360 patents
Page 6 of 18
Utility
Semiconductor inspection and metrology systems for distributing job among the CPUs or GPUs based on logical image processing boundaries
1 Feb 22
Real-time job distribution software architectures for high bandwidth, hybrid processor computation systems for semiconductor inspection and metrology are disclosed.
Ajay Gupta, Sankar Venkataraman, Sashi Balasingam, Mohan Mahadevan
Filed: 14 May 18
Utility
Method of measuring misregistration of semiconductor devices
18 Jan 22
A method of measuring misregistration in the manufacture of semiconductor devices including providing a multilayered semiconductor device, using a scatterometry metrology tool to perform misregistration measurements at multiple sites on the multilayered semiconductor device, receiving raw misregistration data for each of the misregistration measurements, thereafter providing filtered misregistration data by removing outlying raw misregistration data points from the raw misregistration data for each of the misregistration measurements, using the filtered misregistration data to model misregistration for the multilayered semiconductor device, calculating correctables from the modeled misregistration for the multilayered semiconductor device, providing the correctables to the scatterometry metrology tool, thereafter recalibrating the scatterometry metrology tool based on the correctables and measuring misregistration using the scatterometry metrology tool following the recalibration.
Roie Volkovich, Ido Dolev
Filed: 28 Jan 21
Utility
Passivation of nonlinear optical crystals
18 Jan 22
A laser system includes a nonlinear optical (NLO) crystal, wherein the NLO crystal is annealed within a selected temperature range.
Yung-Ho Alex Chuang, Vladimir Dribinski
Filed: 27 Feb 19
Utility
Cross Layer Common-unique Analysis for Nuisance Filtering
13 Jan 22
Common events between layers on a semiconductor wafer are filtered.
Bjorn Brauer
Filed: 27 Sep 21
Utility
Swath selection for semiconductor inspection
11 Jan 22
A semiconductor-inspection method is performed by a semiconductor-inspection system.
Bosuk Kang
Filed: 11 Sep 18
Utility
Probe for testing an electrical property of a test sample
4 Jan 22
A probe for direct nano- and micro-scale electrical characterization of materials and semi conductor wafers.
Lior Shiv
Filed: 2 Mar 18
Utility
Method of depositing a SiN film
4 Jan 22
A method of depositing a SiN film onto a flexible substrate includes providing the flexible substrate, and depositing the SiN film onto the flexible substrate in a plasma enhanced chemical vapour deposition (PECVD) process using SiH4, N2 and H2, in which the temperature of the substrate is 200° C. or less and SiH4 is introduced into the PECVD process at a flow rate of greater than 100 sccm.
Mark Carruthers
Filed: 25 Apr 19
Utility
Repeater defect detection
21 Dec 21
Defects from a hot scan can be saved, such as on persistent storage, random access memory, or a split database.
Eugene Shifrin, Bjorn Brauer, Sumit Sen, Ashok Mathew, Sreeram Chandrasekaran, Lisheng Gao
Filed: 10 Apr 20
Utility
Method of Deposition
16 Dec 21
A hydrogenated silicon carbon nitride (SiCN:H) film is deposited onto a substrate by plasma enhanced chemical vapour deposition (PECVD) comprising: providing the substrate in a chamber; introducing silane (SiH4), a carbon-donating precursor, and nitrogen gas (N2) into the chamber; and sustaining a plasma in the chamber so as to deposit SiCN:H onto the substrate by PECVD, wherein the substrate is maintained at a temperature of less than about 250° C.
Tristan Harper, Kathrine Crook
Filed: 20 May 21
Utility
Model-based metrology using images
14 Dec 21
Methods and systems for combining information present in measured images of semiconductor wafers with additional measurements of particular structures within the measured images are presented herein.
Stilian Ivanov Pandev
Filed: 27 Jun 19
Utility
Target selection improvements for better design alignment
7 Dec 21
Techniques and systems to achieve more accurate design alignment to an image by improved pixel-to-design alignment (PDA) target selection are disclosed.
Santosh Kumar, Pavan Kumar Perali
Filed: 30 Aug 18
Utility
Single Cell Grey Scatterometry Overlay Targets and Their Measurement Using Varying Illumination Parameter(s)
2 Dec 21
Scatterometry overlay (SCOL) measurement methods, systems and targets are provided to enable efficient SCOL metrology with in-die targets.
Amnon Manassen, Yuri Paskover, Eran Amit
Filed: 13 Aug 21
Utility
Plasma generating arrangement
30 Nov 21
A plasma generating arrangement includes a plurality of plasma sources, each plasma source including a respective antenna coil assembly electrically coupled to a common electrical terminal via a respective transmission line.
Paul Bennett
Filed: 25 Feb 19
Utility
Spectral filter for high-power fiber illumination sources
30 Nov 21
A spectral filter includes a curved filtering element including a concave surface forming a portion of a sphere.
Andrew V. Hill, Ohad Bachar, Avi Abramov, Amnon Manassen
Filed: 1 Aug 17
Utility
Lithographic apparatus and method of controlling a lithographic apparatus
23 Nov 21
A Lithographic apparatus and method of controlling a lithographic process.
Stefan Buhl, Philip Groeger, Wansoo Kim
Filed: 28 Dec 18
Utility
Passivation of nonlinear optical crystals
23 Nov 21
The passivation of a nonlinear optical crystal for use in an inspection tool includes growing a nonlinear optical crystal in the presence of at least one of fluorine, a fluoride ion and a fluoride-containing compound, mechanically preparing the nonlinear optical crystal, performing an annealing process on the nonlinear optical crystal and exposing the nonlinear optical crystal to a hydrogen-containing or deuterium-containing passivating gas.
Yung-Ho Alex Chuang, Vladimir Dribinski
Filed: 8 Apr 14
Utility
Training a machine learning model with synthetic images
9 Nov 21
Methods and systems for training a machine learning model using synthetic defect images are provided.
Ian Riley, Li He, Sankar Venkataraman, Michael Kowalski, Arjun Hegde
Filed: 19 Mar 19
Utility
Production of Three-Dimensional Structures by Means of Photoresists
4 Nov 21
A process for the production of three-dimensional structures involves generating stepped structures in the micrometer to millimeter range.
Jens THEIS, Frank BIERAU
Filed: 29 Apr 21
Utility
Process-induced displacement characterization during semiconductor production
2 Nov 21
A controller is configured to perform at least a first characterization process prior to at least one discrete backside film deposition process on a semiconductor wafer; perform at least an additional characterization process following the at least one discrete backside film deposition process; determine at least one of a film force or one or more in-plane displacements for at least one discrete backside film deposited on the semiconductor wafer via the at least one discrete backside film deposition process based on the at least the first characterization process and the at least the additional characterization process; and provide at least one of the film force or the one or more in-plane displacements to at least one process tool via at least one of a feed forward loop or a feedback loop to improve performance of one or more fabrication processes.
Pradeep Vukkadala, Mark D. Smith, Ady Levy, Prasanna Dighe, Dieter Mueller
Filed: 26 Jun 18
Utility
Measurement methodology of advanced nanostructures
26 Oct 21
A parameterized geometric model of a structure can be determined based on spectra from a wafer metrology tool.
Manh Nguyen, Phillip Atkins, Alexander Kuznetsov, Liequan Lee, Natalia Malkova, Paul Aoyagi, Mikhail Sushchik, Dawei Hu, Houssam Chouaib
Filed: 28 Mar 18