16684 patents
Utility
Communication Interface Structure and Die-to-die Package
18 Jan 24
A communication interface structure and a Die-to-Die package are provided.
Sheng-Fan Yang, Chih-Chiang Hung, Yuan-Hung Lin, Shih-Hsuan Hsu, Igor Elkanovich
Filed: 13 Jul 22
Utility
Switches to Reduce Routing Rails of Memory System
18 Jan 24
Disclosed herein are related to a memory array including a set of memory cells and a set of switches to configure the set of memory cells.
Meng-Sheng Chang, Chia-En Huang, Yi-Ching Liu, Yih Wang
Filed: 28 Jul 23
Utility
Semiconductor Device with Reduced Power
18 Jan 24
A semiconductor device and a method of manufacturing the same are provided.
Shih-Wei PENG, Ching-Yu HUANG, Jiann-Tyng TZENG
Filed: 31 Jul 23
Utility
Signal Generator for Controlling Timing of Signal In Memory Device
18 Jan 24
A device includes a first memory subarray, a first modulation circuit, a second memory subarray, a second modulation circuit and a control signal generator.
Xiu-Li YANG, He-Zhou WAN, Mu-Yang YE, Lu-Ping KONG, Ming-Hung CHANG
Filed: 27 Sep 23
Utility
Semiconductor Device Having More Similar Cell Densities In Alternating Rows
18 Jan 24
A method (of forming a semiconductor device) including forming cell regions (in alternating first and second rows having first and second heights) including forming a majority of the cell regions in the first rows including: limiting a height of the majority of the cell regions to be single-row cell regions that span corresponding single one of the first rows but do not extend therebeyond; and forming a minority of the cell regions correspondingly in at least the first rows including reducing widths of the multi-row cell regions to be smaller than comparable single-row cell regions; and expanding heights of the minority of the cell regions to be multi-row cell regions, each of the multi-row cell regions spanning a corresponding single first row and at least a corresponding second row such that cell region densities of the second rows are at least about forty percent.
Wei-Cheng LIN, Hui-Ting YANG, Jiann-Tyng TZENG, Lipen YUAN, Wei-An LAI
Filed: 31 Jul 23
Utility
Memory Array Structure
18 Jan 24
In some aspects of the present disclosure, a memory array structure is disclosed.
Hung-Li Chiang, Jer-Fu Wang, Tzu-Chiang Chen, Meng-Fan Chang
Filed: 12 Jul 22
Utility
Cell Region Including Portion of Conductor of Another Cell Region and Semiconductor Device Include the Same
18 Jan 24
A cell region of a semiconductor device, the cell region including: components (representing a first circuit) including alpha info conductors and dummy conductors which are substantially collinear correspondingly with reference tracks, regarding the first circuit, the alpha info conductors beipng correspondingly for one or more input and/or output signals, or one or more internal signals, and for a majority of the reference tracks, first ends correspondingly of the alpha info conductors or the dummy conductors being aligned and proximal to a first side of the cell region; a first alpha info conductor being on a first reference track and being an intra-cell conductor which does not extend beyond the first side nor a second side of the cell region; and a portion of a first beta info conductor of a second circuit (represented by components of an external cell region) being on the first reference track.
Fong-Yuan CHANG, Chin-Chou LIU, Sheng-Hsiung CHEN, Po-Hsiang HUANG
Filed: 31 Jul 23
Utility
Method and System for Refresh of Memory Devices
18 Jan 24
A memory system includes a memory device, a controller and a timer circuit.
Hiroki NOGUCHI, Yih WANG
Filed: 22 Sep 23
Utility
Optical Fingerprint Sensor with Enhanced Anti-Counterfeiting Features
18 Jan 24
An image sensing apparatus is disclosed.
Feng-Chien Hsieh, Yun-Wei Cheng, Kuo-Cheng Lee, Cheng-Ming Wu, Wei-Li Hu
Filed: 22 Mar 23
Utility
Memory Devices with Improved Bit Line Loading
18 Jan 24
A memory array is disclosed.
Yi-Hsin Nien, Hidehiro Fujiwara, Chih-Yu Lin, Yen-Huei Chen
Filed: 12 Jul 22
Utility
Magnetic Tunnel Junction Device and Method of Forming Same
18 Jan 24
A semiconductor device and a method of forming the same are provided.
Bo-Jhih Shen, Kuang-I Liu, Joung-Wei Liou, Jinn-Kwei Liang, Yi-Wei Chiu, Chin-Hsing Lin, Li-Te Hsu, Han-Ting Tsai, Cheng-Yi Wu, Shih-Ho Lin
Filed: 8 Aug 23
Utility
Drive Circuit with Improved Timing Margin for Memory Device
18 Jan 24
Disclosed herein are related to a memory device.
Masaru Haraguchi, Yoshisato Yokoyama, Yorinobu Fujino
Filed: 30 Jan 23
Utility
By-site-comensated Etch Back for Local Planarization/topography Adjustment
18 Jan 24
A work piece is positioned on a work piece support, which includes a plurality of temperature control zones.
Ming Chyi Liu, Hung-Wen Hsu, Min-Yung Ko
Filed: 7 Aug 23
Utility
Method for Selectively Removing Predetermined Part of Selected Element In Semiconductor Structure
18 Jan 24
A method for treating a semiconductor structure includes: disposing the semiconductor structure in a chamber; introducing a modifying agent into the chamber to modify a surface part of a dielectric element; and introducing a removing agent into the chamber while applying an electromagnetic radiation with a selected frequency to the chamber so as to permit the dielectric element to be selectively heated by the electromagnetic radiation to have a temperature higher than those of other elements of the semiconductor structure, and so as to permit the modified surface part of the dielectric element to be removed.
Chansyun David YANG
Filed: 15 Jul 22
Utility
Semiconductor Devices and Methods of Manufacturing
18 Jan 24
An apparatus, semiconductor device and method of manufacture are presented, wherein a hard mask layer and one or more etch stop layers are etched in an etching chamber.
Wan Hsuan Hsu, Jao Sheng Huang, Yen-Chiu Kuo, Yu-Li Cheng, Ya Tzu Chen, Neng-Jye Yang, Chun-Li Chou
Filed: 28 Jul 23
Utility
Semiconductor Package and Manufacturing Method Thereof
18 Jan 24
A semiconductor package and a manufacturing method thereof are provided.
Jiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih, Ting-Yu Yeh, Chen-Hsuan Tsai
Filed: 1 Aug 23
Utility
Info Packages Including Thermal Dissipation Blocks
18 Jan 24
A method includes forming a package, which includes forming a plurality of redistribution lines over a carrier, and forming a thermal dissipation block over the carrier.
Ching-Yi Lin, Yu-Hao Chen, Fong-Yuan Chang, Po-Hsiang Huang, Jyh Chwen Frank Lee, Shuo-Mao Chen
Filed: 24 Jul 23
Utility
Wafer Cleaning Apparatus and Method
18 Jan 24
The present disclosure relates to an apparatus for wafer cleaning.
Jieh-Chau HUANG, Ying Ting Hsia, Ping-Jung Huang, Pei Yen Hsia, Bi-Ming Yen, Hung-Lung Hu
Filed: 31 Jul 23
Utility
Pick-and-place Tool and Method of Manufacturing Semiconductor Structure
18 Jan 24
A pick-and-place tool includes a bond base and an attaching head.
JEN-YUAN CHANG
Filed: 14 Jul 22
Utility
Method of Monitoring Tool
18 Jan 24
A method includes transferring a tool monitoring device over a load port of a tool.
Hom-Chung LIN, Chi-Ying CHANG, Jih-Churng TWU, Chin-Yun CHEN, Yi-Ting CHANG, Feng-Yu CHEN
Filed: 28 Jul 23