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Camtek (CAMT)

Utility
Method and System for Classifying Defects In Wafer Using Wafer-defect Images, Based on Deep Learning
28 Oct 21
The present disclosure provides method and system 100 for classifying defects in wafer using wafer defect images, based on deep learning network.
Isaac Daniel Buzaglo
Filed: 18 Jul 20
Utility
Optical contrast enhancement for defect inspection
6 Jul 21
An inspection system and a method for inspection an object.
Zehava Ben Ezer
Filed: 12 Feb 19
Utility
Defect detection
29 Jun 21
There may be provided a method for determining three dimensional (3D) defect information, the method may include performing a two-dimensional (2D) inspection of an area of a wafer to generate 2D defect information related to defects of the area of the wafer; estimating 3D defect information regarding the defects of the area of the wafer, wherein the estimating is based on the 2D defect information related to defects of the area of the wafer, and a mapping between 2D defect information and 3D defect information, wherein the mapping is generated using a supervised deep learning machine process.
Daniel Buzaglo
Filed: 25 Mar 20
Utility
Detection of pits using an automatic optical inspection system
27 Apr 21
A method for detecting defects in a thinned die, the method may include inspecting the thinned die with a two-dimensional inspection module, to find suspected defects that appear as non-reflecting regions that fulfill a size condition; measuring, using a depth measurement module, a depth of the suspected defects; and defining a suspected defects as a defects when the depth parameter exceeds a depth threshold.
Aki Shoukrun
Filed: 17 Dec 18
Utility
Inspecting an object that includes a photo-sensitive polyimide layer
2 Nov 20
A method for determining a property of an object positioned on a photo-sensitive polyimide layer, wherein the photo-sensitive polyimide layer is positioned on a lower layer that is a radiation reflecting layer, the method may include illuminating, by an illumination unit, an area of the photo-sensitive polyimide layer with first ultraviolet radiation; sensing, by a first sensor, a first reflected ultraviolet radiation that was reflected from the area; and determining, by a processor, based at least in part on the first reflected ultraviolet radiation, the property of the object.
Zehava Ben-Ezer
Filed: 3 Feb 19
Utility
Defect Detection
30 Sep 20
There may be provided a method for determining three dimensional (3D) defect information, the method may include performing a two-dimensional (2D) inspection of an area of a wafer to generate 2D defect information related to defects of the area of the wafer; estimating 3D defect information regarding the defects of the area of the wafer, wherein the estimating is based on the 2D defect information related to defects of the area of the wafer, and a mapping between 2D defect information and 3D defect information, wherein the mapping is generated using a supervised deep learning machine process.
Daniel Buzaglo
Filed: 24 Mar 20
Utility
Measuring Buried Layers
2 Sep 20
There may be provided a method for inspecting a top redistribution layer conductors of an object.
Zehava Ben Ezer
Filed: 23 Dec 19
Utility
Height measurements of conductive structural elements that are surrounded by a photoresist layer
3 Aug 20
A method for estimating a thickness related to multiple conductive structural elements of an object, the method includes estimating a height difference between an upper surface of a conductive structural element and an upper surface of a photoresists layer portion that surrounds the conductive structural element, to provide multiple height differences; estimating thicknesses of the multiple photoresists layer portions, based at least on the second part of the emitted radiation; and calculating thickness values related to the multiple conductive structural elements, wherein the calculating is based at least on the multiple height differences and on the estimated thickness of the multiple photoresists layer portions.
Eyal Segev
Filed: 6 May 19
Utility
Hierarchical wafer inspection
3 Aug 20
There may be provided a method for evaluating an object, that may include evaluating a region of the object by a first evaluation module to provide first evaluation results that are related to multiple sites of the region; finding, using a mapping between values of first evaluation results and values of second evaluation results, (a) a first site of the multiple sites that does not require an evaluation by a second evaluation module, and (b) a second site of the multiple sites that requires an evaluation by the second evaluation module; wherein the second evaluation module is more reliable than the first evaluation module; evaluating the second site by the second evaluation module to provide second evaluation results of the second sites; estimating, based on first evaluation results of the first site and on the mapping, a state of the first site; and providing an evaluation of the region based on the state of the first site, and on the second evaluation result of the second site.
Menachem Regensburger
Filed: 16 Oct 18
Utility
Migdal Haemeq
6 May 20
A method for automatic defect classification, the method may include (i) acquiring, by a first camera, at least one first image of at least one area of an object; (ii) processing the at least one first image to detect a group of suspected defects within the at least one area; (iii) performing a first classification process for initially classifying the group of suspected defects; (iii) determining whether a first subgroup of the suspected defects requires additional information from a second camera for a completion of a classification; (iv) when determining that the first subgroup of the suspected defects requires additional information from the second camera then: (a) acquiring second images, by the second camera, of the first subgroup of the suspected defects; and (b) performing a second classification process for classifying the first subgroup of suspected defects.
Menachem Regensburger, Daniel Buzaglo
Filed: 13 Jun 18
Utility
Objective lens
23 Mar 20
An inspection system for inspecting a semiconductor substrate, the inspection system may include an inspection unit that comprises a partially blocking bright field unit and a non-blocking bright field unit; wherein the partially blocking bright field unit is configured to block any specular reflection that fulfills the following: (a) the specular reflection is caused by illuminating, along a first axis, of an area of the wafer, (b) the specular reflection propagates along a second axis, (c) the first axis and the second axis are symmetrical about a normal to the area of the wafer, and (d) the normal is parallel to an optical axis of the partially blocking bright field unit; and wherein the non-blocking bright field unit is configured to pass to the image plane any specular reflection that fulfills the following: (a) the specular reflection is caused by illuminating, along the first axis, of an area of the wafer, (b) the specular reflection propagates along the second axis, (c) the first axis and the second axis are symmetrical about the normal, and (d) the normal is parallel to the optical axis of the partially blocking bright field unit.
Zehava Ben Ezer, Menachem Regensburger, Shimon Koren, Tomer Gilad, Shy Shapira
Filed: 27 Jan 18
Utility
Continuous light inspection
2 Dec 19
An inspection system that may include a motion device, for supporting an inspected object and for moving the inspected object, in response to motion device triggering signals, by a movement that is characterized by speed variations; a signal generator, for generating camera triggering signals and motion device location triggering signals; a motion device location generator, for providing location information indicative of locations of the stage at points of time that are determined by the motion device location triggering signals; a continuous illuminator for continuously illuminating areas of the inspected object; and a camera for acquiring images of areas of the inspected object in response to the camera triggering signals.
Shimon Koren, Menachem Regensburger, Zehava Ben-Ezer
Filed: 8 Nov 16
Utility
Cross Talk Reduction
20 Nov 19
A method for detecting cross talk, that may include acquiring a first image of a region of interest (ROI) of a wafer by illuminating the ROI with a first oblique beam, and collecting light reflected from the ROI; acquiring a second image of the ROI by illuminating the ROI with a second oblique beam, and collecting light reflected from the ROI; wherein a orthogonal projection of the first oblique beam on the wafer is oriented to a orthogonal projection of the second oblique beam on the wafer; and detecting cross talk that appears in at least one of first image of the region and the second image of the region.
DROR COHEN
Filed: 6 May 19
Utility
Height Measurements of Conductive Structural Elements That Are Surrounded by a Photoresist Layer
20 Nov 19
A method for estimating a thickness related to multiple conductive structural elements of an object, the method includes estimating a height difference between an upper surface of a conductive structural element and an upper surface of a photoresists layer portion that surrounds the conductive structural element, to provide multiple height differences; estimating thicknesses of the multiple photoresists layer portions, based at least on the second part of the emitted radiation; and calculating thickness values related to the multiple conductive structural elements, wherein the calculating is based at least on the multiple height differences and on the estimated thickness of the multiple photoresists layer portions.
EYAL SEGEV
Filed: 6 May 19
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