146 patents
Page 8 of 8
Utility
Fingerprint sensor and manufacturing method thereof
14 Oct 19
A fingerprint sensor device and a method of making a fingerprint sensor device.
Sung Sun Park, Ji Young Chung, Christopher Berry
Filed: 9 May 17
Utility
Semiconductor Device with Embedded Semiconductor Die and Substrate-to-substrate Interconnects
9 Oct 19
A semiconductor device having an embedded semiconductor die and substrate-to-substrate interconnects is disclosed and may include a substrate with a top surface and a bottom surface, a semiconductor die bonded to the top surface of the substrate, a first mold material encapsulating the semiconductor die and at least a portion of the top surface of the substrate, and a first conductive bump that is on the top surface of the substrate and is at least partially encapsulated by the first mold material.
Jin Seong Kim, Ye Sul Ahn, Cha Gyu Song
Filed: 20 May 19
Utility
Method of Manufacturing a Package-on-Package Type Semiconductor Package
9 Oct 19
A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package.
Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko
Filed: 13 May 19
Utility
Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
7 Oct 19
A structure and method for performing metal-to-metal bonding in an electrical device.
Bora Baloglu, Curtis Zwenger, Ron Huemoeller
Filed: 20 Dec 16
Utility
Electronic Device with Adaptive Vertical Interconnect and Fabricating Method Thereof
2 Oct 19
Electronic components and an electronic device comprising one or more of the electronic components, and a method of manufacturing the electronic components and an electronic device comprising one or more of the electronic components.
Bora Baloglu, Curtis Zwenger, Ronald Huemoeller
Filed: 26 Mar 18
Utility
Embedded Ball Land Substrate, Semiconductor Package, and Manufacturing Methods
2 Oct 19
A electronic device includes an embedded ball land substrate and a semiconductor die.
Corey Reichman, Ronald Huemoeller
Filed: 1 Apr 18