148 patents
Page 5 of 8
Utility
Cover Lid with Selective and Edge Metallization
19 Aug 21
A cover lid for use with a semiconductor package is disclosed.
Ramesh Kothandapani
Filed: 5 May 21
Utility
Methods of Packaging Thin Metal Films to Maintain Their Physical Characteristics
12 Aug 21
The present disclosure is directed to the packaging of metal thin films deposited on polymeric substrates.
Lee A. DONOHUE, Margaret S. FARISS, Christopher MASSING, Robert R. NEWTON, Kevin V. GOODWIN
Filed: 30 Apr 21
Utility
Methods for Heating Strip Product
12 Aug 21
Systems and methods for reducing the thickness of a strip of an aluminum-based material are disclosed.
Karl R. ZIEGLER
Filed: 6 May 19
Utility
Coupling For Rods
29 Jul 21
A cold worked and spinodally-hardened copper alloy comprising from about 8 to about 20 wt % nickel, and from about 5 to about 11 wt % tin, the remaining balance being copper, and having a 0.2% offset yield strength of at least 75 ksi, is used to form a sucker rod coupling or subcoupling.
William D. Nielsen, Diane M. Nielsen, Fritz C. Grensing
Filed: 15 Apr 21
Utility
Wavelength Conversion Element with Convective Cooling
29 Jul 21
A phosphor wheel comprises a disk, a wavelength conversion layer comprising phosphor disposed on the disk, and an impeller disposed on the disk.
SHENGYUAN BAI, GUANGHUI FU, QIMING LI
Filed: 27 Jul 18
Utility
Methods of packaging thin metal films to maintain their physical characteristics
13 Jul 21
The present disclosure is directed to the packaging of metal thin films deposited on polymeric substrates.
Lee A. Donohue, Margaret S. Fariss, Christopher Massing, Robert R. Newton, Kevin V. Goodwin
Filed: 29 Apr 16
Utility
Ability to Three-dimensionally Print an Aperture Mask on a Multi Spectral Filter Array
8 Jul 21
A three-dimensional inkjet printer and method for printing an aperture mask on a multi-spectral filter array.
Kevin R. Downing
Filed: 19 Mar 21
Utility
Metal-on-ceramic substrates
29 Jun 21
A metal-on-ceramic substrate comprises a ceramic layer, a first metal layer, and a bonding layer joining the ceramic layer to the first metal layer.
Richard J. Koba
Filed: 30 Nov 16
Utility
Ceramic combo lid with selective and edge metallizations
29 Jun 21
A frame lid for use with a semiconductor package is disclosed.
Ramesh Kothandapani
Filed: 28 Apr 17
Utility
Electrodes for Biosensors
24 Jun 21
The present disclosure relates to electrodes for biosensors.
ETHAN FONTAINE, JEROME FARQUHARSON
Filed: 18 Apr 19
Utility
Reflective Color Correction for Phosphor Illumination Systems
24 Jun 21
Wavelength conversion elements formed from phosphors and dielectric interference particles dispersed in a host material, either in a single layer or in separate layers, are disclosed.
ROBERT SPRAGUE, MICHAEL P. NEWELL
Filed: 25 Jul 19
Utility
Processes for making salt systems including beryllium fluoride
22 Jun 21
Processes for producing beryllium fluoride salt systems containing beryllium fluoride, such as lithium beryllium fluoride salts, are disclosed herein.
Edgar E. Vidal, Christopher K. Dorn
Filed: 18 Aug 17
Utility
Lift-off Method by Means of Jetting
10 Jun 21
A method for structured coating of a surface of a substrate.
Tobias Geldhauser, Olga Kurapova
Filed: 24 Apr 19
Utility
Light Tunnel and Method of Manufacturing the Same
10 Jun 21
An optical device comprises two flat plates each having a reflective flat surface, and two flat spacer plates of thickness H each having a reflective sidewall.
MICHAEL P. NEWELL
Filed: 1 May 19
Utility
Cover lid with selective and edge metallization
8 Jun 21
A cover lid for use with a semiconductor package is disclosed.
Ramesh Kothandapani
Filed: 21 May 15
Utility
ASi-H bandpass filter comprising a second material with high refractive index and a second bandpass filter as a blocker
1 Jun 21
An optical filter having a substrate including a primary bandpass filter at least predominantly on an interference basis and a secondary bandpass filter at least predominantly on an interference basis.
Thomas Eisenhammer
Filed: 29 Nov 17
Utility
NiW(X) Sputtering Target with Improved Structure
27 May 21
Markus Schultheis, Martin SCHLOTT
Filed: 24 Nov 20
Utility
Wear-resistant Cu—Ni—Sn coating
18 May 21
The present disclosure relates to a method of applying a wear-resistant copper-nickel-tin coating to a substrate using a thermal spray process.
Fritz C. Grensing, Robert E. Kusner, David J. Krus, William D. Nielsen, Karl Ziegler
Filed: 3 Apr 20
Utility
Coupling for rods
18 May 21
A cold worked and spinodally-hardened copper alloy comprising from about 8 to about 20 wt % nickel, and from about 5 to about 11 wt % tin, the remaining balance being copper, and having a 0.2% offset yield strength of at least 75 ksi, is used to form a sucker rod coupling or subcoupling.
William D. Nielsen, Diane M. Nielsen, Fritz C. Grensing
Filed: 24 Sep 19
Utility
Copper-nickel-silicon Alloys with High Strength and High Electrical Conductivity
6 May 21
A copper alloy that does not contain beryllium and has a 0.2% offset yield strength of at least 80 ksi and an electrical conductivity of at least 48% IACS is disclosed.
Carole L. TRYBUS, John C. KULI, Christopher J. TAYLOR
Filed: 12 Jul 19