254 patents
Utility
Electronic Package and Manufacturing Method Thereof
28 Dec 23
An electronic package is provided, in which an electronic element that is electrically connected to a plurality of conductive vias and a functional part that has a hollow area are disposed on a photonic die that has the plurality of conductive vias and at least one external connection portion, where a cladding layer covers the electronic element and the functional part, such that the external connection portion is exposed from the hollow area and the cladding layer for an optical fiber to insert into the hollow area and connect to the external connection portion, so as to achieve the purpose of optoelectronic integration.
Feng Kao, Lung-Yuan Wang
Filed: 14 Sep 22
Utility
Carrying Substrate, Electronic Package Having the Carrying Substrate, and Methods for Manufacturing the Same
28 Dec 23
A method of manufacturing a carrying substrate is provided.
Chi-Ching HO, Bo-Hao MA, Yu-Ting XUE, Ching-Hung TSENG, Guan-Hua LU, Hong-Da CHANG
Filed: 11 Sep 23
Utility
Electronic Package and Manufacturing Method Thereof
21 Dec 23
An electronic package is provided and includes an electronic module and a packaging module stacked on each other, where the electronic module includes a bridge component, a plurality of conductive pillars and an encapsulation layer encapsulating the bridge component and the plurality of conductive pillars, and the packaging module includes a circuit structure and a plurality of electronic elements disposed on the circuit structure, such that the packaging module is stacked on the electronic module via a plurality of supporting elements, and the plurality of electronic elements are electrically bridged with each other via the circuit structure, the plurality of supporting elements and the bridge component.
Po-Kai HUANG, Yung-Ta LI
Filed: 1 May 23
Utility
Electronic Package and Manufacturing Method Thereof
14 Dec 23
An electronic package is provided, in which a package module and a shielding member are disposed on a carrier structure, such that the shielding member covers a top surface and side surfaces of the package module to block the radiation outward from the package module and prevent problem that other electronic components on the carrier structure cannot be transmitted signals normally due to the electromagnetic interference of the package module.
Che-Chi Wu, Chien-Tang Li
Filed: 29 Aug 22
Utility
Electronic Package and Manufacturing Method Thereof
14 Dec 23
An electronic package is provided, in which a plurality of antenna structures and a heat sink are integrated on a package module including an electronic element, so as to guide the heat energy generated by the electronic element out of the package module via the heat sink.
Chung-Yu Ke, Liang-Pin Chen
Filed: 6 Jul 22
Utility
Electronic Package and Manufacturing Method Thereof
7 Dec 23
An electronic package is provided, in which a first electronic element and a second electronic element are disposed on a first side of a circuit structure and a second side of the circuit structure, respectively, where a first metal layer is formed between the first side of the circuit structure and the first electronic element, a second metal layer is formed on a surface of the second electronic element, and at least one thermally conductive pillar is disposed on the second side of the circuit structure and extends into the circuit structure to thermally conduct the first metal layer and the second metal layer.
Meng-Huan Chia, Yih-Jenn Jiang, Chang-Fu Lin, Don-Son Jiang
Filed: 17 Aug 23
Utility
Ultrasonic Device
30 Nov 23
An ultrasonic device is provided and includes an action member, a driving member and a rotating shaft connected to the driving member.
Yu-Lung Huang, Chih-Hui Huang, Cheng-Ying Hsieh, Sin-Cyuan Lin, Men-Yeh Chiang, Chao-Lin Chang, Ting-Hsu Lu
Filed: 13 Jul 22
Utility
Electronic Module, Manufacturing Method Thereof and Electronic Package Having the Same
30 Nov 23
An electronic module is provided, in which a first metal layer, an insulating layer and a second metal layer are sequentially formed on side faces and a non-active face of an electronic component to serve as a capacitor structure, where the capacitor structure is exposed from an active face of the electronic component so that by directly forming the capacitor structure on the electronic component, a distance between the capacitor structure and the electronic component is minimized, such that the effect of suppressing impedance can be optimized.
Ho-Chuan Lin, Chia-Chu Lai, Min-Han Chuang
Filed: 16 Aug 23
Utility
Electronic Package and Manufacturing Method Thereof
23 Nov 23
An electronic package is provided, in which a plurality of electronic elements are disposed on a plurality of carrier structures, and at least one bridging element is disposed between at least two of the carrier structures to electrically bridge the two carrier structures.
Shuai-Lin Liu, Nai-Hao Kao, Chao-Chiang Pu, Yi-Min Fu, Yu-Po Wang
Filed: 5 Jul 22
Utility
Electronic Package and Electronic Structure Thereof
16 Nov 23
An electronic package is provided in which an electronic structure is bonded onto a carrier structure via a plurality of conductive elements, where each of the conductive elements is connected to a single contact of the electronic structure via a plurality of conductive pillars.
Yung-Ta Li, Po-Kai Huang
Filed: 18 Jul 22
Utility
Electronic Package and Manufacturing Method Thereof
16 Nov 23
An electronic package and manufacturing method thereof are provided, in which an electronic module served as a bridge element and a plurality of conductive pillars are embedded in a packaging layer, a routing structure is formed on the packaging layer, and a plurality of electronic elements are disposed on the routing structure, such that the electronic elements electrically bridge the electronic module via the routing structure.
Hsin-Jou Lin, Lung-Yuan Wang, Chih-Nan Lin, Feng Kao, Chiu-Ling Chen
Filed: 6 Jul 22
Utility
Electronic Package and Manufacturing Method Thereof
9 Nov 23
An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.
Wei-Jhen Chen, Chih-Hsun Hsu, Yuan-Hung Hsu, Chih-Nan Lin, Chang-Fu Lin, Don-Son Jiang, Chih-Ming Huang, Yi-Hsin Chen
Filed: 11 Jul 23
Utility
Electronic Package and Method for Manufacturing the Same
9 Nov 23
An electronic package is provided, which includes a plurality of electronic components encapsulated by an encapsulation layer.
Chih-Hsien Chiu, Siang-Yu Lin, Wen-Jung Tsai, Chia-Yang Chen, Chien-Cheng Lin
Filed: 18 Jul 23
Utility
Electronic package and manufacturing method thereof
7 Nov 23
An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures.
Yu-Lung Huang, Chih-Ming Huang, Kuo-Hua Yu, Chang-Fu Lin
Filed: 1 Nov 22
Utility
Electronic Package and Method for Fabricating the Same
26 Oct 23
An electronic package and a method for fabrication the same are provided.
Shu-Chi Chang, Wei-Ping Wang, Hsien-Lung Hsiao, Kaun-I Cheng
Filed: 28 Jun 23
Utility
Electronic Package and Manufacturing Method Thereof
26 Oct 23
An electronic package is provided, in which a first electronic element and at least one support member are disposed on a carrier structure, a spacer is disposed on the first electronic element, and a second electronic element is disposed on the at least one support member and the spacer, so as to prevent the second electronic element from tilting during a wire bonding process.
Yu-Cheng Yeh, I-Hsin Lin, Shao-Hua Chen, Yi-Chen Chi, Wen-We Su, Kuo-Yi Chen
Filed: 21 Jun 22
Utility
Electronic Package and Manufacturing Method Thereof
26 Oct 23
An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.
Ho-Chuan Lin, Min-Han Chuang, Chia-Chu Lai
Filed: 27 Jun 23
Utility
Electronic Package and Manufacturing Method Thereof
26 Oct 23
An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.
Ho-Chuan Lin, Min-Han Chuang, Chia-Chu Lai
Filed: 27 Jun 23
Utility
Electronic Package and Manufacturing Method Thereof
26 Oct 23
An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.
Ho-Chuan Lin, Min-Han Chuang, Chia-Chu Lai
Filed: 27 Jun 23
Utility
Electronic Package and Substrate Structure Thereof
26 Oct 23
An electronic package is provided and includes a substrate structure, an electronic element disposed on the substrate structure and an encapsulation layer encapsulating the electronic element, where at least one functional circuit is formed on a surface of a substrate body of the substrate structure, and a wire having a smaller width is arranged on a boundary line at a junction between an encapsulation area and a peripheral area, so that when a mold for forming the encapsulation layer is formed to cover the substrate structure, the mold will create a gap around the wire to serve as an exhaust passage.
Wen-Chen Hsieh, Ya-Ting Chi, Chia-Wen Tsao, Hsin-Yin Chang, Yi-Lin Tsai, Hsiu-Fang Chien
Filed: 7 Jul 22