3 patents
Utility
Near-hermetic package with flexible signal input and output
15 Aug 23
The disclosure provides a low-cost near-hermetic package, which may a substrate configured to support one or more internal components.
Michael Len, Nicholas S. Koop, Andrew Kempf, Matt Gortner
Filed: 1 Feb 22
Utility
Method of manufacturing printed circuit board assemblies with engineered thermal paths
25 Jul 23
A printed circuit board (PCB) having an engineered thermal path and a method of manufacturing are disclosed herein.
Rick Bauer, Jerrad Martinson, Shane Hoffstatter, Doyle Laudal, Mike Lugert, Mike Len
Filed: 29 Jan 21
Utility
High-density optical waveguide structure and printed circuit board and preparation method thereof
4 Jul 23
The disclosure relates to a high-density optical waveguide structure, a printed circuit board and a preparation method thereof.
Xinhong Shi, Haitao Fu, Jun Zhang, Huamei Zhou, Longxiu Zhu, Marika Immonen
Filed: 8 Jul 19
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