9 patents
Utility
Wafer inspection system including a laser triangulation sensor
14 Feb 23
One example of an inspection system includes a laser, a magnification changer, and a first camera.
John Schaefer, Christopher Voges, Nicholas Smith, Jeffrey Treptau
Filed: 8 Jun 18
Utility
Wafer singulation process control
26 Apr 22
A method for monitoring and controlling a substrate singulation process is described.
Wayne Fitzgerald
Filed: 23 Dec 16
Utility
RepublicationWafer-level Package Assembly Handling
21 Apr 22
A chuck assembly includes an upper surface configured to support a wafer-level package assembly and a clamping mechanism securing the wafer-level package assembly to the upper surface.
Kevin Barr, Edward Andrew Condon
Filed: 28 Sep 18
Utility
RepublicationWafer-level Package Assembly Handling
13 Jan 22
A chuck assembly includes an upper surface configured to support a wafer-level package assembly and a clamping mechanism securing the wafer-level package assembly to the upper surface.
Kevin Barr, Edward Condon
Filed: 28 Sep 18
Utility
Wafer Crack Detection
15 Jul 20
A method for identifying cracks in non-planar substrates is herein disclosed.
Hartmut SEEGER
Filed: 15 Jan 20
Utility
Wafer Inspection System Including a Laser Triangulation Sensor
17 Jun 20
One example of an inspection system includes a laser, a magnification changer, and a first camera.
John Schaefer, Christopher Voges, Nicholas Smith, Jeff Treptau
Filed: 7 Jun 18
Utility
Substrate handling and identification mechanism
25 May 20
A structure and method for employing the structure to reliably read indicia formed on a substrate such as a panel or wafer is disclosed.
Kevin Barr
Filed: 20 Dec 17
Utility
Inspection of substrates
3 Feb 20
Concepts presented herein relate to approaches for performing substrate inspection.
Gurvinder Singh, Wu Y. Han, John Thornell, Chetan Suresh, Wayne Fitzgerald
Filed: 21 Mar 18
Utility
Semiconductor device inspection of metallic discontinuities
4 Nov 19
Concepts presented herein relate to approaches for performing substrate inspection.
Gurvinder Singh, Wu Y. Han, John Thornell, Chetan Suresh, Wayne Fitzgerald
Filed: 21 Mar 18
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