3198 patents
Page 4 of 160
Utility
Method for Si gap fill by PECVD
19 Dec 23
Embodiments of the present disclosure relate to processes for filling trenches.
Xin Liu, Fei Wang, Rui Cheng, Abhijit Basu Mallick, Robert Jan Visser
Filed: 13 Jun 22
Utility
Horizontal gate-all-around device nanowire air gap spacer formation
19 Dec 23
Embodiments provide methods for forming nanowire structures, such as, for example, horizontal gate-all-around (hGAA) structures.
Shiyu Sun, Nam Sung Kim, Bingxi Sun Wood, Naomi Yoshida, Sheng-Chin Kung, Miao Jin
Filed: 16 Feb 22
Utility
Variable loop control feature
12 Dec 23
A method includes identifying a recipe for depositing layers on a substrate in a processing chamber of a substrate processing system.
Venkatanarayana Shankaramurthy, Anton Baryshnikov, Brett Berens, Mitesh Sanghvi, Shuang Liu
Filed: 16 Sep 22
Utility
Piezo position control flow ratio control
12 Dec 23
A method includes receiving, for a first pipe, first pressure values corresponding to first valve positions of a first valve coupled to the first pipe.
Ashley Okada, Ming Xu
Filed: 7 Oct 21
Utility
Methods and apparatus for physical vapor deposition (PVD) dielectric deposition
12 Dec 23
Methods and apparatus for reducing burn-in time of a physical vapor deposition shield, including: sputtering a dielectric target having a first dielectric constant to form a dielectric layer upon an inner surface of a shield, wherein the shield includes an aluminum oxide coating having a second dielectric constant in an amount sufficient to reduce the burn-in time, and wherein the first dielectric constant and second dielectric constant are substantially similar.
Jothilingam Ramalingam, William Fruchterman
Filed: 16 Aug 20
Utility
High density carbon films for patterning applications
12 Dec 23
Embodiments of the present disclosure generally relate to deposition of high transparency, high-density carbon films for patterning applications.
Eswaranand Venkatasubramanian, Samuel E. Gottheim, Pramit Manna, Abhijit Basu Mallick
Filed: 4 Oct 19
Utility
Spot heating by moving a beam with horizontal rotary motion
12 Dec 23
Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber.
Shu-Kwan Danny Lau, Toshiyuki Nakagawa, Zhiyuan Ye
Filed: 8 Jul 20
Utility
Detecting outliers at a manufacturing system using machine learning
12 Dec 23
Methods and systems for detecting outliers at a manufacturing system using machine learning are provided.
Bharath Ram Sundar, Raman K Nurani, Ramkishore Sankarasubramanian, Ramachandran Subramanian, Bharath Muralidharan, Ramaswamy Melatoor Narayanan, Ganapathi Raman Sankaranarayanan
Filed: 4 Feb 21
Utility
Seal mechanisms for load ports
12 Dec 23
The disclosure describes devices and systems for a two-sided seal for a load port, and methods for using said seal.
Douglas B. Baumgarten, Paul B. Reuter, James C Hansen
Filed: 24 Sep 21
Utility
Process kit ring adaptor
12 Dec 23
A process kit ring adaptor includes one or more upper surfaces and one or more lower surfaces.
Leon Volfovski, Andreas Schmid, Denis Martin Koosau, Nicholas Michael Kopec, Steven Babayan, Douglas R. McAllister, Helder Lee, Jeffrey Hudgens, Damon K. Cox
Filed: 29 Mar 21
Utility
Methods for forming elongated contact hole ends
12 Dec 23
Disclosed is a semiconductor processing approach wherein a wafer twist is employed to increase etch rate, at select locations, along a hole or space end arc.
Glen F. R. Gilchrist, Shurong Liang
Filed: 13 May 22
Utility
Methods for transfer of micro-devices
12 Dec 23
An apparatus for positioning micro-devices on a substrate includes one or more supports to hold a donor substrate and a destination substrate, an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate, a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate, and a controller.
Mingwei Zhu, Sivapackia Ganapathiappan, Boyi Fu, Hou T. Ng, Nag B. Patibandla
Filed: 11 Feb 22
Utility
Selective low temperature epitaxial deposition process
12 Dec 23
A method for the selective formation of epitaxial layers is described herein.
Chen-Ying Wu, Abhishek Dube, Yi-Chiau Huang
Filed: 15 Apr 21
Utility
Deposition of reactive metals with protection layer for high volume manufacturing
5 Dec 23
A method and apparatus for manufacturing a flexible layer stack, and to a flexible layer stack.
Subramanya P. Herle
Filed: 23 Nov 21
Utility
Control of steam generation for chemical mechanical polishing
5 Dec 23
A chemical mechanical polishing system includes a steam generator with a heating element to apply heat to a vessel to generate steam, an opening to deliver steam onto a polishing pad, a first valve in a fluid line between the opening and the vessel, a sensor to monitor a steam parameter, and a control system.
Hari Soundararajan, Shou-Sung Chang, Calvin Lee, Jonathan P. Domin, Shuchivrat Datar, Dmitry Sklyar, Paul D. Butterfield, Chad Pollard, Haosheng Wu
Filed: 28 Jun 21
Utility
Bias temperature instability correction in memory arrays
5 Dec 23
A method of correcting bias temperature instability in memory arrays may include applying a first bias to a memory cell, where the memory cell may include a memory element and a select element, and the first bias may causes a value to be stored in the memory element.
Christophe J. Chevallier, Siddarth Krishnan
Filed: 22 Aug 21
Utility
High-temperature chamber and chamber component cleaning and maintenance method and apparatus
5 Dec 23
Examples disclosed herein relate to a method and apparatus for cleaning and repairing a substrate support having a heater disposed therein.
Shuran Sheng, Lin Zhang, Jiyong Huang, Jang Seok Oh, Joseph C. Werner, Nitin Khurana, Ganesh Balasubramanian, Jennifer Y. Sun, Xinhai Han, Zhijun Jiang
Filed: 27 Apr 21
Utility
Methods, systems, and apparatus for tape-frame substrate cleaning and drying
5 Dec 23
Methods, systems, and apparatus for cleaning and drying a tape-frame substrate are provided.
Ying Wang, Guan Huei See, Gregory J. Wilson
Filed: 6 Jan 22
Utility
Methods for near surface work function engineering
5 Dec 23
Methods for adjusting a work function of a structure in a substrate leverage near surface doping.
Taichou Papo Chen
Filed: 4 May 22
Utility
Temperature-controllable process chambers, electronic device processing systems, and manufacturing methods
5 Dec 23
A process chamber includes one or more vertical walls at least partially defining a chamber portion of the process chamber, and multiple zones located about a periphery of the one or more vertical walls, wherein one or more of the multiple zones extends from a top to a bottom of the one or more vertical walls.
Paul Z. Wirth
Filed: 29 Jul 21