144 patents
Page 4 of 8
Utility
Electronic Device and Circuit Board Thereof
14 Jul 22
An electronic device is provided, in which an antenna module for receiving and transmitting radiation signals is disposed on a mounting surface of a circuit board, and an inner layer of the circuit board is formed with a ground surface to arrange a strip-shaped ground circuit along the edges of the ground surface so that the ground circuit occupies at most 50% of the area of the ground surface to improve antenna radiation efficiency.
Ming-Fan Tsai, Chih-Wei Chen, Chien-Cheng Lin, Chao-Ya Yang, Chia-Yang Chen
Filed: 2 Sep 21
Utility
Testing Device and Method
23 Jun 22
Provided is a testing method including: disposing a wafer on a working platform of a testing device; and moving a circuit board of the testing device relative to the working platform by a movement assembly of the testing device so as to allow at least two testing ports of the circuit board to test two chips of the wafer, respectively.
Wen-Chin Liang, Po-Wen Hsiao, Cheng-Tsai Hsieh, Cheng-Shao Chen
Filed: 4 Feb 21
Utility
Electronic Package and Fabrication Method Thereof
16 Jun 22
An electronic package is provided and includes at least one conductor with a relatively large width formed on an electrode pad of an electronic element and in contact with a circuit layer.
Chia-Yu Kuo, Rui-Feng Tai, Yih-Jenn Jiang, Don-Son Jiang, Chang-Fu Lin
Filed: 9 Feb 21
Utility
Electronic Package and Manufacturing Method Thereof
9 Jun 22
An electronic package and a method for manufacturing the electronic package are provided.
Chi-Jen Chen, Hsi-Chang Hsu, Yuan-Hung Hsu, Chang-Fu Lin, Don-Son Jiang
Filed: 28 Jan 21
Utility
Electronic Package and Fabrication Method Thereof
2 Jun 22
An electronic package is provided and includes at least one protective structure positioned between a first electronic element and a second electronic element on a carrier for reducing stresses generated inside the first electronic element and the second electronic element when a filling material is formed on the carrier, encapsulates the protective structure and comes into contact with the first electronic element and the second electronic element, thereby preventing cracking of the first electronic element and the second electronic element and improving the reliability of the electronic package.
Chih-Hsun Hsu, Chi-Jen Chen, Hsi-Chang Hsu, Yuan-Hung Hsu, Rui-Feng Tai, Don-Son Jiang
Filed: 28 Jan 21
Utility
Electronic Package and Manufacturing Method Thereof
12 May 22
An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.
Wei-Jhen Chen, Chih-Hsun Hsu, Yuan-Hung Hsu, Chih-Nan Lin, Chang-Fu Lin, Don-Son Jiang, Chih-Ming Huang, Yi-Hsin Chen
Filed: 28 Dec 20
Utility
Electronic Package and Circuit Structure Thereof
12 May 22
An electronic package is provided, where a circuit layer and a metal layer having a plurality of openings are formed on a dielectric layer of a circuit portion to reduce the area ratio of the metal layer to the dielectric layer, so as to reduce stress concentration and prevent warping of the electronic package.
Fang-Lin Tsai, Chia-Yu Kuo, Pei-Geng Weng, Wei-Son Tsai, Yih-Jenn Jiang
Filed: 28 Dec 20
Utility
Electronic Package and Manufacturing Method Thereof
28 Apr 22
An electronic package is provided, in which at least one first electronic component is arranged on one surface of a circuit structure with circuit layers and a plurality of second electronic components are arranged on the other surface.
Chi-Ching HO, Bo-Hao MA, Chee-Key CHUNG
Filed: 15 Dec 20
Utility
Electronic Package and Manufacturing Method Thereof
24 Mar 22
An electronic package is provided, which is disposed with a second electronic component and a third electronic component on a first electronic component as a carrier structure, such that there is no need to match a layout size of the conventional package substrate.
Cheng Kai Chang, Chang-Fu Lin, Don-Son Jiang
Filed: 1 Dec 20
Utility
Electronic Package and Manufacturing Method Thereof
24 Mar 22
An electronic package in which at least one magnetically permeable member is disposed between a carrier and an electronic component, where the electronic component has a first conductive layer, and the carrier has a second conductive layer, such that the magnetically permeable element is located between the first conductive layer and the second conductive layer.
Chih-Hsien Chiu, Ko-Wei CHANG
Filed: 27 Jan 21
Utility
Electronic Package and Manufacturing Method Thereof
3 Mar 22
An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures.
Yu-Lung Huang, Chih-Ming Huang, Kuo-Hua Yu, Chang-Fu Lin
Filed: 13 Oct 20
Utility
Chip Matching System and Method Thereof
3 Mar 22
A chip matching system and a corresponding method are provided.
Wu-Hung Yen, Yi-Hsien Huang, Chun-Tang Lin, Shu-Hua Chen, Shou-Qi Chang
Filed: 19 Oct 20
Utility
Electronic Package, Manufacturing Method for the Same, and Electronic Structure
3 Mar 22
An electronic package is provided, in which an electronic structure used as an integrated voltage regulator and a plurality of conductive pillars are embedded in an encapsulating layer to facilitate electrical transmission with electronic components at a close range.
Feng Kao, Lung-Yuan Wang
Filed: 23 Nov 20
Utility
Electronic Package and Manufacturing Method Thereof
3 Mar 22
An electronic package is provided, which stacks an electronic structure as an integrated voltage regulator on an electronic component to facilitate close-range cooperation with the electronic component for electrical transmission.
Feng Kao, Lung-Yuan Wang
Filed: 24 Nov 20
Utility
Electronic Package and Fabrication Method Thereof
24 Feb 22
An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant.
Chih-Hsien Chiu, Wen-Jung Tsai
Filed: 3 Nov 21
Utility
Method for Fabricating Electronic Package and Carrier Structure Thereof
27 Jan 22
A carrier structure having a strengthening layer is provided.
Tse-Yuan Lin, Chun-Ming Laio, Yu-Chih Cheng
Filed: 23 Mar 21
Utility
Method for Fabricating Electronic Package
6 Jan 22
An electronic package and a method for fabricating the same are provided.
Lung-Yuan Wang, Feng Kao, Mao-Hua Yeh
Filed: 22 Sep 21
Utility
Electronic Package
2 Dec 21
An electronic package is provided and uses a plurality of bonding wires as a shielding structure.
Chih-Hsien Chiu, Wen-Jung Tsai, Yu-Wei Yeh, Tsung-Hsien Tsai, Chi-Liang Shih, Sheng-Ming Yang, Ping-Hung Liao
Filed: 16 Jul 20
Utility
Electronic Device, Electronic Package and Packaging Substrate Thereof
18 Nov 21
An electronic package is provided and has a packaging substrate including a ground pad and a power pad.
Ho-Chuan Lin, Hsiu-Fang Chien, Chih-Yuan Shih, Tsung-Li Lin
Filed: 30 Jul 20
Utility
Method for Fabricating Electronic Structure with Conductive Elements Arranged for Heating Process
11 Nov 21
An electronic structure and a method for fabricating the same are provided.
Chih-Chiang He, Yu-Wei Yeh, Chia-Yang Chen, Chih-Yi Liao, Chih-Hsien Chiu, Chang-Chao Su
Filed: 27 Apr 21