61 patents
Utility
Wafer Bin Map Based Root Cause Analysis
23 Nov 23
A template for assigning the most probable root causes for wafer defects.
Tomonori Honda, Lin Lee Cheong, Richard Burch, Qing Zhu, Jeffrey Drue David, Michael Keleher
Filed: 3 Aug 23
Utility
Systems, Devices, and Methods for Performing a Non-contact Electrical Measurement on a Cell, Non-contact Electrical Measurement Cell Vehicle, Chip, Wafer, Die, or Logic Block
9 Nov 23
Systems, devices, and methods for performing a non-contact electrical measurement (NCEM) on a NCEM-enabled cell included in a NCEM-enabled cell vehicle may be configured to perform NCEMs while the NCEM-enabled cell vehicle is moving.
Indranil DE, Marian MANKOS, Dennis CIPLICKAS, Christopher HESS, Jeremy CHENG, Balasubramanian MURUGAN, Qi HU
Filed: 5 May 23
Utility
Rational decision-making tool for semiconductor processes
3 Oct 23
A robust predictive model.
Tomonori Honda, Lin Lee Cheong, Lakshmikar Kuravi, Bogdan Cirlig
Filed: 4 Jun 21
Utility
Wafer bin map based root cause analysis
19 Sep 23
A template for assigning the most probable root causes for wafer defects.
Tomonori Honda, Lin Lee Cheong, Richard Burch, Qing Zhu, Jeffrey Drue David, Michael Keleher
Filed: 30 Apr 21
Utility
Systems, Devices, and Methods for Aligning a Particle Beam and Performing a Non-contact Electrical Measurement on a Cell And/or Non-contact Electrical Measurement Cell Vehicle Using a Registration Cell
7 Sep 23
Systems, devices, and methods for performing a non-contact electrical measurement (NCEM) on a NCEM-enabled cell included in a NCEM-enabled cell vehicle may be configured to perform NCEMs while the NCEM-enabled cell vehicle is moving.
Indranil DE, Jeremy CHENG, Thomas SOKOLLIK, Yoram SCHWARZ, Stephen LAM, Xumin SHEN
Filed: 11 Feb 23
Utility
Automatic window generation for process trace
27 Jun 23
Automatic definition of windows for trace analysis.
Richard Burch, Kazuki Kunitoshi, Michio Aruga, Nobichika Akiya
Filed: 22 Jul 21
Utility
Pattern-enhanced spatial correlation of test structures to die level responses
2 May 23
Enhancement of less dominant patterns for parametric wafer measurements.
Richard Burch, Qing Zhu
Filed: 6 Aug 21
Utility
Predicting equipment fail mode from process trace
2 May 23
A predictive model for equipment fail modes.
Richard Burch, Kazuki Kunitoshi
Filed: 22 Jul 21
Utility
Anomalous equipment trace detection and classification
21 Mar 23
Scheme for detection and classification of semiconductor equipment faults.
Richard Burch, Jeffrey D. David, Qing Zhu, Tomonori Honda, Lin Lee Cheong
Filed: 6 Oct 20
Utility
Systems, devices, and methods for aligning a particle beam and performing a non-contact electrical measurement on a cell and/or non-contact electrical measurement cell vehicle using a registration cell
14 Mar 23
Systems, devices, and methods for performing a non-contact electrical measurement (NCEM) on a NCEM-enabled cell included in a NCEM-enabled cell vehicle may be configured to perform NCEMs while the NCEM-enabled cell vehicle is moving.
Indranil De, Jeremy Cheng, Thomas Sokollik, Yoram Schwarz, Stephen Lam, Xumin Shen
Filed: 6 May 22
Utility
Systems, Devices, and Methods for Performing a Non-contact Electrical Measurement on a Cell, Non-contact Electrical Measurement Cell Vehicle, Chip, Wafer, Die, or Logic Block
17 Nov 22
Systems, devices, and methods for performing a non-contact electrical measurement (NCEM) on a NCEM-enabled cell included in a NCEM-enabled cell vehicle may be configured to perform NCEMs while the NCEM-enabled cell vehicle is moving.
Indranil DE, Marian MANKOS, Dennis CIPLICKAS, Christopher HESS, Jeremy CHENG, Balasubramanian MURUGAN, Qi HU
Filed: 23 May 22
Utility
Systems, Devices, and Methods for Aligning a Particle Beam and Performing a Non-contact Electrical Measurement on a Cell And/or Non-contact Electrical Measurement Cell Vehicle Using a Registration Cell
20 Oct 22
Systems, devices, and methods for performing a non-contact electrical measurement (NCEM) on a NCEM-enabled cell included in a NCEM-enabled cell vehicle may be configured to perform NCEMs while the NCEM-enabled cell vehicle is moving.
Indranil DE, Jeremy CHENG, Thomas SOKOLLIK, Yoram SCHWARZ, Stephen LAM, Xumin SHEN
Filed: 6 May 22
Utility
CorrectedRational Decision-Making Tool for Semiconductor Processes
13 Oct 22
A robust predictive model.
Tomonori Honda, Lin Lee Cheong, Lakshmikar Kuravi, Bogdan Cirlin
Filed: 4 Jun 21
Utility
Methods for performing a non-contact electrical measurement on a cell, chip, wafer, die, or logic block
24 May 22
Systems, devices, and methods for performing a non-contact electrical measurement (NCEM) on a NCEM-enabled cell included in a NCEM-enabled cell vehicle may be configured to perform NCEMs while the NCEM-enabled cell vehicle is moving.
Indranil De, Marian Mankos, Dennis Ciplickas, Christopher Hess, Jeremy Cheng, Balasubramanian Murugan, Qi Hu
Filed: 1 Oct 20
Utility
Predicting die susceptible to early lifetime failure
10 May 22
Semiconductor yield is modeled at the die level to predict die that are susceptible to early lifetime failure (ELF).
Richard Burch, Qing Zhu, Keith Arnold
Filed: 2 Mar 21
Utility
Methods for aligning a particle beam and performing a non-contact electrical measurement on a cell using a registration cell
10 May 22
Systems, devices, and methods for performing a non-contact electrical measurement (NCEM) on a NCEM-enabled cell included in a NCEM-enabled cell vehicle may be configured to perform NCEMs while the NCEM-enabled cell vehicle is moving.
Indranil De, Jeremy Cheng, Thomas Sokollik, Yoram Schwarz, Stephen Lam, Xumin Shen
Filed: 1 Oct 20
Utility
Maintenance scheduling for semiconductor manufacturing equipment
5 Apr 22
A maintenance tool for semiconductor process equipment and components.
Tomonori Honda, Jeffrey Drue David, Lin Lee Cheong
Filed: 25 Aug 20
Utility
Sequenced Approach For Determining Wafer Path Quality
3 Mar 22
Wafer quality is determined by modeling equipment history as a sequence of events, then evaluating anomalous results for individual events.
Tomonori Honda, Richard Burch, Jeffrey Drue David
Filed: 27 Aug 21
Utility
Pattern-Enhanced Spatial Correlation of Test Structures to Die Level Responses
10 Feb 22
Enhancement of less dominant patterns for parametric wafer measurements.
Richard Burch, Qing Zhu
Filed: 6 Aug 21
Utility
Predicting Equipment Fail Mode from Process Trace
27 Jan 22
A predictive model for equipment fail modes.
Richard Burch, Kazuki Kunitoshi
Filed: 22 Jul 21