146 patents
Page 2 of 8
Utility
Electronic Device Package and Fabricating Method Thereof
21 Jan 21
Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof.
Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim, Ju Hoon Yoon
Filed: 22 Jun 20
Utility
Semiconductor Device with Optically-transmissive Layer and Manufacturing Method Thereof
21 Jan 21
A method for manufacturing a semiconductor device and a semiconductor device produced thereby.
David Clark, Curtis Zwenger
Filed: 21 Sep 20
Utility
Method of manufacturing a semiconductor device
19 Jan 21
A method for forming packaged electronic devices includes providing a substrate having pads connected by conductive pad linking portions and semiconductor devices attached to the pads in different orientations.
Siang Miang Yeo, Mohd Hasrul Bin Zulkifli
Filed: 12 Jan 18
Utility
Integrated shield package and method
4 Jan 21
An integrated shield electronic component package includes a substrate having as upper surface, a lower surface, and sides extending between the upper surface and the lower surface.
Paul Mescher, Danny Brady
Filed: 21 Oct 18
Utility
Semiconductor Package with High Routing Density Patch
30 Dec 20
Methods and systems for a semiconductor package with high routing density routing patch are disclosed and may include a semiconductor die bonded to a substrate and a high routing density patch bonded to the substrate and to the semiconductor die, wherein the high routing density patch comprises a denser trace line density than the substrate.
Michael Kelly, Ronald Patrick Huemoeller, David Jon Hiner
Filed: 1 Jun 20
Utility
Semiconductor Device and Method of Manufacturing Semiconductor Device
23 Dec 20
In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent an opposite surface.
Ki Yeul YANG, Kyung Han RYU, Seok Hun YUN, Bora BALOGLU, Hyun CHO, Ramakanth ALAPATI
Filed: 20 Jun 19
Utility
Carrier Assisted Substrate Method of Manufacturing an Electronic Device and Electronic Device Produced Thereby
23 Dec 20
An electronic device structure and a method for making an electronic device.
Roger St. Amand, Young Do Kweon
Filed: 18 Jun 19
Utility
Semiconductor Devices with Shield
23 Dec 20
A semiconductor device includes a lead frame, an electronic device, a package body, and a first shield plate.
Yoshio Matsuda, Kenji Nishikawa, Seiichiro Sato, Yoshihiko Ikemoto
Filed: 19 Jun 19
Utility
Method of manufacturing a package-on-package type semiconductor package
14 Dec 20
A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package.
Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko
Filed: 13 May 19
Utility
Method of manufacturing a semiconductor device
14 Dec 20
A method for manufacturing a semiconductor device, for example formed utilizing component stacking.
Won Chul Do, Jin Hee Park
Filed: 9 Aug 15
Utility
Semiconductor Device and Method of Manufacturing Semiconductor Device
9 Dec 20
A packaged electronic device includes a substrate comprising a die pad and a lead spaced apart from the die.
Kenji NISHIKAWA
Filed: 3 Jun 19
Utility
Embedded vibration management system having an array of vibration absorbing structures
7 Dec 20
Methods for an embedded vibration management system are disclosed and may include fabricating a semiconductor package that supports vibration management by forming an array of vibration absorbing structures, placing the array proximate to a leadframe comprising two-legged supported leads, placing a semiconductor device above the leadframe, and encapsulating the semiconductor device and the leadframe.
Bora Baloglu, Adrian Arcedera, Marc Alan Mangrum, Russell Shumway
Filed: 23 Jul 18
Utility
Method of forming an electronic device structure having an electronic component with an on-edge orientation and related structures
23 Nov 20
A method of forming an electronic device structure includes providing an electronic component having a first major surface, an opposing second major surface, a first edge surface, and an opposing second edge surface.
Shaun Bowers
Filed: 26 Feb 18
Utility
Semiconductor package with multiple compartments
23 Nov 20
A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component.
Lawrence Prestousa Natan, Adrian Arcedera, Roveluz Lledo-Reyes, Sarah Christine-Sanchez Torrefranca
Filed: 3 Mar 19
Utility
Semiconductor Device with Redistribution Layers on Partial Encapsulation and Non-photosensitive Passivation Layers
18 Nov 20
A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include providing a carrier with a non-photosensitive protection layer, forming a pattern in the non-photosensitive protection layer, providing a semiconductor die with a contact pad on a first surface, and bonding the semiconductor die to the non-photosensitive protection layer such that the contact pad aligns with the pattern formed in the non-photosensitive protection layer.
Jong Sik Paek, Jin Young Kim, YoonJoo Kim, Jin Han Kim, SeungJae Lee, Se Woong Cha, SungKyu Kim, Jae Hun Bae, Dong Jin Kim, Doo Hyun Park
Filed: 1 Jun 20
Utility
Packaging for Fingerprint Sensors and Methods of Manufacture
18 Nov 20
A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed.
Ronald Patrick Huemoeller, David Bolognia, Robert Francis Darveaux, Brett Arnold Dunlap
Filed: 23 Apr 20
Utility
Method and System for Packing Optimization of Semiconductor Devices
11 Nov 20
Provided is a disclosure for optimizing the number of semiconductor devices on a wafer/substrate.
Glenn Rinne, Daniel Richter
Filed: 29 Jul 20
Utility
Electronic device with top side pin array and manufacturing method thereof
9 Nov 20
An electronic device and a manufacturing method thereof.
Devarajan Balaraman, Daniel Richter, Greg Hames, Dean Zehnder, Glenn Rinne
Filed: 27 May 19
Utility
Method of forming a packaged semiconductor device using ganged conductive connective assembly and structure
9 Nov 20
A packaged semiconductor device has a die attach pad and leads disposed proximate to the die attach pad.
Siang Miang Yeo, Mohd Hasrul Bin Zulkifli
Filed: 29 Jul 18
Utility
Semiconductor Package and Fabricating Method Thereof
4 Nov 20
A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device.
Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park
Filed: 8 Mar 20