98 patents
Utility
Pe-cvd Apparatus and Method
11 Jan 24
A capacitively coupled Plasma Enhanced Chemical Vapour Deposition (PE-CVD) apparatus has a chamber, a first electrode with a substrate support positioned in the chamber, a second electrode with a gas inlet structure positioned in the chamber, and an RF power source connected to the gas inlet structure for supplying RF power thereto.
Stephen BURGESS, Kathrine CROOK, Daniel ARCHARD, William ROYLE, Euan Alasdair MORRISON
Filed: 24 Sep 23
Utility
Apparatus and a Method of Controlling Thickness Variation in a Material Layer Formed Using Physical Vapour Deposition
11 Jan 24
A magnet assembly is disclosed for steering ions used in the formation of a material layer upon a substrate during a pulsed DC physical vapour deposition process.
Tony WILBY, Steve BURGESS, Adrian THOMAS, Rhonda HYNDMAN, Scott HAYMORE, Clive WIDDICKS, Ian MONCRIEFF
Filed: 24 Sep 23
Utility
Post-processing of Indium-containing Compound Semiconductors
4 Jan 24
A method of plasma etching an indium-containing compound semiconductor substrate and plasma etch apparatus for plasma etching an indium-containing semiconductor substrate can use a primary plasma etching process and a secondary plasma etching process.
Weikang FAN, Adam S. BEACHEY
Filed: 20 Mar 23
Utility
Control of Trench Profile Angle in SiC Semiconductors
4 Jan 24
A plasma etch step anisotropically etches a silicon carbide semiconductor substrate through an opening to produce a feature.
Huma Ashraf, Kevin Riddell, Alex Croot
Filed: 25 Jun 23
Utility
Methods and Process Control for Real Time Inert Monitoring of Acid Copper Electrodeposition Solutions
19 Oct 23
Techniques including methods and apparatuses for inert real-time measurement and monitoring of metal and acid concentrations in a processing solution are provided.
Eugene SHALYT, Aaron HABER, Chuannan BAI
Filed: 5 Jan 23
Utility
Exposure Control In Photolithographic Direct Exposure Methods for Manufacturing Circuit Boards or Circuits
19 Oct 23
The invention is directed to a device for exposure control in photolithographic direct exposure processes for two-dimensional structures in photosensitive coatings and to a method for converting registration data into direct exposure data.
Christian SCHWARZ, Jonas BURGHOFF, Stefan HEINEMANN, Holger WAGNER, Steffen RÜCKER, Frank JUGEL
Filed: 15 Sep 21
Utility
Electrochemical Analysis of Metallic Depolarizers In Gold Electrodeposition
7 Sep 23
The present disclosure provides methods for determining concentration of various trace metal ions in aqueous solutions, such as gold plating solutions.
Patrick Saitta, Jingjing Wang, Eugene Shalyt
Filed: 5 Jan 23
Utility
Plasma Etched Silicon Carbide
6 Jul 23
A method of plasma etching a compound semiconductor substrate forms a feature.
Alex CROOT
Filed: 2 Oct 22
Utility
Method of Operating a PVD Apparatus
6 Jul 23
A PVD apparatus can be operated in a cleaning mode to remove material from an electrically conductive feature formed on a semiconductor substrate.
Scott HAYMORE, Tony WILBY, Stephen BURGESS
Filed: 1 Oct 22
Utility
Device for Introducing a Pattern by Radiation on a Wound Endless Structure
4 May 23
A device for introducing patterns by radiating a wound continuous substrate.
Peter VOGT, Toni STROBEL, René PAGEL, Uwe KLOWSKY, Steffen RUECKER, Christian KOENIG, Marcus WITTER
Filed: 19 Apr 20
Utility
PVD Method and Apparatus
4 May 23
A substrate is positioned on a substrate supporting upper surface of a substrate support.
Scott Haymore, Adrian Thomas, Tony Wilby, Stephen Burgess
Filed: 29 Oct 22
Utility
Method and Apparatus for Controlling Stress Variation in a Material Layer Formed Via Pulsed DC Physical Vapor Deposition
30 Mar 23
A method and apparatus are for controlling stress variation in a material layer formed via pulsed DC physical vapour deposition.
Anthony WILBY, Steve Burgess, Ian Moncrieff, Clive Widdicks, Scott Haymore, Rhonda Hyndman
Filed: 4 Dec 22
Utility
Reduction or Elimination of Pattern Placement Error In Metrology Measurements
30 Mar 23
Metrology methods and targets are provided for reducing or eliminating a difference between a device pattern position and a target pattern position while maintaining target printability, process compatibility and optical contrast—in both imaging and scatterometry metrology.
Yoel Feler, Vladimir Levinski, Roel Gronheid, Sharon Aharon, Evgeni Gurevich, Anna Golotsvan, Mark Ghinovker
Filed: 6 Dec 22
Utility
3D Microscope Including Insertable Components To Provide Multiple Imaging And Measurement Capabilities
23 Mar 23
A three-dimensional (3D) microscope includes various insertable components that facilitate multiple imaging and measurement capabilities.
James Jianguo Xu, Ken Kinsun Lee, Rusmin Kudinar, Ronny Soetarman, Hung Phi Nguyen, Zhen Hou
Filed: 28 Nov 22
Utility
Method of Deposition
16 Mar 23
According to the present invention there is provided a method of depositing a hydrogenated silicon carbon nitride (SiCN:H) film onto a substrate by plasma enhanced chemical vapour deposition (PECVD) comprising the steps of: providing the substrate in a chamber; introducing silane (SiH4), a hydrocarbon gas or vapour, nitrogen gas (N2), and hydrogen gas (H2) into the chamber; and sustaining a plasma in the chamber so as to deposit SiCN:H onto the substrate by PECVD at a process temperature of less than about 200° C.
Tristan Harper, Kathrine Crook
Filed: 18 Aug 22
Utility
Methods of Boric Acid Analysis and Process Control of Metallization Solutions
9 Feb 23
Techniques for selective measurement and monitoring of boric acid concentrations in processing solutions are provided.
Jingjing Wang, Jong Woung Kim, Patrick Saitta, Eugene Shalyt
Filed: 5 Jul 22
Utility
Non-reagent Methods and Process Control for Measuring and Monitoring Halide Concentrations In Electrodeposition Solutions for Iron Triad Metals and Their Alloys
22 Dec 22
Techniques including methods and apparatuses for selective measurement and monitoring of halide concentrations in processing solutions for iron triad metals and their alloys are provided.
Eugene SHALYT, Chuannan BAI, Vishal PAREKH, Boling DENG
Filed: 12 May 22
Utility
Temporary Passivation Layer on a Substrate
10 Nov 22
A substrate includes a metal component on a surface.
Michael Grimes, Yuyuan Lin
Filed: 9 May 21
Utility
Method and Apparatus for Plasma Etching
30 Jun 22
Plasma etching a compound semiconductor substrate includes providing a substrate that includes a compound semiconductor material on a substrate support within a chamber.
Weikang Fan, Stephan Shannon L. Lilje
Filed: 26 Oct 21
Utility
Synchronous Substrate Transport and Electrical Probing
30 Jun 22
A system for glass substrate inspection, such as flat patterned media, includes an air table that holds the glass substrate.
Neil Dang Nguyen, Kent Nguyen, Kiran Jitendra, Inho Chae, Gordon Yue
Filed: 29 Dec 20