360 patents
Page 4 of 18
Utility
Defect inspection and review using transmissive current image of charged particle beam system
9 Aug 22
A system is disclosed.
Hong Xiao, Lawrence Muray, Nick Petrone, John Gerling, Abdurrahman Sezginer, Alan D. Brodie, Kuljit Virk, Qiang Q. Zhang, Grace Hsiu-Ling Chen
Filed: 23 May 19
Utility
Automatic optimization of measurement accuracy through advanced machine learning techniques
5 Jul 22
Machine learning techniques are used to predict values of fixed parameters when given reference values of critical parameters.
Tianrong Zhan, Yin Xu, Liequan Lee
Filed: 23 Feb 18
Utility
Bandgap measurements of patterned film stacks using spectroscopic metrology
5 Jul 22
A spectroscopic metrology system includes a spectroscopic metrology tool and a controller.
Tianhan Wang, Aaron Rosenberg, Dawei Hu, Alexander Kuznetsov, Manh Dang Nguyen, Stilian Pandev, John Lesoine, Qiang Zhao, Liequan Lee, Houssam Chouaib, Ming Di, Torsten R. Kaack, Andrei V. Shchegrov, Zhengquan Tan
Filed: 8 Aug 17
Utility
Method and Apparatus for Plasma Etching
30 Jun 22
Plasma etching a compound semiconductor substrate includes providing a substrate that includes a compound semiconductor material on a substrate support within a chamber.
Weikang Fan, Stephan Shannon L. Lilje
Filed: 26 Oct 21
Utility
Synchronous Substrate Transport and Electrical Probing
30 Jun 22
A system for glass substrate inspection, such as flat patterned media, includes an air table that holds the glass substrate.
Neil Dang Nguyen, Kent Nguyen, Kiran Jitendra, Inho Chae, Gordon Yue
Filed: 29 Dec 20
Utility
Device-like Metrology Targets
23 Jun 22
Metrology targets, production processes and optical systems are provided, which enable metrology of device-like targets.
Vladimir Levinski, Amnon Manassen, Eran Amit, Nuriel Amir, Liran Yerushalmi, Amit Shaked
Filed: 8 Mar 22
Utility
Method and Apparatus
23 Jun 22
A metallic feature on a substrate is subjected to a plasma dicing process and is cleaned.
Janet Hopkins, Simon Dawson
Filed: 10 Dec 21
Utility
Method for Measuring and Correcting Misregistration Between Layers In a Semiconductor Device, and Misregistration Targets Useful Therein
23 Jun 22
A method for measurement of misregistration in the manufacture of semiconductor device wafers, the method including measuring misregistration between layers of a semiconductor device wafer at a first instance and providing a first misregistration indication, measuring misregistration between layers of a semiconductor device wafer at a second instance and providing a second misregistration indication, providing a misregistration measurement difference output in response to a difference between the first misregistration indication and the second misregistration indication, providing a baseline difference output and ameliorating the difference between the misregistration measurement difference output and the baseline difference output.
Roie Volkovich, Renan Milo, Liran Yerushalmi, Moran Zaberchik, Yoel Feler, David Izraeli
Filed: 7 Mar 22
Utility
Simultaneous multi-directional laser wafer inspection
21 Jun 22
Disclosed is apparatus for inspecting a sample.
Guoheng Zhao, Sheng Liu, Ben-Ming Benjamin Tsai
Filed: 2 Jul 20
Utility
Method and apparatus for simulation of lithography overlay
21 Jun 22
A method for simulation of lithography overlay is disclosed which comprises storing alignment parameters used to align a semiconductor wafer prior to a lithography step; storing process control parameters used during the lithography step on the semiconductor wafer, storing overlay parameters measured after the lithography step, calculating alternative alignment parameters and alternative process control parameters.
Boris Habets, Stefan Buhl
Filed: 8 Aug 19
Utility
Method of fabricating integrated circuits
14 Jun 22
A method of fabricating an integrated circuit is disclosed.
Tony Wilby, Steve Burgess
Filed: 14 Oct 19
Utility
Data-driven misregistration parameter configuration and measurement system and method
7 Jun 22
A data-driven misregistration parameter configuration and measurement system and method including simulating a plurality of measurement simulations of at least one multilayered semiconductor device, selected from a batch of multilayered semiconductor devices intended to be identical, using sets of measurement parameter configurations, generating simulation data for the device, identifying recommended measurement parameter configurations selected from sets of measurement parameter configurations, providing a multilayered semiconductor device selected from the batch, providing the at least one recommended set of measurement parameter configurations to a misregistration metrology tool having multiple possible sets of measurement parameter configurations, measuring at least one multilayered semiconductor device, selected from the batch, using the recommended set, thereby generating measurement data for the device, thereafter identifying a final recommended set of measurement parameter configurations and measuring misregistration of at least one multilayered semiconductor device, selected from the batch, using the final recommended set.
Shlomit Katz, Roie Volkovich, Anna Golotsvan, Raviv Yohanan
Filed: 10 Jul 19
Utility
Methods and systems for semiconductor metrology based on polychromatic soft X-Ray diffraction
17 May 22
Methods and systems for performing measurements of semiconductor structures based on high-brightness, polychromatic, reflective small angle x-ray scatterometry (RSAXS) metrology are presented herein.
Daniel Wack, Oleg Khodykin, Andrei V. Shchegrov, Alexander Kuznetsov, Nikolay Artemiev, Michael Friedmann
Filed: 9 Jul 18
Utility
Method for detecting defects in ultra-high resolution panels
17 May 22
A system for inspection of electrical circuits, which electrical circuits include a multiplicity of conductors which are mutually spaced from each other, the system including a voltage driver operative to apply different electrical voltages to a plurality of conductors from among the multiplicity of conductors, which plurality of conductors are in spatial propinquity to each other, a sensor operative to sense at least one characteristic of a test region defined thereby with respect to the electrical circuits, the sensor lacking sufficient spatial resolution to distinguish between the locations of individual ones of the plurality of conductors and a defect indicator responsive to at least one output of the sensor for ascertaining whether a defect exists in the plurality of conductors.
Raul Albert Martin, Richard Norio Blythe
Filed: 18 Jun 18
Utility
Systems and methods for optimizing focus for imaging-based overlay metrology
26 Apr 22
Methods and systems for focusing and measuring by mean of an interferometer device, having an optical coherence tomography (OCT) focusing system, by separately directing an overlapped measurement and reference wavefront towards a focus sensor and towards an imaging sensor; where a predefined focusing illumination spectrum of the overlapped wavefront is directed towards the focus sensor, and where a predefined measurement illumination spectrum of the overlapped wavefront is directed towards the imaging sensor.
Amnon Manassen, Andrew Hill
Filed: 14 Apr 20
Utility
Process control metrology
26 Apr 22
Methods and systems for estimating values of process parameters based on measurements of structures fabricated on a product wafer are presented herein.
Stilian Ivanov Pandev, Wei Lu
Filed: 4 May 17
Utility
Topographic phase control for overlay measurement
26 Apr 22
Metrology tools and methods are provided, which estimate the effect of topographic phases corresponding to different diffraction orders, which result from light scattering on periodic targets, and adjust the measurement conditions to improve measurement accuracy.
Vladimir Levinski, Yuri Paskover, Amnon Manassen, Yoni Shalibo
Filed: 3 Nov 19
Utility
Bright and clean x-ray source for x-ray based metrology
26 Apr 22
Methods and systems for x-ray based semiconductor metrology utilizing a clean, hard X-ray illumination source are described herein.
Oleg Khodykin
Filed: 26 Aug 18
Utility
Wafer processing system
19 Apr 22
A wafer processing system has a transport vacuum chamber for handling a frame assembly under vacuum conditions, at least one vacuum cassette elevator load lock for housing a cassette and adjusting a vertical position of the cassette under vacuum conditions, and at least one wafer processing module in vacuum communication with the transport vacuum chamber.
Attila Nagy, Kris Martin
Filed: 2 Jul 20
Utility
3D microscope including insertable components to provide multiple imaging and measurement capabilities
5 Apr 22
A three-dimensional (3D) microscope includes various insertable components that facilitate multiple imaging and measurement capabilities.
James Jianguo Xu, Ken Kinsun Lee, Rusmin Kudinar, Ronny Soetarman, Hung Phi Nguyen, Zhen Hou
Filed: 2 Dec 20