110 patents
Page 2 of 6
Utility
Electronic package
20 Dec 22
An electronic package is provided and uses a plurality of bonding wires as a shielding structure.
Chih-Hsien Chiu, Wen-Jung Tsai, Yu-Wei Yeh, Tsung-Hsien Tsai, Chi-Liang Shih, Sheng-Ming Yang, Ping-Hung Liao
Filed: 16 Jul 20
Utility
Electronic package, supporting structure and fabrication method thereof
13 Dec 22
A supporting structure is provided, which forms a protective layer on a metal member having a plurality of conductive posts, and the protective layer is exposed from end surfaces of the conductive posts, such that conductors are formed on the end surfaces of the conductive posts, thereby avoiding damage of the protective layer.
Cho-Hsin Chang, Hao-Ju Fang, Ting-Wei Chi, Te-Fang Chu
Filed: 6 May 20
Utility
Method for fabricating substrate structure
13 Dec 22
A substrate structure has an obtuse portion formed between a side surface and a bottom surface of a substrate body.
Po-Hao Wang, Chun-Tang Lin, Shou-Qi Chang, Yu-Hsiang Hsieh
Filed: 3 Jun 21
Utility
Electronic package and manufacturing method thereof
6 Dec 22
An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures.
Yu-Lung Huang, Chih-Ming Huang, Kuo-Hua Yu, Chang-Fu Lin
Filed: 13 Oct 20
Utility
Testing device and method
29 Nov 22
Provided is a testing method including: disposing a wafer on a working platform of a testing device; and moving a circuit board of the testing device relative to the working platform by a movement assembly of the testing device so as to allow at least two testing ports of the circuit board to test two chips of the wafer, respectively.
Wen-Chin Liang, Po-Wen Hsiao, Cheng-Tsai Hsieh, Cheng-Shao Chen
Filed: 4 Feb 21
Utility
Package stack structure and method for manufacturing the same
29 Nov 22
The present disclosure provides a package stack structure and a method for manufacturing the same.
Han-Hung Chen, Yuan-Hung Hsu, Chang-Fu Lin, Rung-Jeng Lin, Fu-Tang Huang
Filed: 23 Apr 20
Utility
Electronic package and fabrication method thereof
25 Oct 22
An electronic package is provided and includes an electronic element, an intermediary structure disposed on the electronic element, and a heat dissipation element bonded to the electronic element through the intermediary structure.
Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
Filed: 12 May 20
Utility
Method for fabricating electronic package structure
18 Oct 22
An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate.
Chih-Yuan Shih, Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung-Li Lin, Chi-Pin Tsai, Chien-Cheng Lin, Tsung-Hsien Tsai, Heng-Cheng Chu, Ming-Fan Tsai
Filed: 23 Jan 20
Utility
Electronic package, electronic packaging module having the electronic package, and method for fabricating the electronic package
13 Sep 22
The present application provides an electronic package having an optoelectronic component and a laser component disposed on a packaging unit, with the optoelectronic component and the laser component being separated from each other.
Jin-Wei You, Cheng-Kai Chang
Filed: 27 Apr 20
Utility
Electronic device, electronic package and packaging substrate thereof
6 Sep 22
An electronic package is provided and has a packaging substrate including a ground pad and a power pad.
Ho-Chuan Lin, Hsiu-Fang Chien, Chih-Yuan Shih, Tsung-Li Lin
Filed: 30 Jul 20
Utility
Electronic package and method for fabricating the same
16 Aug 22
An electronic package and a method for fabricating an electronic package are provided.
Kong-Toon Ng, Yi-Chian Liao
Filed: 31 Oct 19
Utility
Electronic package, manufacturing method thereof and conductive structure
9 Aug 22
Provided is an electronic package, including a first substrate of a first conductive structure and a second substrate of a second conductive structure, where a first conductive layer, a bump body and a metal auxiliary layer of the first conductive structure are sequentially formed on the first substrate, and a metal pillar, a second conductive layer, a metal layer and a solder layer of the second conductive structure are sequentially formed on the second substrate, such that the solder layer is combined with the bump body and the metal auxiliary layer to stack the first substrate and the second substrate.
Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
Filed: 7 Jul 20
Utility
Method for fabricating package structure having encapsulate sensing chip
2 Aug 22
A package structure and a method for fabricating the same are provided.
Shao-Tzu Tang, Jia-Fong Yeh, Yi-Hsuan Liu, Mei-Chi Chen, Ying-Chou Tsai
Filed: 12 Nov 20
Utility
Electronic package with multiple electronic components spaced apart by grooves
26 Jul 22
A method for fabricating an electronic package is provided.
Hong-Da Chang, Chun-Chang Ting, Chi-Jen Chen
Filed: 6 Jan 20
Utility
Electronic package and manufacturing method thereof
26 Jul 22
An electronic package is provided, which is disposed with a second electronic component and a third electronic component on a first electronic component as a carrier structure, such that there is no need to match a layout size of the conventional package substrate.
Cheng Kai Chang, Chang-Fu Lin, Don-Son Jiang
Filed: 1 Dec 20
Utility
Electronic package and method for fabricating the same
5 Jul 22
An electronic package and a method for fabricating the same are provided.
Shi-Min Zhou, Han-Hung Chen, Rung-Jeng Lin, Kuo-Hua Yu, Chang-Fu Lin
Filed: 24 Apr 18
Utility
Electronic package, assemble substrate, and method for fabricating the assemble substrate
5 Jul 22
A method for fabricating an assemble substrate is provided, including stacking a circuit portion on a plurality of circuit members.
Lung-Yuan Wang, Wen-Liang Lien
Filed: 1 Oct 19
Utility
Electronic package and manufacturing method thereof
26 Apr 22
An electronic package is provided, in which at least one first electronic component is arranged on one surface of a circuit structure with circuit layers and a plurality of second electronic components are arranged on the other surface.
Chi-Ching Ho, Bo-Hao Ma, Chee-Key Chung
Filed: 15 Dec 20
Utility
Method for fabricating electronic package
29 Mar 22
An electronic package and a method for fabricating the same are provided.
Chen-Yu Huang, Chee-Key Chung, Chang-Fu Lin, Kong-Toon Ng, Rui-Feng Tai, Bo-Hao Ma
Filed: 2 Jul 20
Utility
Method for fabricating carrier-free semiconductor package
29 Mar 22
A method for fabricating a carrier-free semiconductor package includes: half-etching a metal carrier to form a plurality of recess grooves and a plurality of metal studs each serving in position as a solder pad or a die pad; filing each of the recess grooves with a first encapsulant; forming on the metal studs an antioxidant layer such as a silver plating layer or an organic solderable protection layer; and performing die-bonding, wire-bonding and molding processes respectively to form a second encapsulant encapsulating the chip.
Yueh-Ying Tsai, Fu-Di Tang, Chien-Ping Huang, Chun-Chi Ke
Filed: 6 Jan 20