254 patents
Page 2 of 13
Utility
Electronic Package and Manufacturing Method Thereof
26 Oct 23
An electronic package is provided, in which a first electronic element and at least one support member are disposed on a carrier structure, a spacer is disposed on the first electronic element, and a second electronic element is disposed on the at least one support member and the spacer, so as to prevent the second electronic element from tilting during a wire bonding process.
Yu-Cheng Yeh, I-Hsin Lin, Shao-Hua Chen, Yi-Chen Chi, Wen-We Su, Kuo-Yi Chen
Filed: 21 Jun 22
Utility
Electronic package and circuit structure thereof
17 Oct 23
An electronic package is provided, where a circuit layer and a metal layer having a plurality of openings are formed on a dielectric layer of a circuit portion to reduce the area ratio of the metal layer to the dielectric layer, so as to reduce stress concentration and prevent warping of the electronic package.
Fang-Lin Tsai, Chia-Yu Kuo, Pei-Geng Weng, Wei-Son Tsai, Yih-Jenn Jiang
Filed: 28 Dec 20
Utility
Method for fabricating carrier structure
17 Oct 23
A carrier structure is provided.
Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
Filed: 2 Nov 20
Utility
Electronic Package and Manufacturing Method Thereof
5 Oct 23
An electronic package is provided, in which a first packaging layer is formed on a circuit structure, a portion of at least one conductive column is inserted into the first packaging layer, a remaining portion of the conductive column is protruded from the first packaging layer, and a second packaging layer is formed to cover the remaining portion of the conductive column, so that the conductive column is integrally formed in the first packaging layer and the second packaging layer.
Chung-Yu Ke, Liang-Pin Chen
Filed: 23 May 22
Utility
Electronic module, manufacturing method thereof and electronic package having the same
3 Oct 23
An electronic module is provided, in which a first metal layer, an insulating layer and a second metal layer are sequentially formed on side faces and a non-active face of an electronic component to serve as a capacitor structure, where the capacitor structure is exposed from an active face of the electronic component so that by directly forming the capacitor structure on the electronic component, a distance between the capacitor structure and the electronic component is minimized, such that the effect of suppressing impedance can be optimized.
Ho-Chuan Lin, Chia-Chu Lai, Min-Han Chuang
Filed: 2 Sep 21
Utility
Electronic Package and Manufacturing Method Thereof
28 Sep 23
An electronic package is provided, and the manufacturing method of which is to form a plurality of conductive pillars and dispose an electronic element on a first circuit structure, then cover the plurality of conductive pillars and the electronic element with a cladding layer, and then form a second circuit structure on the cladding layer, so that the plurality of conductive pillars are electrically connected to the first circuit structure and the second circuit structure, and the electronic element is electrically connected to the first circuit structure, where a fan-out redistribution layer is configured in the first circuit structure and the second circuit structure, and at least one ground layer is configured in the second circuit structure.
Ting-Yang Chou, Yih-Jenn Jiang, Don-Son Jiang
Filed: 19 May 22
Utility
Electronic package and method for manufacturing the same
19 Sep 23
An electronic package and a manufacturing method thereof are provided, where a plurality of shielding wires are arranged on a carrier and spanning across an electronic component to cover the electronic component, so that the shielding wires serve as a shielding structure to protect the electronic component from the interference of external electromagnetic waves.
Ming-Fan Tsai, Chih-Wei Chen, Tsung-Hsien Tsai, Chao-Ya Yang, Chia-Yang Chen
Filed: 19 Aug 20
Utility
Electronic package and manufacturing method thereof
19 Sep 23
An electronic package is provided, in which a first electronic element and a second electronic element are disposed on a first side of a circuit structure and a second side of the circuit structure, respectively, where a first metal layer is formed between the first side of the circuit structure and the first electronic element, a second metal layer is formed on a surface of the second electronic element, and at least one thermally conductive pillar is disposed on the second side of the circuit structure and extends into the circuit structure to thermally conduct the first metal layer and the second metal layer.
Meng-Huan Chia, Yih-Jenn Jiang, Chang-Fu Lin, Don-Son Jiang
Filed: 25 Aug 21
Utility
Electronic Package and Manufacturing Method Thereof
7 Sep 23
An electronic package is provided in which a chip packaging module, an electronic element having a plurality of contacts, and an electronic connector are disposed on a routing structure of a carrier component, so as to communicatively connect with the chip packaging module via the electronic element and the electronic connector, thereby increasing a signal transmission speed.
Chao-Chiang Pu, Chi-Ching Ho, Yi-Min Fu, Yu-Po Wang, Shuai-Lin Liu
Filed: 10 May 22
Utility
Electronic Package and Manufacturing Method Thereof, and Antenna Module and Manufacturing Method Thereof
7 Sep 23
An antenna module is provided with a plurality of antenna structures and a shielding structure arranged on a plate body, and the shielding structure is located between two adjacent antenna structures, where the shielding structure includes a concave portion formed on the plate body and a dielectric material formed between the concave portion and the antenna structure to generate different impedance characteristics, thereby improving the antenna isolation.
Shao-Tzu Tang, Chih-Hsien Chiu, Wen-Jung Tsai, Ko-Wei Chang, Chia-Chu LAI
Filed: 19 May 22
Utility
Test equipment and test device thereof
5 Sep 23
Testing equipment is used in an antenna testing process, and includes a testing head having a perforation, and a testing device having a cylinder.
Bo-Siang Fang, Kuang-Sheng Wang, Hsinjou Lin, Shao-Meng Sim, Mao-Hua Yeh
Filed: 20 Dec 19
Utility
Electronic package and method for manufacturing the same
5 Sep 23
An electronic package is provided, which includes a plurality of electronic components encapsulated by an encapsulation layer.
Chih-Hsien Chiu, Siang-Yu Lin, Wen-Jung Tsai, Chia-Yang Chen, Chien-Cheng Lin
Filed: 19 Jul 21
Utility
Electronic Package and Fabrication Method Thereof
31 Aug 23
An electronic package is provided and includes a first carrier structure having a plurality of antenna feed lines, and an antenna module disposed on the first carrier structure.
Chung-Yu Ke, Chia-Chu Lai, Liang-Pin Chen
Filed: 4 May 23
Utility
Electronic Package and Manufacturing Method Thereof
17 Aug 23
An electronic package is provided, in which a circuit structure is disposed on the uppermost side of a plurality of stacked organic material substrates for connecting an electronic element, so that a line width/line spacing of a redistribution layer of the circuit structure conforms with a line width/line spacing of the electronic element.
Feng Kao, Lung-Yuan Wang
Filed: 21 Apr 22
Utility
Method for fabricating electronic package
15 Aug 23
An electronic package and a method for fabrication the same are provided.
Shu-Chi Chang, Wei-Ping Wang, Hsien-Lung Hsiao, Kaun-I Cheng
Filed: 16 Dec 20
Utility
Electronic package comprising wire inside an electronic component and manufacturing method thereof
15 Aug 23
An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.
Ho-Chuan Lin, Min-Han Chuang, Chia-Chu Lai
Filed: 6 Jul 21
Utility
Electronic Package and Manufacturing Method Thereof
10 Aug 23
An electronic package is provided, in which an electronic module and at least one support member are disposed on a substrate structure having a circuit layer, such that the stress on the substrate structure is dispersed through the at least one support member to eliminate the problem of stress concentration and prevent the substrate structure from warping.
Yi-Min Fu, Chi-Ching Ho, Chao-Chiang Pu, Yu-Po Wang
Filed: 29 Aug 22
Utility
Electronic Package and Substrate Structure Thereof
10 Aug 23
An electronic package is provided and includes a substrate structure and an electronic element disposed on the substrate structure.
Hsiu-Fang Chien, Wen-Chen Hsieh, Chia-Wen Tsao, Hsin-Yin Chang, Ya-Ting Chi, Yi-Lin Tsai
Filed: 23 Aug 22
Utility
Electronic device and circuit board thereof
8 Aug 23
An electronic device is provided, in which an antenna module for receiving and transmitting radiation signals is disposed on a mounting surface of a circuit board, and an inner layer of the circuit board is formed with a ground surface to arrange a strip-shaped ground circuit along the edges of the ground surface so that the ground circuit occupies at most 50% of the area of the ground surface to improve antenna radiation efficiency.
Ming-Fan Tsai, Chih-Wei Chen, Chien-Cheng Lin, Chao-Ya Yang, Chia-Yang Chen
Filed: 2 Sep 21
Utility
Electronic Package and Fabrication Method Thereof
3 Aug 23
An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant.
Chih-Hsien Chiu, Wen-Jung Tsai
Filed: 30 Jan 23