55 patents
Utility
Plating Apparatus and Plating Method
18 Jan 24
The present invention discloses a plating apparatus and plating methods for plating metal layers on a substrate.
Yinuo Jin, Hongchao Yang, Jian Wang, Hui Wang
Filed: 31 Jul 23
Utility
Methods and apparatus for cleaning flip chip assemblies
16 Jan 24
An apparatus for cleaning flip chip assemblies is provided.
Xiaoyan Zhang, Fuping Chen, Hui Wang
Filed: 19 Apr 19
Utility
Plating apparatus
2 Jan 24
A plating apparatus for depositing metal on a substrate, comprising a membrane frame (14), a catholyte inlet pipe (30) and a center cap (40).
Zhaowei Jia, Hongchao Yang, Chenhua Lu, Jian Wang, Hui Wang
Filed: 30 Aug 17
Utility
Methods and apparatus for cleaning substrates
19 Dec 23
The present invention discloses a method for cleaning substrate without damaging patterned structure on the substrate using ultra/mega sonic device, comprising: applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; after micro jet generated by bubble implosion and before said micro jet generated by bubble implosion damaging patterned structure on the substrate, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after temperature inside bubble cooling down to a set temperature, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned.
Hui Wang, Xi Wang, Fuping Chen, Fufa Chen, Jian Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Jun Wang, Xuejun Li
Filed: 14 Jun 21
Utility
Plating Apparatus and Plating Method
23 Nov 23
The present invention discloses plating apparatuses and plating methods for metal deposition on a substrate with pattern structures.
Hui Wang, Jian Wang, Hongchao Yang, Zhaowei Jia
Filed: 23 Mar 20
Utility
Plating apparatus and plating method
10 Oct 23
A plating apparatus and plating methods for plating metal layers on a substrate.
Yinuo Jin, Hongchao Yang, Jian Wang, Hui Wang
Filed: 28 Dec 18
Utility
Method for cleaning semiconductor wafers
12 Sep 23
A method for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the method comprising: delivering a cleaning liquid over a surface of a semiconductor wafer during a cleaning process; and imparting sonic energy to the cleaning liquid from a sonic transducer during the cleaning process, wherein power is alternately supplied to the sonic transducer at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, the first predetermined period of time and the second predetermined period of time consecutively following one another, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.
Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xi Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Liangzhi Xie, Jun Wang, Xuejun Li
Filed: 15 Nov 17
Utility
System for Cleaning Semiconductor Wafers
17 Aug 23
A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.
Hui WANG, Fufa CHEN, Fuping CHEN, Jian WANG, Xi WANG, Xiaoyan ZHANG, Yinuo JIN, Zhaowei JIA, Liangzhi XIE, Jun WANG, Xuejun LI
Filed: 9 Mar 23
Utility
Method of Removing Barrier Layer
13 Jul 23
Embodiments of the present invention provide a method for removing a barrier layer of a metal interconnection on a wafer, which remove a single-layer metal ruthenium barrier layer.
Hui Wang, Hongwei Zhang, Yingwei Dai, Yinuo Jin, Jian Wang
Filed: 31 May 21
Utility
Method and Apparatus for Removing Particles or Photoresist on Substrates
11 May 23
Methods and an apparatus for removing particles or photoresist on substrates.
Xiaoyan Zhang, Wenjun Wang, Fuping Chen, Jun Wang, Shena Jia, Deyun Wang, Hui Wang, Guangyu Xia, He Wang
Filed: 21 Apr 20
Utility
Methods and apparatus for cleaning substrates
2 May 23
A method for effectively cleaning vias (20034), trenches (20036) or recessed areas on a substrate (20010) using an ultra/mega sonic device (1003, 3003, 16062, 17072), comprising: applying liquid (1032) into a space between a substrate (20010) and an ultra/mega sonic device (1003, 3003, 16062, 17072); setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside vias (20034), trenches (20036) or recessed areas on the substrate (20010) increasing to a first set value, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside the vias (20034), trenches (20036) or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate (20010) being cleaned.
Hui Wang, Xi Wang, Fuping Chen, Fufa Chen, Jian Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Jun Wang, Xuejun Li
Filed: 16 Jul 21
Utility
System for cleaning semiconductor wafers
25 Apr 23
A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.
Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xi Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Liangzhi Xie, Jun Wang, Xuejun Li
Filed: 9 Sep 21
Utility
Method and apparatus for uniformly metallization on substrate
18 Apr 23
The present invention relates to applying at least one ultra/mega sonic device and its reflection plate for forming standing wave in a metallization apparatus to achieve highly uniform metallic film deposition at a rate far greater than conventional film growth rate in electrolyte.
Hui Wang, Fuping Chen, Xi Wang
Filed: 1 Feb 21
Utility
Apparatus and method for wet process on semiconductor substrate
11 Apr 23
An apparatus and a method for wet process on a semiconductor substrate are provided.
Hui Wang, Xi Wang, Cheng Cheng, Jun Wu
Filed: 25 Oct 16
Utility
Methods and system for cleaning semiconductor wafers
14 Feb 23
A method for cleaning semiconductor substrate without damaging patterned structure on the substrate using ultra/mega sonic device comprising applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; before bubble cavitation in said liquid damaging patterned structure on the substrate, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after temperature inside bubble cooling down to a set temperature, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned.
Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xi Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Liangzhi Xie, Jun Wang, Xuejun Li
Filed: 4 Jan 21
Utility
Apparatus for cleaning semiconductor substrates
15 Nov 22
An apparatus for cleaning semiconductor substrates including a chamber, a chuck, a liquid collector, an enclosing wall, at least one driving mechanism, at least one internal dispenser, and at least one external dispenser.
Hui Wang, Xiaofeng Tao, Fuping Chen, Shena Jia, Xi Wang, Xiaoyan Zhang, Xuejun Li
Filed: 6 Mar 17
Utility
Substrate Cleaning Method and Apparatus
3 Nov 22
A method for cleaning a substrate with pattern structures comprises the following steps: using gas-liquid atomization to clean a substrate surface (601); using TEBO megasonic to clean the substrate surface (602); and drying the substrate (603).
Wenjun Wang, Ting Yao, Xiaoyan Zhang, Fuping Chen, Hui Wang
Filed: 1 Nov 19
Utility
Plating chuck
11 Oct 22
A plating chuck for holding a substrate during plating processes, wherein the substrate has a notch area (3031) and a patterned region (3032) adjacent to the notch area (3031).
Hui Wang, Jian Wang, Zhaowei Jia, Hongchao Yang
Filed: 7 Sep 17
Utility
Method and apparatus for cleaning semiconductor wafer
4 Oct 22
A method and apparatus for cleaning semiconductor wafer, combining batch cleaning and single wafer cleaning together.
Hui Wang, Fuping Chen, Liangzhi Xie, Shena Jia, Xi Wang, Xiaoyan Zhang
Filed: 8 Apr 19
Utility
Method and Apparatus for Cleaning Semiconductor Wafer
4 Aug 22
A method for cleaning semiconductor wafer includes putting at least one wafer on a cassette bracket in a first cleaning tank filled with chemical solution; after said wafers have been processed in the first cleaning tank, transferring the wafers from the first cleaning tank to a second cleaning tank with the wafers immersing in the chemical solution; and after said wafers have been processed in the second cleaning tank, taking the wafers out of the second cleaning tank.
Hui Wang, Xi Wang, Fuping Chen
Filed: 20 Apr 22