7578 patents
Utility
Forming a Doped Hardmask
18 Jan 24
Methods for depositing a hardmask with ions implanted at different tilt angles are described herein.
Scott FALK, Rajesh PRASAD, Sarah Michelle BOBEK, Harry WHITESELL, Kurt DECKER-LUCKE, Kyu-Ha SHIM, Adaeze OSONKIE, Tomohiko KITAJIMA
Filed: 13 Oct 22
Utility
Automated Substrate Placement to Chamber Center
18 Jan 24
Embodiments disclosed herein include a method of centering a substrate in a chamber.
Wolfgang Aderhold
Filed: 15 Jul 22
Utility
Hybrid Bonding of Semiconductor Structures to Advanced Substrate Panels
18 Jan 24
Methods for bonding semiconductor surfaces leverage hybrid bonding processes to enable heterogeneous integration architectures.
Anup PANCHOLI, Marvin Louis BERNT, Ronald Patrick HUEMOELLER, Avinash SHANTARAM, Vincent DICAPRIO
Filed: 18 Jul 22
Utility
High Connectivity Device Stacking
18 Jan 24
The present disclosure generally relates to stacked miniaturized electronic devices and methods of forming the same.
Kurtis LESCHKIES, Han-Wen CHEN, Steven VERHAVERBEKE, Giback PARK, Kyuil CHO, Jeffrey L. FRANKLIN, Wei-Sheng LEI
Filed: 27 Jul 23
Utility
Batch Processing Apparatus, Systems, and Related Methods and Structures for Epitaxial Deposition Operations
18 Jan 24
The present disclosure relates to batch processing apparatus, systems, and related methods and structures for epitaxial deposition operations.
Manjunath SUBBANNA, Ala MORADIAN, Errol Antonio C. SANCHEZ, Zuoming ZHU, Peydaye Saheli GHAZAL, Martin Jeffrey SALINAS, Aniketnitin PATIL, Raja Murali DHAMODHARAN, Shu-Kwan LAU
Filed: 2 Dec 22
Utility
Calibration of an Aligner Station of a Processing System
18 Jan 24
A calibration object is transferred from a processing chamber to an aligner station by one or more robot arms.
Nicholas Michael Bergantz, Andreas Schmid, Leon Volfovski, Sanggyum Kim, Damon Cox, Paul Wirth
Filed: 27 Sep 23
Utility
Reconstituted Substrate Structure and Fabrication Methods for Heterogeneous Packaging Integration
18 Jan 24
The present disclosure relates to thin-form-factor reconstituted substrates and methods for forming the same.
Han-Wen CHEN, Steven VERHAVERBEKE, Guan Huei SEE, Giback PARK, Giorgio CELLERE, Diego TONINI, Vincent DICAPRIO, Kyuil CHO
Filed: 31 Jul 23
Utility
Enclosure System with Charging Assembly
18 Jan 24
A system includes an enclosure configured to couple to an equipment front end module (EFEM) of a substrate processing system, a charging assembly, and one or more support structures within the enclosure.
Phillip Alfred Criminale, Zhiqiang Guo, Andrew S.C. Ho, Rachel Sara Stolzman, Michael Carl Hankes
Filed: 27 Sep 23
Utility
Method of Manufacturing an Anode Structure, Vacuum Deposition System, Anode Structure, and Lithium Battery Layer Stack
18 Jan 24
A method of manufacturing an anode structure (10) for a lithium battery is described.
Roland TRASSL
Filed: 27 Sep 23
Utility
Diagnostic Disc with a High Vacuum and Temperature Tolerant Power Source
18 Jan 24
A method includes establishing, by a diagnostic disc, a secure wireless connection with a computing system using a wireless communication circuit of the diagnostic disc before or after the diagnostic disc is placed into a processing chamber.
Phillip A. Criminale, Zhiqiang Guo, Andrew Myles, Martin Perez-Guzman
Filed: 28 Sep 23
Utility
Conductive Oxide Overhang Structures for Oled Devices
18 Jan 24
Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein.
Ji Young CHOUNG, Chung-chia CHEN, Yu-hsin LIN, Jungmin LEE, Dieter HAAS, Si Kyoung KIM
Filed: 14 Jul 23
Utility
Methods for Removing Deposits on the Surface of a Chamber Component
18 Jan 24
Described herein is a method for removing deposits off a surface of a chamber component.
Tuochuan Huang, Min Shen, Kenneth Chien, Han Wang, Stayce Parmer, Rynn Wang
Filed: 12 Jul 22
Utility
Monitoring Thickness In Face-up Polishing
18 Jan 24
A chemical mechanical polishing system includes a support configured to hold a substrate face-up, a polishing article having a polishing surface smaller than an exposed surface of the substrate, a port for dispensing a polishing liquid, one or more actuators to bring the polishing surface into contact with a first portion of the exposed surface of the substrate and to generate relative motion between the substrate and the polishing pad and optically transmissive polymer window, an in-situ optical monitoring system, and a controller configured to receive a signal from the optical in-situ monitoring system and to modifying a polishing parameter based on the signal.
Brian J. Brown, Chirantha Rodrigo, Ekaterina A. Mikhaylichenko, Boguslaw A. Swedek, Thomas H. Osterheld, Dominic J. Benvegnu, Lakshmanan Karuppiah
Filed: 14 Jul 23
Utility
Membrane for Carrier Head with Segmented Substrate Chuck
18 Jan 24
A membrane for a CMP carrier head includes a circular lower portion that provides a substrate mounting surface for a central region of a substrate, a first plurality of flaps that extend upward from the circular lower portion to form a plurality of inner chambers, an annular upper portion that provides a lower surface for applying pressure to an annular outer region of the substrate, and a second plurality of flaps that extend upward from the annular upper portion to form a plurality of independently pressurizable outer chambers.
Steven M. Zuniga, Jay Gurusamy
Filed: 1 Aug 23
Utility
Monitoring Thickness In Face-up Polishing with Roller
18 Jan 24
A chemical mechanical polishing system includes a support configured to hold a substrate face-up, a polishing article having a polishing surface smaller than an exposed surface of the substrate, a port for dispensing a polishing liquid, one or more actuators to bring the polishing surface into contact with a first portion of the exposed surface of the substrate and to generate relative motion between the substrate and the polishing pad and optically transmissive polymer window, an in-situ optical monitoring system, and a controller configured to receive a signal from the optical in-situ monitoring system and to modifying a polishing parameter based on the signal.
Brian J. Brown, Chirantha Rodrigo, Ekaterina A. Mikhaylichenko, Boguslaw A. Swedek, Thomas H. Osterheld, Dominic J. Benvegnu, Lakshmanan Karuppiah
Filed: 14 Jul 23
Utility
Flow Guide Structures and Heat Shield Structures, and Related Methods, for Deposition Uniformity and Process Adjustability
18 Jan 24
The present disclosure relates to flow guide structures and heat shield structures, and related methods, for deposition uniformity and process adjustability.
Zuoming ZHU, Ala MORADIAN, Shu-Kwan LAU, John TOLLE, Manjunath SUBBANNA, Martin Jeffrey SALINAS, Chia Cheng CHIN, Thomas KIRSCHENHEITER, Saurabh CHOPRA
Filed: 20 Dec 22
Utility
In-situ Epi Growth Rate Control of Crystal Thickness Using Parametric Resonance Sensing
18 Jan 24
A method and apparatus for processing semiconductor substrates is described herein.
Sathya Shrinivas CHARY
Filed: 18 Jul 22
Utility
Purge Ring for Reduced Substrate Backside Deposition
18 Jan 24
Embodiments of a purge ring for use in a process chamber are provided herein.
Geraldine VASQUEZ, Yi XU, Dien-yeh WU, Aixi ZHANG, Jallepally RAVI, Yu LEI
Filed: 11 Jul 23
Utility
Batch Processing Apparatus, Systems, and Related Methods and Structures for Epitaxial Deposition Operations
18 Jan 24
The present disclosure relates to batch processing apparatus, systems, and related methods and structures for epitaxial deposition operations.
Errol Antonio C. SANCHEZ, Shu-Kwan LAU, Zuoming ZHU, Saurabh CHOPRA, Abhishek DUBE, Chandra MOHAPATRA, Alexandros ANASTASOPOULOS, Martin Jeffrey SALINAS
Filed: 2 Dec 22
Utility
Rotary Electrical Feedthrough Integration for Process Chamber
18 Jan 24
Embodiments disclosed herein include semiconductor processing tools.
ANANTHA SUBRAMANI, YANG GUO, JOHN FORSTER, WADE HARRELSON, ANDREW TOMKO, ANTHONY CHAN, SATHYA SWAROOP GANTA, MIKE MURTAGH, SANJEEV BALUJA
Filed: 14 Jul 22