76 patents
Utility
Dual-cure Resin for Preparing Chemical Mechanical Polishing Pads
21 Dec 23
The invention provides a composition for preparing a chemical-mechanical polishing pad via photopolymerization and heating, the composition comprising a first component comprising: one or more acrylate-blocked isocyanates, one or more acrylate monomers and at least one photoinitiator.
Chen-Chih TSAI
Filed: 15 Jun 23
Utility
Uv-curable Resins for Chemical Mechanical Polishing Pads
21 Dec 23
The invention provides a composition for preparing a chemical-mechanical polishing pad via photopolymerization, comprising one or more acrylate urethane oligomers, one or more acrylate monomers and at least one photo-polymerization initiator.
Ping HUANG
Filed: 15 Jun 23
Utility
Polishing pad employing polyamine and cyclohexanedimethanol curatives
19 Dec 23
A chemical-mechanical polishing pad comprising a thermosetting polyurethane polishing layer includes an isocyanate-terminated urethane prepolymer, a polyamine curative, and a cyclohexanedimethanol curative.
Rui Ma, Lin Fu, Chen-Chih Tsai, Jaeseok Lee, Sarah Brosnan
Filed: 8 Jul 20
Utility
Chemical mechanical planarization pads via vat-based production
19 Dec 23
A chemical mechanical polishing (CMP) pad includes a polishing portion formed using a vat-based additive manufacturing process.
Eric S. Moyer, Lin Fu, William Michael Spitzig, Chen-Chih Tsai, Ping Huang, Justin Stewart, Carlos Barros
Filed: 7 May 20
Utility
UV-curable resins used for chemical mechanical polishing pads
7 Nov 23
The invention provides a UV-curable resin for forming a chemical-mechanical polishing pad comprising: (a) one or more acrylate blocked isocyanates; (b) one or more acrylate monomers; and (c) a photoinitiator.
Chen-Chih Tsai, Eric S. Moyer, Ping Huang
Filed: 18 Oct 21
Utility
Silica-based slurry for selective polishing of carbon-based films
31 Oct 23
The invention provides a chemical-mechanical polishing composition comprising: (a) a silica abrasive, (b) a surfactant, (c) an iron cation, (d) optionally a ligand, and (e) water, wherein the silica abrasive has a negative zeta potential in the chemical-mechanical polishing composition.
Brian Reiss, Fernando Hung Low, Michael Morrow, Helin Huang
Filed: 14 Sep 21
Utility
Dual Additive Polishing Composition for Glass Substrates
12 Oct 23
A chemical mechanical polishing composition comprises, consists of, or consists essentially of a liquid carrier, abrasive particles in the liquid carrier, a pyrophosphate compound, and a sulfonate compound or a compound including a quaternary ammonium group.
Tong LI
Filed: 16 Feb 23
Utility
CMP composition including a novel abrasive
15 Aug 23
A chemical mechanical polishing composition includes a liquid carrier and colloidal silica particles dispersed in the liquid carrier.
Alexander W. Hains, Kim Long, Steven Grumbine, Roman A. Ivanov, Kevin P. Dockery, Benjamin Petro, Brian Sneed, Galyna Krylova
Filed: 30 Mar 21
Utility
Ceria-based Slurry Compositions for Selective and Nonselective CMP of Silicon Oxide, Silicon Nitride, and Polysilicon
3 Aug 23
The invention provides a chemical-mechanical polishing composition comprising: (a) ceria abrasive particles; (b) a cationic polymer; (c) a buffer; and (d) water, wherein the polishing composition has a pH of about 6 to about 9.
Brian Reiss, Juyeon Chang, Shengyu Jin, Helin Huang
Filed: 3 Feb 22
Utility
Ceria-based Slurry Compositions for Selective and Nonselective CMP of Silicon Oxide, Silicon Nitride, and Polysilicon
3 Aug 23
The invention provides a chemical-mechanical polishing composition comprising: (a) ceria abrasive particles; (b) a cationic polymer; (c) a conductivity adjust selected from an ammonium salt, a potassium salt, and a combination thereof; and (d) water, wherein the polishing composition has a pH of about 3 to about 6.
Brian REISS, Juyeon CHANG, Shengyu JIN, Helin HUANG
Filed: 3 Feb 22
Utility
Solid polymer electrolyte compositions and methods of preparing same
25 Apr 23
A solid polymer electrolyte precursor composition includes (i) one or more organic solvents; (ii) one or more cellulosic polymers dissolved in the organic solvent(s); (iii) one or more polymerizable components dissolved or dispersed in the organic solvent(s); (iv) one or more photo-initiators dissolved or dispersed in the organic solvent(s), where at least one of the one or more photo-initiators, following irradiation with light, promotes polymerization of at least one of the one or more polymerizable components; (v) one or more lithium ion sources dissolved or dispersed in the organic solvent(s); (vi) one or more plasticizers dissolved or dispersed in the organic solvent(s); and (vii) one or more ceramic particles dissolved or dispersed in the organic solvent(s).
Deepak Shukla, Gladys Rocio Montenegro Galindo, Kevin M. Donovan, Zichao Yang
Filed: 8 Jun 20
Utility
Titanium dioxide containing ruthenium chemical mechanical polishing slurry
18 Apr 23
A chemical mechanical polishing composition for polishing a ruthenium containing substrate comprises, consists of, or consists essentially of a water based liquid carrier; titanium oxide particles dispersed in the liquid carrier, the titanium oxide particles including rutile and anatase such that an x-ray diffraction pattern of the titanium oxide particles has a ratio X:Y greater than about 0.05, wherein X represents an intensity of a peak in the x-ray diffraction pattern having a d-spacing of about 3.24 Å and Y represents an intensity of a peak in the x-ray diffraction pattern having a d-spacing of about 3.51 Å; and a pH in a range from about 7 to about 10.
Jin-Hao Jhang, Cheng-Yuan Ko
Filed: 2 Aug 21
Utility
Chemical Mechanical Planarization Pad with a Release Liner Comprising a Pull Tab
23 Mar 23
A chemical mechanical polishing (CMP) pad with a release liner that has a pull tab is prepared by contacting the CMP pad to an adhesive layer with release liner.
Justin Stewart, Gary Snider, Carlos Barros
Filed: 17 Sep 21
Utility
Silica-based Slurry Compositions Containing High Molecular Weight Polymers for Use In CMP of Dielectrics
23 Mar 23
The invention provides a chemical-mechanical polishing composition comprising: (a) about 3.0 wt. % to about 10 wt. % silica abrasive; (b) an anionic polymer having a weight average molecular weight of about 400 kDa to about 7000 kDa; and (c) water, wherein the polishing composition has a viscosity of at least about 1 cPs, a ratio of viscosity (cPs) to wt. % of silica abrasive of about 0.2 cPs/wt. % to about 1.5 cPs/wt. %, and a pH of about 9 to about 12.
Brian REISS, Brittany JOHNSON, Sajo NAIK, Lung-Tai LU, Kim LONG, Elliot KNAPTON, Douglas ROBELLO, Sarah BROSNAN
Filed: 23 Sep 22
Utility
CMP Composition Including an Anionic Abrasive
9 Mar 23
A chemical mechanical polishing composition comprises, consists of, or consists essentially of a liquid carrier, anionic particles dispersed in the liquid carrier, an anionic polymer or surfactant, and a cationic polymer.
Yang-Yao Lee, Hsin-Yen Wu, Kevin P. Dockery, Na Zhang, Chi-Rung Shie
Filed: 25 Aug 22
Utility
Textured CMP Pad Comprising Polymer Particles
9 Mar 23
A chemical mechanical polishing pad comprising a polishing portion, the polishing portion comprising: a polymeric body; a plurality of polymer particles embedded within the body of the polymeric body, wherein at least a portion of the plurality of polymer particles is at least partially exposed at a surface of the polymeric body; and a plurality of pores at the surface of the polymeric body.
Rui MA, Kaiting Li, Jessica Tabert, Sangcheol Kim, Satish Rai
Filed: 2 Sep 22
Utility
Method to increase barrier film removal rate in bulk tungsten slurry
7 Mar 23
The invention relates to a chemical-mechanical polishing composition comprising (a) a first abrasive comprising cationically modified colloidal silica particles, (b) a second abrasive having a Mohs hardness of about 5.5 or more, (c) a cationic polymer, (d) an iron containing activator, (e) an oxidizing agent, and (f) water.
William J. Ward, Matthew E. Carnes, Ji Cui, Helin Huang
Filed: 16 Jul 19
Utility
Composition and Method for Cobalt CMP
23 Feb 23
A chemical mechanical polishing composition for polishing a substrate having a cobalt layer includes a water based liquid carrier, cationic silica abrasive particles dispersed in the liquid carrier, and a triazole compound, wherein the polishing composition has a pH of greater than about 6 and the cationic silica abrasive particles have a zeta potential of at least 10 mV.
Fernando HUNG LOW, Steven KRAFT, Roman A. IVANOV, Steven GRUMBINE, Andrew R. WOLFF
Filed: 24 Oct 22
Utility
Derivatized polyamino acids
8 Nov 22
A composition comprises, consists of, or consists essentially of a polymer including a derivatized amino acid monomer unit.
Na Zhang, David Bailey, Kevin P. Dockery, Roman A. Ivanov, Deepak Shukla
Filed: 16 Dec 20
Utility
High Removal Rate Magnetorheological Finishing Head
6 Oct 22
A magnetorheological finishing head comprising magnetic pole pieces, nozzle shape, and wheel shape tailored to maximize volumetric removal rate.
William MESSNER, Johnathan DAVIS, Christopher MALONEY
Filed: 2 Sep 20