 11,617,572 20,643,341 23,506,847  8,794,633 10,145,101 11,617,572 
Non-cash interest expense on promissory note and long-term payable relating to license agreements 6,208,530 4,579,116 5,702,607  3,840,668 2,557,329 6,208,530 
Litigation settlement (noncash portion)  9,211,849  
Change in the fair value of commitment to issue shares and warrants 29,815,452 30,100,793  
Allowance for doubtful accounts 630 30,911,015  
Other non-cash expense 516,910   
Changes in operating assets and liabilities:
  
Accounts receivable, net 10,710,359  (10,970,690)    (150,028)  (32,671) 10,710,359 
Amount due from subsidiaries  (102,943,505) 117,115,344 552,254,977  134,189,896  (194,240,814)  (102,943,505)
Prepaid expense and other current assets  (18,489,522)  (3,788,061) 1,151,816  1,236,370  (2,669,420)  (18,489,522)
Accounts payable 1,482,771 4,811,093   6,636,844  (232,240) 1,482,771 
Amount due to subsidiaries  (15,250,847)  (7,317,250) 71,206,587  110,182,143 16,004,466  (15,250,847)
Accrued expenses and other current liabilities 50,055,886  (5,397,776)  (11,229,650)  (40,072,877)  (11,978,670) 50,055,886 
Other long term liabilities   (3,333,333) 3,333,333   (11,324,000) 20,970,000  
Liability T settlement  212,167,381  
Income tax payable  (675,000) 1,149,983   1,868,371  (474,983)  (675,000)
Dividend received from a subsidiary 47,000,000 315,000,000     47,000,000 
       
 
Net cash provided by operating activities
 119,377,065 374,693,735 572,333,179  187,982,651  (60,331,813) 119,377,065 
       
 
Investing activities:
  
 
Purchase of plant and equipment  (145,071,160)  (1,734,514)  (5,235,928)  (3,778,983)  (19,507,536)  (145,071,160)
Proceeds from sell of plant and equipment 81,720,082   
Proceeds from sell of plant and equipment and other Asset  64,899,316 81,720,082 
Purchases of acquired intangible assets  (75,639,710)  (87,295,157)  (9,573,524)  (14,716,700)  (41,728,828)  (75,639,710)
Sale of short-term investments   6,352,678 
Purchase of short-term investments  (2,453,951)   
Investment in subsidiaries  (122,038,065)  (256,736,240)  (426,974,644)  (179,000,125)  (11,980,551)  (122,038,065)
       
 
Change in restricted cash 5,002,008  (12,502,008)  
Net cash used in investing activities
  (261,028,853)  (345,765,911)  (435,431,418)  (194,947,751)  (20,819,606)  (261,028,853)
       
Financing activities:
 
Proceeds from short-term borrowing 104,270,000 80,464,986 418,357,773 
Repayment of short-term debt  (141,218,700)  (115,304,059)  (257,100,000)
Repayment of promissory notes  (80,000,000)  (15,000,000)  (30,000,000)
Proceeds from exercise of employee stock options 2,217,678 215,026 796,269 
Proceeds from issuance of ordinary shares 199,122,212  168,100,000 
Net cash provided by (used in) financing activities
 84,391,190  (49,624,047) 300,154,042 
Effect of exchange rate changes  (629,906) 52,960  (437,242)
NET INCREASE (DECREASE) IN CASH AND CASH EQUIVALENTS
 76,796,184  (130,722,506) 158,065,012 
CASH AND CASH EQUIVALENTS, beginning of period
 33,384,536 164,107,042 6,042,030 
CASH AND CASH EQUIVALENTS, end of period
 110,180,720 33,384,536 164,107,042 
SUPPLEMENTAL DISCLOSURES OF NON-CASH INVESTING AND FINANCIAL ACTIVITIES
 
Inception of accounts payable for plant and equipment  (328,168)  (1,587,984)  (20,231,796)
Inception of long-term payable for acquired intangible assets    (9,208,881)

F-78F-50


             
  Year ended December 31, 
  2008  2007  2006 
Financing activities:
            
             
Proceeds from short-term borrowing  418,357,773   154,383,000   225,003,998 
Repayment of short-term debt  (257,100,000)  (165,383,000)  (369,485,080)
Repayment of promissory notes  (30,000,000)  (49,260,000)  (42,740,000)
Proceeds from exercise of employee stock options  796,269   4,039,131   3,965,308 
Repurchase of restricted ordinary shares     (21,500)  (58,190)
Proceeds from issuance of ordinary shares  168,100,000       
          
             
Net cash provided by (used in) financing activities
  300,154,042   (56,242,369)  (183,313,964)
          
             
Effect of exchange rate changes  (437,242)  (93,720)  (47,138)
          
             
NET DECREASE IN CASH AND CASH EQUIVALENTS
  158,065,012   (27,408,265)  (46,459,341)
             
CASH AND CASH EQUIVALENTS, beginning of period
  6,042,030   33,450,295   79,909,636 
          
             
CASH AND CASH EQUIVALENTS, end of period
 $164,107,042  $6,042,030  $33,450,295 
          
             
SUPPLEMENTAL DISCLOSURES OF NON-CASH INVESTING AND FINANCIAL ACTIVITIES
            
             
Inception of accounts payable for plant and equipment $(20,231,796) $(4,811,094) $ 
          
Inception of long-term payable for acquired intangible assets $(9,208,881) $(51,054,737) $(16,992,950)
          

F-79


SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION
FINANCIAL INFORMATION OF PARENT COMPANY NOTES TO SCHEDULE I
 1.The financial statements of Semiconductor Manufacturing International Corporation (the “Company”) have been prepared in accordance with accounting principles generally accepted in the United States of America (“US GAAP”) except for accounting of the Company’s subsidiariesOrganization and certain footnote disclosures as described below.Principal Activities
 2.Certain information and footnote disclosures normally included in financial statements prepared in accordance with US GAAP have been condensed or omitted. The footnote disclosures contain supplemental information relating to the operations of the Company and, as such, these statements should be read in conjunction with the notes to the Consolidated Financial Statements of the Company.
3. As of December 31, 2008, 2007 and 2006, there were no material contingencies, significant provisions of long-term obligations, mandatory dividend or redemption requirements of redeemable stocks or guarantees of2010, the Company except for those which have been separately disclosed inoperates primarily through the Consolidated Financial Statement, if any.following subsidiaries:
 4. For the year ended
Place and date ofAttributable
incorporation/equity interest
Name of companyestablishmentheldPrincipal activity
Better Way Enterprises Limited
(“Better Way”)
Samoa April 5, 2000100%Provision of marketing related activities
Semiconductor Manufacturing
International (Shanghai) Corporation
(“SMIS”)*#
People’s Republic of China (the “PRC”) December 31, 2008, $47,000,000 cash dividend was paid to the 21, 2000100%Manufacturing and trading of semiconductor products
SMIC, AmericasUnited States of America June 22, 2001100%Provision of marketing related activities
Semiconductor Manufacturing
International (Beijing) Corporation
(“SMIB”)*#
PRC July 25, 2002100%Manufacturing and trading of semiconductor products
SMIC Japan Corporation#
Japan October 8, 2002100%Provision of marketing related activities
SMIC Europe S.R.LItaly July 3, 2003100%Provision of marketing related activities
SMIC Commercial (Shanghai) Limited
Company by SMIS. For the year ended(formerly SMIC Consulting
Corporation)*
PRC September 30, 2003100%Operation of a convenience store
Semiconductor Manufacturing
International (Tianjin) Corporation
(“SMIT”)*#
PRC November 3, 2003100%Manufacturing and trading of semiconductor products
Semiconductor Manufacturing
International (AT) Corporation
(“AT”) (Note 1)
Cayman Islands July 26, 200466.3%Investment holding
Semiconductor Manufacturing
International (Chengdu) Corporation
(“SMICD”)* (Note 1)
PRC December 31, 2007, $315,000,000 cash dividend was paid to the Company by SMIS. For the years ended28, 200466.3%Manufacturing and trading of semiconductor products
SMIC Energy Technology (Shanghai)
Corporation (“Energy Science”)*#
PRC September 9, 2005100%Manufacturing and trading of solar cell related semiconductor products
SMIC Development (Chengdu)
Corporation*#
PRC December 31, 2006, there was no cash dividends paid to the Company by its consolidated subsidiaries.29, 2005100%Construction, operation, and management of SMICD’s living quarter, schools, and supermarket

 

F-80


Organization and Principal Activities
Place and date ofAttributable
incorporation/equity interest
Name of companyestablishmentheldPrincipal activity
Magnificent Tower LimitedBritish Virgin Islands January 5, 2006100%Investment holding
Semiconductor Manufacturing International (BVI) Corporation (“SMIC (BVI)”)British Virgin Islands April 26, 2007100%Investment holding
Admiral Investment Holdings LimitedBritish Virgin Islands October 10, 2007100%Investment holding
SMIC Shenzhen (HK) Company LimitedHong Kong January 29, 2008100%Investment holding
Semiconductor Manufacturing
International (Shenzhen)
Corporation*
PRC March 20, 2008100%Manufacturing and trading of semiconductor products
Siltech Manufacturing (Shanghai)
Corporation Limited*
PRC March 3, 200997.7%Manufacturing and trading of semiconductor products
Note 1:Please refer to Note 30 (Subsequent Events) to the consolidated financial statements for details regarding the sequent changes of the company’s shareholding.
*Companies registered as wholly foreign-owned enterprises in the People’s Republic of China (“PRC”) excluding for the purpose of this annual report, Hong Kong, Macau and Taiwan.
#Abbreviation for identification purposes
In addition to the above, the Company has a number of wholly owned subsidiaries in the PRC, Hong Kong, Samoa, the British Virgin Islands and Cayman Islands.


Annex A
GLOSSARY OF TECHNICAL TERMS
   
ASIC Application Specific Integrated Circuit. A proprietary integrated circuit designed and manufactured to meet a customer’s specific functional requirements.
   
Cell A primary unit that normally repeats many times in an integrated circuit. Cells represent individual functional design units or circuits that may be reused as blocks in designs. For example, a memory cell represents a storage unit in a memory array.
   
CIS CMOS Image Sensor. CIS can be used in applications such as still and video cameras and embedded cameras in mobile telephones. It is a fast growing imaging sensor technology. The fabrication of CIS is fully compatible with the mainstream CMOS process, which enables system-on-chip capability, low power consumption and low cost of fabrication.
   
Clean room Area within a fab in which the wafer fabrication takes place. The classification of a clean room relates to the maximum number of particles of contaminants per cubic foot within that room. For example, a class 100 clean room contains less than 100 particles of contaminants per cubic foot.
   
CMOS Complementary Metal Oxide Silicon. A fabrication process that incorporates n-channel and p-channel CMOS transistors within the same silicon substrate. Currently, this is the most commonly used integrated circuit fabrication process technology and is one of the latest fabrication techniques to use metal oxide semiconductor transistors.
   
CVD Chemical Vapor Deposition. A process in which gaseous chemicals react on a heated wafer surface to form solid film.
   
Die One individual chip cut from a wafer before being packaged.
   
Dielectric material A type of non-conducting material used for isolation purposes between conductors, such as metals.
   
DRAM Dynamic Random Access Memory. A device that temporarily stores digital information but requires regular refreshing to ensure data is not lost.
   
DSP Digital Signal Processor. A type of integrated circuit that processes and manipulates digital information after it has been converted from an analog source.
   
EEPROM Electrically Erasable Programmable Read-Only Memory. An integrated circuit that can be electrically erased and electrically programmed with user-defined information.
   
EPROM Erasable Programmable Read-Only Memory. A form of PROM that is programmable electrically yet erasable using ultraviolet light.


   
FCRAMFCRAM™ Fast Cycle Random Access Memory. A proprietary form of RAM developed by Fujitsu Limited.
   
Fill factor The percentage of LCOS metal surface area used for light reflection as compared to the total surface area. The higher the fill factor, the more light will be reflected from a given surface area.
   
Flash memory A type of non-volatile memory where data is erased in blocks. The name “flash” is derived from the rapid block erase operation. Flash memory requires only one transistor per memory cell versus two transistors per memory cell for EEPROMs, making flash memory less expensive to produce. Flash memory is the most popular form of non-volatile semiconductor memory currently available.
   
Gold Bumping The fabrication process of forming gold bump termination electrodes on a finished wafer.
   
High voltage semiconductor High voltage semiconductors are semiconductor devices that can drive relatively high voltage potential to systems that require higher voltage of between five volts to several hundred volts.
   
IDM Integrated Device Manufacturer.
   
Integrated circuit An electronic circuit where all the elements of the circuit are integrated together on a single semiconductor substrate.


   
Interconnect Conductive materials such as aluminum, doped polysilicon or copper that form the wiring circuitry to carry electrical signals to different parts of the chip.
   
I/O Inputs/Outputs.
   
LCOS Liquid Crystal On Silicon. A type of micro-display technology.
   
Logic device A device that contains digital integrated circuits that perform a function rather than store information.
   
Low leakage Characteristic of a transistor that has a low amount of current leakage. Low leakage allows for power-saving.power- saving. Low leakage semiconductors are primarily used in applications such as cellular telephones, calculators and automotive applications.
   
Mask A glass plate with a pattern of transparent and opaque areas used to create patterns on wafers. “Mask” is commonly used to refer to a plate that has a pattern large enough to pattern a whole wafer at one time, as compared to a reticle, where a glass plate can contain the pattern for one or more dies but is not large enough to transfer a wafer-sized pattern all at once.
   
Mask ROM A type of non-volatile memory that is programmed during fabrication (mask-defined) and the data can be read but not erased.
   
Memory A device that can store information for later retrieval.


   
Micro-display A small display that is of such high resolution that it is only practically viewed or projected with lenses or mirrors. A micro-display is typically magnified by optics to enlarge the image viewed by the user. For example, a miniature display smaller than one inch in size may be magnified to provide a 12-inch to 60-inch viewing area.
   
Micron A term for micrometer, which is a unit of linear measure that equals one one-millionth (1/1,000,000) of a meter. There are 25.4 microns in one one-thousandth of an inch.
   
Mixed-signal The combination of analog and digital circuitry in a single semiconductor.
   
MOS Metal Oxide Semiconductor. A type of semiconductor device fabricated with a conducting layer and a semiconducting layer separated by an insulating layer.
   
NAND Flash A type of flash memory commonly used for mass storage applications such as MP3 players and digital cameras.
   
Nanometer A term for micrometer, which is a unit of linear measure that equals one thousandth (1/1,000) of a micron.
   
Non-volatile memory Memory products that maintain their content when the power supply is switched off.
   
OTP One-time programmable memory used for program and data storage, usually used in applications that require only a one-time data change.
   
PROM Programmable Read-Only Memory. Memory that can be reprogrammed once after manufacturing.
   
RAM Random Access Memory. Memory devices where any memory cell in a large memory array may be accessed in any order at random.
   
Redistribution Layer
Manufacturing
 The manufacturing process of fabricating additional dielectric and copper interconnect layers to redistribute the pads to new locations on a finished wafer.
   
Reticle See “Mask” above.
   
RF Radio Frequency. Radio frequency semiconductors are primarily used in communications devices such as cell phones.
   
ROM Read-Only Memory. See “Mask ROM” above.
   
Scanner An aligner that scans light through a slit across a mask to produce an image on a wafer.


   
Semiconductor An element with an electrical resistivity within the range of an insulator and a conductor. A semiconductor can conduct or block the flow of electric current depending on the direction and magnitude of applied electrical biases.
   
Solder bumping The fabrication processes of forming solder bump termination electrodes, which are elevated metal structures, or lead free bump termination electrodes.


   
SRAM Static Random Access Memory. A type of volatile memory product that is used in electronic systems to store data and program instructions. Unlike the more common DRAM, it does not need to be refreshed.
   
Stepper A machine used in the photolithography process in making wafers. With a stepper, a small portion of the wafer is aligned with the mask upon which the circuitry design is laid out and is then exposed to strong light. The machine then “steps” to the next area, repeating the process until the entire wafer has been done. Exposing only a small area of a wafer at a time allows the light to be focused more strongly, which gives better resolution of the circuitry design.
   
System-on-chip A chip that incorporates functions usually performed by several different devices and therefore generally offers better performance and lower cost.
   
Systems companies Companies that design and manufacture complete end market products or systems for sale to the market.
   
Transistor An individual circuit that can amplify or switch electric current. This is the building block of all integrated circuits.
   
Volatile memory Memory products that lose their content when the power supply is switched off.
   
Wafer A thin, round, flat piece of silicon that is the base of most integrated circuits.

 


EXHIBIT INDEX
   
Exhibit 1.1 
Eleventh Amended and Restated Articles of Association, as adopted at the Registrant’s annual general meeting of shareholders on June 2, 2008(1)
   
Exhibit 4.1 
Settlement Agreement dated January 31, 2005 by and between Semiconductor Manufacturing International Corporation and Taiwan Semiconductor Manufacturing Corporation, Ltd., including Patent License Agreement(2)
   
Exhibit 4.2 
English language summary of Chinese language Syndicate Loan Agreement dated May 26, 2005, between Semiconductor Manufacturing International (Beijing) Corporation, Semiconductor Manufacturing International Corporation, as guarantor, and China Development Bank, China Construction Bank, Bank of China, Agricultural Bank of China, China Merchants Bank, HuaXia Bank, China Mingsheng Bank, Bank of Communications, Bank of Beijing, Industrial and Commercial Bank of China (Asia) and CITIC Ka Wah Bank(2)
   
Exhibit 4.3 
Form of Indemnification Agreement, as adopted at the Registrant’s annual general meeting of shareholders on May 6, 2005(2)
   
Exhibit 4.4 Form of Service Contract between the Company and each of its executive officers(3)
   
Exhibit 4.5 Form of Service Contract between the Company and each of its directors(3)
   
Exhibit 4.6 
English language summary of Chinese language Syndicate Loan Agreement dated May 31, 2006, between Semiconductor Manufacturing International (Tianjin) Corporation, Semiconductor Manufacturing International Corporation, as guarantor, and China Construction Bank, China Minsheng Bank, China Development Bank, Industrial and Commercial Bank of China, Agricultural Bank of China, Bank of China, China Merchants Bank, China Bo Hai Bank, Bank of Communications and Bangkok Bank(3)(4)
   
Exhibit 4.7 
English language summary of Chinese language Syndicate Loan Agreement dated June 8, 2006, between Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International Corporation, as guarantor, and ABN AMRO Bank N.V., Bank of China (Hong Kong) Limited, Bank of Communications, The Bank of Tokyo-Mitsubishi UFJ, Ltd., China Construction Bank, DBS Bank Ltd., Fubon Bank (Hong Kong) Limited, Industrial and Commercial Bank of China and Shanghai Pudong Development Bank(3)(4)
   
Exhibit 4.8 
Share Purchase Agreement, dated November 6, 2008, by and between the Company and Datang Telecom Technology & Industry Holdings Limited Co., Ltd.(4)(5)
   
Exhibit 4.9 
English language translation of Strategic Cooperation Agreement, dated December 24, 2008 by and between the Company and Datang Telecom Technology & Industry Holdings Co., Ltd.(5)(6)
Exhibit 4.10Settlement Agreement dated November 9, 2009 by and between the Company and Taiwan Semiconductor Manufacturing Corporation, Ltd., including Share and Warrant Agreements(7)
Exhibit 4.11Placing Agreement dated July 8, 2010 by and between the Company as the Issuer and J.P. Morgan (Asia Pacific) Limited and The Royal Bank of Scotland N.V., Hong Kong Branch as placing agents.
Exhibit 4.12Subscription Agreement with Datang Telecom Technology & Industry Holdings Co., Ltd. dated August 16, 2010
Exhibit 4.13Subscription Agreement with Country Hill Limited, a wholly-owned subsidiary of China Investment Corporation dated April 18, 2011
Exhibit 4.14Further Subscription Agreement with Datang Holdings (Hongkong) Investment Company Limited, a wholly-owned subsidiary of Datang Telecom Technology & Industry Holdings Co., Ltd., dated May 5, 2011
Exhibit 4.15English language translation of Chinese language Joint Venture Agreement and Joint Venture Memorandum dated May 12, 2011, between Semiconductor Manufacturing International Corporation and Hubei Science & Technology Investment Group Co., Ltd.
   
Exhibit 8.1 List of Subsidiaries
   
Exhibit 12.1 Certification of CEO under Section 302 of the U.S. Sarbanes-Oxley Act of 2002
   
Exhibit 12.2 Certification of Acting CFO under Section 302 of the U.S. Sarbanes-Oxley Act of 2002
   
Exhibit 13.1 Certification of CEO and Acting CFO under Section 906 of the U.S. Sarbanes-Oxley Act of 2002
   
Exhibit 99.1 Consent of Deloitte Touche Tohmatsu
   
Exhibit 101.INSXBRL Instance Document
Exhibit 101.SCHXBRL Taxonomy Extension Schema Document
Exhibit 101.CALXBRL Taxonomy Extension Calculation Linkbase Document
Exhibit 101.DEFXBRL Taxonomy Extension Definition Linkbase Document
Exhibit 101.LABXBRL Taxonomy Extension Label Linkbase Document
Exhibit 101.PREXBRL Taxonomy Extension Presentation Linkbase Document
(1) Previously filed as an exhibit to the Registrant’s Annual Report on Form 20F for the fiscal year ended December 31, 2007, filed June 27, 2008 and amended November 28, 2008.
 
(2) Previously filed as an exhibit to the Registrant’s Annual Report on Form 20F for the fiscal year ended December 31, 2004, filed June 28, 2005. With respect to Exhibit 4.1, please refer to Item 8 “Litigation” in the Registrant’s Annual Report on Form 20F for the fiscal year ended December 31, 2008.
 
(3)Previously filed as an exhibit to the Registrant’s Annual Report on Form 20F for the fiscal year ended December 31, 2008, filed June 22, 2009.
(4) Previously filed as an exhibit to the Registrant’s Annual Report on Form 20F for the fiscal year ended December 31, 2005, filed June 28, 2006.
 
(4)Previously filed as an exhibit to the Registrant’s Form 6-K dated November 17, 2008. Portions of this exhibit were omitted and filed separately with the Commission pursuant to Rule 24b-2 of the Securities Exchange Act of 1934, as amended, concerning confidential treatment.
(5) Previously filed as an exhibit to the Registrant’s Form 6-K dated January 5, 2009. Portions of this exhibit were omitted and filed separately with the Commission pursuant to Rule 24b-2 of the Securities Exchange Act of 1934, as amended, concerning confidential treatment.
(6)Previously filed as an exhibit to the Registrant’s Form 6-K dated January 5, 2009. Portions of this exhibit were omitted and filed separately with the Commission pursuant to Rule 24b-2 of the Securities Exchange Act of 1934, as amended, concerning confidential treatment.
(7)Previously filed as an exhibit to the Registrant’s Annual Report on Form 20F for the fiscal year ended December 31, 2009, filed June 29, 2010.