254 patents
Page 8 of 13
Utility
Method for Fabricating Substrate Structure
23 Sep 21
A substrate structure has an obtuse portion formed between a side surface and a bottom surface of a substrate body.
Po-Hao Wang, Chun-Tang Lin, Shou-Qi Chang, Yu-Hsiang Hsieh
Filed: 3 Jun 21
Utility
Method for Fabricating Electronic Package
23 Sep 21
An electronic package is provided, including: an encapsulation layer embedded with a first electronic component and conductive pillars; a circuit structure disposed on one surface of the encapsulation layer; a second electronic component disposed on the circuit structure; an insulation layer formed on the other surface of the encapsulation layer; and a circuit portion disposed on the insulation layer.
Kong-Toon Ng, Hung-Ho Lee, Chee-Key Chung, Chang-Fu Lin, Chi-Hsin Chiu
Filed: 3 Jun 21
Utility
Electronic Package and Fabrication Method Thereof
16 Sep 21
An electronic package is provided and includes an electronic element, an intermediary structure disposed on the electronic element, and a heat dissipation element bonded to the electronic element through the intermediary structure.
Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
Filed: 12 May 20
Utility
Electronic Package
9 Sep 21
Provided is an electronic package, including a multi-chip packaging body with a plurality of electronic elements and a stress buffer layer disposed on the multi-chip packaging body.
Chi-Jen Chen, Chih-Hsun Hsu, Chee-Key Chung, Jia-Wei Pan, Chang-Fu Lin
Filed: 18 May 20
Utility
Electronic package and method for fabricating the same
7 Sep 21
An electronic package and a method for fabricating the same are provided.
Wen-Jung Tsai, Ching-Chia Chen, Ying-Chou Tsai
Filed: 7 Aug 19
Utility
Electronic package and method for fabricating the same
7 Sep 21
An electronic package is provided, including: a first carrying structure having a first circuit layer; a package module disposed on the first carrying structure and electrically connected to the first circuit layer; a first electronic component disposed on the first carrying structure and electrically connected to the first circuit layer; and a second electronic component stacked on and electrically connected to the first electronic component.
Hsin-Yi Liao, Cheng-Kai Chang
Filed: 18 Nov 19
Utility
Electronic package and method for manufacturing the same
24 Aug 21
This present disclosure provides an electronic package and a method for manufacturing the same.
Ying-Chang Tseng, Yuan-Hung Hsu, Chang-Fu Lin
Filed: 27 Nov 18
Utility
Fabrication method of semiconductor package with stacked semiconductor chips
24 Aug 21
A semiconductor package includes a build-up structure; a semiconductor disposed on the build-up structure in a flip-chip manner and having a plurality of bumps penetrating therethrough; an electronic element disposed on the semiconductor chip; and an encapsulant formed on the build-up structure and encapsulating the semiconductor chip and the electronic element, thereby improving the product yield and the overall heat dissipating efficiency.
Lu-Yi Chen
Filed: 14 Jan 20
Utility
Method for fabricating electronic package
24 Aug 21
An electronic package and a method for fabricating the same are provided.
Han-Hung Chen, Chun-Yi Huang, Chang-Fu Lin, Rung-Jeng Lin, Kuo-Hua Yu
Filed: 14 Jul 20
Utility
Method for manufacturing electronic package
3 Aug 21
The disclosure provides an electronic package and a method of manufacturing the same.
Chieh-Lung Lai, Cheng-Yi Chen, Chun-Hung Lu, Mao-Hua Yeh
Filed: 29 Apr 20
Utility
Electronic package
3 Aug 21
An electronic package is provided.
Ying-Wei Lu, Bo-Siang Fang, Kuan-Ta Chen, Chia-Chu Lai
Filed: 29 Aug 19
Utility
Electronic package
20 Jul 21
The disclosure provides an electronic package, including a carrier, an electronic component disposed on the carrier, a buffer, and an antenna structure, wherein the antenna structure includes a metal frame disposed on the carrier and a wire disposed on the carrier and electrically connected to the metal frame, and the buffer covers the wire so as to reduce the emission wave speed of the wire and thus the wavelength is shorten, thereby satisfying the length requirement of the antenna within the limited space of the carrier and achieving an operating frequency radiated as required.
Ming-Fan Tsai, Chih-Hsien Chiu, Tsung-Hsien Tsai, Chao-Ya Yang, Chia-Yang Chen
Filed: 6 Jul 18
Utility
Electronic package
20 Jul 21
An electronic package is formed by arranging two encapsulating portions of different materials between a plurality of electronic components stacked to each other to adjust a stress distribution of the electronic package, so that the degree of warpage of the electronic package can be optimally controlled.
Wei-Jhen Chen, Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
Filed: 23 Jun 20
Utility
Electronic Package and Method for Manufacturing the Same
8 Jul 21
An electronic package and a manufacturing method thereof are provided, where a plurality of shielding wires are arranged on a carrier and spanning across an electronic component to cover the electronic component, so that the shielding wires serve as a shielding structure to protect the electronic component from the interference of external electromagnetic waves.
Ming-Fan Tsai, Chih-Wei Chen, Tsung-Hsien Tsai, Chao-Ya Yang, Chia-Yang Chen
Filed: 19 Aug 20
Utility
Substrate structure, electronic package having the same, and method for fabricating the same
6 Jul 21
A substrate structure has an obtuse portion formed between a side surface and a bottom surface of a substrate body.
Po-Hao Wang, Chun-Tang Lin, Shou-Qi Chang, Yu-Hsiang Hsieh
Filed: 15 Jun 17
Utility
Electronic package and method for fabricating the same
6 Jul 21
An electronic package is provided, including: an encapsulation layer embedded with a first electronic component and conductive pillars; a circuit structure disposed on one surface of the encapsulation layer; a second electronic component disposed on the circuit structure; an insulation layer formed on the other surface of the encapsulation layer; and a circuit portion disposed on the insulation layer.
Kong-Toon Ng, Hung-Ho Lee, Chee-Key Chung, Chang-Fu Lin, Chi-Hsin Chiu
Filed: 16 Jul 19
Utility
Electronic Package
1 Jul 21
An electronic package is disclosed.
Rung-Jeng Lin, Han-Hung Chen, Shi-Min Zhou, Kuo-Hua Yu, Chang-Fu Lin
Filed: 27 Apr 20
Utility
Method for Fabricating Electronic Package
10 Jun 21
A method for fabricating an electronic package is provided.
Hsin-Yi Liao, Cheng-Kai Chang, Bo-Hao Ma, Chun-Chi Ke
Filed: 17 Mar 20
Utility
Method for Fabricating Electronic Package
13 May 21
An electronic package and a method for fabrication the same are provided.
Shu-Chi Chang, Wei-Ping Wang, Hsien-Lung Hsiao, Kaun-I Cheng
Filed: 16 Dec 20
Utility
Test Equipment and Test Device Thereof
29 Apr 21
Testing equipment is used in an antenna testing process, and includes a testing head having a perforation, and a testing device having a cylinder.
Bo-Siang Fang, Kuang-Sheng Wang, Hsinjou Lin, Shao-Meng Sim, Mao-Hua Yeh
Filed: 20 Dec 19