254 patents
Page 9 of 13
Utility
Electronic Package and Method for Fabricating the Same
8 Apr 21
An electronic package is provided, including: a first carrying structure having a first circuit layer; a package module disposed on the first carrying structure and electrically connected to the first circuit layer; a first electronic component disposed on the first carrying structure and electrically connected to the first circuit layer; and a second electronic component stacked on and electrically connected to the first electronic component.
Hsin-Yi Liao, Cheng-Kai Chang
Filed: 18 Nov 19
Utility
Electronic Package, Packaging Substrate, and Methods for Fabricating the Same
8 Apr 21
An electronic package, a packaging substrate, and methods for fabricating the same are disposed.
Jun-Chang Ding, Hong-Da Chang, Hsi-Chang Hsu
Filed: 17 Dec 20
Utility
Electronic Package and Fabrication Method Thereof
18 Mar 21
An electronic package is provided and includes a plurality of electronic elements, a spacing structure connecting each of the plurality of electronic elements, and a plurality of conductive elements electrically connected to the plurality of electronic elements and serving as external contacts.
Yu-Lung Huang, Chee-Key Chung, Yuan-Hung Hsu, Chi-Jen Chen
Filed: 6 May 20
Utility
Electronic Package and Method for Manufacturing the Same
18 Mar 21
An electronic package and a method for manufacturing the same are provided, where at least one substrate structure having a second antenna portion is disposed on a carrier structure having a first antenna portion, and then an antenna structure having a first antenna body and a second antenna body is stacked on the carrier structure by a plurality of supporting members to cover the first antenna portion and the second antenna portion, so that the first antenna body corresponds to the first antenna portion, and the second antenna body corresponds to the second antenna portion.
Cheng-Piao Tung, Wen-Jung Tsai
Filed: 19 Aug 20
Utility
Electrical testing method of interposer
16 Mar 21
An interposer is provided which includes: a substrate having a first surface with a plurality of first conductive pads and a second surface opposite to the first surface, the second surface having a plurality of second conductive pads; a plurality of conductive through holes penetrating the first and second surfaces of the substrate and electrically connecting the first and second conductive pads; and a first removable electrical connection structure formed on the first surface and electrically connecting a portion of the first conductive pads so as to facilitate electrical testing of the interposer.
Lu-Yi Chen, Chi-Hsin Chiu, Shih-Kuang Chiu
Filed: 7 May 18
Utility
Electronic package, method for fabricating the same, and heat dissipator
16 Mar 21
An electronic package is provided.
Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Kuo-Hua Yu, Wen-Shan Tsai, En-Li Lin, Kaun-I Cheng, Wei-Ping Wang
Filed: 6 Aug 19
Utility
Inspection Equipment and Testing Device Thereof
11 Mar 21
An inspection equipment is used for inspecting an antenna, and includes a testing device having a first circuit structure, a carrier, a supporting part and a second circuit structure detachably stacked on one another sequentially.
Bo-Siang Fang, Kuan-Ta Chen, Hsinjou Lin
Filed: 6 Jan 20
Utility
Electronic Package and Method for Fabricating the Same
11 Mar 21
A method for fabricating an electronic package is provided.
Hong-Da Chang, Chun-Chang Ting, Chi-Jen Chen
Filed: 6 Jan 20
Utility
Automated antenna testing device
9 Mar 21
An automated antenna testing device is disclosed.
Cheng-Tsai Hsieh, Cheng-Shao Chen
Filed: 7 Oct 19
Utility
Automated Antenna Testing Device
4 Mar 21
An automated antenna testing device is disclosed.
Cheng-Tsai Hsieh, Cheng-Shao Chen
Filed: 7 Oct 19
Utility
Method for Fabricating Carrier Structure
4 Mar 21
A carrier structure is provided.
Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
Filed: 2 Nov 20
Utility
Method for Fabricating Package Structure
4 Mar 21
A package structure and a method for fabricating the same are provided.
Shao-Tzu Tang, Jia-Fong Yeh, Yi-Hsuan Liu, Mei-Chi Chen, Ying-Chou Tsai
Filed: 12 Nov 20
Utility
Electronic Package and Method for Fabricating the Same
4 Mar 21
An electronic package and a method for fabricating an electronic package are provided.
Kong-Toon Ng, Yi-Chian Liao
Filed: 31 Oct 19
Utility
Electronic Package, Assemble Substrate, and Method for Fabricating the Assemble Substrate
18 Feb 21
A method for fabricating an assemble substrate is provided, including stacking a circuit portion on a plurality of circuit members.
Lung-Yuan Wang, Wen-Liang Lien
Filed: 1 Oct 19
Utility
Method for fabricating electronic package with conductive pillars
9 Feb 21
A method for fabricating an electronic package includes providing a metal member including a supporting plate and a plurality of conductive pillars disposed on the supporting plate.
Chih-Hsien Chiu, Chia-Yang Chen, Chih-Chiang He
Filed: 1 Apr 20
Utility
Electronic module
9 Feb 21
An electronic module is provided, which includes: a substrate; an antenna body disposed over the substrate; and an encapsulant formed on the substrate and encapsulating the antenna body.
Chih-Hsien Chiu, Chi-Liang Shih
Filed: 24 Apr 15
Utility
Electronic package, packaging substrate, and methods for fabricating the same
26 Jan 21
An electronic package, a packaging substrate, and methods for fabricating the same are disposed.
Jun-Chang Ding, Hong-Da Chang, Hsi-Chang Hsu
Filed: 26 Feb 19
Utility
Electronic package
26 Jan 21
An electronic package includes an antenna structure and an adjustment structure arranged on a carrier structure.
Ying-Wei Lu, Bo-Siang Fang, Kuan-Ta Chen
Filed: 15 Nov 18
Utility
Electronic package and method for fabricating the same
26 Jan 21
An electronic package and a method for fabrication the same are provided.
Shu-Chi Chang, Wei Ping Wang, Hsien-Lung Hsiao, Kaun-I Cheng
Filed: 20 Jun 17
Utility
Electronic Packaging Structure and Method for Manufacturing the Same
21 Jan 21
The present disclosure provides an electronic packaging structure.
Jin-Wei You, Cheng-Kai Chang
Filed: 27 Sep 19