3198 patents
Page 5 of 160
Utility
Advanced temperature control for wafer carrier in plasma processing chamber
5 Dec 23
An advanced temperature control system and method are described for a wafer carrier in a plasma processing chamber.
Fernando M. Silveira, Chunlei Zhang, Phillip Criminale, Jaeyong Cho
Filed: 22 Jul 16
Utility
Substrate structuring methods
5 Dec 23
The present disclosure relates to methods and apparatus for structuring a semiconductor substrate.
Han-Wen Chen, Steven Verhaverbeke, Giback Park
Filed: 18 May 22
Utility
Indium-gallium-nitride light emitting diodes with increased red-light quantum efficiency
5 Dec 23
Exemplary processing methods of forming a semiconductor structure may include forming a nucleation layer on a semiconductor substrate.
Michael Chudzik, Michel Khoury, Max Batres
Filed: 10 Mar 21
Utility
OLED panel with trench overhang structures
5 Dec 23
Embodiments described herein generally relate to sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display.
Ji-young Choung, Jungmin Lee, Chung-chia Chen, Yusin Lin, Dieter Haas, Si Kyoung Kim
Filed: 13 Dec 22
Utility
Apparatus, system, and method for generating gas for use in a process chamber
5 Dec 23
Embodiments described herein generally relate to apparatus having a canister with a sidewall, a top, and a bottom forming a canister volume.
David Marquardt
Filed: 10 Nov 20
Utility
Segmented showerhead for uniform delivery of multiple precursors
5 Dec 23
Apparatus for supplying vaporized reactants to a reaction chamber are described herein.
Alexander Lerner, Prashanth Kothnur, Roey Shaviv, Satish Radhakrishnan
Filed: 13 Sep 19
Utility
Ceramic showerheads with conductive electrodes
5 Dec 23
Exemplary semiconductor processing chamber showerheads may include a dielectric plate characterized by a first surface and a second surface opposite the first surface.
Laksheswar Kalita, Soonam Park, Dmitry Lubomirsky, Tien Fak Tan, LokKee Loh, Saravjeet Singh, Tae Won Kim
Filed: 23 Feb 23
Utility
Symmetric flow valve for flow conductance control
5 Dec 23
Embodiments of symmetric flow valves for use in a substrate processing chamber are provided herein.
Andrew Nguyen, Yogananda Sarode Vishwanath, Xue Chang, Anilkumar Rayaroth, Chetan Naik, Balachandra Jatak Narayan
Filed: 1 Dec 21
Utility
Adjustable attenuation optical unit
5 Dec 23
An adjustable attenuation optical unit that may include a lightguide that includes a core, wherein the core comprises an output, an input and an exterior surface; and an adjustable attenuator that is configured to define an interfacing parameter related to an area of the exterior surface thereby receiving at least some of the light that impinges on the area.
Eitam Yitzchak Vinegrad, Itay Asulin
Filed: 17 Aug 21
Utility
Reducing substrate surface scratching using machine learning
5 Dec 23
Process recipe data associated a process to be performed for a substrate at a process chamber is provided as input to a trained machine learning model.
Kartik B Shah, Satish Radhakrishnan, Karthik Ramanathan, Karthikeyan Balaraman, Adolph Miller Allen, Xinyuan Chong, Mitrabhanu Sahu, Wenjing Xu, Michael Sterling Jackson, Weize Hu, Feng Chen
Filed: 19 Dec 22
Utility
Pressure regulated flow controller
5 Dec 23
A manufacturing system includes a processing chamber, an gas supply, and a mass flow control apparatus coupled to the gas supply and the processing chamber.
Ming Xu, Kenneth Le, Ashley M. Okada
Filed: 12 Feb 21
Utility
Film thickness estimation from machine learning based processing of substrate images
5 Dec 23
A neural network is trained for use in a substrate thickness measurement system by obtaining ground truth thickness measurements of a top layer of a calibration substrate at a plurality of locations, each location at a defined position for a die being fabricated on the substrate.
Sivakumar Dhandapani, Arash Alahgholipouromrani, Dominic J. Benvegnu, Jun Qian, Kiran Lall Shrestha
Filed: 25 Jun 21
Utility
Temperature and slurry flow rate control in CMP
28 Nov 23
A chemical mechanical polishing system includes a polishing a port to dispense polishing liquid onto a polishing pad and a liquid flow controller to control a flow rate of the polishing liquid to the port, a temperature control system to control a temperature of the polishing pad, and a control system.
Haosheng Wu, Jianshe Tang, Brian J. Brown, Shih-Haur Shen, Shou-Sung Chang, Hari Soundararajan
Filed: 24 Jun 21
Utility
Apparatus and methods for susceptor deposition material removal
28 Nov 23
Apparatus and method for removing material from the susceptor of a batch processing chamber are described.
Vijayabhaskara Venkatagiriyappa, Nitin Bhargav, Tae Kwang Lee
Filed: 24 Aug 20
Utility
Window in thin polishing pad
28 Nov 23
A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface.
Yongqi Hu, Kadthala Ramaya Narendrnath, Thomas Lawrence Terry
Filed: 5 Oct 21
Utility
Hydrophilic and zeta potential tunable chemical mechanical polishing pads
28 Nov 23
In one implementation, a method of forming a porous polishing pad is provided.
Sivapackia Ganapathiappan, Boyi Fu, Ashwin Chockalingam, Ankit Vora, Daniel Redfield, Rajeev Bajaj, Nag B. Patibandla, Hou T. Ng, Sudhakar Madhusoodhanan
Filed: 4 Apr 19
Utility
Amorphous silicon-based films resistant to crystallization
28 Nov 23
Deposition methods may prevent or reduce crystallization of silicon in a deposited amorphous silicon film that may occur after annealing at high temperatures.
Aykut Aydin, Krishna Nittala, Karthik Janakiraman, Yi Yang, Gautam K. Hemani
Filed: 27 Oct 20
Utility
Isolator apparatus and methods for substrate processing chambers
28 Nov 23
Aspects of the present disclosure relate generally to isolator devices, components thereof, and methods associated therewith for substrate processing chambers.
Nitin Pathak, Amit Kumar Bansal, Tuan Anh Nguyen, Thomas Rubio, Badri N. Ramamurthi, Juan Carlos Rocha-Alvarez
Filed: 26 Oct 22
Utility
Methods of forming silicon carbide coated base substrates at multiple temperatures
28 Nov 23
Embodiments of the present disclosure generally relate to silicon carbide coated base substrates, silicon carbide substrates thereof, and methods for forming silicon carbide coated base substrates.
Yen Lin Leow, Xinning Luan, Hui Chen, Kirk Allen Fisher, Shawn Thomas
Filed: 12 Jan 21
Utility
Reflector plate for substrate processing
28 Nov 23
Embodiments of the present disclosure generally relate to apparatus for processing a substrate, and more specifically to reflector plates for rapid thermal processing.
Wolfgang R. Aderhold
Filed: 20 Nov 20