360 patents
Page 9 of 18
Utility
Overlay metrology system and method
20 Jul 21
A system for measuring an overlay error of a sample is disclosed.
Yung-Ho Alex Chuang, Yinying Xiao-Li, John Fielden, Xuefeng Liu, Peilin Jiang
Filed: 12 Apr 18
Utility
High accuracy of relative defect locations for repeater analysis
20 Jul 21
Methods and systems for transforming positions of defects detected on a wafer are provided.
Shishir Suman, Kenong Wu, Hong Chen
Filed: 14 May 18
Utility
System for combined imaging and scatterometry metrology
20 Jul 21
Metrology targets, design files, and design and production methods thereof are provided.
Eran Amit, Raviv Yohanan
Filed: 29 Apr 19
Utility
Vacuum Hold-down Apparatus for Flattening Bowed Semiconductor Wafers
15 Jul 21
Vacuum hold-down apparatus suitable for retaining a wafer in a desired position and orientation, the apparatus including a vacuum chuck assembly defining a vacuum chuck surface having a vacuum communication aperture, a venturi vacuum generator fixed with respect to the vacuum chuck assembly and communicating with the vacuum chuck surface via the vacuum communication aperture and a positive pressure fluid line communicating with the venturi vacuum generator.
Ariel Hildesheim, Ofer Angel
Filed: 25 Mar 19
Utility
Polarization measurements of metrology targets and corresponding target designs
13 Jul 21
Targets, target elements and target design method are provided, which comprise designing a target structure to have a high contrast above a specific contrast threshold to its background in polarized light while having a low contrast below the specific contrast threshold to its background in non-polarized light.
Eran Amit, Barry Loevsky, Andrew Hill, Amnon Manassen, Nuriel Amir, Vladimir Levinski, Roie Volkovich
Filed: 28 Oct 19
Utility
Device metrology targets and methods
6 Jul 21
An overlay metrology system includes one or more processors coupled to an illumination source to direct illumination to a sample and a detector to capture diffracted orders of radiation from the sample.
Eran Amit, Daniel Kandel, Dror Alumot, Amit Shaked, Liran Yerushalmi
Filed: 13 Aug 18
Utility
Sample transport device with integrated metrology
6 Jul 21
A metrology system may include one or more casings that fit within an interior cavity of a sample transport device, an illumination source within one of the one or more casings, one or more illumination optics within one of the one or more casings for directing illumination from the illumination source to a sample located in the interior cavity of the sample transport device, one or more collection optics within one of the one or more casings for light from the sample in response to the illumination from the illumination source, and one or more detectors within one of the one or more casings for generating metrology data based on at least a portion of the light collected by the one or more collection optics.
Giampietro Bieli, Robert Tas, Kevin O'Brien, Shankar Krishnan, Joshua Butler
Filed: 20 Feb 19
Utility
Clamp assembly
6 Jul 21
A clamp assembly is for clamping an outer peripheral portion of a substrate to a support in a plasma processing chamber.
Anthony Barker, Huma Ashraf, Brian Kiernan
Filed: 28 Oct 15
Utility
Defect discovery and recipe optimization for inspection of three-dimensional semiconductor structures
29 Jun 21
Methods and systems for discovery of defects of interest (DOI) buried within three dimensional semiconductor structures and recipe optimization are described herein.
Santosh Bhattacharyya, Devashish Sharma, Christopher Maher, Bo Hua, Philip Measor, Robert M. Danen
Filed: 29 Nov 17
Utility
Defect-location determination using correction loop for pixel alignment
29 Jun 21
A method of semiconductor-wafer image alignment is performed at a semiconductor-wafer defect-inspection system.
David Dowling, Tarunark Singh, Bjorn Brauer, Santosh Bhattacharyya, Bryant Mantiply, Hucheng Lee, Xiaochun Li, Sangbong Park
Filed: 21 May 19
Utility
Method and Apparatus for Plasma Etching
24 Jun 21
A structure comprising a substrate and a component which forms involatile metal etch products is plasma etched.
Huma Ashraf, Kevin Riddell, Codrin Prahoveanu
Filed: 15 Nov 20
Utility
Method of Plasma Etching
24 Jun 21
A structure comprising a semiconductor substrate and a layer of PZT (lead zirconate titanate) is etched by performing a first plasma etch step with a first etch process gas mixture.
Huma Ashraf, Kevin Riddell, Codrin Prahoveanu
Filed: 23 Nov 20
Utility
Wafer Exposure Method Using Wafer Models and Wafer Fabrication Assembly
24 Jun 21
Critical dimension values can be obtained from wafer structures at predefined measurement sites.
Stefan Buhl, Philip Groeger, Patrick Lomtscher
Filed: 19 Feb 20
Utility
Semiconductor Wafer Dicing Process
17 Jun 21
A semiconductor wafer dicing process is disclosed for dicing a wafer into individual dies.
Matthew Michael Day, Samira Binte Kazemi
Filed: 10 Nov 20
Utility
Measurement models of nanowire semiconductor structures based on re-useable sub-structures
15 Jun 21
Methods and systems for generating measurement models of nanowire based semiconductor structures based on re-useable, parametric models are presented herein.
Houssam Chouaib, Alexander Kuznetsov
Filed: 13 Mar 19
Utility
Magnetically microfocused electron emission source
15 Jun 21
A magnetically microfocused electron emission source apparatus is disclosed.
Christopher Sears
Filed: 24 Jun 19
Utility
Method of plasma etching
15 Jun 21
According to the invention there is provided a method of plasma etching a silicon-based compound semiconductor substrate, the method comprising providing the substrate within an etch chamber and performing a cyclical process on the substrate, each cycle comprising supplying an etchant gas into the chamber, energising the gas into a plasma, and performing an etch step on the substrate using the plasma; and performing a desorption step, wherein during the desorption step, the only gas that is supplied into the etch chamber is an inert gas, so as to allow reactive species that have adsorbed to the surface of the substrate during the etch step to desorb from the surface of the substrate.
Huma Ashraf, Kevin Riddell, Alex Wood
Filed: 20 Jun 19
Utility
Inspection-guided critical site selection for critical dimension measurement
15 Jun 21
Systems and methods for determining location of critical dimension (CD) measurement or inspection are disclosed.
Jagdish Chandra Saraswatula, Arpit Yati, Hari Pathangi
Filed: 25 Feb 18
Utility
Spectrometer for vacuum ultraviolet measurements in high-pressure environment
15 Jun 21
A spectrometer apparatus is disclosed.
Ilya Bezel, Anatoly Shchemelinin
Filed: 8 Mar 19
Utility
System and method for x-ray imaging and classification of volume defects
15 Jun 21
X-ray imaging and classification of volume defects within a three-dimensional structure includes identifying one or more volume defects within a three-dimensional structure of a sample and acquiring, with a transmission-mode x-ray diffraction imaging tool, one or more coherent diffraction images of the one or more identified volume defects.
Richard W. Solarz, Oleg Khodykin, Bosheng Zhang, Steven R. Lange
Filed: 28 Jun 17