15 patents
Utility
Frequency-modulating sensor array
11 Jan 24
Spatially-distributed resonant MEMS sensors are coordinated to generate frequency-modulated signals indicative of regional contact forces, ambient conditions and/or environmental composition.
Paul M. Hagelin, Charles I. Grosjean, Lev Goncharov
Filed: 11 Jul 23
Utility
Micromechanical Structure with Bonded Cover
4 Jan 24
A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator.
Aaron Partridge, Markus Lutz, Pavan Gupta
Filed: 4 Apr 23
Utility
Mems Resonator
28 Dec 23
Multiple degenerately-doped silicon layers are implemented within resonant structures to control multiple orders of temperature coefficients of frequency.
Charles I. Grosjean, Nicholas Miller, Paul M. Hagelin, Ginel C. Hill, Joseph C. Doll
Filed: 23 Jun 23
Utility
Stacked-die Mems Resonator
7 Dec 23
A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights.
Pavan Gupta, Aaron Partridge, Markus Lutz
Filed: 6 Jun 23
Utility
Mems Cavity with Non-contaminating Seal
14 Sep 23
A semiconductor device includes a first silicon layer disposed between second and third silicon layers and separated therefrom by respective first and second oxide layers.
Michael Julian Daneman, Charles I. Grosjean, Paul M. Hagelin
Filed: 3 Mar 23
Utility
Ovenized Mems
10 Nov 22
One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate—in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.).
Carl Arft, Aaron Partridge, Markus Lutz, Charles I. Grosjean
Filed: 25 May 22
Utility
Stacked-die Mems Resonator
10 Nov 22
A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights.
Pavan Gupta, Aaron Partridge, Markus Lutz
Filed: 27 May 22
Utility
Frequency-modulating Sensor Array
15 Sep 22
Spatially-distributed resonant MEMS sensors are coordinated to generate frequency-modulated signals indicative of regional contact forces, ambient conditions and/or environmental composition.
Paul M. Hagelin, Charles I. Grosjean, Lev Goncharov
Filed: 2 Apr 22
Utility
Mems Cavity with Non-contaminating Seal
26 May 22
A semiconductor device includes a first silicon layer disposed between second and third silicon layers and separated therefrom by respective first and second oxide layers.
Michael Julian Daneman, Charles I. Grosjean, Paul M. Hagelin
Filed: 6 Dec 21
Utility
Encapsulated Microelectromechanical Structure
22 Jul 21
A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator.
Aaron Partridge, Markus Lutz, Pavan Gupta
Filed: 3 Aug 20
Utility
Stacked-die Mems Resonator
17 Jun 21
A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights.
Pavan Gupta, Aaron Partridge, Markus Lutz
Filed: 6 Jan 21
Utility
Mems Cavity with Non-contaminating Seal
16 Dec 20
A semiconductor device includes a first silicon layer disposed between second and third silicon layers and separated therefrom by respective first and second oxide layers.
Michael Julian Daneman, Charles I. Grosjean, Paul M. Hagelin
Filed: 20 May 20
Utility
Low-profile Stacked-die Mems Resonator System
9 Dec 20
A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights.
Pavan Gupta, Aaron Partridge, Markus Lutz
Filed: 15 Jun 20
Utility
Ovenized Mems
10 Jun 20
One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate—in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.).
Carl Arft, Aaron Partridge, Markus Lutz, Charles I. Grosjean
Filed: 28 Nov 19
Utility
Encapsulated Microelectromechanical Structure
11 Mar 20
A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator.
Aaron Partridge, Markus Lutz, Pavan Gupta
Filed: 9 Sep 19
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