146 patents
Page 3 of 8
Utility
Semiconductor package using a polymer substrate
2 Nov 20
A semiconductor package using a polymer substrate is disclosed and may include a polymer cavity structure comprising first metal traces, a micro-electro mechanical systems (MEMS) device and a semiconductor die bonded to a first surface within a cavity of the cavity structure, and a substrate coupled to the cavity structure and comprising second metal traces coupled to the first metal traces.
Yung Woo Lee, Byung Jun Kim, Dong Hyun Bang, EunNaRa Cho, Adrian Arcedera, Jae Ung Lee
Filed: 22 Jan 19
Utility
Method of forming a packaged semiconductor device having enhanced wettable flank and structure
2 Nov 20
A packaged electronic device includes a substrate having a lead.
Pedro Joel Rivera-Marty
Filed: 3 Jan 20
Utility
Semiconductor Device Package and Manufacturing Method Thereof
28 Oct 20
Methods and systems for a semiconductor device package with a die to interposer wafer first bond are disclosed and may include bonding a plurality of semiconductor die comprising electronic devices to an interposer wafer, and applying an underfill material between the die and the interposer wafer.
Michael G. Kelly, Ronald Patrick Huemoeller, Won Chul Do, David Jon Hiner
Filed: 9 Jul 20
Utility
Embedded ball land substrate, semiconductor package, and manufacturing methods
26 Oct 20
A electronic device includes an embedded ball land substrate and a semiconductor die.
Corey Reichman, Ronald Huemoeller
Filed: 1 Apr 18
Utility
Thin bonded interposer package
26 Oct 20
Methods and systems for a thin bonded interposer package are disclosed and may, for example, include bonding a semiconductor die to a first surface of a substrate, forming contacts on the first surface of the substrate, encapsulating the semiconductor die, formed contacts, and first surface of the substrate using a mold material while leaving a top surface of the semiconductor die not encapsulated by mold material, forming vias through the mold material to expose the formed contacts.
Christopher J. Berry, Roger D. St. Amand, Jin Seong Kim
Filed: 24 Mar 19
Utility
Stackable Via Package and Method
21 Oct 20
A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal.
Akito Yoshida, Mahmoud Dreiza, Curtis Michael Zwenger
Filed: 27 Jan 20
Utility
Semiconductor Device with Redistribution Layers Formed Utilizing Dummy Substrates
21 Oct 20
A semiconductor device with redistribution layers formed utilizing dummy substrates is disclosed and may include forming a first redistribution layer on a first dummy substrate, forming a second redistribution layer on a second dummy substrate, electrically connecting a semiconductor die to the first redistribution layer, electrically connecting the first redistribution layer to the second redistribution layer, and removing the dummy substrates.
Jin Young Kim, Ji Young Chung, Doo Hyun Park, Choon Heung Lee
Filed: 5 Jul 20
Utility
Method of Forming a Plurality of Electronic Component Packages and Packages Formed Thereby
21 Oct 20
A method of forming a plurality of electronic component packages includes attaching electronic components to a carrier, wherein high aspect ratio spaces exist between the electronic components.
Brett Arnold Dunlap
Filed: 27 Jan 20
Utility
Encapsulated semiconductor package
19 Oct 20
A method of manufacturing a semiconductor package includes mounting and electrically connecting a semiconductor die to a substrate.
Ronald Patrick Huemoeller, Sukianto Rusli, David Jon Hiner
Filed: 30 May 19
Utility
Semiconductor device with through-mold via
19 Oct 20
In accordance with the present description, there is provided multiple embodiments of a semiconductor device.
Dong Joo Park, Jin Seong Kim, Ki Wook Lee, Dae Byoung Kang, Ho Choi, Kwang Ho Kim, Jae Dong Kim, Yeon Soo Jung, Sung Hwan Cho
Filed: 1 Jul 18
Utility
Semiconductor Package and Manufacturing Method Thereof
14 Oct 20
A semiconductor device structure and a method for manufacturing a semiconductor device.
Jong Sik Paek, No Sun Park
Filed: 12 Jan 20
Utility
Stiffener Package and Method of Fabricating Stiffener Package
14 Oct 20
A wafer level fan out package includes a semiconductor die having a first surface, a second surface, and a third surface.
Jin Young Kim, Doo Hyun Park, Seung Jae Lee
Filed: 12 Jan 20
Utility
Semiconductor device with thin redistribution layers
12 Oct 20
A semiconductor device with thin redistribution layers is disclosed and may include forming a first redistribution layer on a dummy substrate, electrically coupling a semiconductor die to the first redistribution layer, and forming a first encapsulant layer on the redistribution layer and around the semiconductor die.
Dong Hoon Lee, Do Hyung Kim, Seung Chul Han
Filed: 22 Apr 19
Utility
Semiconductor Device and Manufacturing Method Thereof
7 Oct 20
A method for manufacturing a semiconductor device and a semiconductor device produced thereby.
Dong Jin Kim, Jin Han Kim, Won Chul Do, Jae Hun Bae, Won Myoung Ki, Dong Hoon Han, Do Hyung Kim, Ji Hun Lee, Jun Hwan Park, Seung Nam Son, Hyun Cho, Curtis Zwenger
Filed: 3 Feb 20
Utility
Electronic device with adaptive vertical interconnect and fabricating method thereof
28 Sep 20
Electronic components and an electronic device comprising one or more of the electronic components, and a method of manufacturing the electronic components and an electronic device comprising one or more of the electronic components.
Bora Baloglu, Curtis Zwenger, Ronald Huemoeller
Filed: 26 Mar 18
Utility
Semiconductor Device and Manufacturing Method Thereof
23 Sep 20
A method for manufacturing a semiconductor device and a semiconductor device produced thereby.
Jong Sik Paek, Doo Hyun Park, Seong Min Seo, Sung Geun Kang, Yong Song, Wang Gu Lee, Eun Young Lee, Seo Yeon Ahn, Pil Je Sung
Filed: 22 Dec 19
Utility
Semiconductor Package Using Cavity Substrate and Manufacturing Methods
23 Sep 20
A semiconductor package includes a cavity substrate, a semiconductor die, and an encapsulant.
Young Do Kweon, JeongByung Chae, DongJoo Park, ByoungWoo Cho, SeHwan Hong
Filed: 1 Jun 20
Utility
Semiconductor package and fabricating method thereof
21 Sep 20
A semiconductor package structure and a method for making a semiconductor package.
David Hiner, Michael Kelly, Ronald Huemoeller
Filed: 1 Dec 19
Utility
Wafer-level stack chip package and method of manufacturing the same
21 Sep 20
A semiconductor product in the form of a stack chip package and a method of manufacturing the same, where a plurality of semiconductor chips are stacked one on another so as to enable the exchange of electrical signals between the semiconductor chips, and where a conductive layer is included for inputting and outputting signals to and from individual chips.
Yeong Beom Ko, Dong Jin Kim, Se Woong Cha
Filed: 2 Nov 15
Utility
Semiconductor device with optically-transmissive layer and manufacturing method thereof
21 Sep 20
A method for manufacturing a semiconductor device and a semiconductor device produced thereby.
David Clark, Curtis Zwenger
Filed: 17 Nov 19