360 patents
Utility
Method and apparatus for depositing a material
16 Jan 24
A method is for depositing a dielectric material on to a substrate in a chamber by pulsed DC magnetron sputtering with a pulsed DC magnetron device which produces one or more primary magnetic fields.
Stephen R Burgess, Rhonda Hyndman, Amit Rastogi, Eduardo Paulo Lima, Clive L Widdicks, Paul Rich, Scott Haymore, Daniel Cook
Filed: 31 Dec 20
Utility
Pe-cvd Apparatus and Method
11 Jan 24
A capacitively coupled Plasma Enhanced Chemical Vapour Deposition (PE-CVD) apparatus has a chamber, a first electrode with a substrate support positioned in the chamber, a second electrode with a gas inlet structure positioned in the chamber, and an RF power source connected to the gas inlet structure for supplying RF power thereto.
Stephen BURGESS, Kathrine CROOK, Daniel ARCHARD, William ROYLE, Euan Alasdair MORRISON
Filed: 24 Sep 23
Utility
Apparatus and a Method of Controlling Thickness Variation in a Material Layer Formed Using Physical Vapour Deposition
11 Jan 24
A magnet assembly is disclosed for steering ions used in the formation of a material layer upon a substrate during a pulsed DC physical vapour deposition process.
Tony WILBY, Steve BURGESS, Adrian THOMAS, Rhonda HYNDMAN, Scott HAYMORE, Clive WIDDICKS, Ian MONCRIEFF
Filed: 24 Sep 23
Utility
Post-processing of Indium-containing Compound Semiconductors
4 Jan 24
A method of plasma etching an indium-containing compound semiconductor substrate and plasma etch apparatus for plasma etching an indium-containing semiconductor substrate can use a primary plasma etching process and a secondary plasma etching process.
Weikang FAN, Adam S. BEACHEY
Filed: 20 Mar 23
Utility
Control of Trench Profile Angle in SiC Semiconductors
4 Jan 24
A plasma etch step anisotropically etches a silicon carbide semiconductor substrate through an opening to produce a feature.
Huma Ashraf, Kevin Riddell, Alex Croot
Filed: 25 Jun 23
Utility
Accuracy improvements in optical metrology
2 Jan 24
Methods, metrology modules and target designs are provided, which improve the accuracy of metrology measurements.
Barak Bringoltz, Evgeni Gurevich, Ido Adam, Yoel Feler, Dror Alumot, Yuval Lamhot, Noga Sella, Yaron De Leeuw, Tal Yaziv, Eltsafon Ashwal-Island, Lilach Saltoun, Tom Leviant
Filed: 18 Feb 21
Utility
Axially adjusted, non-rotating barrel fiber collimator
28 Nov 23
Systems and methods for adjusting a distance of an optical fiber end to a lens assembly are provided.
Edgardo H. Engracia, Jr., Ariel Faynerman, Robert Cosmas
Filed: 12 Dec 19
Utility
Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications
21 Nov 23
An apparatus includes an instrumented substrate apparatus, a substrate assembly including a bottom and top substrate mechanically coupled, an electronic assembly, a nested enclosure assembly including an outer and inner enclosure wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses the electronic assembly.
Mei Sun, Earl Jensen, Jing G Zhou, Ran Liu
Filed: 28 Oct 19
Utility
Optical near-field metrology
14 Nov 23
Systems and methods are provided which utilize optical microcavity probes to map wafer topography by near-field interactions therebetween in a manner which complies with high volume metrology requirements.
Yuri Paskover, Amnon Manassen, Vladimir Levinski
Filed: 19 May 17
Utility
PE-CVD apparatus and method
31 Oct 23
A capacitively coupled Plasma Enhanced Chemical Vapour Deposition (PE-CVD) apparatus has a chamber, a first electrode with a substrate support positioned in the chamber, a second electrode with a gas inlet structure positioned in the chamber, and an RF power source connected to the gas inlet structure for supplying RF power thereto.
Stephen Burgess, Kathrine Crook, Daniel Archard, William Royle, Euan Alasdair Morrison
Filed: 8 Jan 21
Utility
Methods and Process Control for Real Time Inert Monitoring of Acid Copper Electrodeposition Solutions
19 Oct 23
Techniques including methods and apparatuses for inert real-time measurement and monitoring of metal and acid concentrations in a processing solution are provided.
Eugene SHALYT, Aaron HABER, Chuannan BAI
Filed: 5 Jan 23
Utility
Exposure Control In Photolithographic Direct Exposure Methods for Manufacturing Circuit Boards or Circuits
19 Oct 23
The invention is directed to a device for exposure control in photolithographic direct exposure processes for two-dimensional structures in photosensitive coatings and to a method for converting registration data into direct exposure data.
Christian SCHWARZ, Jonas BURGHOFF, Stefan HEINEMANN, Holger WAGNER, Steffen RÜCKER, Frank JUGEL
Filed: 15 Sep 21
Utility
Measurement of overlay error using device inspection system
10 Oct 23
A method and system for measuring overlay in a semiconductor manufacturing process comprise capturing an image of a feature in an article at a predetermined manufacturing stage, deriving a quantity of an image parameter from the image and converting the quantity into an overlay measurement.
Choon Hoong Hoo, Fangren Ji, Amnon Manassen, Liran Yerushalmi, Antonio Mani, Allen Park, Stilian Pandev, Andrei Shchegrov, Jon Madsen
Filed: 1 Feb 21
Utility
Apparatus for plasma dicing
26 Sep 23
An apparatus is for plasma dicing a semiconductor substrate of the type forming part of a workpiece, the workpiece further including a carrier sheet on a frame member, where the carrier sheet carries the semiconductor substrate.
Gautham Ragunathan, David Tossell, Oliver Ansell
Filed: 30 Apr 19
Utility
Process-induced distortion prediction and feedforward and feedback correction of overlay errors
19 Sep 23
Systems and methods for prediction and measurement of overlay errors are disclosed.
Pradeep Vukkadala, Haiguang Chen, Jaydeep K. Sinha, Sathish Veeraraghavan
Filed: 5 Aug 19
Utility
Electrochemical Analysis of Metallic Depolarizers In Gold Electrodeposition
7 Sep 23
The present disclosure provides methods for determining concentration of various trace metal ions in aqueous solutions, such as gold plating solutions.
Patrick Saitta, Jingjing Wang, Eugene Shalyt
Filed: 5 Jan 23
Utility
DC magnetron sputtering
8 Aug 23
A method of depositing a film on a substrate is provided.
Scott Haymore, Amit Rastogi, Rhonda Hyndman, Steve Burgess, Ian Moncrieff
Filed: 27 Apr 21
Utility
Device-like metrology targets
25 Jul 23
Metrology targets, production processes and optical systems are provided, which enable metrology of device-like targets.
Vladimir Levinski, Amnon Manassen, Eran Amit, Nuriel Amir, Liran Yerushalmi, Amit Shaked
Filed: 8 Mar 22
Utility
Apparatus and method
25 Jul 23
A white light illumination source can illuminate a region of a substrate to be plasma etched with an incident light beam.
Oliver Ansell, Harry Gordon-Moys
Filed: 21 Aug 20
Utility
Plasma Etched Silicon Carbide
6 Jul 23
A method of plasma etching a compound semiconductor substrate forms a feature.
Alex CROOT
Filed: 2 Oct 22