3198 patents
Utility
MEMS resonator sensor substrate for plasma, temperature, stress, or deposition sensing
16 Jan 24
Embodiments disclosed herein include diagnostic substrates and methods of using the diagnostic substrates to extract plasma parameters.
Chuang-Chia Lin, David Peterson, Philip Allan Kraus, Amir Bayati
Filed: 2 Jul 21
Utility
Multi-level RF pulse monitoring and RF pulsing parameter optimization at a manufacturing system
16 Jan 24
Methods and systems for RF pulse monitoring and RF pulsing parameter optimization at a manufacturing system are provided.
Dermot Cantwell, Quentin Ernie Walker, Serghei Malkov, Jatinder Kumar
Filed: 23 Jan 23
Utility
Ion implantation to modify glass locally for optical devices
16 Jan 24
Embodiments described herein provide for optical devices with methods of forming optical device substrates having at least one area of increased refractive index or scratch resistance.
Nai-Wen Pi, Jinxin Fu, Kang Luo, Ludovic Godet
Filed: 22 Mar 22
Utility
Methods and systems for cleaning process sequence management
16 Jan 24
Methods and systems for cleaning process sequence management are provided.
Chongyang C. Wang
Filed: 9 Nov 21
Utility
Methods for electrochemical deposition of isolated seed layer areas
16 Jan 24
A method of depositing a metal material on an isolated seed layer uses a barrier layer as a conductive path for plating.
Marvin Louis Bernt
Filed: 23 Sep 21
Utility
Techniques and apparatus for anisotropic stress compensation in substrates using ion implantation
16 Jan 24
A method may include providing a substrate, where the substrate includes a first main surface and a second main surface, opposite the first main surface.
Scott Falk, Jun-Feng Lu, Qintao Zhang
Filed: 9 Nov 21
Utility
Diffusion barrier films enabling the stability of lithium
16 Jan 24
Lithium-containing anodes, high performance electrochemical devices, such as secondary batteries, including the aforementioned lithium-containing electrodes, and methods for fabricating the same are provided.
Dmitri A. Brevnov
Filed: 18 Jun 19
Utility
System apparatus and method for enhancing electrical clamping of substrates using photo-illumination
16 Jan 24
An apparatus may include a clamp to clamp a substrate wherein the clamp is arranged opposing a back side of the substrate; and an illumination system, disposed to direct radiation to the substrate, when the substrate is disposed on the clamp, wherein the radiation comprises a radiation energy equal to or above a threshold energy to generate mobile charge in the substrate, where the illumination system is disposed to direct radiation to a front side of the substrate, opposite the back side of the substrate.
Qin Chen, Julian G. Blake, Michael W. Osborne, Steven M. Anella, Jonathan D. Fischer
Filed: 21 May 20
Utility
Process chamber with reduced plasma arc
16 Jan 24
A processing system comprises a chamber body, a substrate support and a lid assembly.
Fei Wu, Abdul Aziz Khaja, Sungwon Ha, Vinay K. Prabhakar, Ganesh Balasubramanian
Filed: 23 Apr 20
Utility
Temperature-based in-situ edge assymetry correction during CMP
9 Jan 24
A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier laterally movable by an actuator across the polishing pad to hold a substrate against a polishing surface of the polishing pad during a polishing process, a thermal control system including a plurality of independently controllable heaters and coolers to independently control temperatures of a plurality of zones on the polishing pad, and a controller configured to cause the thermal control system to generate a first zone having a first temperature and a second zone having a different second temperature on the polishing pad.
Haosheng Wu, Shou-Sung Chang, Jianshe Tang, Chih Chung Chou, Hui Chen, Hari Soundararajan, Benjamin Cherian
Filed: 15 Apr 20
Utility
Profile control with multiple instances of contol algorithm during polishing
9 Jan 24
During polishing of a stack of adjacent layers, a plurality of instances of a profile control algorithm are executed on a controller with different instances having different values for a control parameter.
Kun Xu, Harry Q. Lee, Benjamin Cherian, David Maxwell Gage
Filed: 7 Jun 21
Utility
Substrate support cover for high-temperature corrosive environment
9 Jan 24
Embodiments of the present disclosure generally relate to an apparatus and a method for cleaning a processing chamber.
Shuran Sheng, Lin Zhang, Jiyong Huang, Joseph C. Werner, Stanley Wu, Mahesh Adinath Kanawade, Yikai Chen, Yixing Lin, Ying Ma
Filed: 2 Mar 20
Utility
Homoleptic lanthanide deposition precursors
9 Jan 24
Described are lanthanide-containing metal coordination complexes which may be used as precursors in thin film depositions, e.g., atomic layer deposition processes.
Thomas Knisley, Mark Saly
Filed: 9 Sep 22
Utility
Multi-piece slit valve gate
9 Jan 24
Disclosed is a slit valve gate.
Shawn Thanhson Le, Peter Reimer, Ofer Amir, Hannie Thi Vo
Filed: 28 Jul 22
Utility
Fabrication of diffractive optic element having a variable refractive index profile by inkjet printing deposition
9 Jan 24
Embodiments of the present disclosure generally relate to optical devices.
Kang Luo, Xiaopei Deng, Daihua Zhang, Ludovic Godet
Filed: 23 Sep 21
Utility
Imprint compositions with passivated nanoparticles and materials and processes for making the same
9 Jan 24
Embodiments of the present disclosure generally relate to imprint compositions and materials and related processes useful for nanoimprint lithography (NIL).
Amita Joshi, Andrew Ceballos, Kenichi Ohno, Rami Hourani, Ludovic Godet
Filed: 16 Nov 21
Utility
Optical emission spectroscopy control of gas flow in processing chambers
9 Jan 24
A system may be configured to monitor an amount of a gas species in a processing chamber using Optical Emission Spectrometry.
Philip DiGiacomo, Sunil Kumar Garg, Paul G. Kiely, Keith A. Miller, Rajat Agrawal
Filed: 11 Mar 21
Utility
Use of adaptive replacement maps in digital lithography for local cell replacement
9 Jan 24
Embodiments described herein relate to a system, software, and a method of using the system to edit a design to be printed by a lithography system.
Aravind Inumpudi, Thomas L. Laidig
Filed: 1 Dec 21
Utility
Methods of forming molybdenum contacts
9 Jan 24
Methods for forming a semiconductor structure are described.
Seshadri Ganguli, Jacqueline S. Wrench, Yixiong Yang, Yong Yang, Srinivas Gandikota
Filed: 7 May 21
Utility
Fully self-aligned subtractive etch
9 Jan 24
Apparatuses and methods to provide fully self-aligned first metallization lines, M1, via, and second metallization lines, M2, are described.
Lili Feng, Yuqiong Dai, Madhur Sachan, Regina Freed, Ho-yung David Hwang
Filed: 1 Jun 21