22 patents
Utility
Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plate
2 Jan 24
A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate.
Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
Filed: 10 May 22
Utility
Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate
2 Jan 24
A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate.
Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
Filed: 20 Jul 22
Utility
Light Emitting Diode (LED) Structure Having Single Epitaxial Structure Separated Into Light Emitting Zones
21 Dec 23
A single light emitting diode (LED) structure includes an array of spaced discrete light emitting zones separated by isolation areas.
Trung Tri Doan, David Trung Doan
Filed: 9 Aug 23
Utility
Method for making electronic device arrays using a temporary substrate and a carrier substrate
14 Nov 23
A method for making light emitting device LED arrays includes the steps of providing a plurality of LEDs having a desired configuration (e.g., VLED, FCLED, PLED); attaching the LEDs to a carrier substrate and to a temporary substrate; forming one or more metal layers and one or more insulator layers configured to electrically connect the LEDs to form a desired circuitry; and separating the LEDs along with the layered metal layers and insulator layers that form the desired circuitry from the carrier substrate and the temporary substrate.
David Trung Doan, Trung Tri Doan
Filed: 21 Feb 22
Utility
Single light emitting diode (LED) structure having epitaxial structure separated into light emitting zones
15 Aug 23
A single light emitting diode (LED) structure includes an array of spaced discrete light emitting zones separated by isolation areas.
Trung Tri Doan, David Trung Doan
Filed: 7 Dec 20
Utility
Method And System For Transferring Alignment Marks Between Substrate Systems
4 May 23
A method for transferring alignment marks between substrate systems includes providing a substrate having semiconductor devices and alignment marks in precise alignment with the semiconductor devices; and physically transferring and bonding the semiconductor devices and the alignment marks to a temporary substrate of a first substrate system.
David Trung Doan, Yoshinori Ogawa, Nobuaki Matsumoto
Filed: 18 Nov 22
Utility
Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving Plate
19 Jan 23
A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate [30], and forming a plurality of die sized semiconductor structures [32] on the substrate [30].
CHEN-FU CHU, SHIH-KAI CHAN, YI-FENG SHIH, DAVID TRUNG DOAN, TRUNG TRI DOAN, YOSHINORI OGAWA, KOHEI OTAKE, KAZUNORI KONDO, KEIJI OHORI, TAICHI KITAGAWA, NOBUAKI MATSUMOTO, TOSHIYUKI OZAI, SHUHEI UEDA, JUNYA ISHIZAKI
Filed: 3 Aug 22
Utility
Method and system for transferring alignment marks between substrate systems
3 Jan 23
David Trung Doan, Yoshinori Ogawa, Nobuaki Matsumoto
Filed: 27 Apr 21
Utility
Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving Plate
10 Nov 22
A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate.
Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
Filed: 20 Jul 22
Utility
Method For Making Light Emitting Device (LED) Arrays And Electronic Products Using A Temporary Substrate And A Carrier Substrate
3 Nov 22
A method for making light emitting device LED arrays includes the steps of providing a plurality of LEDs having a desired configuration (e.g., VLED, FCLED, PLED); attaching the LEDs to a carrier substrate and to a temporary substrate; forming one or more metal layers and one or more insulator layers configured to electrically connect the LEDs to form a desired circuitry; and mounting additional devices on the desired circuitry to form a second circuitry level; performing the mounting step multiple times to form a plurality of electronic products that include the additional devices and the second circuitry level; and separating the LEDs from the carrier substrate and the temporary substrate.
David TRUNG DOAN, Trung TRI DOAN
Filed: 14 Jun 22
Utility
Method To Remove An Isolation Layer On The Corner Between The Semiconductor Light Emitting Device To The Growth Substrate
6 Oct 22
A method for fabricating semiconductor light emitting devices (LEDs) includes forming a plurality of light emitting diode (LED) structures having sidewall P-N junctions on a growth substrate, and forming an isolation layer on the light emitting diode (LED) structures having corners at intersections of the epitaxial structures with the growth substrate.
CHEN-FU CHU, SHIH-KAI CHAN, YI-FENG SHIH, TRUNG TRI DOAN, DAVID TRUNG DOAN, YOSHINORI OGAWA, KAZUNORI KONDO, TOSHIYUKI OZAI, NOBUAKI MATSUMOTO, TAICHI KITAGAWA
Filed: 16 Feb 22
Utility
Method For Making Electronic Device Arrays Using A Temporary Substrate And A Carrier Substrate
1 Sep 22
A method for making light emitting device LED arrays includes the steps of providing a plurality of LEDs having a desired configuration (e.g., VLED, FCLED, PLED); attaching the LEDs to a carrier substrate and to a temporary substrate; forming one or more metal layers and one or more insulator layers configured to electrically connect the LEDs to form a desired circuitry; and separating the LEDs along with the layered metal layers and insulator layers that form the desired circuitry from the carrier substrate and the temporary substrate.
David Trung Doan, Trung Tri Doan
Filed: 21 Feb 22
Utility
Method For Fabricating (LED) Dice Using Semiconductor Structures On A Substrate And Laser Lift-Off To A Receiving Plate
25 Aug 22
A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate.
Chen-Fu Chu, SHIH-KAI CHAN, YI-FENG SHIH, DAVID TRUNG DOAN, TRUNG TRI DOAN, YOSHINORI OGAWA, KOHEl OTAKE, KAZUNORI KONDO, KEIJI OHORI, TAICHI KITAGAWA, NOBUAKI MATSUMOTO, TOSHIYUKI OZAi, SHUHEI UEDA
Filed: 10 May 22
Utility
Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate
16 Aug 22
A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate.
Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
Filed: 7 Aug 20
Utility
Method for making light emitting device (LED) arrays using a temporary substrate and a carrier substrate
12 Jul 22
A method for making light emitting device LED arrays includes the steps of providing a plurality of LEDs having a desired configuration (e.g., VLED, FCLED, PLED); attaching the LEDs to a carrier substrate and to a temporary substrate; forming one or more metal layers and one or more insulator layers configured to electrically connect the LEDs to form a desired circuitry; and separating the LEDs along with the layered metal layers and insulator layers that form the desired circuitry from the carrier substrate and the temporary substrate.
David Trung Doan, Trung Tri Doan
Filed: 23 Oct 20
Utility
Method And System For Transferring Alignment Marks Between Substrate Systems
11 Nov 21
A method for transferring alignment marks between substrate systems includes providing a substrate having semiconductor devices and alignment marks in precise alignment with the semiconductor devices; and physically transferring and bonding the semiconductor devices and the alignment marks to a temporary substrate of a first substrate system.
David Trung Doan, Yoshinori Ogawa, Nobuaki Matsumoto
Filed: 27 Apr 21
Utility
Single Light Emitting Diode (LED) Structure Having Epitaxial Structure Separated Into Light Emitting Zones
22 Apr 21
A single light emitting diode (LED) structure includes an array of spaced discrete light emitting zones separated by isolation areas.
Trung Tri Doan, DAVID TRUNG DOAN
Filed: 7 Dec 20
Utility
Single light emitting diode (LED) structure
30 Mar 21
A single light emitting diode (LED) structure includes an array of spaced discrete light emitting zones separated by isolation areas.
Trung Tri Doan, David Trung Doan
Filed: 28 Aug 18
Utility
Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving Plate
4 Mar 21
A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate.
Chen-Fu Chu, Shih-Kai CHAN, Yi-Feng SHIH, David Trung DOAN, Trung Tri DOAN, Yoshinori OGAWA, Kohei OTAKE, Kazunori KONDO, Keiji OHORI, Taichi KITAGAWA, Nobuaki MATSUMOTO, Toshiyuki OZAI, Shuhei UEDA
Filed: 7 Aug 20
Utility
Method For Making Light Emitting Device (LED) Arrays Using A Temporary Substrate And A Carrier Substrate
11 Feb 21
A method for making light emitting device LED arrays includes the steps of providing a plurality of LEDs having a desired configuration (e.g., VLED, FCLED, PLED); attaching the LEDs to a carrier substrate and to a temporary substrate; forming one or more metal layers and one or more insulator layers configured to electrically connect the LEDs to form a desired circuitry; and separating the LEDs along with the layered metal layers and insulator layers that form the desired circuitry from the carrier substrate and the temporary substrate.
David Trung Doan, Trung Tri Doan
Filed: 23 Oct 20