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TSM Taiwan Semiconductor Manufacturing

Filed: 23 Oct 20, 6:01am

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1934 Act Registration No. 1-14700

 

 

 

 

 

 

UNITED STATES

SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

 

 

 

FORM 6-K

 

 

 

REPORT OF FOREIGN PRIVATE ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16 UNDER

THE SECURITIES EXCHANGE ACT OF 1934

 

 

 

For the month of October 2020

 

 

Taiwan Semiconductor Manufacturing Company Ltd.

(Translation of Registrant’s Name Into English)

 

 

 

No. 8, Li-Hsin Rd. 6,
Hsinchu Science Park,
Taiwan, R.O.C.
(Address of Principal Executive Offices)

 

 

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.
Form 20-F              Form 40-F  

Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(1):

Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(7):

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 


 

 

 

 

 

 

SIGNATURES

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Taiwan Semiconductor Manufacturing Company Ltd.

Date:

October 23, 2020

By

/s/ Wendell Huang

 

 

 

 

Wendell Huang

 

 

 

 

Vice President & Chief Financial Officer

 

 


 

 


 

 

 

 

Taiwan Semiconductor Manufacturing Company Limited

("TSMC"; NYSE: TSM)

 

 

 

 

 

This is to report 1) the changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 2) the changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 3) the acquisition and disposition of assets by TSMC and its subsidiaries; 4) the capital appropriations approved by TSMC board of directors and 5) The unsecured bonds issued by TSMC and its subsidiaries for the month of September 2020.

 

 

 

 

 

1. The changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:

 

Title

Name

Number of shares held as of

Changes

8/31/2020

9/30/2020

 

Senior Vice President

J.K. Lin

13,529,979

13,533,979

4,000

 

Senior Vice President

Cliff Hou

432,976

433,907

931

 

Senior Vice President

Kevin Zhang

-

11,000

11,000

 

Vice President and

Chief Financial Officer

Wendell Huang

1,651,534

1,651,552

18

     Note: Shareholdings include shares held by the related parties.

 

2. The changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC: None.

 

 

 

 

 

3. The acquisition and disposition of assets by TSMC and its subsidiaries:

Fixed-income investment: NT$5.0 billion of acquisition and NT$4.2 billion of disposition.

4. The capital appropriations approved by TSMC board of directors: Inapplicable.

 

 

 

 

 

 

 

 


 

 

 

5. The unsecured bonds issued by TSMC and its subsidiaries:

(1) Domestic NT$ unsecured bonds issued:

Issuance

Tranche

Issuance Period

Total Amount
(in billions)

Coupon
Rate

Repayment and
Interest Payment

109-5

A

Sep. 2020 ~ Sep. 2025

NT$4.8

0.50%

Two equal installments in last two years; interest payable annually

B

Sep. 2020 ~ Sep. 2027

NT$8.0

0.58%

C

Sep. 2020 ~ Sep. 2030

NT$2.8

0.60%

 

 

 

 

 

 

(2) Domestic US$ unsecured bonds issued:

Issuance

Tranche

Issuance Period

Total Amount
(in billions)

Coupon
Rate

Repayment and
Interest Payment

109-1

-

Sep. 2020 ~ Sep. 2060

US$1.0

2.70%

Bullet repayment (callable on the 5th anniversary of the issue date and every anniversary thereafter); interest payable annually

 

 

 

 

 

 

(3) Overseas US$ unsecured bonds issued:

Issuance Period

Total Amount
(in billions)

Coupon
Rate

Repayment and
Interest Payment

Sep. 2020 ~ Sep. 2025

US$1.00

0.750%

Bullet repayment (callable at any time, in whole or in part, at the relevant redemption price according to relevant agreements); interest payable semi-annually

Sep. 2020 ~ Sep. 2027

US$0.75

1.000%

Sep. 2020 ~ Sep. 2030

US$1.25

1.375%