360 patents
Page 5 of 18
Utility
Broad band plasma inspection based on a nuisance map
5 Apr 22
A noise map is used for defect detection.
Kaushik Reddy Vemareddy, Shishir Suman, Pavan Kumar Perali
Filed: 2 May 18
Utility
Method and system for mixed mode wafer inspection
5 Apr 22
Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells.
Jason Z. Lin, Allen Park, Ellis Chang, Richard Wallingford, Songnian Rong, Chetana Bhaskar
Filed: 30 Nov 18
Utility
Method and system for optical three dimensional topography measurement
29 Mar 22
For three-dimensional topography measurement of a surface of an object patterned illumination is projected on the surface through an objective.
Guoheng Zhao, Maarten van der Burgt, Sheng Liu, Andy Hill, Johan De Greeve, Karel van Gils
Filed: 2 Mar 20
Utility
Off-axis illumination overlay measurement using two-diffracted orders imaging
22 Mar 22
Metrology methods and tools are provided, which enhance the accuracy of the measurements and enable simplification of the measurement process as well as improving the correspondence between the metrology targets and the semiconductor devices.
Yoni Shalibo, Yuri Paskover, Vladimir Levinski, Amnon Manassen, Shlomo Eisenbach, Gilad Laredo, Ariel Hildesheim
Filed: 14 Dec 18
Utility
Inspection of Reticles Using Machine Learning
17 Mar 22
Disclosed are methods and apparatus for inspecting a photolithographic reticle.
Hawren Fang, Abdurrahman Sezginer, Rui-fang Shi
Filed: 24 Nov 21
Utility
Deposition Method
17 Mar 22
Pulsed DC reactive sputtering of a target deposits an additive-containing aluminium nitride film onto a metallic layer of a semiconductor substrate.
Scott Haymore, Adrian Thomas, Tony Wilby
Filed: 30 Aug 21
Utility
Systems and methods for predicting defects and critical dimension using deep learning in the semiconductor manufacturing process
15 Mar 22
An initial inspection or critical dimension measurement can be made at various sites on a wafer.
Arpit Yati
Filed: 16 Nov 17
Utility
Wafer inspection using difference images
8 Mar 22
Systems and methods increase the signal to noise ratio of optical inspection of wafers to obtain higher inspection sensitivity.
Abdurrahman Sezginer, Xiaochun Li, Pavan Kumar, Junqing Huang, Lisheng Gao, Grace H. Chen, Yalin Xiong, Hawren Fang
Filed: 4 May 18
Utility
Boron-based capping layers for EUV optics
8 Mar 22
Disclosed herein are optical elements and methods for making the same.
Gildardo R Delgado, Shannon B Hill, Zefram Marks
Filed: 16 May 19
Utility
System and method for pumping laser sustained plasma with an illumination source having modified pupil power distribution
1 Mar 22
A system for generating pump illumination for laser sustained plasma (LSP) is disclosed.
Ilya Bezel, Matthew Derstine, Andrey Stepanov, Nikolay Sherbak
Filed: 9 Nov 18
Utility
Apparatus for the Exposure of Plate-shaped Workpieces with High Throughput
24 Feb 22
A movable table system comprising two identical tables on a common rail arrangement having a linear rail region underneath a detection unit and a processing unit, and therefore the tables can be alternatingly moved in a straight line along the common rail arrangement, in the same table-movement direction, fully underneath the detection unit and processing unit, and can be independently controlled by a computer unit.
Steffen RUECKER, Uwe KLOWSKY
Filed: 11 Dec 19
Utility
Inspection of reticles using machine learning
22 Feb 22
Disclosed are methods and apparatus for inspecting a photolithographic reticle.
Hawren Fang, Abdurrahman Sezginer, Rui-fang Shi
Filed: 27 Nov 18
Utility
Plasma Etching Apparatus and Method
17 Feb 22
A plasma etching apparatus for etching a semiconductor substrate comprises: a plasma chamber; a plasma generation device for sustaining a plasma within the plasma chamber; a substrate support disposed within the plasma chamber for supporting the semiconductor substrate, the substrate support comprising an electrically conductive structure; a power supply for providing an RF electrical signal having an RF power to the electrically conductive structure; and an annular dielectric ring structure comprising a backside surface, the backside surface comprising an electrically conductive coating; wherein the electrically conductive structure is spaced apart from and extends under the electrically conductive coating so that when RF power is provided to the electrically conductive structure the RF power couples to the electrically conductive coating.
Maxime Varvara, Codrin Prahoveanu
Filed: 23 Jul 21
Utility
Machine learning in metrology measurements
15 Feb 22
Metrology methods and targets are provided, that expand metrological procedures beyond current technologies into multi-layered targets, quasi-periodic targets and device-like targets, without having to introduce offsets along the critical direction of the device design.
Eran Amit
Filed: 6 Dec 17
Utility
Resistivity probes with curved portions
15 Feb 22
Resistivity probes can be used to test integrated circuits.
Walter H. Johnson, III, Nanchang Zhu, Xianghua Liu, Jianli Cui, Zhu-bin Shi, Zhuoxian Zhang, Haiyang You, Lu Yu, Jianou Shi, Fan Zhang
Filed: 10 Nov 19
Utility
Method of depositing silicon nitride
15 Feb 22
A method is for depositing silicon nitride by plasma-enhanced chemical vapour deposition (PECVD).
Kathrine Crook, Steve Burgess
Filed: 15 Aug 19
Utility
Method and system for correlating optical images with scanning electron microscopy images
8 Feb 22
The correlation of optical images with SEM images includes acquiring a full optical image of a sample by scanning the sample with an optical inspection sub-system, storing the full optical image, identifying a location of a feature-of-interest present in the full optical image with an additional sources, acquiring an SEM image of a portion of the sample that includes the feature at the identified location with a SEM tool, acquiring an optical image portion at the location identified by the additional source, the image portions including a reference structure, correlating the image portion and the SEM image based on the presence of the feature-of-interest and the reference structure in both the image portions and the SEM image, and transferring a location of the feature-of-interest in the SEM image into the coordinate system of the image portion of the full optical image to form a corrected optical image.
Hucheng Lee, Lisheng Gao, Jan Lauber, Yong Zhang
Filed: 11 Jul 19
Utility
Apparatus and method for processing a substrate
1 Feb 22
An apparatus for electrochemically processing a semiconductor substrate includes a processing chamber of the type that is sealable to a peripheral portion of a semiconductor substrate so as to define a covered processing volume.
Martin Ayres, John MacNeil, Trevor Thomas
Filed: 10 Apr 20
Utility
Diagnostic methods for the classifiers and the defects captured by optical tools
1 Feb 22
Wafer inspection with stable nuisance rates and defect of interest capture rates are disclosed.
Martin Plihal, Erfan Soltanmohammadi, Saravanan Paramasivam, Sairam Ravu, Ankit Jain, Prasanti Uppaluri, Vijay Ramachandran
Filed: 7 Dec 17
Utility
Expediting spectral measurement in semiconductor device fabrication
1 Feb 22
A device and method for expediting spectral measurement in metrological activities during semiconductor device fabrication through interferometric spectroscopy of white light illumination during calibration, overlay, and recipe creation.
Vincent Immer, Tal Marciano, Etay Lavert
Filed: 21 Jul 20