254 patents
Page 5 of 13
Utility
Electronic Module, Manufacturing Method Thereof and Electronic Package Having the Same
10 Nov 22
An electronic module is provided, in which a first metal layer, an insulating layer and a second metal layer are sequentially formed on side faces and a non-active face of an electronic component to serve as a capacitor structure, where the capacitor structure is exposed from an active face of the electronic component so that by directly forming the capacitor structure on the electronic component, a distance between the capacitor structure and the electronic component is minimized, such that the effect of suppressing impedance can be optimized.
Ho-Chuan Lin, Chia-Chu Lai, Min-Han Chuang
Filed: 2 Sep 21
Utility
Electronic package and fabrication method thereof
25 Oct 22
An electronic package is provided and includes an electronic element, an intermediary structure disposed on the electronic element, and a heat dissipation element bonded to the electronic element through the intermediary structure.
Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
Filed: 12 May 20
Utility
Electronic Package and Fabrication Method Thereof
20 Oct 22
An electronic package is provided and includes an electronic element, an intermediary structure disposed on the electronic element, and a heat dissipation element bonded to the electronic element through the intermediary structure.
Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
Filed: 30 Jun 22
Utility
Method for fabricating electronic package structure
18 Oct 22
An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate.
Chih-Yuan Shih, Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung-Li Lin, Chi-Pin Tsai, Chien-Cheng Lin, Tsung-Hsien Tsai, Heng-Cheng Chu, Ming-Fan Tsai
Filed: 23 Jan 20
Utility
Method for Fabricating Assemble Substrate
22 Sep 22
A method for fabricating an assemble substrate is provided, including stacking a circuit portion on a plurality of circuit members.
Lung-Yuan WANG, Wen-Liang Lien
Filed: 2 Jun 22
Utility
Electronic package, electronic packaging module having the electronic package, and method for fabricating the electronic package
13 Sep 22
The present application provides an electronic package having an optoelectronic component and a laser component disposed on a packaging unit, with the optoelectronic component and the laser component being separated from each other.
Jin-Wei You, Cheng-Kai Chang
Filed: 27 Apr 20
Utility
Electronic device, electronic package and packaging substrate thereof
6 Sep 22
An electronic package is provided and has a packaging substrate including a ground pad and a power pad.
Ho-Chuan Lin, Hsiu-Fang Chien, Chih-Yuan Shih, Tsung-Li Lin
Filed: 30 Jul 20
Utility
Electronic package with multiple electronic components spaced apart by grooves
1 Sep 22
A method for fabricating an electronic package is provided.
Hong-Da Chang, Chun-Chang Ting, Chi-Jen Chen
Filed: 18 May 22
Utility
Electronic Package and Fabrication Method Thereof
18 Aug 22
An electronic package is provided and includes a first carrier structure having a plurality of antenna feed lines, and an antenna module disposed on the first carrier structure.
Chung-Yu Ke, Chia-Chu Lai, Liang-Pin Chen
Filed: 15 Apr 21
Utility
Electronic Package
18 Aug 22
An electronic package is provided, including at least an electronic element and at least an antenna structure disposed on a carrier structure.
Chih-Hsien Chiu, Wen-Jung Tsai, Chia-Chu Lai
Filed: 19 Apr 21
Utility
Electronic package and method for fabricating the same
16 Aug 22
An electronic package and a method for fabricating an electronic package are provided.
Kong-Toon Ng, Yi-Chian Liao
Filed: 31 Oct 19
Utility
Electronic package, manufacturing method thereof and conductive structure
9 Aug 22
Provided is an electronic package, including a first substrate of a first conductive structure and a second substrate of a second conductive structure, where a first conductive layer, a bump body and a metal auxiliary layer of the first conductive structure are sequentially formed on the first substrate, and a metal pillar, a second conductive layer, a metal layer and a solder layer of the second conductive structure are sequentially formed on the second substrate, such that the solder layer is combined with the bump body and the metal auxiliary layer to stack the first substrate and the second substrate.
Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
Filed: 7 Jul 20
Utility
Method for fabricating package structure having encapsulate sensing chip
2 Aug 22
A package structure and a method for fabricating the same are provided.
Shao-Tzu Tang, Jia-Fong Yeh, Yi-Hsuan Liu, Mei-Chi Chen, Ying-Chou Tsai
Filed: 12 Nov 20
Utility
Electronic package with multiple electronic components spaced apart by grooves
26 Jul 22
A method for fabricating an electronic package is provided.
Hong-Da Chang, Chun-Chang Ting, Chi-Jen Chen
Filed: 6 Jan 20
Utility
Electronic package and manufacturing method thereof
26 Jul 22
An electronic package is provided, which is disposed with a second electronic component and a third electronic component on a first electronic component as a carrier structure, such that there is no need to match a layout size of the conventional package substrate.
Cheng Kai Chang, Chang-Fu Lin, Don-Son Jiang
Filed: 1 Dec 20
Utility
Electronic Device and Circuit Board Thereof
14 Jul 22
An electronic device is provided, in which an antenna module for receiving and transmitting radiation signals is disposed on a mounting surface of a circuit board, and an inner layer of the circuit board is formed with a ground surface to arrange a strip-shaped ground circuit along the edges of the ground surface so that the ground circuit occupies at most 50% of the area of the ground surface to improve antenna radiation efficiency.
Ming-Fan Tsai, Chih-Wei Chen, Chien-Cheng Lin, Chao-Ya Yang, Chia-Yang Chen
Filed: 2 Sep 21
Utility
Electronic package and method for fabricating the same
5 Jul 22
An electronic package and a method for fabricating the same are provided.
Shi-Min Zhou, Han-Hung Chen, Rung-Jeng Lin, Kuo-Hua Yu, Chang-Fu Lin
Filed: 24 Apr 18
Utility
Electronic package, assemble substrate, and method for fabricating the assemble substrate
5 Jul 22
A method for fabricating an assemble substrate is provided, including stacking a circuit portion on a plurality of circuit members.
Lung-Yuan Wang, Wen-Liang Lien
Filed: 1 Oct 19
Utility
Testing Device and Method
23 Jun 22
Provided is a testing method including: disposing a wafer on a working platform of a testing device; and moving a circuit board of the testing device relative to the working platform by a movement assembly of the testing device so as to allow at least two testing ports of the circuit board to test two chips of the wafer, respectively.
Wen-Chin Liang, Po-Wen Hsiao, Cheng-Tsai Hsieh, Cheng-Shao Chen
Filed: 4 Feb 21
Utility
Electronic Package and Fabrication Method Thereof
16 Jun 22
An electronic package is provided and includes at least one conductor with a relatively large width formed on an electrode pad of an electronic element and in contact with a circuit layer.
Chia-Yu Kuo, Rui-Feng Tai, Yih-Jenn Jiang, Don-Son Jiang, Chang-Fu Lin
Filed: 9 Feb 21