110 patents
Utility
Electronic package and manufacturing method thereof
7 Nov 23
An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures.
Yu-Lung Huang, Chih-Ming Huang, Kuo-Hua Yu, Chang-Fu Lin
Filed: 1 Nov 22
Utility
Electronic package and circuit structure thereof
17 Oct 23
An electronic package is provided, where a circuit layer and a metal layer having a plurality of openings are formed on a dielectric layer of a circuit portion to reduce the area ratio of the metal layer to the dielectric layer, so as to reduce stress concentration and prevent warping of the electronic package.
Fang-Lin Tsai, Chia-Yu Kuo, Pei-Geng Weng, Wei-Son Tsai, Yih-Jenn Jiang
Filed: 28 Dec 20
Utility
Method for fabricating carrier structure
17 Oct 23
A carrier structure is provided.
Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
Filed: 2 Nov 20
Utility
Electronic module, manufacturing method thereof and electronic package having the same
3 Oct 23
An electronic module is provided, in which a first metal layer, an insulating layer and a second metal layer are sequentially formed on side faces and a non-active face of an electronic component to serve as a capacitor structure, where the capacitor structure is exposed from an active face of the electronic component so that by directly forming the capacitor structure on the electronic component, a distance between the capacitor structure and the electronic component is minimized, such that the effect of suppressing impedance can be optimized.
Ho-Chuan Lin, Chia-Chu Lai, Min-Han Chuang
Filed: 2 Sep 21
Utility
Electronic package and method for manufacturing the same
19 Sep 23
An electronic package and a manufacturing method thereof are provided, where a plurality of shielding wires are arranged on a carrier and spanning across an electronic component to cover the electronic component, so that the shielding wires serve as a shielding structure to protect the electronic component from the interference of external electromagnetic waves.
Ming-Fan Tsai, Chih-Wei Chen, Tsung-Hsien Tsai, Chao-Ya Yang, Chia-Yang Chen
Filed: 19 Aug 20
Utility
Electronic package and manufacturing method thereof
19 Sep 23
An electronic package is provided, in which a first electronic element and a second electronic element are disposed on a first side of a circuit structure and a second side of the circuit structure, respectively, where a first metal layer is formed between the first side of the circuit structure and the first electronic element, a second metal layer is formed on a surface of the second electronic element, and at least one thermally conductive pillar is disposed on the second side of the circuit structure and extends into the circuit structure to thermally conduct the first metal layer and the second metal layer.
Meng-Huan Chia, Yih-Jenn Jiang, Chang-Fu Lin, Don-Son Jiang
Filed: 25 Aug 21
Utility
Test equipment and test device thereof
5 Sep 23
Testing equipment is used in an antenna testing process, and includes a testing head having a perforation, and a testing device having a cylinder.
Bo-Siang Fang, Kuang-Sheng Wang, Hsinjou Lin, Shao-Meng Sim, Mao-Hua Yeh
Filed: 20 Dec 19
Utility
Electronic package and method for manufacturing the same
5 Sep 23
An electronic package is provided, which includes a plurality of electronic components encapsulated by an encapsulation layer.
Chih-Hsien Chiu, Siang-Yu Lin, Wen-Jung Tsai, Chia-Yang Chen, Chien-Cheng Lin
Filed: 19 Jul 21
Utility
Method for fabricating electronic package
15 Aug 23
An electronic package and a method for fabrication the same are provided.
Shu-Chi Chang, Wei-Ping Wang, Hsien-Lung Hsiao, Kaun-I Cheng
Filed: 16 Dec 20
Utility
Electronic package comprising wire inside an electronic component and manufacturing method thereof
15 Aug 23
An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.
Ho-Chuan Lin, Min-Han Chuang, Chia-Chu Lai
Filed: 6 Jul 21
Utility
Electronic device and circuit board thereof
8 Aug 23
An electronic device is provided, in which an antenna module for receiving and transmitting radiation signals is disposed on a mounting surface of a circuit board, and an inner layer of the circuit board is formed with a ground surface to arrange a strip-shaped ground circuit along the edges of the ground surface so that the ground circuit occupies at most 50% of the area of the ground surface to improve antenna radiation efficiency.
Ming-Fan Tsai, Chih-Wei Chen, Chien-Cheng Lin, Chao-Ya Yang, Chia-Yang Chen
Filed: 2 Sep 21
Utility
Electronic package and fabrication method thereof
21 Mar 23
An electronic package is provided and includes at least one protective structure positioned between a first electronic element and a second electronic element on a carrier for reducing stresses generated inside the first electronic element and the second electronic element when a filling material is formed on the carrier, encapsulates the protective structure and comes into contact with the first electronic element and the second electronic element, thereby preventing cracking of the first electronic element and the second electronic element and improving the reliability of the electronic package.
Chih-Hsun Hsu, Chi-Jen Chen, Hsi-Chang Hsu, Yuan-Hung Hsu, Rui-Feng Tai, Don-Son Jiang
Filed: 28 Jan 21
Utility
Flip-chip process and bonding equipment
14 Mar 23
A flip-chip process is to provide a pressing jig with a channel, so that the pressing jig grips a chip module by vacuum suction through the channel, and the chip module can be bonded onto a circuit board via a plurality of solder bumps through the pressing jig, and then a heating device is provided to heat the plurality of solder bumps and reflow the plurality of solder bumps.
Yu-Lung Huang, Chih-Ming Huang, Kuo-Hua Yu, Chang-Fu Lin
Filed: 3 Aug 21
Utility
Electronic package, packaging substrate, and methods for fabricating the same
7 Mar 23
An electronic package, a packaging substrate, and methods for fabricating the same are disposed.
Jun-Chang Ding, Hong-Da Chang, Hsi-Chang Hsu
Filed: 17 Dec 20
Utility
Fabrication method of electronic package having antenna function
28 Feb 23
An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant.
Chih-Hsien Chiu, Wen-Jung Tsai
Filed: 3 Nov 21
Utility
Electronic package and manufacturing method thereof
21 Feb 23
An electronic package in which at least one magnetically permeable member is disposed between a carrier and an electronic component, where the electronic component has a first conductive layer, and the carrier has a second conductive layer, such that the magnetically permeable element is located between the first conductive layer and the second conductive layer.
Chih-Hsien Chiu, Ko-Wei Chang
Filed: 27 Jan 21
Utility
Method for fabricating electronic package and carrier structure thereof
3 Jan 23
A carrier structure having a strengthening layer is provided.
Tse-Yuan Lin, Chun-Ming Laio, Yu-Chih Cheng
Filed: 23 Mar 21
Utility
Testing device for burn-in test operations and control method thereof
20 Dec 22
A control method is provided and used to place a target object on a test platform in a cabin of a testing device, to sense the temperature of the target object by a temperature response structure, and then to receive temperature signals of the temperature response structure by a controller, where the controller can regulate the pressure inside the cabin to control the air pressure of the cabin, so that the target object can still maintain good heat dissipation under high power consumption.
Chao-Ming Tu, Chih-Ming Yang, Wen-Chin Liang, Cheng-Shao Chen, Yung-Ming Wang
Filed: 8 Feb 21
Utility
Chip matching system and method thereof
20 Dec 22
A chip matching system and a corresponding method are provided.
Wu-Hung Yen, Yi-Hsien Huang, Chun-Tang Lin, Shu-Hua Chen, Shou-Qi Chang
Filed: 19 Oct 20
Utility
Electronic package and manufacturing method thereof
20 Dec 22
An electronic package and a method for manufacturing the electronic package are provided.
Chi-Jen Chen, Hsi-Chang Hsu, Yuan-Hung Hsu, Chang-Fu Lin, Don-Son Jiang
Filed: 28 Jan 21