50 patents
Page 2 of 3
Utility
Multi-cell power converter
8 Mar 22
An improved distributed-output multi-cell-element power converter utilizes a multiplicity of magnetic core elements, switching elements, capacitor elements and terminal connections in a step and repeat pattern.
Patrizio Vinciarelli
Filed: 8 Aug 19
Utility
Method and apparatus for delivering power to semiconductors
1 Mar 22
A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate.
Patrizio Vinciarelli
Filed: 26 Jan 21
Utility
Electronic assemblies having components with edge connectors
1 Mar 22
Circuit assemblies can be electrically interconnected by providing a circuit assembly having a top surface, a bottom surface, and a perimeter edge connecting the top and bottom surfaces, the perimeter edge being formed of insulative material and having a plurality of conductive features embedded in and exposed on the surface of the edge.
Patrizio Vinciarelli, Robert Joseph Balcius, Steven P. Sadler, Mark Andrew Thompson
Filed: 26 Apr 21
Utility
Power Distribution Architecture with Series-connected Bus Converter
17 Feb 22
Apparatus for power conversion are provided.
Patrizio Vinciarelli, Andrew D'Amico
Filed: 26 Jul 21
Design
Electric terminal
1 Feb 22
Patrizio Vinciarelli, Michael LaFleur
Filed: 6 Feb 20
Utility
Method and apparatus for delivering power to semiconductors
25 Jan 22
A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate.
Patrizio Vinciarelli, Andrew T. D'Amico
Filed: 12 Aug 20
Utility
Three-phase AC to DC isolated power conversion with power factor correction
18 Jan 22
An isolated, power factor corrected, converter, for operation from a three-phase AC source, comprises three power processors, each power processor connected to one of the three phases.
Patrizio Vinciarelli
Filed: 21 Feb 19
Utility
Method and apparatus for delivering power to semiconductors
24 Aug 21
A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate.
Patrizio Vinciarelli, Andrew T. D'Amico
Filed: 24 Apr 20
Utility
Power distribution architecture with series-connected bus converter
27 Jul 21
Apparatus for power conversion are provided.
Patrizio Vinciarelli, Andrew D'Amico
Filed: 4 Feb 20
Utility
Adaptive control of resonant power converters
25 May 21
A power converter including a transformer, a resonant circuit including the transformer and a resonant capacitor having a characteristic resonant frequency and period, and output circuitry connected to the transformer for delivering a rectified output voltage to a load.
Patrizio Vinciarelli
Filed: 15 Apr 20
Utility
Power regulator and power conversion circuitry for delivering power
25 May 21
A DC-to-DC transformer converts power from an input source to a load using a fixed voltage transformation ratio.
Patrizio Vinciarelli
Filed: 1 Jun 18
Utility
Electronic assemblies having components with edge connectors
11 May 21
Circuit assemblies can be electrically interconnected by providing a circuit assembly having a top surface, a bottom surface, and a perimeter edge connecting the top and bottom surfaces, the perimeter edge being formed of insulative material and having a plurality of conductive features embedded in and exposed on the surface of the edge.
Patrizio Vinciarelli, Robert Joseph Balcius, Steven P. Sadler, Mark Andrew Thompson
Filed: 30 Mar 18
Utility
Method and apparatus for delivering power to semiconductors
4 May 21
A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate.
Patrizio Vinciarelli, Andrew T. D'Amico
Filed: 26 Jul 18
Utility
Start-up control in power systems using fixed-ratio power conversion
16 Mar 21
A power converter system converts power from an input source for delivery to an active load.
Patrizio Vinciarelli
Filed: 15 Apr 20
Utility
Method and apparatus for delivering power to semiconductors
2 Mar 21
A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate.
Patrizio Vinciarelli
Filed: 20 Sep 19
Design
Power converter
23 Feb 21
Patrizio Vinciarelli, Michael B. LaFleur
Filed: 7 Nov 18
Utility
Delivering power to semiconductor loads
26 Jan 21
Encapsulated electronic modules having complex contact structures may be formed by encapsulating panels containing a substrate comprising pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within terminal holes and other holes drilled in the panel within the boundaries of the cut lines.
Patrizio Vinciarelli
Filed: 12 Dec 18
Utility
Panel-molded electronic assemblies
28 Sep 20
A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area.
Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico
Filed: 13 Feb 20
Utility
Method and apparatus for delivering power to semiconductors
21 Sep 20
A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate.
Patrizio Vinciarelli, Andrew T. D'Amico
Filed: 11 Mar 19
Utility
Panel molded electronic assemblies with integral terminals
21 Sep 20
Encapsulated electronic modules having complex contact structures may be formed by encapsulating panels containing a substrate comprising pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within terminal holes and other holes drilled in the panel within the boundaries of the cut lines.
Patrizio Vinciarelli, Michael B. LaFleur
Filed: 11 Dec 18