146 patents
Page 7 of 8
Utility
Semiconductor device and manufacturing method thereof
9 Dec 19
An electronic device and a method of manufacturing an electronic device.
Bora Baloglu, Ron Huemoeller, Curtis Zwenger
Filed: 2 Jun 16
Utility
Semiconductor package structure for improving die warpage and manufacturing method thereof
9 Dec 19
A semiconductor die package includes a semiconductor die, a film for improving die warpage bonded to a first face of the semiconductor die, a plurality of electrically conductive bumps formed on a second face of the semiconductor die, a substrate onto which the electrically conductive bumps of the second face of the semiconductor die are bonded to electrically connect the semiconductor die and the substrate, and a mold compound applied these components to form an exposed surface of the semiconductor die package that is coplanar with an exposed surface of the film.
Jin Seong Kim, Byong Woo Cho, Cha Gyu Song
Filed: 12 Mar 18
Utility
Semiconductor device and manufacturing method thereof
9 Dec 19
A method of manufacturing a semiconductor device includes forming a substrate structure.
Ronald Huemoeller
Filed: 10 Dec 17
Utility
Methods and Structures for Increasing the Allowable Die Size In TMV Packages
4 Dec 19
A package includes a substrate having an electronic component flip chip mounted thereto by flip chip bumps.
Louis W. Nicholls, Roger D. St. Amand, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang, Robert F. Darveaux
Filed: 1 Apr 19
Utility
Semiconductor Device and Method of Manufacturing a Semiconductor Device
4 Dec 19
An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield.
Hee Sung Kim, Yeong Beom Ko, Joon Dong Kim, Dong Jean Kim, Sang Seon Oh
Filed: 6 Aug 19
Utility
Shielded Electronic Component Package
4 Dec 19
An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad.
Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
Filed: 9 Jun 19
Utility
Semiconductor device and manufacturing method thereof
2 Dec 19
A semiconductor device having an EMI shield layer and/or EMI shielding wires, and a manufacturing method thereof, are provided.
Soo Hyun Kim, Jae Min Na, Dae Gon Kim, Tae Kyung Hwang, Kwang Mo Chris Lim, SungSun Park, KyeRyung Kim
Filed: 12 Apr 17
Utility
Semiconductor package and fabricating method thereof
2 Dec 19
A semiconductor package structure and a method for making a semiconductor package.
David Hiner, Michael Kelly, Ronald Huemoeller
Filed: 6 Dec 18
Utility
Semiconductor package having inspection structure and related methods
25 Nov 19
An electronic device structure includes a leadframe with a die pad and a lead.
Marc Alan Mangrum
Filed: 20 Dec 18
Utility
Semiconductor device with optically-transmissive layer and manufacturing method thereof
25 Nov 19
A method for manufacturing a semiconductor device and a semiconductor device produced thereby.
David Clark, Curtis Zwenger
Filed: 5 Apr 18
Utility
Semiconductor device and manufacturing method thereof
18 Nov 19
A semiconductor device and a manufacturing method thereof are disclosed.
Jong Sik Paek, Eun Sook Sohn, In Bae Park, Won Chul Do, Glenn A. Rinne
Filed: 18 Dec 16
Utility
Thin Bonded Interposer Package
13 Nov 19
Methods and systems for a thin bonded interposer package are disclosed and may, for example, include bonding a semiconductor die to a first surface of a substrate, forming contacts on the first surface of the substrate, encapsulating the semiconductor die, formed contacts, and first surface of the substrate using a mold material while leaving a top surface of the semiconductor die not encapsulated by mold material, forming vias through the mold material to expose the formed contacts.
Christopher J. Berry, Roger D. St. Amand, Jin Seong Kim
Filed: 24 Mar 19
Utility
Semiconductor device having stacked dies and stacked pillars and method of manufacturing thereof
11 Nov 19
Various aspects of this disclosure provide a semiconductor device and a method of manufacturing a semiconductor device.
Won Geol Lee, Won Chul Do, Ji Hun Yi
Filed: 27 Feb 17
Utility
Stiffener Package and Method of Fabricating Stiffener Package
6 Nov 19
A wafer level fan out package includes a semiconductor die having a first surface, a second surface, and a third surface.
Jin Young Kim, Doo Hyun Park, Seung Jae Lee
Filed: 4 Mar 19
Utility
Method of manufacturing an electronic device and electronic device manufactured thereby
4 Nov 19
An electronic device and a method of making an electronic device.
Bora Baloglu, Curtis Zwenger, Ronald Huemoeller
Filed: 25 Feb 18
Utility
Method for fabricating semiconductor package and semiconductor package using the same
4 Nov 19
Provided are a method for fabricating a semiconductor package and a semiconductor package using the same, which can simplify a fabricating process of the semiconductor package by forming a lead frame on which a semiconductor die can be mounted without a separate grinding process, and can improve product reliability by preventing warpage from occurring during a grinding process.
Seung Woo Lee, Byong Jin Kim, Won Bae Bang, Sang Goo Kang
Filed: 17 Jan 18
Utility
Encapsulated semiconductor package
28 Oct 19
A method of manufacturing a semiconductor package includes mounting and electrically connecting a semiconductor die to a substrate.
Ronald Patrick Huemoeller, Sukianto Rusli, David Jon Hiner
Filed: 22 Dec 14
Utility
Semiconductor Device Package and Manufacturing Method Thereof
23 Oct 19
Methods and systems for a semiconductor device package with a die to interposer wafer first bond are disclosed and may include bonding a plurality of semiconductor die comprising electronic devices to an interposer wafer, and applying an underfill material between the die and the interposer wafer.
Michael G. Kelly, Ronald Patrick Huemoeller, Won Chul Do, David Jon Hiner
Filed: 5 May 19
Utility
Semiconductor Device and Manufacturing Method Thereof
23 Oct 19
A thin semiconductor device with enhanced edge protection, and a method of manufacturing thereof.
Won Bae Bang, Kwang Seok Oh
Filed: 27 Jun 19
Utility
Semiconductor Package Using Cavity Substrate and Manufacturing Methods
16 Oct 19
A semiconductor package includes a cavity substrate, a semiconductor die, and an encapsulant.
Young Do Kweon, JeongByung Chae, DongJoo Park, ByoungWoo Cho, SeHwan Hong
Filed: 15 Apr 18