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IVAC Intevac

APP
Utility
System with Dual-motion Substrate Carriers
25 Mar 21
A processing system is provided, including a vacuum enclosure having a plurality of process windows and a continuous track positioned therein; a plurality of processing chambers attached sidewalls of the vacuum enclosures, each processing chamber about one of the process windows; a loadlock attached at one end of the vacuum enclosure and having a loading track positioned therein; at least one gate valve separating the loadlock from the vacuum enclosure; a plurality of substrate carriers configured to travel on the continuous track and the loading track; at least one track exchanger positioned within the vacuum enclosure, the track exchangers movable between a first position, wherein substrate carriers are made to continuously move on the continuous track, and a second position wherein the substrate carriers are made to transfer between the continuous track and the loading track.
Terry Bluck
Filed: 25 Sep 19
GRANT
Utility
Optical coating having nano-laminate for improved durability
23 Mar 21
An optical coating, such as anti-reflective coating (ARC) or colored coating for optical devices, suitable especially for mobile devices.
Terry Bluck, Gaurav Saraf, James Craig Hunter, Changwan Hwang, Paul R. Markoff Johnson, Jae Ha Choi
Filed: 1 Jun 18
GRANT
Utility
Multi-piece substrate holder and alignment mechanism
30 Nov 20
A system for transporting substrates and precisely align the substrates horizontally and vertically.
Hoang Huy Vu, Babak Adibi, Terry Bluck
Filed: 18 Jul 18
APP
Utility
Method to Produce High Density Diamond Like Carbon Thin Films
11 Nov 20
A method for forming a diamond-like carbon (DLC) coating on an article is provided, comprising: alternatingly performing a deposition process and an ashing process on the article a determined number of times, wherein during the deposition process the method proceeds by forming on the article a layer of DLC which includes graphitic sp2 carbon and tetrahedral sp3 carbon, and during the ashing process the method proceeds by selectively etching the graphitic sp2 carbon, wherein the determine number of time is configured to result in a designated overall thickness of the DLC coating.
Samuel D. Harkness, IV, Kentaro Takano, Jae Ha Choi
Filed: 3 May 20
APP
Utility
Inline Vacuum Processing System with Substrate and Carrier Cooling
4 Nov 20
A substrate processing system, including a processing module having at least one sputtering source; a first buffer module positioned on a first side of the processing module; a second buffer module positioned on a second side of the processing module directly opposite the first side; a first cooling module attached to the first buffer module; a second cooling module attached to the second buffer module; a transport system transporting substrate carriers in a straight line through the first cooling module, the first buffer module, the processing module, the second buffer module and the second cooling module; wherein the system is arranged linearly in the order: first cooling module, the first buffer module, the processing module, the second buffer module and the second cooling module.
Terry Bluck, Arun Karamcheti
Filed: 28 Apr 20
GRANT
Utility
System architecture for combined static and pass-by processing
24 Aug 20
Disclosed is a substrate processing system which enables combined static and pass-by processing.
Patrick Leahey, Eric Lawson, Charles Liu, Terry Bluck, Kevin P. Fairbairn, Robert L. Ruck, Samuel D. Harkness, IV
Filed: 18 Feb 18
GRANT
Utility
Thermally assisted negative electron affinity photocathode
22 Jun 20
A novel photocathode employing a conduction band barrier is described.
Kenneth A. Costello, Verle W. Aebi, Michael Jurkovic, Xi Zeng
Filed: 11 Sep 17
APP
Utility
Hybrid System Architecture for Thin Film Deposition
17 Jun 20
A processing system is provided, including a vacuum enclosure having a plurality of process windows and a continuous track positioned therein; a plurality of processing chambers attached sidewalls of the vacuum enclosures, each processing chamber about one of the process windows; a loadlock attached at one end of the vacuum enclosure and having a loading track positioned therein; at least one gate valve separating the loadlock from the vacuum enclosure; a plurality of substrate carriers configured to travel on the continuous track and the loading track; at least one track exchanger positioned within the vacuum enclosure, the track exchangers movable between a first position, wherein substrate carriers are made to continuously move on the continuous track, and a second position wherein the substrate carriers are made to transfer between the continuous track and the loading track.
Terry Bluck
Filed: 15 Dec 19
GRANT
Utility
Wafer plate and mask arrangement for substrate fabrication
8 Jun 20
A system for processing wafers in a vacuum processing chamber.
Terry Bluck, Aaron Zanetto, William Eugene Runstadler, Jr., Terry Pederson
Filed: 2 Oct 16
GRANT
Utility
Ion implant system having grid assembly
27 Apr 20
An ion implantation system having a grid assembly.
Babak Adibi, Moon Chun
Filed: 20 Aug 17
GRANT
Utility
System of height and alignment rollers for precise alignment of wafers for ion implantation
10 Feb 20
A system for transporting substrates and precisely alignment the substrates to shadow masks.
William Eugene Runstadler, Jr., Babak Adibi, Terry Bluck
Filed: 18 Jul 18
APP
Utility
Multi-colored Dielectric Coating
18 Dec 19
A multi-color dielectric coating is formed using interleaved layers of dielectric material, having alternating refractive index, to create reflections at selected wavelengths, thus appearing as different colors.
Terry Bluck, Paul Ramon Markoff Johnson, Alexander Vassilievich Demchuk
Filed: 19 Feb 19
APP
Utility
Multi-colored Dielectric Coating and Uv Inkjet Printing
18 Dec 19
A multi-color dielectric coating is formed using interleaved layers of dielectric material, having alternating refractive index, to create reflections at selected wavelengths, thus appearing as different colors.
Terry Bluck, Arun Karamcheti
Filed: 13 Jun 19
GRANT
Utility
Patterned chuck for substrate processing
14 Oct 19
A chuck for wafer processing that counters the deleterious effects of thermal expansion of the wafer.
Terry Bluck, Babak Adibi, Vinay Prabhakar, William Eugene Runstadler, Jr.
Filed: 18 Jan 17
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