146 patents
Page 6 of 8
Utility
Semiconductor Device and Manufacturing Method Thereof
11 Mar 20
A method for manufacturing a semiconductor device and a semiconductor device produced thereby.
David Clark, Curtis Zwenger
Filed: 17 Nov 19
Utility
Semiconductor package and fabricating method thereof
9 Mar 20
A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device.
Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park
Filed: 4 Dec 17
Reissue
Packaging for fingerprint sensors and methods of manufacture
2 Mar 20
A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed.
Ronald Patrick Huemoeller, David Bolognia, Robert Francis Darveaux, Brett Arnold Dunlap
Filed: 10 Jul 17
Utility
Wiring Substrate, Semiconductor Package Having the Wiring Substrate, and Manufacturing Method Thereof
26 Feb 20
Provided is a wiring substrate and its manufacturing method in which a thick wiring layer capable of being applied with a large current and a thin wiring layer capable of being subjected to microfabrication coexist in the same layer.
Naoki HAYASHI
Filed: 22 Oct 19
Utility
Encapsulated Semiconductor Package
26 Feb 20
A method of manufacturing a semiconductor package includes mounting and electrically connecting a semiconductor die to a substrate.
Ronald Patrick Huemoeller, Sukianto Rusli, David Jon Hiner
Filed: 27 Oct 19
Utility
Packaged electronic device having integrated antenna and locking structure
17 Feb 20
A packaged electronic device includes an integrated antenna as part of a conductive leadframe.
Marc Alan Mangrum
Filed: 2 Mar 18
Utility
Semiconductor Device and Manufacturing Method Thereof
12 Feb 20
A semiconductor device includes a low-density substrate, a high-density patch positioned inside a cavity in the low-density substrate, a first semiconductor die, and a second semiconductor die.
Jae Hun Bae, Won Chul Do, Min Yoo, Young Rae Kim, Min Hwa Chang, Dong Hyun Kim, Ah Ra Jo, Seok Geun Ahn
Filed: 19 May 19
Utility
Semiconductor Device and Manufacturing Method Thereof
5 Feb 20
An electronic device and a method of making an electronic device.
Joon Young Park, Jung Soo Park, Ji Hye Yoon
Filed: 20 May 19
Utility
Semiconductor device and manufacturing method thereof
3 Feb 20
A method for manufacturing a semiconductor device and a semiconductor device produced thereby.
Dong Jin Kim, Jin Han Kim, Won Chul Do, Jae Hun Bae, Won Myoung Ki, Dong Hoon Han, Do Hyung Kim, Ji Hun Lee, Jun Hwan Park, Seung Nam Son, Hyun Cho, Curtis Zwenger
Filed: 24 Jun 18
Utility
Semiconductor package with EMI shield and fabricating method thereof
3 Feb 20
A semiconductor device with EMI shield and a fabricating method thereof are provided.
Doo Soub Shin, Tae Yong Lee, Kyoung Yeon Lee, Sung Gyu Kim
Filed: 11 Jan 17
Utility
Method of forming a plurality of electronic component packages
27 Jan 20
A method of forming a plurality of electronic component packages includes attaching electronic components to a carrier, wherein high aspect ratio spaces exist between the electronic components.
Brett Arnold Dunlap
Filed: 26 Jun 17
Utility
Stackable via package and method
27 Jan 20
A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal.
Akito Yoshida, Mahmoud Dreiza, Curtis Michael Zwenger
Filed: 10 Feb 19
Utility
Semiconductor Product with Interlocking Metal-to-metal Bonds and Method for Manufacturing Thereof
15 Jan 20
A structure and method for performing metal-to-metal bonding in an electrical device.
Bora Baloglu, Curtis Zwenger, Ron Huemoeller
Filed: 5 Sep 19
Utility
Stiffener package and method of fabricating stiffener package
13 Jan 20
A wafer level fan out package includes a semiconductor die having a first surface, a second surface, and a third surface.
Jin Young Kim, Doo Hyun Park, Seung Jae Lee
Filed: 4 Mar 19
Utility
Semiconductor package and manufacturing method thereof
13 Jan 20
A semiconductor device structure and a method for manufacturing a semiconductor device.
Jong Sik Paek, No Sun Park
Filed: 26 Mar 18
Utility
Semiconductor Device with Thin Redistribution Layers
8 Jan 20
Dong Hoon Lee, Do Hyung Kim, Seung Chul Han
Filed: 22 Apr 19
Utility
Method of forming a packaged semiconductor device having enhanced wettable flank and structure
6 Jan 20
A packaged electronic device includes a substrate having a lead.
Pedro Joel Rivera-Marty
Filed: 20 Dec 18
Utility
Semiconductor Device with Integrated Heat Distribution and Manufacturing Method Thereof
1 Jan 20
A semiconductor package having an internal heat distribution layer and methods of forming the semiconductor package are provided.
Bora Baloglu, Ron Huemoeller, Curtis Zwenger
Filed: 8 Sep 19
Utility
Electronic Device Package and Fabricating Method Thereof
25 Dec 19
Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof.
Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim, Ju Hoon Yoon
Filed: 27 May 19
Utility
Semiconductor device and manufacturing method thereof
23 Dec 19
A method for manufacturing a semiconductor device and a semiconductor device produced thereby.
Jong Sik Paek, Doo Hyun Park, Seong Min Seo, Sung Geun Kang, Yong Song, Wang Gu Lee, Eun Young Lee, Seo Yeon Ahn, Pil Je Sung
Filed: 17 Sep 18