146 patents
Utility
Semiconductor device having a lid configured as an enclosure and a capacitive structure and method of manufacturing a semiconductor device
21 Feb 23
A method for forming a packaged electronic device includes providing a substrate having a first major surface and an opposing second major surface.
Ramakanth Alapati
Filed: 12 Dec 18
Utility
Semiconductor device and method of manufacturing thereof
31 Jan 23
A semiconductor device and a method of manufacturing a semiconductor device.
Yi Seul Han, Tae Yong Lee, Ji Yeon Ryu
Filed: 21 Mar 17
Utility
Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate
30 Aug 22
A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate.
Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park, Byong Woo Cho, Gyu Wan Han, Ji Young Chung, Jin Seong Kim, Do Hyun Na
Filed: 1 Oct 18
Utility
Semiconductor device and method of manufacturing semiconductor device
7 Jun 22
In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent an opposite surface.
Ki Yeul Yang, Kyung Han Ryu, Seok Hun Yun, Bora Baloglu, Hyun Cho, Ramakanth Alapati
Filed: 21 Jun 19
Utility
Semiconductor device and manufacturing method thereof
21 Dec 21
A semiconductor device and a method of manufacturing a semiconductor device.
Jin Young Khim, Ji Young Chung, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee, Jae Min Bae
Filed: 28 Aug 18
Utility
Semiconductor package and manufacturing method thereof
19 Oct 21
A semiconductor package and a method of manufacturing a semiconductor package.
Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong, Byong Jin Kim, Min Chul Shin, Ho Jeong Lim, Ji Hyun Kim, Chang Hun Kim
Filed: 23 Jul 18
Utility
Semiconductor devices and methods of manufacturing semiconductor devices
1 Jun 21
A packaged semiconductor device includes a substrate with first and second opposing major surfaces.
Shaun Bowers, Ramakanth Alapati
Filed: 10 Aug 19
Utility
Land structure for semiconductor package and method therefor
25 May 21
A semiconductor package structure includes a substrate comprising a land structure.
Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung
Filed: 28 Nov 17
Utility
Electronic package structure with improved board level reliability
18 May 21
A method for providing an electronic package structure includes providing a substrate having a die pad having a die pad top surface and an opposing die pad bottom surface, leads laterally spaced apart from the die pad, and a substrate encapsulant interposed between the die pad and the leads and includes a substrate top surface and an opposing substrate bottom surface.
Tae Kyung Hwang, Eun Sook Sohn, Won Joon Kang, Gi Jeong Kim
Filed: 10 Feb 18
Utility
System and Method for Laser Assisted Bonding of an Electronic Device
18 Mar 21
A system and method for laser assisted bonding of semiconductor die.
Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim
Filed: 27 Aug 20
Utility
Semiconductor package and fabricating method thereof
9 Mar 21
A semiconductor device structure and a method for making a semiconductor device.
Michael Kelly, David Hiner, Ronald Huemoeller, Roger St. Amand
Filed: 29 Jan 19
Utility
Semiconductor device having conductive wire with increased attachment angle and method
9 Mar 21
A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die.
Jun Ho Jeon, Kyeong Sool Seong, Seok Ho Na, Jeong Il Kim, Young Kyu Kim, Sung Ho Jeon, Deok In Lim, Sung Moo Hong, Sung Jung Kim, Sung Han Ryu, Kyung Nam Kang, Seong Hak Yoo
Filed: 18 Oct 18
Utility
Packaged electronic device having integrated antenna and locking structure
16 Feb 21
A packaged electronic device includes an integrated antenna as part of a conductive leadframe.
Marc Alan Mangrum
Filed: 12 Jan 20
Utility
Semiconductor Devices and Methods of Manufacturing Semiconductor Devices
11 Feb 21
A packaged semiconductor device includes a substrate with first and second opposing major surfaces.
Shaun BOWERS, Ramakanth ALAPATI
Filed: 10 Aug 19
Utility
Semiconductor device and method of manufacturing semiconductor device
2 Feb 21
A packaged electronic device includes a substrate comprising a die pad and a lead spaced apart from the die.
Kenji Nishikawa
Filed: 4 Jun 19
Utility
Method of forming a molded substrate electronic package and structure
2 Feb 21
An electronic package includes a substrate having a plurality of lands embedded within an insulating layer.
Won Bae Bang, Byong Jin Kim, Gi Jeong Kim, Ji Young Chung
Filed: 3 Feb 18
Utility
Wafer level fan out semiconductor device and manufacturing method thereof
26 Jan 21
A wafer level fan out semiconductor device and a manufacturing method thereof are provided.
Boo Yang Jung, Jong Sik Paek, Choon Heung Lee, In Bae Park, Sang Won Kim, Sung Kyu Kim, Sang Gyu Lee
Filed: 21 Jul 17
Utility
Semiconductor package using a coreless signal distribution structure
26 Jan 21
A semiconductor package using a coreless signal distribution structure (CSDS) is disclosed and may include a CSDS comprising at least one dielectric layer, at least one conductive layer, a first surface, and a second surface opposite to the first surface.
Do Hyung Kim, Jung Soo Park, Seung Chul Han
Filed: 29 Aug 17
Utility
Wafer-level Stack Chip Package and Method of Manufacturing the Same
21 Jan 21
A semiconductor product in the form of a stack chip package and a method of manufacturing the same, where a plurality of semiconductor chips are stacked one on another so as to enable the exchange of electrical signals between the semiconductor chips, and where a conductive layer is included for inputting and outputting signals to and from individual chips.
Yeong Beom Ko, Dong Jin Kim, Se Woong Cha
Filed: 22 Sep 20
Utility
Semiconductor Device and Manufacturing Method Thereof
21 Jan 21
A semiconductor device including a relatively thin interposer excluding a through silicon hole and a manufacturing method thereof are provided.
Jong Sik Paek, Won Chul Do, Doo Hyun Park, Eun Ho Park, Sung Jae Oh
Filed: 2 Jun 20