98 patents
Page 4 of 5
Utility
Strontium Tetraborate As Optical Coating Material
11 Nov 20
Strontium tetraborate is used as an optical coating material for optical components utilized in semiconductor inspection and metrology systems to take advantage of its high refractive indices, high optical damage threshold and high microhardness in comparison to conventional optical materials.
Yung-Ho Alex Chuang, Yinying Xiao-Li, Elena Loginova, John Fielden
Filed: 15 Mar 20
Utility
Verification Metrology Targets and Their Design
4 Nov 20
Metrology target design methods and verification targets are provided.
Michael E. Adel, Inna Tarshish-Shapir, Shiming Wei, Mark Ghinovker
Filed: 5 Jul 20
Utility
Simultaneous Multi-directional Laser Wafer Inspection
21 Oct 20
Disclosed is apparatus for inspecting a sample.
Guoheng Zhao, Sheng Liu, Ben-Ming Benjamin Tsai
Filed: 1 Jul 20
Utility
High-Brightness Illumination Source for Optical Metrology
21 Oct 20
An illumination source may include two or more input light sources, a collector, and any combination of a beam uniformizer, a speckle reducer, or any number of output fibers to provide a selected illumination etendue.
Amnon Manassen, Andrew V. Hill, Ohad Bachar, Avi Abramov
Filed: 3 Jun 19
Utility
System and Method for Generation of Wafer Inspection Critical Areas
21 Oct 20
A method includes receiving one or more sets of wafer data, identifying one or more primitives from one or more shapes in one or more layers in the one or more sets of wafer data, classifying each of the one or more primitives as a particular primitive type, identifying one or more primitive characteristics for each of the one or more primitives, generating a primitive database of the one or more primitives, generating one or more rules based on the primitive database, receiving one or more sets of design data, applying the one or more rules to the one or more sets of design data to identify one or more critical areas, and generating one or more wafer inspection recipes including the one or more critical areas for an inspection sub-system.
Prasanti Uppaluri, Rajesh Manepalli, Ashok V. Kulkarni, Saibal Banerjee, John Kirkland
Filed: 5 Jul 20
Utility
Methods And Systems For Combining X-Ray Metrology Data Sets To Improve Parameter Estimation
21 Oct 20
Methods and systems for measuring a complex semiconductor structure based on measurement data before and after a critical process step are presented.
Christopher Liman, Antonio Arion Gellineau, Andrei V. Shchegrov, Sungchul Yoo
Filed: 12 Apr 20
Utility
Apparatus and Method for Processing a Substrate
14 Oct 20
An apparatus for electrochemically processing a semiconductor substrate includes a processing chamber of the type that is sealable to a peripheral portion of a semiconductor substrate so as to define a covered processing volume.
Martin Ayres, John MacNeil, Trevor Thomas
Filed: 9 Apr 20
Utility
Inspection System with Grounded Capacitive Sample Proximity Sensor
14 Oct 20
A capacitive proximity measurement system may include a sensor electrode configured to be positioned proximate to a conductive measurement area on a test surface of a sample, a plate connector configured to provide an electrical connection between a system ground and a conductive plate parallel to the test surface, and a controller.
Yang Xie, Feilong Lin, Rushford A. Ogden
Filed: 1 May 19
Utility
Stochastic Reticle Defect Dispositioning
14 Oct 20
A system for stochastic reticle defect dispositioning is disclosed.
Moshe E. Preil, John J. Biafore, Alessandro Vaglio Pret
Filed: 18 Mar 20
Utility
Learnable Defect Detection for Semiconductor Applications
14 Oct 20
Methods and systems for learnable defect detection for semiconductor applications are provided.
Jing Zhang, Zhuoning Yuan, Yujie Dong, Kris Bhaskar
Filed: 1 Apr 20
Utility
Defect Candidate Generation for Inspection
14 Oct 20
Systems and methods for detecting defect candidates on a specimen are provided.
Martin Plihal, Erfan Soltanmohammadi, Prasanti Uppaluri, Mohit Jani, Chris Maher
Filed: 14 Oct 19
Utility
Automated Focusing System For Tracking Specimen Surface with a Configurable Focus Offset
7 Oct 20
An auto-focusing system is disclosed.
Xiumei Liu, Kai Cao, Richard Wallingford, Matthew Giusti, Brooke Bruguier
Filed: 30 Mar 20
Utility
Using Absolute Z-height Values for Synergy Between Tools
7 Oct 20
A semiconductor review tool receives absolute Z-height values for the semiconductor wafer, such as a semiconductor wafer with a beveled edge.
Sandeep Madhogarhia, Hari Sriraman Pathangi, Rohit Bhat
Filed: 30 Mar 20
Utility
Method for Measuring and Correcting Misregistration Between Layers In a Semiconductor Device, and Misregistration Targets Useful Therein
30 Sep 20
A method for measurement of misregistration in the manufacture of semiconductor device wafers, the method including measuring misregistration between layers of a semiconductor device wafer at a first instance and providing a first misregistration indication, measuring misregistration between layers of a semiconductor device wafer at a second instance and providing a second misregistration indication, providing a misregistration measurement difference output in response to a difference between the first misregistration indication and the second misregistration indication, providing a baseline difference output and ameliorating the difference between the misregistration measurement difference output and the baseline difference output.
Roie Volkovich, Renan Milo, Liran Yerushalmi, Moran Zaberchik, Yoel Feler, David Izraeli
Filed: 5 May 19
Utility
Die Screening Using Inline Defect Information
30 Sep 20
Embodiments herein include methods, systems, and apparatuses for die screening using inline defect information.
Alex Teng Song Lim, Ganesh Meenakshisundaram
Filed: 11 Jun 19
Utility
Magneto-optic Kerr Effect Metrology Systems
23 Sep 20
A laser beam is directed through a transmissive axicon telescope or a reflective axicon telescope such as in a magneto-optic Kerr effect metrology system.
Jun Wang, Yaolei Zheng, Chunxia Li, Changfei Yan, Lansheng Dong, Yang Zhou, Hai-Yang You, Haijing Peng, Jianou Shi, Rui Ni, Shankar Krishnan, David Y. Wang, Walter H. Johnson, Barry Blasenheim
Filed: 16 Mar 20
Utility
Process Monitoring Of Deep Structures With X-Ray Scatterometry
23 Sep 20
Methods and systems for estimating values of process parameters, structural parameters, or both, based on x-ray scatterometry measurements of high aspect ratio semiconductor structures are presented herein.
Antonio Arion Gellineau, Thaddeus Gerard Dziura
Filed: 4 Jun 20
Utility
Full Beam Metrology For X-Ray Scatterometry Systems
23 Sep 20
Methods and systems for characterizing dimensions and material properties of semiconductor devices by full beam x-ray scatterometry are described herein.
Antonio Arion Gellineau, Thaddeus Gerard Dziura, John J. Hench, Andrei Veldman, Sergey Zalubovsky
Filed: 4 Jun 20
Utility
System and Method for Converting Backside Surface Roughness to Frontside Overlay
23 Sep 20
A system for estimating front side overlay on a sample based on shape data is disclosed.
Jian Shen, Ningqi Zhu, John McCormack, Yanfei Sun
Filed: 5 Mar 20
Utility
Correlating Sem and Optical Images for Wafer Noise Nuisance Identification
16 Sep 20
Disclosed are apparatus and methods for inspecting a sample.
Qiang Zhang, Grace H. Chen
Filed: 27 May 20